CN113620710B - 使用相与应力控制的等离子体喷涂涂覆设计 - Google Patents
使用相与应力控制的等离子体喷涂涂覆设计 Download PDFInfo
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- CN113620710B CN113620710B CN202110908948.7A CN202110908948A CN113620710B CN 113620710 B CN113620710 B CN 113620710B CN 202110908948 A CN202110908948 A CN 202110908948A CN 113620710 B CN113620710 B CN 113620710B
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- plasma
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- 238000005507 spraying Methods 0.000 title claims abstract description 20
- 238000013461 design Methods 0.000 title description 2
- 238000000576 coating method Methods 0.000 claims abstract description 73
- 238000005524 ceramic coating Methods 0.000 claims abstract description 68
- 239000007921 spray Substances 0.000 claims abstract description 61
- 238000000034 method Methods 0.000 claims abstract description 60
- 239000011248 coating agent Substances 0.000 claims abstract description 54
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims abstract description 17
- 238000007750 plasma spraying Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 15
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- 239000004065 semiconductor Substances 0.000 claims abstract description 8
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 5
- 239000000843 powder Substances 0.000 claims description 55
- 239000007789 gas Substances 0.000 claims description 44
- 239000000203 mixture Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 19
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 239000006104 solid solution Substances 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 229910017493 Nd 2 O 3 Inorganic materials 0.000 claims description 7
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 239000001307 helium Substances 0.000 claims description 4
- 229910052734 helium Inorganic materials 0.000 claims description 4
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 4
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 2
- 229910052760 oxygen Inorganic materials 0.000 claims description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 31
- 238000004544 sputter deposition Methods 0.000 abstract description 2
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract 1
- 210000002381 plasma Anatomy 0.000 description 80
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- 239000002245 particle Substances 0.000 description 31
- 239000000758 substrate Substances 0.000 description 23
- 239000011324 bead Substances 0.000 description 18
- 239000002131 composite material Substances 0.000 description 18
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 16
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 description 16
- 230000035882 stress Effects 0.000 description 15
- 235000012431 wafers Nutrition 0.000 description 12
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- 238000004140 cleaning Methods 0.000 description 10
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- 229910001233 yttria-stabilized zirconia Inorganic materials 0.000 description 4
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- 229910003465 moissanite Inorganic materials 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
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- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
- C04B35/48—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on zirconium or hafnium oxides, zirconates, zircon or hafnates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
