TWM581289U - Batch wafer wet treatment device - Google Patents

Abstract

A batch wafer wet treatment device includes a tank body, a wafer lifting mechanism, a wafer rotating mechanism and a main control module. The tank is configured for accommodating a cassette and a wafer located in the cassette. The wafer lifting mechanism is disposed on the tank body to lift and lower the wafer in the wafer cassette and the wafer cassette. The wafer rotating mechanism is disposed on the wafer lifting mechanism and is configured for contacting and driving the wafer for rotation. The main control module is connected to the wafer lifting mechanism and the wafer rotating mechanism, and controls lifting of the wafer lifting mechanism and rotation of the wafer rotating mechanism. The wafer can be uniformly etched by controlling the level and rotational speed of the wafer relative to the etchant in the bath.

Description

Batch substrate wet processing device

The invention relates to a technical field of wet etching of a substrate, in particular to a batch substrate wet processing device, which can improve the uniformity of substrate etching, avoiding complete etching of a partial region of the substrate, and insufficient etching of another partial region, resulting in a finished substrate. The problem of declining quality and yield.

In the conventional wet bench (Wet Bench) batch substrate slot immersion method, a wafer boat equipped with a substrate (or wafer) is usually placed in a tank carrying an etchant to perform immersion cycle etching. However, the above etching method has the following disadvantages.

1. The flow field inhomogeneity in the tank causes the uniformity of substrate etching to be unsatisfactory.

2. The boat can cause the dead angle of the syrup cycle, so that some parts of the substrate can not contact the etching syrup, which further reduces the uniformity of substrate etching.

3. The inconvenience of the trough immersion method is that when the crystal boat with the substrate is immersed into the trough body, the bottom of the substrate will first contact the etching liquid. When the boat is lifted off the trough body, the bottom of the substrate is finally separated from the etching liquid. Therefore, the etching time at the bottom of the substrate is the longest, and the etching time at the top of the substrate is the shortest, which further causes poor uniformity of substrate etching.

Due to several shortcomings of the above-mentioned batch substrate trench immersion method, the uniformity of substrate etching is not good, and the yield of the finished substrate is lowered.

The novel creator has created a batch substrate wet processing device in view of the problem that the uniformity of substrate etching is not ideal due to the conventional batch substrate trench etching method, and the defects and defects thereof are improved.

The main purpose of the present invention is to provide a batch substrate wet processing device which can improve the uniformity of substrate etching, avoiding partial etching of the substrate, and insufficient etching of other local regions, resulting in deterioration of the quality and yield of the finished substrate. problem.

In order to achieve the above object, the novel batch substrate wet processing apparatus comprises: a tank body having a cavity formed therein for holding an etchant and for accommodating a boat and a substrate located in the boat; a substrate lifting mechanism is disposed on the slot body, and includes a fixing base, a lifting drive module and a lifting base. The fixing base is fixedly disposed outside the slot, and the lifting driving module is movably disposed on the The lifting base is fixedly disposed on the lifting and driving module, is located in the receiving slot, and can be driven by the lifting and driving module to rise relative to the slot body or descend relative to the slot body In the tank, the lifting seat is used to support the wafer boat and the substrate in the boat; a substrate rotating mechanism is disposed on the lifting base of the substrate lifting mechanism, and includes a rotating driving module, a transmission component and a driven rotating component, wherein the rotating driving module is fixedly disposed on the lifting seat, the transmission The component is coupled to the rotating driving module and is actuated by the driving of the rotating driving module. The driven rotating component is disposed on the lifting base, is connected to the driving component, and is rotatable by the driving component. a driven rotating assembly for contacting and driving the substrate for rotation; a main control module connecting the substrate lifting mechanism and the substrate rotating mechanism, and The lifting and lowering of the substrate elevating mechanism and the rotation of the substrate rotating mechanism are controlled.

