CN1131164C - 加衬垫的晶片容器 - Google Patents
加衬垫的晶片容器 Download PDFInfo
- Publication number
- CN1131164C CN1131164C CN99809950A CN99809950A CN1131164C CN 1131164 C CN1131164 C CN 1131164C CN 99809950 A CN99809950 A CN 99809950A CN 99809950 A CN99809950 A CN 99809950A CN 1131164 C CN1131164 C CN 1131164C
- Authority
- CN
- China
- Prior art keywords
- wafer
- liner
- support
- level face
- door
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67369—Closed carriers characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67383—Closed carriers characterised by substrate supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49826—Assembling or joining
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
- Buffer Packaging (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9224798P | 1998-07-10 | 1998-07-10 | |
US60/092,247 | 1998-07-10 | ||
US09/349,314 US6267245B1 (en) | 1998-07-10 | 1999-07-08 | Cushioned wafer container |
US09/349,314 | 1999-07-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1313825A CN1313825A (zh) | 2001-09-19 |
CN1131164C true CN1131164C (zh) | 2003-12-17 |
Family
ID=26785437
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN99809950A Expired - Lifetime CN1131164C (zh) | 1998-07-10 | 1999-07-09 | 加衬垫的晶片容器 |
Country Status (7)
Country | Link |
---|---|
US (1) | US6267245B1 (zh) |
EP (1) | EP1133437B1 (zh) |
JP (3) | JP2003522078A (zh) |
KR (1) | KR100843732B1 (zh) |
CN (1) | CN1131164C (zh) |
HK (1) | HK1039475A1 (zh) |
WO (1) | WO2000002798A1 (zh) |
Families Citing this family (89)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6736268B2 (en) * | 1997-07-11 | 2004-05-18 | Entegris, Inc. | Transport module |
US6871741B2 (en) * | 1998-05-28 | 2005-03-29 | Entegris, Inc. | Composite substrate carrier |
US6808668B2 (en) * | 1998-05-28 | 2004-10-26 | Entegris, Inc. | Process for fabricating composite substrate carrier |
US6464081B2 (en) * | 1999-01-06 | 2002-10-15 | Entegris, Inc. | Door guide for a wafer container |
JP3938293B2 (ja) * | 2001-05-30 | 2007-06-27 | 信越ポリマー株式会社 | 精密基板収納容器及びその押さえ部材 |
US6923325B2 (en) | 2001-07-12 | 2005-08-02 | Entegris, Inc. | Horizontal cassette |
TW511649U (en) * | 2001-09-12 | 2002-11-21 | Ind Tech Res Inst | Wafer retainer |
US7059475B2 (en) | 2001-10-04 | 2006-06-13 | Entegris, Inc. | System for cushioning wafer in wafer carrier |
JP4153874B2 (ja) * | 2001-11-14 | 2008-09-24 | インテグリス・インコーポレーテッド | ウエハ保持システムを備えたウエハ・キャリア |
WO2003042073A1 (en) * | 2001-11-14 | 2003-05-22 | Entegris, Inc. | Wafer support attachment for a semi-conductor wafer transport container |
US6644477B2 (en) * | 2002-02-26 | 2003-11-11 | Entegris, Inc. | Wafer container cushion system |
US7175026B2 (en) | 2002-05-03 | 2007-02-13 | Maxtor Corporation | Memory disk shipping container with improved contaminant control |
US20040074808A1 (en) * | 2002-07-05 | 2004-04-22 | Entegris, Inc. | Fire retardant wafer carrier |