- C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
- C04B35/505—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds based on yttrium oxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/10—Oxides, borides, carbides, nitrides or silicides; Mixtures thereof
- C23C4/11—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32477—Vessel characterised by the means for protecting vessels or internal parts, e.g. coatings
- H01J37/32495—Means for protecting the vessel against plasma
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Physics & Mathematics (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structural Engineering (AREA)
- Composite Materials (AREA)
- Analytical Chemistry (AREA)
- Coating By Spraying Or Casting (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461994648P | 2014-05-16 | 2014-05-16 | |
| US61/994,648 | 2014-05-16 | ||
| US14/712,054 | 2015-05-14 | ||
| US14/712,054 US10196728B2 (en) | 2014-05-16 | 2015-05-14 | Plasma spray coating design using phase and stress control |
| CN201580001477.4A CN105431926B (zh) | 2014-05-16 | 2015-05-15 | 使用相与应力控制的等离子体喷涂涂覆设计 |
| PCT/US2015/031172 WO2015175987A1 (en) | 2014-05-16 | 2015-05-15 | Plasma spray coating design using phase and stress control |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001477.4A Division CN105431926B (zh) | 2014-05-16 | 2015-05-15 | 使用相与应力控制的等离子体喷涂涂覆设计 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113620710A CN113620710A (zh) | 2021-11-09 |
| CN113620710B true CN113620710B (zh) | 2022-11-11 |
Family
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110908948.7A Active CN113620710B (zh) | 2014-05-16 | 2015-05-15 | 使用相与应力控制的等离子体喷涂涂覆设计 |
| CN201580001477.4A Expired - Fee Related CN105431926B (zh) | 2014-05-16 | 2015-05-15 | 使用相与应力控制的等离子体喷涂涂覆设计 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580001477.4A Expired - Fee Related CN105431926B (zh) | 2014-05-16 | 2015-05-15 | 使用相与应力控制的等离子体喷涂涂覆设计 |
Country Status (5)
| Country | Link |
|---|---|
| US (3) | US10196728B2 (enExample) |
| JP (1) | JP7033919B2 (enExample) |
| KR (2) | KR20220084213A (enExample) |
| CN (2) | CN113620710B (enExample) |
| WO (1) | WO2015175987A1 (enExample) |
Families Citing this family (43)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
| US9708713B2 (en) | 2013-05-24 | 2017-07-18 | Applied Materials, Inc. | Aerosol deposition coating for semiconductor chamber components |
| US9850568B2 (en) | 2013-06-20 | 2017-12-26 | Applied Materials, Inc. | Plasma erosion resistant rare-earth oxide based thin film coatings |
| US9711334B2 (en) | 2013-07-19 | 2017-07-18 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based thin film coatings on process rings |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US10468235B2 (en) | 2013-09-18 | 2019-11-05 | Applied Materials, Inc. | Plasma spray coating enhancement using plasma flame heat treatment |
| US9440886B2 (en) | 2013-11-12 | 2016-09-13 | Applied Materials, Inc. | Rare-earth oxide based monolithic chamber material |
| US9725799B2 (en) | 2013-12-06 | 2017-08-08 | Applied Materials, Inc. | Ion beam sputtering with ion assisted deposition for coatings on chamber components |
| US9976211B2 (en) | 2014-04-25 | 2018-05-22 | Applied Materials, Inc. | Plasma erosion resistant thin film coating for high temperature application |
| US9869013B2 (en) | 2014-04-25 | 2018-01-16 | Applied Materials, Inc. | Ion assisted deposition top coat of rare-earth oxide |
