CN113035751A - Chip rotating device of stress-relief etching machine and equipment thereof - Google Patents
Chip rotating device of stress-relief etching machine and equipment thereof Download PDFInfo
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- CN113035751A CN113035751A CN202110231609.XA CN202110231609A CN113035751A CN 113035751 A CN113035751 A CN 113035751A CN 202110231609 A CN202110231609 A CN 202110231609A CN 113035751 A CN113035751 A CN 113035751A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses a chip rotating device of a destressing corrosion machine and equipment thereof.A base of a supporting component is connected with a plurality of flower baskets in a sliding way, a bracket and side plates are arranged at two sides of the base, a cylinder shell of a rotating component is arranged on the side plates, a sliding plate is arranged in the cylinder shell in a sliding way, a supporting platform is connected with the sliding plate through a connecting plate, a rotating motor is arranged on the supporting platform, a rotating rod is connected with the rotating motor through a driver, a first air pump and a second air pump are communicated with the cylinder shell, and a sealing plate is arranged on the connecting rod. The basket of flowers sets up on the slide, starts to rotate the motor, thereby the driver drives the bull stick and rotates and can drive the chip and rotate and corrode, then the first cylinder of cross start and second cylinder drive a supporting bench and reciprocate, drive the chip and reciprocate and carry out more abundant corruption and washing in the basket of flowers for processing can be more even, solves current device because concentric rotation can make mid portion process problem not even enough.
Description
Technical Field
The invention relates to the field of semiconductor processing, in particular to a chip rotating device of a destressing etching machine and equipment thereof.
Background
During the fabrication of semiconductor integrated circuits, semiconductor wafers are typically subjected to a number of process steps, such as film deposition, etching, polishing, etc. These process steps become important sites for contamination generation. In order to maintain the wafer surface clean and remove contaminants deposited on the wafer surface during the various process steps, the wafer surface after each process step must be cleaned. Therefore, the cleaning process becomes the most common process step in the integrated circuit fabrication process, and aims to effectively control the contamination level of each step to achieve the goal of each process step.
In the wet etching and wet cleaning processes, a large amount of chemical liquid is used, and the purpose of removing specific materials or removing pollutants is achieved by utilizing the corrosion characteristics of the chemical liquid. In single-chip wet equipment, a chemical liquid medicine is sprayed to the surface of a rotating wafer by utilizing a spray arm structure to realize the purpose of corrosion or cleaning, and the middle part of the traditional device is not processed uniformly due to concentric rotation.
Disclosure of Invention
The invention aims to provide a chip rotating device of a stress-relief etching machine and equipment thereof, and aims to solve the problem that the middle part of the traditional device is not uniformly processed due to concentric rotation.
In order to achieve the above object, in a first aspect, the present invention provides a chip rotation apparatus for a stress-relief etching machine, including a support assembly and a rotation assembly, the support assembly includes a base, a plurality of baskets, a bracket and a side plate, the base has a slideway, the baskets are slidably connected with the slideway and are located at one side of the slideway, the bracket is fixedly connected with the base and is located at one side of the base, the side plate is fixedly connected with the base and is located at one side of the slideway, the rotation assembly includes a rotation motor, a driver, a rotation rod, a support table, a first air pump, a second air pump, a cylinder housing, a sliding plate, a connecting plate and a sealing plate, the cylinder housing has a first through hole and a second through hole, the cylinder housing is fixedly connected with the side plate and is located at one side of the side plate, the sliding plate is slidably connected with the cylinder housing, and is located in the cylinder casing, the first air pump and the second air pump are fixedly connected with the side plate and are respectively communicated with the first through hole and the second through hole, the support table is fixedly connected with the connecting plate and is located at one side of the connecting plate, the rotating motor is fixedly connected with the support table and is located at one side of the support table, the driver is fixedly connected with an output shaft of the rotating motor and is located at one side of the slideway, the rotating rod is meshed with the driver and is located at one side of the slideway, and the sealing plate is fixedly connected with the connecting plate and contacts the cylinder casing.
The transmission device comprises a first gear, a second gear and a third gear, the first gear is fixedly connected with an output shaft of the rotating motor and is located on one side of the rotating motor, the second gear and the third gear are rotatably connected with the supporting table and are located on one side of the supporting table, the second gear is meshed with the first gear, and the third gear is meshed with the second gear and the rotating rod.
