KR20210097123A - 세라믹스-구리 복합체, 세라믹스-구리 복합체의 제조 방법, 세라믹스 회로 기판 및 파워 모듈 - Google Patents

세라믹스-구리 복합체, 세라믹스-구리 복합체의 제조 방법, 세라믹스 회로 기판 및 파워 모듈 Download PDF

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KR20210097123A
KR20210097123A KR1020217016267A KR20217016267A KR20210097123A KR 20210097123 A KR20210097123 A KR 20210097123A KR 1020217016267 A KR1020217016267 A KR 1020217016267A KR 20217016267 A KR20217016267 A KR 20217016267A KR 20210097123 A KR20210097123 A KR 20210097123A
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copper
ceramic
layer
region
composite
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KR1020217016267A
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English (en)
Korean (ko)
Inventor
아키마사 유아사
다카히로 나카무라
슈헤이 모리타
고지 니시무라
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덴카 주식회사
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B18/00—Layered products essentially comprising ceramics, e.g. refractory products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
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    • H01L23/14—
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
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    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
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    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
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    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
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    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
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    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
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  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
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  • Manufacturing Of Printed Wiring (AREA)
KR1020217016267A 2018-11-22 2019-11-22 세라믹스-구리 복합체, 세라믹스-구리 복합체의 제조 방법, 세라믹스 회로 기판 및 파워 모듈 Pending KR20210097123A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-218964 2018-11-22
JP2018218964 2018-11-22
PCT/JP2019/045833 WO2020105734A1 (ja) 2018-11-22 2019-11-22 セラミックス－銅複合体、セラミックス－銅複合体の製造方法、セラミックス回路基板およびパワーモジュール

Publications (1)

Publication Number Publication Date
KR20210097123A true KR20210097123A (ko) 2021-08-06

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