| US10730798B2 (en) | 2014-05-07 | 2020-08-04 | Applied Materials, Inc. | Slurry plasma spray of plasma resistant ceramic coating |
| US10196728B2 (en) | 2014-05-16 | 2019-02-05 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
| US9460898B2 (en) | 2014-08-08 | 2016-10-04 | Applied Materials, Inc. | Plasma generation chamber with smooth plasma resistant coating |
| CN105648386B (zh) * | 2016-02-18 | 2018-12-07 | 中国科学院上海硅酸盐研究所 | 热喷涂氧化铝–氧化钇复合陶瓷涂层及其制备方法 |
| US11326253B2 (en) | 2016-04-27 | 2022-05-10 | Applied Materials, Inc. | Atomic layer deposition of protective coatings for semiconductor process chamber components |
| US9850573B1 (en) | 2016-06-23 | 2017-12-26 | Applied Materials, Inc. | Non-line of sight deposition of erbium based plasma resistant ceramic coating |
| US20180016678A1 (en) | 2016-07-15 | 2018-01-18 | Applied Materials, Inc. | Multi-layer coating with diffusion barrier layer and erosion resistant layer |
| DE102016009730A1 (de) * | 2016-07-28 | 2018-02-01 | Forschungszentrum Jülich GmbH | Verfahren zur Verstärkung von transparenten Keramiken sowie Keramik |
| US10186400B2 (en) | 2017-01-20 | 2019-01-22 | Applied Materials, Inc. | Multi-layer plasma resistant coating by atomic layer deposition |
| US10755900B2 (en) | 2017-05-10 | 2020-08-25 | Applied Materials, Inc. | Multi-layer plasma erosion protection for chamber components |
| US11279656B2 (en) | 2017-10-27 | 2022-03-22 | Applied Materials, Inc. | Nanopowders, nanoceramic materials and methods of making and use thereof |
| KR102044333B1 (ko) * | 2017-12-26 | 2019-11-13 | 주식회사 포스코 | 용사 코팅 장치 |
| KR102845765B1 (ko) * | 2018-01-15 | 2025-08-13 | 어플라이드 머티어리얼스, 인코포레이티드 | 원격 플라즈마 산화에 대한 아르곤 추가 |
| US11047035B2 (en) | 2018-02-23 | 2021-06-29 | Applied Materials, Inc. | Protective yttria coating for semiconductor equipment parts |
| US10443126B1 (en) | 2018-04-06 | 2019-10-15 | Applied Materials, Inc. | Zone-controlled rare-earth oxide ALD and CVD coatings |
| US11667575B2 (en) | 2018-07-18 | 2023-06-06 | Applied Materials, Inc. | Erosion resistant metal oxide coatings |
| BE1026683B1 (nl) * | 2018-10-05 | 2020-05-07 | Soleras Advanced Coatings Bvba | Sputterdoel |
| CN109207917B (zh) * | 2018-10-19 | 2020-08-04 | 南京航空航天大学 | 一种NiCrAlSi/CeO2掺杂YSZ热障涂层及其制备方法 |
| US11180847B2 (en) | 2018-12-06 | 2021-11-23 | Applied Materials, Inc. | Atomic layer deposition coatings for high temperature ceramic components |
| US10858741B2 (en) | 2019-03-11 | 2020-12-08 | Applied Materials, Inc. | Plasma resistant multi-layer architecture for high aspect ratio parts |
| CN109987947A (zh) * | 2019-04-19 | 2019-07-09 | 中国科学院上海硅酸盐研究所 | 利用原位应力诱导相变同步优化氧化铝涂层导热与力学性能的方法 |
| KR102042559B1 (ko) * | 2019-05-30 | 2019-12-02 | (주)쉬엔비 | 플라즈마를 이용하여 피부미용 및 피부재생이 가능한 플라즈마 핸드피스 및 이를 이용한 플라즈마 발생장치 |
| CN110904361B (zh) * | 2019-12-16 | 2020-10-30 | 北京君山表面技术工程有限公司 | 等离子喷涂用镍基合金复合粉末及熔覆涂层的制备方法 |
| US20230051800A1 (en) * | 2020-01-27 | 2023-02-16 | Applied Materials, Inc. | Methods and apparatus for plasma spraying silicon carbide coatings for semiconductor chamber applications |
| USD979524S1 (en) | 2020-03-19 | 2023-02-28 | Applied Materials, Inc. | Confinement liner for a substrate processing chamber |
| USD943539S1 (en) | 2020-03-19 | 2022-02-15 | Applied Materials, Inc. | Confinement plate for a substrate processing chamber |
| US11380524B2 (en) | 2020-03-19 | 2022-07-05 | Applied Materials, Inc. | Low resistance confinement liner for use in plasma chamber |
| US20220013336A1 (en) * | 2020-07-10 | 2022-01-13 | Applied Materials, Inc. | Process kit with protective ceramic coatings for hydrogen and nh3 plasma application |