The flower basket comprises a plurality of spacers and a flower basket body, the flower basket body is provided with a third through hole, and the spacers are fixedly connected with the flower basket body and located in the third through hole.
The flower basket further comprises two supporting shoulders, the two supporting shoulders are fixedly connected with the flower basket body, located on two sides of the flower basket body and connected with the slide ways in a sliding mode.
Wherein, the supporting component further comprises a conveying line, and the conveying line is arranged on one side of the base.
The support assembly further comprises a photoelectric sensor, and the photoelectric sensor is fixedly connected with the support and is positioned on one side of the slide way.
In a second aspect, the present invention further provides a chip rotation apparatus of a stress-relief etching machine, including: chip rotary device and corruption subassembly of destressing corrosion machine, the corruption subassembly includes support arm, corrosion nozzle, washing shower nozzle and end box, the support arm with support fixed connection, and be located one side of support, corrosion nozzle with wash the shower nozzle with support arm fixed connection, and be located one side of support arm, end box with base fixed connection, and be located the base is kept away from one side of support.
The support arm comprises an arm body and a sliding rod, the arm body is fixedly connected with the support and is positioned on one side of the support, the sliding rod is slidably connected with the arm body and is positioned on one side of the arm body, and the corrosion sprayer and the cleaning sprayer are arranged on the sliding rod.
The invention relates to a chip rotating device of a destressing corrosion machine and equipment thereof, wherein a plurality of flower baskets are connected with a slideway in a sliding way, the flower baskets can be supported by the slideway to slide, a plurality of chips to be processed are placed in the flower baskets, a bracket is fixedly connected with a base, a side plate is fixedly connected with the base and used for installing a rotating component, a cylinder shell is fixedly connected with the side plate, a sliding plate is connected with the cylinder shell in a sliding way, so that the sliding plate can slide in the cylinder shell, a first air pump and a second air pump are fixedly connected with the side plate, the sliding plate can be pushed to move up and down in the cylinder shell by respectively starting the first air pump and the second air pump, a support table is fixedly connected with the connecting plate, and a support plate can move up and down along with the sliding plate under the action of the connecting plate, the rotary motor is fixedly connected with the supporting table, the driver is fixedly connected with an output shaft of the rotary motor, the rotary motor can drive the driver to rotate, the rotating rod is meshed with the driver, the driver can drive the rotating rod to drive, the rotating rod can contact with a chip in the flower basket to drive the chip to rotate, the sealing plate is fixedly connected with the connecting plate, an opening in the cylinder shell can be sealed, and gas leakage in the moving process is avoided. Through with the basket of flowers sets up on the slide, then start rotate the motor, through the actuator drives thereby the bull stick rotates and can drive the chip rotates and corrodes, then cross start first cylinder with the second cylinder drives the brace table reciprocates to drive the chip and be in reciprocate in the basket of flowers and carry out more abundant corruption and washing, make processing more even, thereby solve current device because concentric rotation can make the not enough even problem of mid portion processing.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a bottom structural view of a chip rotating apparatus of a stress-relief etching machine according to the present invention;
FIG. 2 is a top view of a chip rotation device of a stress-relief etching machine according to the present invention;
FIG. 3 is a schematic cross-sectional view of a wafer rotating apparatus of a stress-relief etching apparatus according to the present invention;
FIG. 4 is a top view of a chip spinning apparatus of a stress relief etching machine according to the present invention;
FIG. 5 is a bottom view of a chip rotating apparatus of a stress-relief etching machine according to the present invention.