In an embodiment of the present invention, the lift drive module is a hydraulic/pneumatic cylinder, and an actuating rod is disposed on the hydraulic/pneumatic cylinder in a telescopic manner, and the actuating rod is connected to the lift base.

In an embodiment of the present invention, a vertical plate body is formed on the lifting seat, and a horizontal plate is formed at the bottom end of the vertical plate body for supporting the boat.

In an embodiment of the present invention, the rotary drive module has a drive shaft for a drive motor; the drive assembly includes a vertical drive rod and a horizontal drive shaft, the vertical drive rod is rotatably disposed through the vertical a horizontal drive shaft that meshes with the vertical drive rod; the driven rotary assembly includes two horizontal rotary drive rods, and the two horizontal rotary drive rods mesh with the horizontal drive shaft A horizontal driving rotating rod is formed with a contact driving portion for contacting and driving the substrate to rotate.

In an embodiment of the present invention, the two horizontal rotating rods are located at the same horizontal position.

In an embodiment of the present invention, the contact driving portion is formed with a plurality of axially arranged friction ribs.

In an embodiment of the present invention, the drive shaft and the vertical transmission rod are in mesh with each other through the two bevel gears; the vertical transmission rod and the horizontal transmission shaft are meshed with each other through the two bevel gears; Each of the horizontal rotating belts is meshed with each other through the two gears.

In an embodiment of the present invention, the batch substrate wet processing apparatus further includes an etch rate database module, the etch rate database module is coupled to the main control module, and is configured to provide etching of various portions of the substrate Historical data on the rate.

Another object of the present invention is to provide a batch substrate wet processing device, which comprises a tank body is formed in the tank body, a pocket is formed for holding the etching liquid, and is used for accommodating the boat and the substrate in the boat; a substrate lifting mechanism is disposed in the tank body And comprising a fixed seat, a lifting drive module and a lifting seat, the fixing seat is fixedly disposed outside the slot, the lifting driving module is movably disposed on the fixing seat, and the lifting seat is fixedly disposed on the The lifting drive module is located in the receiving slot and can be driven by the lifting driving module to rise outside the receiving slot with respect to the slot body or descend into the receiving slot relative to the slot body. Supporting the wafer boat and the substrate in the wafer boat; a substrate rotating mechanism disposed on the lifting platform of the substrate lifting mechanism, and comprising a rotary driving module, a transmission component and a driven rotating component, The rotary drive module is fixedly disposed on the lift base, the drive assembly is coupled to the rotary drive module and is actuated by the rotary drive module, and the driven rotary assembly is disposed on the lift base and connected to the drive Component And rotating by the driving component, the driven rotating component is configured to contact and drive the substrate to rotate; and a main control module, the substrate lifting mechanism and the substrate rotating mechanism are connected, and the substrate lifting mechanism is controlled And a rotation of the substrate rotating mechanism; wherein a vertical plate body is formed on the lifting seat, and a horizontal plate is formed at a bottom end of the vertical plate body for supporting the boat; wherein the rotating driving module a drive shaft for a drive motor; the drive assembly includes a vertical drive rod and a horizontal drive shaft rotatably disposed on the vertical plate body and engaged with the drive shaft, the level Drive shaft and the vertical drive a rod engaging; the driven rotating assembly includes two horizontal rotating driving rods, the two horizontal rotating driving rods are engaged with the horizontal driving shaft, and a contact driving portion is formed on each of the horizontal rotating driving rods for contacting and driving the substrate Rotation; wherein the two horizontal rotations are in the same horizontal position.

In an embodiment of the present invention, the contact driving portion is formed with a plurality of axially arranged friction ribs.

In an embodiment of the present invention, the drive shaft and the vertical transmission rod are in mesh with each other through the two bevel gears; the vertical transmission rod and the horizontal transmission shaft are meshed with each other through the two bevel gears; Each of the horizontal rotating belts is meshed with each other through the two gears.

In an embodiment of the present invention, the batch substrate wet processing apparatus further includes an etch rate database module, the etch rate database module is coupled to the main control module, and is configured to provide etching of various portions of the substrate Historical data on the rate.