| CN112251706B (zh) * | 2020-09-20 | 2022-05-17 | 苏州纳创佳环保科技工程有限公司 | 一种聚碳硅烷/氧化锆的激光防护复合涂层的制备方法 |
| DE102020126082A1 (de) * | 2020-10-06 | 2022-04-07 | Forschungszentrum Jülich GmbH | Verfahren zur Herstellung einer Beschichtung sowie Beschichtung |
| WO2023106357A1 (ja) * | 2021-12-10 | 2023-06-15 | トーカロ株式会社 | プラズマエッチング装置用部材等に好適な成膜材料およびその製造方法 |
| CN115852294B (zh) * | 2022-12-28 | 2023-08-01 | 西安交通大学 | 一种基于应力调控的含表面裂纹热障涂层及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084020A (zh) * | 2008-02-26 | 2011-06-01 | 应用材料公司 | 可抵抗还原等离子体的含钇陶瓷涂层 |
| KR20130090303A (ko) * | 2012-02-03 | 2013-08-13 | 주식회사케이세라셀 | 정전척 제조용 플라즈마 스프레이 코팅 재료 및 이의 제조방법 |
Family Cites Families (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010062209A (ko) * | 1999-12-10 | 2001-07-07 | 히가시 데쓰로 | 고내식성 막이 내부에 형성된 챔버를 구비하는 처리 장치 |
| US6949203B2 (en) | 1999-12-28 | 2005-09-27 | Applied Materials, Inc. | System level in-situ integrated dielectric etch process particularly useful for copper dual damascene |
| JP2002060943A (ja) * | 2000-08-22 | 2002-02-28 | Tohoku Electric Power Co Inc | 高純度シリコンの被覆方法及び装置 |
| JP4277973B2 (ja) * | 2001-07-19 | 2009-06-10 | 日本碍子株式会社 | イットリア−アルミナ複合酸化物膜の製造方法、イットリア−アルミナ複合酸化物膜および耐蝕性部材 |
| US20030047464A1 (en) | 2001-07-27 | 2003-03-13 | Applied Materials, Inc. | Electrochemically roughened aluminum semiconductor processing apparatus surfaces |
| AU2002367931A1 (en) | 2001-08-02 | 2003-12-22 | 3M Innovative Properties Company | Alumina-yttria-zirconium oxide/hafnium oxide materials, and methods of making and using the same |
| US20080264564A1 (en) | 2007-04-27 | 2008-10-30 | Applied Materials, Inc. | Method of reducing the erosion rate of semiconductor processing apparatus exposed to halogen-containing plasmas |
| US20080213496A1 (en) * | 2002-02-14 | 2008-09-04 | Applied Materials, Inc. | Method of coating semiconductor processing apparatus with protective yttrium-containing coatings |
| US8067067B2 (en) * | 2002-02-14 | 2011-11-29 | Applied Materials, Inc. | Clean, dense yttrium oxide coating protecting semiconductor processing apparatus |
| US7026009B2 (en) | 2002-03-27 | 2006-04-11 | Applied Materials, Inc. | Evaluation of chamber components having textured coatings |
| US7179526B2 (en) * | 2002-08-02 | 2007-02-20 | 3M Innovative Properties Company | Plasma spraying |
| JP2004091269A (ja) | 2002-08-30 | 2004-03-25 | Rikogaku Shinkokai | 多相セラミックス用溶融体ならびにその鋳造および被覆方法 |
| US20040148868A1 (en) * | 2003-02-05 | 2004-08-05 | 3M Innovative Properties Company | Methods of making ceramics |
| JP2005097722A (ja) | 2003-08-25 | 2005-04-14 | Tosoh Corp | 耐蝕性部材及びその製造方法 |
| KR101084553B1 (ko) * | 2003-10-17 | 2011-11-17 | 토소가부시키가이샤 | 진공장치용 부품과 그 제조방법 및 그것을 이용한 장치 |
| US7910218B2 (en) * | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
| DE102004044597B3 (de) * | 2004-09-13 | 2006-02-02 | Forschungszentrum Jülich GmbH | Verfahren zur Herstellung dünner, dichter Keramikschichten |
| US7672110B2 (en) | 2005-08-29 | 2010-03-02 | Applied Materials, Inc. | Electrostatic chuck having textured contact surface |
| US7968205B2 (en) | 2005-10-21 | 2011-06-28 | Shin-Etsu Chemical Co., Ltd. | Corrosion resistant multilayer member |
| KR101344990B1 (ko) | 2006-04-20 | 2013-12-24 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 도전성 내플라즈마 부재 |
| US20080029032A1 (en) | 2006-08-01 | 2008-02-07 | Sun Jennifer Y | Substrate support with protective layer for plasma resistance |