1-support component, 2-rotating component, 4-corrosion component, 11-base, 12-flower basket, 13-support, 14-side plate, 15-conveying line, 16-photoelectric sensor, 21-rotating motor, 22-driver, 23-rotating rod, 24-support platform, 25-first air pump, 26-second air pump, 27-cylinder shell, 28-sliding plate, 29-connecting plate, 30-sealing plate, 31-auxiliary rod, 32-stabilizing seat, 41-support arm, 42-corrosion nozzle, 43-cleaning nozzle, 44-bottom box, 111-slideway, 121-spacer, 122-flower basket body, 123-third through hole, 124-support shoulder, 221-first gear, 222-second gear, 223-third gear, 271-first through hole, 272-second through hole, 411-arm body, 412-sliding rod and 413-adjusting screw rod.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In a first aspect, referring to fig. 1 to 3, the present invention provides a chip rotation apparatus of a stress-relief etching machine, including:
the flower basket support device comprises a support assembly 1 and a rotating assembly 2, wherein the support assembly 1 comprises a base 11, a plurality of flower baskets 12, a bracket 13 and a side plate 14, the base 11 is provided with a slide rail 111, the plurality of flower baskets 12 are slidably connected with the slide rail 111 and are positioned on one side of the slide rail 111, the bracket 13 is fixedly connected with the base 11 and is positioned on one side of the base 11, the side plate 14 is fixedly connected with the base 11 and is positioned on one side of the slide rail 111, the rotating assembly 2 comprises a rotating motor 21, a driver 22, a rotating rod 23, a support table 24, a first air pump 25, a second air pump 26, a cylinder shell 27, a sliding plate 28, a connecting plate 29 and a sealing plate 30, the cylinder shell 27 is provided with a first through hole 271 and a second through hole 272, the cylinder shell 27 is fixedly connected with the side plate 14 and is positioned on one side of the side plate 14, and the sliding plate 28 is slidably connected, and is located in the cylinder housing 27, the first air pump 25 and the second air pump 26 are fixedly connected with the side plate 14 and are respectively communicated with the first through hole 271 and the second through hole 272, the support table 24 is fixedly connected with the connecting plate 29 and is located at one side of the connecting plate 29, the rotating motor 21 is fixedly connected with the support table 24 and is located at one side of the support table 24, the driver 22 is fixedly connected with an output shaft of the rotating motor 21 and is located at one side of the slideway 111, the rotating rod 23 is engaged with the driver 22 and is located at one side of the slideway 111, and the sealing plate 30 is fixedly connected with the connecting plate 29 and is contacted with the cylinder housing 27.
In the present embodiment, the support assembly 1 includes a base 11, a plurality of flower baskets 12, a support 13 and a side plate 14, the base 11 has a slide rail 111, the plurality of flower baskets 12 are slidably connected to the slide rail 111 and located at one side of the slide rail 111, the flower baskets 12 can be supported by the slide rail 111 to slide, a plurality of chips to be processed are placed in the flower baskets 12, the support 13 is fixedly connected to the base 11 and located at one side of the base 11, the side plate 14 is fixedly connected to the base 11 and located at one side of the slide rail 111 for mounting the rotating assembly 2, the rotating assembly 2 includes a rotating motor 21, a driver 22, a rotating rod 23, a support table 24, a first air pump 25, a second air pump 26, a cylinder housing 27, a sliding plate 28, a connecting plate 29 and a sealing plate 30, the cylinder housing 27 has a first through hole 271 and a second through hole 272, the cylinder housing 27 is fixedly connected with the side plate 14 and is positioned at one side of the side plate 14, the sliding plate 28 is slidably connected with the cylinder housing 27 and is positioned in the cylinder housing 27, so that the sliding plate 28 can slide in the cylinder housing 27, the first air pump 25 and the second air pump 26 are fixedly connected with the side plate 14 and are respectively communicated with the first through hole 271 and the second through hole 272, the sliding plate 28 can be pushed to move up and down in the cylinder housing 27 by respectively starting the first air pump 25 and the second air pump 26, the support table 24 is fixedly connected with the connection plate 29 and is positioned at one side of the connection plate 29, the support plate can move up and down along with the sliding plate 28 under the action of the connection plate 29, the rotating motor 21 is fixedly connected with the support table 24 and is positioned at one side of the support table 24, the driver 22 is fixedly connected with an output shaft of the rotating motor 21 and is positioned at one side of the slideway 111, the rotating motor 21 can drive the driver 22 to rotate, the rotating rod 23 is meshed with the driver 22 and is positioned at one side of the slideway 111, the driver 22 can drive the rotating rod 23 to drive, the rotating rod 23 can contact with a chip in the basket 12 to drive the chip to rotate, the sealing plate 30 is fixedly connected with the connecting plate 29 and contacts with the cylinder shell 27, and an opening on the cylinder shell 27 can be sealed, so that gas leakage in the moving process is avoided. Through with basket of flowers 12 sets up on slide 111, then start rotate motor 21, thereby drive through actuator 22 the bull stick 23 rotates and can drive the chip rotates and corrodes, then cross start the first cylinder with the second cylinder drives supporting bench 24 reciprocates to drive the chip and reciprocate in basket of flowers 12 and carry out more abundant corruption and washing, make processing can be more even, thereby solve current device because concentric rotation can make the not enough even problem of mid portion processing.