According to the above technical means, the batch substrate wet processing apparatus of the present invention controls the substrate to be raised and lowered to the top edge or the bottom edge of the center portion to align the liquid surface of the etching liquid according to the etching rate of the central portion and the peripheral portion of the substrate. The peripheral portion surrounding the periphery of the center portion is partially located above the etching liquid level, so that the substrate can perform forward etching compensation for the center portion or the circumference portion with a lower etching rate, and another portion with a higher etching rate. Negative etching compensation is performed to further improve the uniformity of substrate etching and improve substrate yield.

10‧‧‧

100‧‧‧ 容容

20‧‧‧Substrate lifting mechanism

21‧‧‧ Fixed seat

22‧‧‧Slide rails

23‧‧‧ Slider

24‧‧‧ Lifting drive module

25‧‧‧ Lifting seat

251‧‧‧Vertical board

30‧‧‧The boat

40‧‧‧Substrate rotation mechanism

400‧‧‧Umbrella gear

41‧‧‧Rotary drive module

42‧‧‧Vertical transmission rod

43‧‧‧ horizontal drive shaft

45‧‧‧ horizontal rotating rod

430, 450‧‧‧ gears

455‧‧‧Contact Drive Department

60‧‧‧etch rate database module

70‧‧‧Master Module

80‧‧‧ liquid level

90‧‧‧Substrate

91‧‧‧ Central Department

912‧‧‧Top edge

911‧‧‧ bottom edge

92‧‧‧The Peripheral Department

S01, S02, S03, S04‧‧ steps

1 is a perspective view of a batch substrate wet processing apparatus, a boat, and a substrate.

Figure 2 is the main control module and substrate lifting of the batch substrate wet processing device. Architecture block diagram of the mechanism, substrate rotation mechanism, and etch rate database module.

3 is a perspective cross-sectional view of the batch substrate wet processing apparatus, the boat, and the substrate.

4 is a schematic perspective view showing the operation of the batch substrate wet processing device, the boat, and the substrate.

Fig. 5 is a front cross-sectional view showing the batch substrate wet processing apparatus, wafer boat, and substrate of the present invention.

6 is a front cross-sectional view showing the operation of the batch substrate wet processing apparatus, the boat, and the substrate.

Fig. 7 is a perspective view showing the trough body and the lifting base of the batch substrate wet processing apparatus of the present invention.

FIG. 8 is a schematic perspective view showing the operation of the batch substrate wet processing apparatus omitting the tank body and the lifting seat.

9 is an enlarged perspective view of the transmission assembly and the driven rotating assembly of the batch substrate wet processing apparatus of the present invention.

10 is another enlarged perspective view of the transmission assembly and the driven rotating assembly of the batch substrate wet processing apparatus of the present invention.

Figure 11 is a flow chart showing the steps of the wet processing method of the batch substrate of the present invention.

12 is a schematic view showing the execution of the wet processing method of the batch substrate of the present invention, showing the substrate height adjustment step and the execution state of the substrate rotation step when the etching rate of the central portion of the substrate is higher than the etching rate of the peripheral portion .

13 is a schematic view showing the execution of the wet processing method of the batch substrate of the present invention, showing When the etching rate of the peripheral portion of the substrate is higher than the etching rate of the central portion, the substrate height adjusting step and the execution state of the substrate rotating step.

Referring to FIG. 1 to FIG. 3 , the batch substrate wet processing apparatus comprises: a tank body 10 , a substrate lifting mechanism 20 , a substrate rotating mechanism 40 , a main control module 70 , and an etching rate database module . 60.

A cavity 100 is formed in the tank body 10 for holding the etching liquid and for accommodating the boat 30 and the substrate (or wafer) 90 located in the boat 30.

The substrate lifting mechanism 20 is disposed on the slot body 10 and includes a fixing base 21, a lifting drive module 24 and a lifting base 25.