US7823730B2 (en) * | 2002-09-11 | 2010-11-02 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
JP4133407B2 (ja) * | 2003-02-13 | 2008-08-13 | ミライアル株式会社 | 薄板収納容器 |
US20040126220A1 (en) * | 2002-12-31 | 2004-07-01 | Howell Ryan Lee | Front opening shipping box |
US7455181B2 (en) | 2003-05-19 | 2008-11-25 | Miraial Co., Ltd. | Lid unit for thin plate supporting container |
TWI239931B (en) * | 2003-05-19 | 2005-09-21 | Miraial Co Ltd | Lid unit for thin plate supporting container and thin plate supporting container |
US7131248B2 (en) * | 2003-07-14 | 2006-11-07 | Peak Plastic & Metal Products (Int'l) Limited | Wafer shipper with orientation control |
US7344030B2 (en) * | 2003-11-07 | 2008-03-18 | Entegris, Inc. | Wafer carrier with apertured door for cleaning |
US7182203B2 (en) * | 2003-11-07 | 2007-02-27 | Entegris, Inc. | Wafer container and door with vibration dampening latching mechanism |
JP4681221B2 (ja) * | 2003-12-02 | 2011-05-11 | ミライアル株式会社 | 薄板支持容器 |
JP4903893B2 (ja) * | 2003-12-02 | 2012-03-28 | ミライアル株式会社 | 薄板支持容器用蓋体 |
JP2005294386A (ja) * | 2004-03-31 | 2005-10-20 | Miraial Kk | 薄板支持容器用蓋体 |
WO2005112535A1 (ja) * | 2004-05-13 | 2005-11-24 | Matsushita Electric Industrial Co., Ltd. | 部品供給用プレート収容体及び部品供給装置 |
JP4667769B2 (ja) * | 2004-06-11 | 2011-04-13 | 信越ポリマー株式会社 | 基板収納容器 |
US20060042998A1 (en) * | 2004-08-24 | 2006-03-02 | Haggard Clifton C | Cushion for packing disks such as semiconductor wafers |
US7720558B2 (en) | 2004-09-04 | 2010-05-18 | Applied Materials, Inc. | Methods and apparatus for mapping carrier contents |
JP4338617B2 (ja) * | 2004-10-20 | 2009-10-07 | 信越ポリマー株式会社 | 基板収納容器 |
US7523830B2 (en) * | 2004-11-23 | 2009-04-28 | Entegris, Inc. | Wafer container with secondary wafer restraint system |
US7528936B2 (en) * | 2005-02-27 | 2009-05-05 | Entegris, Inc. | Substrate container with pressure equalization |
JP2006269771A (ja) * | 2005-03-24 | 2006-10-05 | Miraial Kk | 気密容器 |
EP1902465A2 (en) | 2005-07-08 | 2008-03-26 | Asyst Technologies, Inc. | Workpiece support structures and apparatus for accessing same |
JP2007123673A (ja) * | 2005-10-31 | 2007-05-17 | Asyst Shinko Inc | 物品収納用容器の防振機構 |
US8365919B2 (en) * | 2005-12-29 | 2013-02-05 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
JP5385130B2 (ja) * | 2006-06-13 | 2014-01-08 | インテグリス・インコーポレーテッド | ウェハ収納容器用の再利用可能な弾性クッション |
US20080006559A1 (en) * | 2006-07-07 | 2008-01-10 | Entegris, Inc. | Substrate carrier and handle |
US20080157455A1 (en) * | 2006-12-29 | 2008-07-03 | Applied Materials, Inc. | Compliant substrate holding assembly |
JP4964065B2 (ja) * | 2007-09-03 | 2012-06-27 | 積水化成品工業株式会社 | 板状体の搬送容器 |
JP4764865B2 (ja) * | 2007-11-13 | 2011-09-07 | 信越ポリマー株式会社 | リテーナ及び基板収納容器 |
JP4852023B2 (ja) * | 2007-11-19 | 2012-01-11 | 信越ポリマー株式会社 | リテーナ及び基板収納容器 |
US20090175707A1 (en) * | 2008-01-03 | 2009-07-09 | Bonora Anthony C | Controlled deflection of large area semiconductor substrates for shipping and manufacturing containers |