| US7875370B2 (en) | 2006-08-18 | 2011-01-25 | United Technologies Corporation | Thermal barrier coating with a plasma spray top layer |
| US7479464B2 (en) | 2006-10-23 | 2009-01-20 | Applied Materials, Inc. | Low temperature aerosol deposition of a plasma resistive layer |
| US7718559B2 (en) | 2007-04-20 | 2010-05-18 | Applied Materials, Inc. | Erosion resistance enhanced quartz used in plasma etch chamber |
| US7696117B2 (en) | 2007-04-27 | 2010-04-13 | Applied Materials, Inc. | Method and apparatus which reduce the erosion rate of surfaces exposed to halogen-containing plasmas |
| US8367227B2 (en) | 2007-08-02 | 2013-02-05 | Applied Materials, Inc. | Plasma-resistant ceramics with controlled electrical resistivity |
| JP5047741B2 (ja) | 2007-09-13 | 2012-10-10 | コバレントマテリアル株式会社 | 耐プラズマ性セラミックス溶射膜 |
| JP2009068067A (ja) | 2007-09-13 | 2009-04-02 | Covalent Materials Corp | 耐プラズマ性セラミックス溶射膜 |
| US8129029B2 (en) | 2007-12-21 | 2012-03-06 | Applied Materials, Inc. | Erosion-resistant plasma chamber components comprising a metal base structure with an overlying thermal oxidation coating |
| CA2658210A1 (en) * | 2008-04-04 | 2009-10-04 | Sulzer Metco Ag | Method and apparatus for the coating and for the surface treatment of substrates by means of a plasma beam |
| US9725797B2 (en) * | 2008-04-30 | 2017-08-08 | United Technologies Corporation | Process for forming an improved durability thick ceramic coating |
| US8206829B2 (en) | 2008-11-10 | 2012-06-26 | Applied Materials, Inc. | Plasma resistant coatings for plasma chamber components |
| US9017765B2 (en) | 2008-11-12 | 2015-04-28 | Applied Materials, Inc. | Protective coatings resistant to reactive plasma processing |
| JP2011117012A (ja) | 2009-11-30 | 2011-06-16 | Mitsubishi Heavy Ind Ltd | 遮熱コーティングの施工方法、耐熱部材及びガスタービン |
| US20110198034A1 (en) | 2010-02-11 | 2011-08-18 | Jennifer Sun | Gas distribution showerhead with coating material for semiconductor processing |
| JP2011177743A (ja) * | 2010-03-01 | 2011-09-15 | Honda Motor Co Ltd | プラズマ溶接トーチ、及びプラズマ溶接トーチを用いた溶接方法 |
| TW201209957A (en) | 2010-05-28 | 2012-03-01 | Praxair Technology Inc | Substrate supports for semiconductor applications |
| FI125358B (fi) | 2010-07-09 | 2015-09-15 | Teknologian Tutkimuskeskus Vtt Oy | Termisesti ruiskutettu täysin amorfinen oksidipinnoite |
| US20120183790A1 (en) | 2010-07-14 | 2012-07-19 | Christopher Petorak | Thermal spray composite coatings for semiconductor applications |
| US8916021B2 (en) | 2010-10-27 | 2014-12-23 | Applied Materials, Inc. | Electrostatic chuck and showerhead with enhanced thermal properties and methods of making thereof |
| CN103194715B (zh) * | 2012-01-05 | 2015-07-01 | 中国科学院微电子研究所 | 一种大气等离子喷涂技术制备非晶Y3Al5O12涂层的方法 |
| US9034199B2 (en) | 2012-02-21 | 2015-05-19 | Applied Materials, Inc. | Ceramic article with reduced surface defect density and process for producing a ceramic article |
| US9212099B2 (en) | 2012-02-22 | 2015-12-15 | Applied Materials, Inc. | Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramics |
| US20150064406A1 (en) | 2012-03-22 | 2015-03-05 | Tocalo Co., Ltd. | Method for forming fluoride spray coating, and fluoride spray coating covered member |
| US20130273313A1 (en) | 2012-04-13 | 2013-10-17 | Applied Materials, Inc. | Ceramic coated ring and process for applying ceramic coating |
| US9090046B2 (en) | 2012-04-16 | 2015-07-28 | Applied Materials, Inc. | Ceramic coated article and process for applying ceramic coating |
| US20130288037A1 (en) | 2012-04-27 | 2013-10-31 | Applied Materials, Inc. | Plasma spray coating process enhancement for critical chamber components |