The fixing base 21 is fixedly disposed outside the groove body 10, and can be fixedly disposed on the groove body 10 through a fixing member such as a bolt or a rivet. In an embodiment of the present invention, the fixing base 21 and the trough body 10 are disposed together on other equipment or pedestals.

Referring to FIGS. 3, 5 and 7, the lift drive module 24 is movably disposed on the mount 21.

The lifting base 25 is fixedly disposed on the lifting and lowering drive module 24, and is located in the receiving slot 100, and can be driven by the lifting and lowering driving module 24 to rise relative to the slot body 10 or to the slot 100. The body 10 is lowered into the pocket 100. The lifting seat 25 is used to support the wafer boat 30 and the substrate 90 in the boat 30. In Figures 3, 5 and 7, the lifter 25 is located at a lower position such that the boat 30 and the substrate 90 can be located deeper into the etchant and completely immersed in the etchant. 4, 6 and 8, in FIG. 4, 6 and 8, the lifting seat 25 is raised to an upper position so that the boat 30 and the substrate 90 can be located at a shallower level of the etching solution or Above and partially or completely Remove the etchant.

In an embodiment of the present invention, the lift drive module 24 is a hydraulic/pneumatic cylinder, and an actuating rod 241 is disposed on the hydraulic/pneumatic cylinder in a telescopic manner. As shown in FIG. 7, the actuating rod 241 is shown in FIG. The lifting seat 25 is connected. In addition, the hydraulic/pneumatic cylinder is externally connected to a hydraulic/hydraulic source for driving the hydraulic rod/pneumatic cylinder actuating rod 241 to expand and contract. In an embodiment of the present invention, a vertical plate body 251 is formed on the lifting base 25, and a horizontal plate 253 is formed at the bottom end of the vertical plate body 251 for supporting the boat 30, as shown in FIG.

In the embodiment of the present invention, the fixing base 21 is provided with two sliding rails 22, and the lifting base 25 is provided with two sliding blocks 23, and the two sliding blocks 23 are slidably coupled to the two sliding rails 22, respectively. . The arrangement of the slide rails 22 and the sliders 23 allows the lift base 25 to move stably vertically.

The substrate rotating mechanism 40 is disposed on the lifting base 25 of the substrate lifting mechanism 20 and includes a rotary driving module 41, a transmission component and a driven rotating component.

The rotary drive module 41 is fixedly disposed on the lift base 25. In an embodiment of the invention, the rotary drive module 41 has a drive shaft for a drive motor.

The transmission assembly is coupled to the rotary drive module 41 and is actuated by the rotation of the rotary drive module 41. The driven rotary assembly is disposed on the lift base 25, coupled to the drive assembly, and is receivable by the drive assembly Drive and rotate. In an embodiment of the invention, the transmission assembly includes a vertical drive rod 42 and a horizontal drive shaft 43. The vertical transmission rod 42 is rotatably disposed on the vertical plate body 251 and engaged with the drive shaft, and the horizontal transmission shaft 43 is engaged with the vertical transmission rod 42.

Referring to Figures 9 and 10, the driven rotating assembly is used to contact and drive the substrate 90 for rotation. In an embodiment of the present invention, the driven rotating component comprises two horizontal rotating rods 45. The two horizontal rotation driving rods 45 are engaged with the horizontal transmission shaft 43, and a contact driving portion 455 is formed on each of the horizontal rotation driving rods 45 for contacting and driving the substrate 90 to rotate. In an embodiment of the present invention, the two horizontal rotating rods 45 are located at the same horizontal position. In an embodiment of the present invention, the contact driving portion 455 is formed with a plurality of axially arranged friction ribs to provide good friction of the substrate 90 to help drive the substrate 90 to rotate.

In an embodiment of the present invention, the drive shaft and the vertical transmission rod 42 are meshed with each other through the two bevel gears 400; the vertical transmission rod 42 and the horizontal transmission shaft 43 are meshed with each other through the two bevel gears 400; The horizontal transmission shaft 43 and each of the horizontal rotation driving rods 45 mesh with each other through the two gears 430 and 450.

