JPWO2020196755A1 - - Google Patents

Info

Publication number
JPWO2020196755A1
JPWO2020196755A1 JP2021509590A JP2021509590A JPWO2020196755A1 JP WO2020196755 A1 JPWO2020196755 A1 JP WO2020196755A1 JP 2021509590 A JP2021509590 A JP 2021509590A JP 2021509590 A JP2021509590 A JP 2021509590A JP WO2020196755 A1 JPWO2020196755 A1 JP WO2020196755A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021509590A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2020196755A1 publication Critical patent/JPWO2020196755A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2021509590A 2019-03-28 2020-03-26 Pending JPWO2020196755A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019064606 2019-03-28
PCT/JP2020/013671 WO2020196755A1 (ja) 2019-03-28 2020-03-26 粘着シート、粘着シートの製造方法及び半導体装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2020196755A1 true JPWO2020196755A1 (ko) 2020-10-01

Family

ID=72611640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021509590A Pending JPWO2020196755A1 (ko) 2019-03-28 2020-03-26

Country Status (5)

Country Link
JP (1) JPWO2020196755A1 (ko)
KR (1) KR20210148102A (ko)
CN (1) CN113631379A (ko)
TW (1) TWI836046B (ko)
WO (1) WO2020196755A1 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4219154A1 (en) * 2021-09-06 2023-08-02 Sekisui Chemical Co., Ltd. Adhesive tape for semiconductor device manufacturing
JPWO2023037914A1 (ko) * 2021-09-10 2023-03-16
WO2024009593A1 (ja) * 2022-07-08 2024-01-11 株式会社レゾナック 粘着剤組成物及び保護シート

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284666A (ja) * 2006-03-20 2007-11-01 Furukawa Electric Co Ltd:The 加熱剥離性粘着テープ
WO2010122943A1 (ja) * 2009-04-21 2010-10-28 日東電工株式会社 加熱膨張型再剥離性アクリル系粘着テープ又はシート
JP2011074245A (ja) * 2009-09-30 2011-04-14 Kyocera Chemical Corp 仮固定用接着剤組成物及び部品の加工方法
WO2013042698A1 (ja) * 2011-09-20 2013-03-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
JP2013159743A (ja) * 2012-02-07 2013-08-19 Nitto Denko Corp 粘着剤積層物の剥離方法およびそれに用いる粘着剤層
JP2013203800A (ja) * 2012-03-27 2013-10-07 Nitto Denko Corp 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
WO2016076131A1 (ja) * 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
WO2017150676A1 (ja) * 2016-03-03 2017-09-08 リンテック株式会社 半導体加工用粘着テープ、及び半導体装置の製造方法
WO2018074316A1 (ja) * 2016-10-17 2018-04-26 株式会社スリーボンド 硬化性樹脂組成物
WO2018181770A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シート

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3594853B2 (ja) 1999-11-08 2004-12-02 日東電工株式会社 加熱剥離型粘着シート
WO2018181766A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 半導体装置の製造方法及び両面粘着シート

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007284666A (ja) * 2006-03-20 2007-11-01 Furukawa Electric Co Ltd:The 加熱剥離性粘着テープ
WO2010122943A1 (ja) * 2009-04-21 2010-10-28 日東電工株式会社 加熱膨張型再剥離性アクリル系粘着テープ又はシート
JP2011074245A (ja) * 2009-09-30 2011-04-14 Kyocera Chemical Corp 仮固定用接着剤組成物及び部品の加工方法
WO2013042698A1 (ja) * 2011-09-20 2013-03-28 日東電工株式会社 電子部品切断用加熱剥離型粘着シート及び電子部品切断方法
JP2013159743A (ja) * 2012-02-07 2013-08-19 Nitto Denko Corp 粘着剤積層物の剥離方法およびそれに用いる粘着剤層
JP2013203800A (ja) * 2012-03-27 2013-10-07 Nitto Denko Corp 電子部品切断用加熱剥離型粘着シート及び電子部品加工方法
WO2016076131A1 (ja) * 2014-11-13 2016-05-19 Dic株式会社 両面粘着テープ、物品及び分離方法
WO2017150676A1 (ja) * 2016-03-03 2017-09-08 リンテック株式会社 半導体加工用粘着テープ、及び半導体装置の製造方法
WO2018074316A1 (ja) * 2016-10-17 2018-04-26 株式会社スリーボンド 硬化性樹脂組成物
WO2018181770A1 (ja) * 2017-03-31 2018-10-04 リンテック株式会社 粘着シート

Also Published As

Publication number Publication date
WO2020196755A1 (ja) 2020-10-01
TW202102631A (zh) 2021-01-16
TWI836046B (zh) 2024-03-21
KR20210148102A (ko) 2021-12-07
CN113631379A (zh) 2021-11-09

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