| US9394615B2 (en) | 2012-04-27 | 2016-07-19 | Applied Materials, Inc. | Plasma resistant ceramic coated conductive article |
| US9988702B2 (en) | 2012-05-22 | 2018-06-05 | Kabushiki Kaisha Toshiba | Component for plasma processing apparatus and method for manufacturing component for plasma processing apparatus |
| US9604249B2 (en) | 2012-07-26 | 2017-03-28 | Applied Materials, Inc. | Innovative top-coat approach for advanced device on-wafer particle performance |
| US9447365B2 (en) | 2012-07-27 | 2016-09-20 | Applied Materials, Inc. | Enhanced cleaning process of chamber used plasma spray coating without damaging coating |
| US9343289B2 (en) | 2012-07-27 | 2016-05-17 | Applied Materials, Inc. | Chemistry compatible coating material for advanced device on-wafer particle performance |
| JP6246567B2 (ja) | 2012-11-22 | 2017-12-13 | 群馬県 | 複層皮膜付き基材およびその製造方法 |
| US9916998B2 (en) | 2012-12-04 | 2018-03-13 | Applied Materials, Inc. | Substrate support assembly having a plasma resistant protective layer |
| US8941969B2 (en) | 2012-12-21 | 2015-01-27 | Applied Materials, Inc. | Single-body electrostatic chuck |
| US9358702B2 (en) | 2013-01-18 | 2016-06-07 | Applied Materials, Inc. | Temperature management of aluminium nitride electrostatic chuck |
| JP6262716B2 (ja) | 2013-03-13 | 2018-01-17 | 株式会社フジミインコーポレーテッド | 溶射用粉末、及び溶射皮膜の形成方法 |
| US9816392B2 (en) * | 2013-04-10 | 2017-11-14 | General Electric Company | Architectures for high temperature TBCs with ultra low thermal conductivity and abradability and method of making |
| US9583369B2 (en) | 2013-07-20 | 2017-02-28 | Applied Materials, Inc. | Ion assisted deposition for rare-earth oxide based coatings on lids and nozzles |
| US10468235B2 (en) | 2013-09-18 | 2019-11-05 | Applied Materials, Inc. | Plasma spray coating enhancement using plasma flame heat treatment |
| US9440886B2 (en) | 2013-11-12 | 2016-09-13 | Applied Materials, Inc. | Rare-earth oxide based monolithic chamber material |
| US9250588B1 (en) | 2013-11-21 | 2016-02-02 | Kyocera Document Solutions Inc. | Fixing device and image forming apparatus including this |
| JP5894198B2 (ja) | 2014-01-06 | 2016-03-23 | 株式会社フジミインコーポレーテッド | 溶射用スラリー及び溶射皮膜の形成方法 |
| US20170022595A1 (en) | 2014-03-31 | 2017-01-26 | Kabushiki Kaisha Toshiba | Plasma-Resistant Component, Method For Manufacturing The Plasma-Resistant Component, And Film Deposition Apparatus Used For Manufacturing The Plasma-Resistant Component |
| US10730798B2 (en) | 2014-05-07 | 2020-08-04 | Applied Materials, Inc. | Slurry plasma spray of plasma resistant ceramic coating |
| US10196728B2 (en) | 2014-05-16 | 2019-02-05 | Applied Materials, Inc. | Plasma spray coating design using phase and stress control |
-
2015
- 2015-05-14 US US14/712,054 patent/US10196728B2/en active Active
- 2015-05-15 KR KR1020227020158A patent/KR20220084213A/ko not_active Ceased
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- 2018-12-21 US US16/231,139 patent/US10604831B2/en active Active
-
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- 2020-02-19 US US16/794,634 patent/US11578398B2/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102084020A (zh) * | 2008-02-26 | 2011-06-01 | 应用材料公司 | 可抵抗还原等离子体的含钇陶瓷涂层 |
| KR20130090303A (ko) * | 2012-02-03 | 2013-08-13 | 주식회사케이세라셀 | 정전척 제조용 플라즈마 스프레이 코팅 재료 및 이의 제조방법 |
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| JP7033919B2 (ja) | 2022-03-11 |
| CN113620710A (zh) | 2021-11-09 |
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