The main control module 70 is connected to the substrate elevating mechanism 20 and the substrate rotating mechanism 40, and can control the lifting and lowering of the substrate elevating mechanism 20 and the rotation of the substrate rotating mechanism 40. In an embodiment of the present invention, the main control module 70 is a computer having a central processing unit, a memory, a storage, an input interface, and an output interface, and a main control software is loaded in the storage. The computer drives the substrate lifting mechanism 20 and/or the substrate rotating mechanism 40 to perform lifting and/or rotation of the substrate 90 by executing the main control software or automatically by a user.

The etch rate database module 60 is coupled to the main control module 70 and is used to provide historical data on the rate at which portions of the substrate are etched. In an embodiment of the present invention, the etch rate data module 60 is a database module for providing historical data of the rate at which portions of the substrate are etched to the main control module 70. The main control module The substrate elevating mechanism 20 and the substrate rotating mechanism 40 are driven based on the etching rate data of each portion of the substrate, and the substrate 90 is raised and lowered to a specific position to adjust the rotational speed of the substrate 90.

Referring to FIGS. 11 to 13, the present invention relates to a batch substrate wet processing method, comprising: The device provides a step S01, a substrate soaking step S02, a substrate height adjusting step S03, and a substrate rotating step S04.

The apparatus provides a step S01 comprising providing a batch of substrate wet processing apparatus, as shown in Figures 1 to 10. The batch substrate wet processing apparatus comprises: a tank body 10 in which a tank 100 is formed, wherein the tank 100 carries an etching liquid; and a substrate lifting mechanism 20 is disposed in the tank body 10, for supporting the wafer boat 30 and the substrate 90 in the wafer boat 30, and for raising or lowering the wafer boat 30 and the substrate 90 in the wafer boat 30, so that the substrate 90 can be located at different heights. The substrate rotating mechanism 40 is disposed on the substrate lifting mechanism 20 and is used for contacting and driving the substrate 90 for rotation; The main control module 70 is connected to the substrate lifting mechanism 20 and the substrate rotating mechanism 40, and can control the lifting and lowering of the substrate lifting mechanism 20 and the rotation of the substrate rotating mechanism 40; and an etching rate database module 60 connecting the main The control module 70 is configured to collect and provide historical data of the rate at which portions of the substrate 90 are etched.

The substrate soaking step S02 includes placing a wafer boat 30 and a substrate 90 in the wafer boat 30 into the cavity 100, so that the wafer boat 30 and the substrate in the boat 30 are supported by the lifting seat 25. And the substrate 90 is completely located in the etching liquid, wherein the substrate 90 includes a central portion 91 and a peripheral portion 92 surrounding the central portion 91.

The substrate height adjusting step S03 includes driving the substrate lifting mechanism 20 to raise or lower the substrate 90 by the main control module 70, so that the substrate 90 is completely located in the etching liquid, partially in the etching liquid or completely in the etching. Above the liquid.

The substrate rotating step S04 includes driving the substrate rotating mechanism 40 to drive the substrate 90 to rotate by the main control module 70.

Referring to FIG. 12, when the etching rate of the central portion 91 of the substrate 90 is higher than the etching rate of the peripheral portion 92, the central portion 91 of the substrate 90 is raised to the full extent by performing the substrate height adjusting step S03. Located on the etching liquid, the bottom edge 911 of the center portion 91 is aligned with the liquid surface 80 of the etching liquid, and the substrate 90 is rotated by performing the substrate rotation step S04 to increase the etching amount of the peripheral portion 92. At the same time, the etching amount of the center portion 91 is reduced.

