CN113165986A - 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 - Google Patents
陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 Download PDFInfo
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- CN113165986A CN113165986A CN201980075826.5A CN201980075826A CN113165986A CN 113165986 A CN113165986 A CN 113165986A CN 201980075826 A CN201980075826 A CN 201980075826A CN 113165986 A CN113165986 A CN 113165986A
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310371038.9A CN116353153A (zh) | 2018-11-22 | 2019-11-22 | 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-218964 | 2018-11-22 | ||
| JP2018218964 | 2018-11-22 | ||
| PCT/JP2019/045833 WO2020105734A1 (ja) | 2018-11-22 | 2019-11-22 | セラミックス-銅複合体、セラミックス-銅複合体の製造方法、セラミックス回路基板およびパワーモジュール |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310371038.9A Division CN116353153A (zh) | 2018-11-22 | 2019-11-22 | 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 |
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| Publication Number | Publication Date |
|---|---|
| CN113165986A true CN113165986A (zh) | 2021-07-23 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980075826.5A Pending CN113165986A (zh) | 2018-11-22 | 2019-11-22 | 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 |
| CN202310371038.9A Pending CN116353153A (zh) | 2018-11-22 | 2019-11-22 | 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310371038.9A Pending CN116353153A (zh) | 2018-11-22 | 2019-11-22 | 陶瓷-铜复合体、陶瓷-铜复合体的制造方法、陶瓷电路基板及功率模块 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12065385B2 (https=) |
| EP (1) | EP3885331B1 (https=) |
| JP (1) | JP7410872B2 (https=) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2021187201A1 (ja) * | 2020-03-18 | 2021-09-23 | 株式会社 東芝 | 接合体、セラミックス銅回路基板、接合体の製造方法、およびセラミックス銅回路基板の製造方法 |
| JP7537900B2 (ja) | 2020-03-31 | 2024-08-21 | Dowaメタルテック株式会社 | ろう材およびその製造方法並びに金属-セラミックス接合基板の製造方法 |
| CN113939095B (zh) | 2020-06-29 | 2023-02-10 | 比亚迪股份有限公司 | 一种陶瓷覆铜板及其制备方法 |
| DE102020120189A1 (de) * | 2020-07-30 | 2022-02-03 | Rogers Germany Gmbh | Verfahren zur Herstellung eines Metall-Keramik-Substrats und ein Metall-Keramik-Substrat hergestellt mit einem solchen Verfahren |
| KR20260009336A (ko) * | 2023-06-14 | 2026-01-19 | 교세라 가부시키가이샤 | 금속과 절연체의 접합체, 그 용도, 및 금속과 절연체의 접합체의 제조 방법 |
| WO2025211988A1 (ru) * | 2024-04-01 | 2025-10-09 | Рафаиль Исмагильевич ШАЙДУЛЛИН | Способ изготовления медно-керамических композитов для плат силовой электроники |
| CN119794486A (zh) * | 2025-01-13 | 2025-04-11 | 武汉理工大学 | 一种基于Ag@TiH2复合钎料的Si3N4/Cu连接件及其制备与应用 |
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- 2019-11-22 WO PCT/JP2019/045833 patent/WO2020105734A1/ja not_active Ceased
- 2019-11-22 JP JP2020557676A patent/JP7410872B2/ja active Active
- 2019-11-22 EP EP19887440.6A patent/EP3885331B1/en active Active
- 2019-11-22 KR KR1020217016267A patent/KR20210097123A/ko active Pending
- 2019-11-22 CN CN202310371038.9A patent/CN116353153A/zh active Pending
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7410872B2 (ja) | 2024-01-10 |
| EP3885331A1 (en) | 2021-09-29 |
| US20220009842A1 (en) | 2022-01-13 |
| EP3885331A4 (en) | 2022-01-19 |
| WO2020105734A1 (ja) | 2020-05-28 |
| CN116353153A (zh) | 2023-06-30 |
| EP3885331B1 (en) | 2024-03-06 |
| KR20210097123A (ko) | 2021-08-06 |
| JPWO2020105734A1 (ja) | 2021-10-14 |
| US12065385B2 (en) | 2024-08-20 |
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