KR101525753B1 (ko) | 2008-01-13 | 2015-06-09 | 엔테그리스, 아이엔씨. | 큰 지름의 웨이퍼를 취급하는 장치 및 방법 |
CN102017118B (zh) * | 2008-04-25 | 2013-03-06 | 信越聚合物株式会社 | 保持器及包括保持器的基板收纳容器 |
TWI337162B (en) * | 2008-07-31 | 2011-02-11 | Gudeng Prec Industral Co Ltd | A wafer container with constraints |
US7971722B2 (en) * | 2008-08-08 | 2011-07-05 | Gudeng Precision Industral Co, Ltd | Wafer container with restrainer |
TWI400766B (zh) * | 2008-08-27 | 2013-07-01 | Gudeng Prec Industral Co Ltd | 具一體成形晶圓限制件模組之前開式晶圓盒 |
TWI343353B (en) * | 2008-11-04 | 2011-06-11 | Gudeng Prec Industral Co Ltd | A wafer container having the snap-fitting constraint module |
KR101165613B1 (ko) * | 2009-05-13 | 2012-07-16 | 미라이얼 가부시키가이샤 | 반도체 웨이퍼 수납용기 |
JP5424201B2 (ja) | 2009-08-27 | 2014-02-26 | アユミ工業株式会社 | 加熱溶融処理装置および加熱溶融処理方法 |
CN102844249B (zh) * | 2010-04-20 | 2014-09-10 | 未来儿株式会社 | 基板收纳容器 |
CN102858653B (zh) * | 2010-05-24 | 2014-09-10 | 未来儿株式会社 | 基板收纳容器 |
TWI465375B (zh) * | 2010-06-02 | 2014-12-21 | Gudeng Prec Industral Co Ltd | 一種配置有彈性件模組之晶圓盒 |
US20130299384A1 (en) * | 2010-10-19 | 2013-11-14 | Entegris, Inc. | Front opening wafer container with wafer cushion |
WO2012054630A2 (en) * | 2010-10-20 | 2012-04-26 | Entegris, Inc. | Front opening wafer container with door deflection minimization |
US9224627B2 (en) * | 2011-02-16 | 2015-12-29 | Texchem Advanced Products Incorporated Sdn Bhd | Single and dual stage wafer cushion and wafer separator |
WO2012151431A2 (en) | 2011-05-03 | 2012-11-08 | Entergris, Inc. | Wafer container with particle shield |
CN106941087B (zh) | 2011-08-12 | 2020-03-10 | 恩特格里斯公司 | 晶片载具 |
WO2013166515A1 (en) * | 2012-05-04 | 2013-11-07 | Entegris, Inc. | Wafer container with door mounted shipping cushions |
JP6214630B2 (ja) * | 2012-05-04 | 2017-10-18 | インテグリス・インコーポレーテッド | ウェーハを支える交換可能なバックストップ |
KR20140092548A (ko) * | 2013-01-16 | 2014-07-24 | 삼성전자주식회사 | 웨이퍼 보관 장치 |
US9184077B2 (en) | 2013-09-30 | 2015-11-10 | Taiwan Semiconductor Manufacturing Co., Ltd | Wafer pod and wafer positioning mechanism thereof |
US9304690B2 (en) | 2014-05-07 | 2016-04-05 | HGST Netherlands B.V. | System and method for peer-to-peer PCIe storage transfers |
SG11201701526QA (en) * | 2014-08-28 | 2017-03-30 | Entegris Inc | Substrate container |
JP6326330B2 (ja) * | 2014-09-05 | 2018-05-16 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
JP6375186B2 (ja) * | 2014-09-05 | 2018-08-15 | 株式会社Screenホールディングス | 基板収納容器、ロードポート装置および基板処理装置 |
JP6415220B2 (ja) * | 2014-09-29 | 2018-10-31 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6430195B2 (ja) * | 2014-09-29 | 2018-11-28 | 株式会社Screenホールディングス | 基板収納容器 |
JP6328534B2 (ja) | 2014-09-30 | 2018-05-23 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
WO2016100843A1 (en) * | 2014-12-18 | 2016-06-23 | Entegris, Inc. | Wafer container with shock condition protection |
TWM510539U (zh) * | 2015-03-13 | 2015-10-11 | Entegris Inc | 使用於膜架傳送裝置的修改彈簧墊 |