Referring to FIG. 13, when the etching rate of the peripheral portion 92 of the substrate 90 is higher than the etching rate of the central portion 91, the central portion 91 of the substrate 90 is lowered to be completely positioned by performing the substrate height adjusting step S03. Under the etching liquid, the top edge 912 of the central portion 91 is aligned with the liquid surface 80 of the etching liquid, and the substrate 90 is rotated by performing the substrate rotating step S04 to increase the etching amount of the central portion 91. At the same time, the amount of etching of the peripheral portion 92 is reduced.

In an embodiment of the present invention, the radius of the central portion 91 of the substrate 90 is a floating value, which is changed according to the etching rate of the portions of the substrate 90 provided to the substrate 90. The radius of the central portion 91 is 0 to the radius of the substrate 90. For example, assuming that the radius of the substrate 90 is R, when the historical data of the etch rate database module 60 indicates that the etch rate of the center of the substrate 90 to the center region having a radius of R/2 is relatively uniform, When the etching rate of the peripheral region between R/2 and R of the substrate 90 is relatively uniform, and the etching rate of the two regions of the more central region and the peripheral region is different, the main control device sets the R/2. The center portion of the radius is the center portion 91, and the peripheral portion between the R/2 and R is set as the peripheral portion 92. The main control device can instantly reset the range of the central portion 91 and the peripheral portion 92 according to the change in the etching rate of each portion of the substrate 90.

In an embodiment of the present invention, the substrate height adjustment step S03 and the substrate rotation step S04 are performed simultaneously or sequentially, and the substrate height adjustment step S03 can be repeatedly performed. The substrate rotation step S04 can be repeatedly performed.

According to the above technical means, the batch substrate wet processing apparatus and the batch substrate wet processing method control the substrate 90 to rise to the top of the center portion 91 according to the etching rate of the central portion 91 and the peripheral portion 92 of the substrate 90. The edge 912, or the bottom edge 911 cuts the liquid surface 80 of the etching liquid and partially surrounds the peripheral portion 92 surrounding the center portion 91 above the etching liquid level 80, so that the substrate 90 can have a lower etching rate. The central portion 91 or the peripheral portion is subjected to forward etching compensation, and the other portion having a higher etching rate is subjected to negative etching compensation, thereby improving the uniformity of etching of the substrate 90 and improving the yield of the substrate 90.

Claims (12)