Further, the transmission 22 includes a first gear 221, a second gear 222 and a third gear 223, the first gear 221 is fixedly connected to the output shaft of the rotating motor 21 and is located at one side of the rotating motor 21, the second gear 222 and the third gear 223 are rotatably connected to the supporting platform 24 and are located at one side of the supporting platform 24, the second gear 222 is engaged with the first gear 221, and the third gear 223 is engaged with the second gear 222 and the rotating rod 23.
In this embodiment, the rotating motor 21 can drive the first gear 221 to rotate, so as to drive the second gear 222 and the third gear 223 to rotate in turn, so as to drive the rotating rod 23 to rotate. The position of the rotating rod 23 and the rotating motor 21 can be extended by the actuator 22, and the rotating motor 21 is prevented from interfering with the base 11 during movement.
Further, the flower basket 12 includes a plurality of spacers 121 and a basket body 122, the basket body 122 has a third through hole 123, and the plurality of spacers 121 are fixedly connected to the basket body 122 and located in the third through hole 123.
In the present embodiment, the plurality of spacers 121 are supported by the basket body 122, so that a plurality of chips can be respectively placed between two spacers 121 to be spaced apart, and the chips can be moved by contacting the basket 12 through the third through hole 123.
Further, the flower basket 12 further includes two supporting shoulders 124, and the two supporting shoulders 124 are fixedly connected to the basket body 122, located on two sides of the basket body 122, and slidably connected to the slide rail 111.
In the present embodiment, the two support shoulders 124 can stably slide relative to the slide rail 111, and then the flower basket 12 can be taken by the support shoulders 124.
Further, the support assembly 1 further comprises a conveying line 15, and the conveying line 15 is arranged on one side of the base 11.
In this embodiment, the processed flower basket 12 can be automatically carried out by the conveyor line 15, thereby improving the work efficiency.
Further, the support assembly 1 further includes a photoelectric sensor 16, and the photoelectric sensor 16 is fixedly connected to the bracket 13 and is located on one side of the slideway 111.
In the present embodiment, the model of the photoelectric sensor 16 is BEN10M-TDT, which can detect the position of the flower basket 12, so as to automatically control the erosion nozzle 42, and make the operation more convenient.
Further, the rotating assembly 2 further includes an auxiliary rod 31, and the auxiliary rod 31 is rotatably connected to the supporting platform 24 and is located at one side of the supporting platform 24.
In this embodiment, the auxiliary lever 31 may support the chip together with the rotation lever 23, so that the chip may be more easily rotated, thereby improving the working efficiency.
Further, the rotating assembly 2 further includes a stabilizing base 32, the stabilizing base 32 is slidably connected to the base 11 and is located on one side of the sliding channel 111, and the auxiliary rod 31 and the rotating rod 23 are rotatably connected to the stabilizing base 32.
In the present embodiment, the stabilizing seat 32 is provided at one side of the base 11, and can support the auxiliary lever 31 and the rotating lever 23, so that the rotation and upward movement are more stable.
In a second aspect, referring to fig. 4 to 5, the present invention further provides a chip rotation apparatus of a stress-relief etching machine, including: chip rotary device and corruption subassembly 4 of destressing etching machine, corruption subassembly 4 includes support arm 41, corrosion nozzle 42, washs shower nozzle 43 and end box 44, support arm 41 with support 13 fixed connection, and be located one side of support 13, corrosion nozzle 42 with wash shower nozzle 43 with support arm 41 fixed connection, and be located one side of support arm 41, end box 44 with base 11 fixed connection, and be located one side that support 13 was kept away from to base 11.
In the present embodiment, by disposing the supporting arm 41 on the holder 13 and then disposing the etching nozzle 42 and the cleaning nozzle 43 on the supporting arm 41, the chip disposed on the chip rotating device of the stress-relief etching machine can be subjected to etching process and cleaning after etching is completed, so that the etching solution and the cleaning solution can enter the bottom box 44 for collection.
Further, the supporting arm 41 includes an arm body 411 and a sliding rod 412, the arm body 411 is fixedly connected to the bracket 13 and is located at one side of the bracket 13, the sliding rod 412 is slidably connected to the arm body 411 and is located at one side of the arm body 411, and the corrosion nozzle 42 and the cleaning nozzle 43 are disposed on the sliding rod 412.
In this embodiment, the sliding rod 412 is slidable with respect to the arm 411, and then the erosion nozzle 42 and the cleaning nozzle 43 are provided on the sliding rod 412, so that the position of the arm 411 can be adjusted by sliding the sliding rod 412, which makes adjustment easier.