TW201709386A (zh) * | 2015-03-25 | 2017-03-01 | 恩特葛瑞斯股份有限公司 | 晶片容器 |
JP6372871B2 (ja) * | 2015-04-10 | 2018-08-15 | 信越ポリマー株式会社 | 基板収納容器 |
JP6577130B2 (ja) | 2015-07-13 | 2019-09-18 | インテグリス・インコーポレーテッド | 収納部が強化された基板容器 |
US20170115657A1 (en) | 2015-10-22 | 2017-04-27 | Lam Research Corporation | Systems for Removing and Replacing Consumable Parts from a Semiconductor Process Module in Situ |
US10062599B2 (en) | 2015-10-22 | 2018-08-28 | Lam Research Corporation | Automated replacement of consumable parts using interfacing chambers |
US10124492B2 (en) | 2015-10-22 | 2018-11-13 | Lam Research Corporation | Automated replacement of consumable parts using end effectors interfacing with plasma processing system |
US9881820B2 (en) * | 2015-10-22 | 2018-01-30 | Lam Research Corporation | Front opening ring pod |
CN109075112A (zh) | 2016-02-05 | 2018-12-21 | 恩特格里斯公司 | 用于衬底容器的缓冲保持器 |
TWI628122B (zh) * | 2016-03-15 | 2018-07-01 | 景碩科技股份有限公司 | Card with open and close frame |
US10388554B2 (en) | 2016-04-06 | 2019-08-20 | Entegris, Inc. | Wafer shipper with purge capability |
TWI642602B (zh) * | 2017-03-15 | 2018-12-01 | 景碩科技股份有限公司 | 具有開合式框架的卡匣 |
CN110574152B (zh) * | 2017-04-05 | 2023-10-27 | 未来儿股份有限公司 | 基板收纳容器 |
US11348815B2 (en) | 2017-04-06 | 2022-05-31 | Miraial Co., Ltd. | Board storing container |
US11417554B2 (en) * | 2017-08-10 | 2022-08-16 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container and method of manufacturing the same |
JP6992240B2 (ja) * | 2017-11-16 | 2022-01-13 | 信越ポリマー株式会社 | 基板収納容器 |
US11756816B2 (en) * | 2019-07-26 | 2023-09-12 | Applied Materials, Inc. | Carrier FOUP and a method of placing a carrier |
KR20240049518A (ko) * | 2021-08-27 | 2024-04-16 | 미라이얼 가부시키가이샤 | 기판수납용기, 그 제조방법 및 뚜껑체측 기판지지부 |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4043451A (en) | 1976-03-18 | 1977-08-23 | Fluoroware, Inc. | Shipping container for silicone semiconductor wafers |
US4248346A (en) | 1979-01-29 | 1981-02-03 | Fluoroware, Inc. | Shipping container for semiconductor substrate wafers |
DE3413837A1 (de) | 1984-04-12 | 1985-10-17 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verpackung fuer halbleiterscheiben |
US5024329A (en) | 1988-04-22 | 1991-06-18 | Siemens Aktiengesellschaft | Lockable container for transporting and for storing semiconductor wafers |
JPH01274447A (ja) * | 1988-04-26 | 1989-11-02 | Nippon Steel Corp | ウェーハ輸送用ケース |
JPH0744020Y2 (ja) * | 1989-02-10 | 1995-10-09 | 信越ポリマー株式会社 | ウエーハ容器におけるウエーハ支持板 |
JPH04120723A (ja) * | 1990-09-12 | 1992-04-21 | Kawasaki Steel Corp | ウエハ熱処理用治具 |
JPH04257244A (ja) * | 1991-02-12 | 1992-09-11 | Fujitsu Ltd | ウェーハキャリア |
US5207324A (en) | 1991-03-08 | 1993-05-04 | Fluoroware, Inc. | Wafer cushion for shippers |
US5253755A (en) * | 1991-03-20 | 1993-10-19 | Fluoroware, Inc. | Cushioned cover for disk container |
US5555981A (en) * | 1992-05-26 | 1996-09-17 | Empak, Inc. | Wafer suspension box |