A batch substrate wet processing apparatus includes: a tank body having a cavity formed therein for holding an etchant, and for accommodating a boat and a substrate located in the boat; The substrate lifting mechanism is disposed on the slot body, and includes a fixing base, a lifting drive module and a lifting seat. The fixing seat is fixedly disposed outside the slot, and the lifting driving module is movably disposed on the fixing body. The lifting seat is fixedly disposed on the lifting drive module, is located in the receiving slot, and can be driven by the lifting driving module to rise relative to the slot body or descend to the slot body The lifting seat is configured to support the wafer boat and the substrate in the boat; a substrate rotating mechanism is disposed on the lifting platform of the substrate lifting mechanism, and includes a rotating driving module and a transmission And a driven rotating component fixedly disposed on the lifting base, the driving component is coupled to the rotating driving module and is actuated by the driving of the rotating driving module, wherein the driven rotating component is disposed at a lifting base coupled to the transmission assembly and rotatable by the driving assembly, the driven rotating assembly for contacting and driving the substrate to rotate; and a main control module connecting the substrate lifting mechanism and the The substrate rotating mechanism controls the lifting and lowering of the substrate lifting mechanism and the rotation of the substrate rotating mechanism. The batch substrate wet processing apparatus according to claim 1, wherein the lifting drive module is a hydraulic/pneumatic cylinder, and an operating rod is disposed on the hydraulic/pneumatic cylinder in a telescopic manner, and the operating rod is connected. The lift seat. The batch substrate wet processing apparatus according to claim 1, wherein a vertical plate body is formed on the lifting seat, and a horizontal plate is formed at a bottom end of the vertical plate body for supporting the boat. The batch substrate wet processing apparatus of claim 3, wherein the rotary drive module is a drive motor and has a drive shaft; the drive assembly includes a vertical drive rod and a horizontal drive shaft, the vertical drive rod Rotatingly disposed on the vertical plate body and engaging with the drive shaft, the horizontal drive shaft is engaged with the vertical transmission rod; the driven rotation assembly includes two horizontal rotation driving rods, and the two horizontal rotation driving rods The horizontal drive shaft is engaged, and a contact driving portion is formed on each of the horizontal rotary driving rods for contacting and driving the substrate to rotate. The batch substrate wet processing apparatus of claim 4, wherein the two horizontal rotating rods are located at the same horizontal position. The batch substrate wet processing apparatus according to claim 4, wherein the contact driving portion is formed with a plurality of axially arranged friction ribs. The batch substrate wet processing apparatus according to claim 5, wherein the drive shaft and the vertical transmission rod are meshed with each other through two bevel gears; and the vertical transmission rod and the horizontal transmission shaft pass through the two bevel gears Inter-engagement; the horizontal transmission shaft and each of the horizontal rotation-driven rods mesh with each other through the two gears. The batch substrate wet processing apparatus according to any one of claims 1 to 7, wherein the batch substrate wet processing apparatus further comprises an etch rate database module, wherein the etch rate database module is connected to the main The control module is configured to provide historical data on the rate at which portions of the substrate are etched. A batch substrate wet processing apparatus includes: a tank body having a cavity formed therein for holding an etchant, and for accommodating a boat and a substrate located in the boat; a substrate lifting mechanism disposed on the slot body and including a fixing base and a lifting drive module And a lifting base fixedly disposed on the outside of the slot, the lifting and driving module is movably disposed on the fixing base, and the lifting seat is fixedly disposed on the lifting driving module, and is located in the receiving slot And being driven by the lifting and driving module to rise outside the cavity with respect to the groove body or descending into the cavity relative to the groove body, the lifting seat is used for supporting the wafer boat and the substrate in the boat a substrate rotating mechanism is disposed on the lifting base of the substrate lifting mechanism, and includes a rotating driving module, a transmission component and a driven rotating component, wherein the rotating driving module is fixedly disposed on the lifting seat, The transmission assembly is coupled to the rotary drive module and is actuated by the rotary drive module. The driven rotary assembly is disposed on the lift base, coupled to the drive assembly, and rotatable by the drive assembly. The driven rotating component is configured to contact and drive the substrate for rotation; and a main control module is connected to the substrate lifting mechanism and the substrate rotating mechanism, and controls the lifting and lowering of the substrate lifting mechanism And rotating the substrate rotating mechanism; wherein the lifting seat is formed with a vertical plate body, and a horizontal plate is formed at the bottom end of the vertical plate body for supporting the boat; wherein the rotary driving module is The drive motor has a drive shaft; the drive assembly includes a vertical drive rod and a horizontal drive shaft rotatably disposed on the vertical plate body and engaged with the drive shaft, the horizontal drive shaft Engaging with the vertical transmission rod; the driven rotation assembly includes two horizontal rotation driving rods, and the two horizontal rotation driving rods are engaged with the horizontal transmission shaft, and a contact driving portion is formed on each of the horizontal rotation driving rods for contact and The substrate is driven to rotate; wherein the two horizontal rotating rods are located at the same horizontal position. The batch substrate wet processing apparatus according to claim 9, wherein the contact driving portion is shaped There are a plurality of axially arranged friction ribs. The batch substrate wet processing apparatus according to claim 9, wherein the drive shaft and the vertical transmission rod are meshed with each other through two bevel gears; and the vertical transmission rod and the horizontal transmission shaft pass through the two bevel gears Inter-engagement; the horizontal transmission shaft and each of the horizontal rotation-driven rods mesh with each other through the two gears. The batch substrate wet processing apparatus according to any one of claims 9 to 11, wherein the batch substrate wet processing apparatus further comprises an etch rate database module, wherein the etch rate database module is connected to the main The control module is configured to provide historical data on the rate at which portions of the substrate are etched.