Further, the supporting arm 41 further includes an adjusting screw 413, and the adjusting screw 413 is rotatably connected to the arm 411 and is in threaded connection with the sliding rod 412.
In this embodiment, the slide bar 412 is moved up and down by rotating the adjusting screw 413, so that the positions of the cleaning head 43 and the etching head 42 can be easily adjusted.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (8)
1. A chip rotating device of a stress-relief etching machine, which is characterized in that,
the flower basket support comprises a support component and a rotating component, wherein the support component comprises a base, a plurality of flower baskets, a support and a side plate, the base is provided with a slideway, the flower baskets are slidably connected with the slideway and are positioned on one side of the slideway, the support is fixedly connected with the base and is positioned on one side of the base, the side plate is fixedly connected with the base and is positioned on one side of the slideway, the rotating component comprises a rotating motor, a driver, a rotating rod, a support table, a first air pump, a second air pump, a cylinder shell, a sliding plate, a connecting plate and a sealing plate, the cylinder shell is provided with a first through hole and a second through hole, the cylinder shell is fixedly connected with the side plate and is positioned on one side of the side plate, the sliding plate is slidably connected with the cylinder shell and is positioned in the cylinder shell, and the first air pump and the second air pump are fixedly connected with the side plate, the support table is fixedly connected with the connecting plate and is positioned on one side of the connecting plate, the rotating motor is fixedly connected with the support table and is positioned on one side of the support table, the driver is fixedly connected with an output shaft of the rotating motor and is positioned on one side of the slideway, the rotating rod is meshed with the driver and is positioned on one side of the slideway, and the sealing plate is fixedly connected with the connecting plate and contacts the cylinder shell.
2. The chip rotating apparatus of a stress-relief etching machine according to claim 1,
the transmission device comprises a first gear, a second gear and a third gear, the first gear is fixedly connected with an output shaft of the rotating motor and is located on one side of the rotating motor, the second gear and the third gear are rotatably connected with the supporting table and are located on one side of the supporting table, the second gear is meshed with the first gear, and the third gear is meshed with the second gear and the rotating rod.
3. The chip rotating apparatus of a stress-relief etching machine according to claim 1,
the flower basket comprises a plurality of spacers and a flower basket body, the flower basket body is provided with a third through hole, and the spacers are fixedly connected with the flower basket body and located in the third through hole.
4. The chip rotating apparatus of a stress-relief etching machine according to claim 3,
the flower basket further comprises two supporting shoulders, the two supporting shoulders are fixedly connected with the flower basket body, located on two sides of the flower basket body and connected with the slide ways in a sliding mode.
5. The chip rotating apparatus of a stress-relief etching machine according to claim 1,
the supporting assembly further comprises a conveying line, and the conveying line is arranged on one side of the base.
6. The chip rotating apparatus of a stress-relief etching machine and the device thereof according to claim 5,
the support assembly further comprises a photoelectric sensor, and the photoelectric sensor is fixedly connected with the support and is positioned on one side of the slide way.
7. A chip rotating apparatus of a stress-relief etching machine comprising the chip rotating device of the stress-relief etching machine according to any one of claims 1 to 6,
still including corroding the subassembly, corrode the subassembly and include support arm, corrode the shower nozzle, wash shower nozzle and end box, the support arm with support fixed connection, and be located one side of support, corrode the shower nozzle with wash the shower nozzle with support arm fixed connection, and be located one side of support arm, end box with base fixed connection, and be located the base is kept away from one side of support.
8. The chip rotating apparatus of a stress-relief etching machine according to claim 7,
the support arm comprises an arm body and a sliding rod, the arm body is fixedly connected with the support and is positioned on one side of the support, the sliding rod is slidably connected with the arm body and is positioned on one side of the arm body, and the corrosion sprayer and the cleaning sprayer are arranged on the sliding rod.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110231609.XA CN113035751B (en) | 2021-03-02 | 2021-03-02 | Chip rotating device of stress-relief etching machine and equipment thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110231609.XA CN113035751B (en) | 2021-03-02 | 2021-03-02 | Chip rotating device of stress-relief etching machine and equipment thereof |
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| CN113035751A true CN113035751A (en) | 2021-06-25 |
| CN113035751B CN113035751B (en) | 2022-08-19 |
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| CN113035751B (en) | 2022-08-19 |
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