CN113631379A - 粘合片、粘合片的制造方法及半导体装置的制造方法 - Google Patents
粘合片、粘合片的制造方法及半导体装置的制造方法 Download PDFInfo
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- CN113631379A CN113631379A CN202080024090.1A CN202080024090A CN113631379A CN 113631379 A CN113631379 A CN 113631379A CN 202080024090 A CN202080024090 A CN 202080024090A CN 113631379 A CN113631379 A CN 113631379A
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-064606 | 2019-03-28 | ||
| JP2019064606 | 2019-03-28 | ||
| PCT/JP2020/013671 WO2020196755A1 (ja) | 2019-03-28 | 2020-03-26 | 粘着シート、粘着シートの製造方法及び半導体装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113631379A true CN113631379A (zh) | 2021-11-09 |
Family
ID=72611640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202080024090.1A Pending CN113631379A (zh) | 2019-03-28 | 2020-03-26 | 粘合片、粘合片的制造方法及半导体装置的制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2020196755A1 (ko) |
| KR (1) | KR20210148102A (ko) |
| CN (1) | CN113631379A (ko) |
| TW (1) | TWI836046B (ko) |
| WO (1) | WO2020196755A1 (ko) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4219154A1 (en) * | 2021-09-06 | 2023-08-02 | Sekisui Chemical Co., Ltd. | Adhesive tape for semiconductor device manufacturing |
| JPWO2023037914A1 (ko) * | 2021-09-10 | 2023-03-16 | ||
| WO2024009593A1 (ja) * | 2022-07-08 | 2024-01-11 | 株式会社レゾナック | 粘着剤組成物及び保護シート |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284666A (ja) * | 2006-03-20 | 2007-11-01 | Furukawa Electric Co Ltd:The | 加熱剥離性粘着テープ |
| CN102405268A (zh) * | 2009-04-21 | 2012-04-04 | 日东电工株式会社 | 加热膨胀型再剥离性丙烯酸类粘合带或粘合片 |
| CN103242752A (zh) * | 2012-02-07 | 2013-08-14 | 日东电工株式会社 | 粘合剂层叠物的剥离方法以及使用其的粘合剂层 |
| CN103827241A (zh) * | 2011-09-20 | 2014-05-28 | 日东电工株式会社 | 电子部件切断用加热剥离型粘合片及电子部件切断方法 |
| CN104185665A (zh) * | 2012-03-27 | 2014-12-03 | 日东电工株式会社 | 电子部件切断用加热剥离型粘合片及电子部件加工方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3594853B2 (ja) | 1999-11-08 | 2004-12-02 | 日東電工株式会社 | 加熱剥離型粘着シート |
| JP2011074245A (ja) * | 2009-09-30 | 2011-04-14 | Kyocera Chemical Corp | 仮固定用接着剤組成物及び部品の加工方法 |
| WO2016076131A1 (ja) * | 2014-11-13 | 2016-05-19 | Dic株式会社 | 両面粘着テープ、物品及び分離方法 |
| KR102365799B1 (ko) * | 2016-03-03 | 2022-02-21 | 린텍 가부시키가이샤 | 반도체 가공용 점착 테이프, 및 반도체 장치의 제조 방법 |
| KR102387311B1 (ko) * | 2016-10-17 | 2022-04-15 | 가부시끼가이샤 쓰리본드 | 경화성 수지 조성물 |
| WO2018181766A1 (ja) * | 2017-03-31 | 2018-10-04 | リンテック株式会社 | 半導体装置の製造方法及び両面粘着シート |
| JP6764526B2 (ja) * | 2017-03-31 | 2020-09-30 | リンテック株式会社 | 粘着シート |
-
2020
- 2020-03-26 JP JP2021509590A patent/JPWO2020196755A1/ja active Pending
- 2020-03-26 WO PCT/JP2020/013671 patent/WO2020196755A1/ja active Application Filing
- 2020-03-26 CN CN202080024090.1A patent/CN113631379A/zh active Pending
- 2020-03-26 KR KR1020217028633A patent/KR20210148102A/ko not_active Application Discontinuation
- 2020-03-27 TW TW109110521A patent/TWI836046B/zh active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007284666A (ja) * | 2006-03-20 | 2007-11-01 | Furukawa Electric Co Ltd:The | 加熱剥離性粘着テープ |
| CN102405268A (zh) * | 2009-04-21 | 2012-04-04 | 日东电工株式会社 | 加热膨胀型再剥离性丙烯酸类粘合带或粘合片 |
| CN103827241A (zh) * | 2011-09-20 | 2014-05-28 | 日东电工株式会社 | 电子部件切断用加热剥离型粘合片及电子部件切断方法 |
| CN103242752A (zh) * | 2012-02-07 | 2013-08-14 | 日东电工株式会社 | 粘合剂层叠物的剥离方法以及使用其的粘合剂层 |
| CN104185665A (zh) * | 2012-03-27 | 2014-12-03 | 日东电工株式会社 | 电子部件切断用加热剥离型粘合片及电子部件加工方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2020196755A1 (ja) | 2020-10-01 |
| TW202102631A (zh) | 2021-01-16 |
| TWI836046B (zh) | 2024-03-21 |
| JPWO2020196755A1 (ko) | 2020-10-01 |
| KR20210148102A (ko) | 2021-12-07 |
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