US5273159A (en) * | 1992-05-26 | 1993-12-28 | Empak, Inc. | Wafer suspension box |
JP3256584B2 (ja) * | 1992-12-15 | 2002-02-12 | 三菱電機株式会社 | 半導体ウエハ密閉容器、半導体処理装置及び半導体ウエハ搬送装置 |
JPH0679152U (ja) * | 1993-04-22 | 1994-11-04 | 株式会社大八化成 | 半導体ウエーハ運搬用容器の構造 |
US5472086A (en) | 1994-03-11 | 1995-12-05 | Holliday; James E. | Enclosed sealable purgible semiconductor wafer holder |
JPH07302833A (ja) * | 1994-05-09 | 1995-11-14 | Hitachi Cable Ltd | ウェハ用キャリア |
US5482161A (en) | 1994-05-24 | 1996-01-09 | Fluoroware, Inc. | Mechanical interface wafer container |
US5586658A (en) | 1995-06-06 | 1996-12-24 | Fluoroware, Inc. | Wafer cushions for wafer shipper |
US5575394A (en) * | 1994-07-15 | 1996-11-19 | Fluoroware, Inc. | Wafer shipper and package |
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JPH0864669A (ja) * | 1994-08-25 | 1996-03-08 | Hitachi Cable Ltd | ウエハボックス |
US5785186A (en) * | 1994-10-11 | 1998-07-28 | Progressive System Technologies, Inc. | Substrate housing and docking system |
EP0744765A1 (en) | 1995-05-22 | 1996-11-27 | Symbios Logic Inc. | Apparatus for storing and carrying semiconductor wafers |
JPH09107026A (ja) * | 1995-10-12 | 1997-04-22 | Shin Etsu Polymer Co Ltd | ウェーハ収納容器のウェーハカセット |
JPH1010705A (ja) * | 1996-06-25 | 1998-01-16 | Nikon Corp | レチクルケース |
US5788082A (en) * | 1996-07-12 | 1998-08-04 | Fluoroware, Inc. | Wafer carrier |
US5915562A (en) | 1996-07-12 | 1999-06-29 | Fluoroware, Inc. | Transport module with latching door |
JP4024333B2 (ja) * | 1996-12-04 | 2007-12-19 | ミライアル株式会社 | 薄板支持器 |
JPH10233437A (ja) * | 1997-02-20 | 1998-09-02 | Komatsu Kasei Kk | 半導体ウェハ包装容器 |
-
1999
- 1999-07-08 US US09/349,314 patent/US6267245B1/en not_active Expired - Lifetime
- 1999-07-09 KR KR1020017000419A patent/KR100843732B1/ko not_active IP Right Cessation
- 1999-07-09 JP JP2000559036A patent/JP2003522078A/ja not_active Ceased
- 1999-07-09 WO PCT/US1999/014870 patent/WO2000002798A1/en active Application Filing
- 1999-07-09 CN CN99809950A patent/CN1131164C/zh not_active Expired - Lifetime
- 1999-07-09 EP EP99933631.6A patent/EP1133437B1/en not_active Expired - Lifetime
-
2002
- 2002-02-16 HK HK02101136.1A patent/HK1039475A1/zh unknown
-
2007
- 2007-02-14 JP JP2007065797A patent/JP4847374B2/ja not_active Expired - Lifetime
-
2011
- 2011-08-10 JP JP2011175099A patent/JP5185417B2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
WO2000002798A8 (en) | 2000-06-15 |
JP4847374B2 (ja) | 2011-12-28 |
WO2000002798A1 (en) | 2000-01-20 |
KR100843732B1 (ko) | 2008-07-04 |
JP2007227941A (ja) | 2007-09-06 |
KR20010071835A (ko) | 2001-07-31 |
EP1133437A4 (en) | 2008-04-09 |
JP2003522078A (ja) | 2003-07-22 |
HK1039475A1 (zh) | 2002-04-26 |
EP1133437A1 (en) | 2001-09-19 |
EP1133437B1 (en) | 2014-05-14 |
CN1313825A (zh) | 2001-09-19 |
WO2000002798A9 (en) | 2000-07-27 |
US6267245B1 (en) | 2001-07-31 |
JP5185417B2 (ja) | 2013-04-17 |
JP2011233934A (ja) | 2011-11-17 |
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