CN220753402U - Silicon carbide wafer belt cleaning device - Google Patents
Silicon carbide wafer belt cleaning device Download PDFInfo
- Publication number
- CN220753402U CN220753402U CN202322369799.9U CN202322369799U CN220753402U CN 220753402 U CN220753402 U CN 220753402U CN 202322369799 U CN202322369799 U CN 202322369799U CN 220753402 U CN220753402 U CN 220753402U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- silicon carbide
- carbide wafer
- mounting panel
- cleaning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 77
- 229910010271 silicon carbide Inorganic materials 0.000 title claims abstract description 57
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 51
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 238000005406 washing Methods 0.000 claims description 19
- 239000002904 solvent Substances 0.000 abstract description 23
- 239000007921 spray Substances 0.000 abstract description 12
- 239000003921 oil Substances 0.000 abstract description 9
- 235000012431 wafers Nutrition 0.000 description 50
- 238000000034 method Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 235000013547 stew Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model discloses a silicon carbide wafer cleaning device, which relates to the technical field of wafer cleaning and comprises a bottom plate, wherein a first cleaning bath groove is fixedly connected to the middle of the bottom plate, a water pump is fixedly connected to one side of the first cleaning bath groove, a spray head is fixedly connected to the output end of the water pump, one side of the spray head is fixedly connected to one side of the inner wall of the first cleaning bath groove, a second cleaning bath groove is arranged on one side of the first cleaning bath groove, and the bottom end of the second cleaning bath groove is fixedly connected to the top end of the bottom plate. According to the utility model, the cleaning solvent in the first cleaning bath tank is driven to flow through the cooperation of the water pump and the spray head, and the output end of the spray head is opposite to the middle part of one end of the positioning plate, so that the cleaning solvent near the silicon carbide wafer movably clamped in the limiting tank flows, and the cleaning solvent can sufficiently remove oil and organic residues attached to the outer surface of the silicon carbide wafer, thereby improving the cleaning efficiency of the silicon carbide wafer cleaning device.
Description
Technical Field
The utility model relates to the technical field of wafer cleaning, in particular to a silicon carbide wafer cleaning device.
Background
Silicon carbide wafers, also called silicon carbide single crystal wafers, are sliced, ground and polished along a specific crystallization direction to obtain a sheet-like single crystal material, the surface of the silicon carbide wafer is required to be cleaned before the silicon carbide wafer is processed, oil and organic residues attached to the surface of the silicon wafer are cleaned, and when the silicon carbide wafer is cleaned, the conventional silicon carbide wafer cleaning device generally clamps the silicon carbide wafer in a positioning groove, and the silicon carbide wafer is soaked in a cleaning bath containing a cleaning solution.
In the prior art, as disclosed in chinese patent CN219286352U, a silicon carbide wafer cleaning device comprises a wafer accommodating tray, wherein a lifting assembly is fixedly connected to an inner bottom wall of the wafer accommodating tray, and a carrying table is disposed at one side of the wafer accommodating tray.
However, in the prior art, when the silicon carbide wafer is immersed and cleaned in the cleaning bath, although the oil and organic residues attached to the surface of the silicon carbide wafer can be removed, the cleaning solvent in the cleaning bath is kept still, so that the cleaning solvent does not flow and clean the surface of the silicon carbide wafer, the efficiency of cleaning the silicon carbide wafer is lower, and the oil and organic residues on the surface of the silicon carbide wafer can be removed after long-time immersion.
Disclosure of Invention
The utility model aims to solve the problems that in the prior art, when a silicon carbide wafer is soaked and cleaned in a cleaning bath, oil and organic residues attached to the surface of the silicon carbide wafer can be removed, but because cleaning liquid in the cleaning bath is kept still, the cleaning solution does not flow to clean the surface of the silicon carbide wafer, so that the efficiency of cleaning the silicon carbide wafer is lower, and the problem that the oil and the organic residues on the surface of the silicon carbide wafer can be removed only by long-time soaking is solved.
In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a carborundum wafer belt cleaning device, includes the bottom plate, the middle part fixedly connected with of bottom plate washs the bathroom, one side fixedly connected with water pump of washing the bathroom, the output fixedly connected with shower nozzle of water pump, one side fixedly connected with of shower nozzle is in one side of washing the bathroom inner wall, one side of washing the bathroom is equipped with No. two washings the bathroom, no. two bottom fixed connection of wasing the bathroom is on the top of bottom plate.
Preferably, the top surface fixedly connected with mounting bracket of bottom plate, the top fixedly connected with spout of mounting bracket, the inside slip joint of spout has the mounting panel No. one.
Preferably, the bottom fixedly connected with electric telescopic handle of mounting panel No. one, the bottom fixedly connected with mounting panel No. two of electric telescopic handle.
Preferably, the bottom fixedly connected with No. two electric telescopic handle of No. two mounting panels, the even fixedly connected with locating plate of bottom of No. two electric telescopic handle, the even fixedly connected with location snap ring of bottom of locating plate, the even fixedly connected with location arch of bottom of location snap ring.
Preferably, the equal fixedly connected with connecting rod all around of No. two mounting panel bottom, the bottom fixedly connected with mounting panel No. three of connecting rod, the spacing groove has evenly been seted up to the top surface of No. three mounting panels, the even fixedly connected with spacing fixture block of inner wall in spacing groove.
Preferably, the bottom surface of No. three mounting panels evenly fixedly connected with rotation motor, rotation motor's output fixedly connected with gyro wheel, the gyro wheel sets up the lower extreme at the spacing inslot wall.
Preferably, the middle part fixedly connected with No. two rotating electrical machines on mounting panel top, no. two rotating electrical machines's output fixedly connected with gear, the outside meshing of gear has the rack, rack fixed connection is in the both sides of spout.
Compared with the prior art, the utility model has the advantages and positive effects that:
1. according to the utility model, the cleaning solvent in the first cleaning bath tank is driven to flow through the cooperation of the water pump and the spray head, and the output end of the spray head is opposite to the middle part of one end of the positioning plate, so that the cleaning solvent near the silicon carbide wafer movably clamped in the limiting tank flows, and the cleaning solvent can sufficiently remove oil and organic residues attached to the outer surface of the silicon carbide wafer, thereby improving the cleaning efficiency of the silicon carbide wafer cleaning device.
2. According to the utility model, the silicon carbide wafer is driven to rotate in the limiting groove by the roller, so that in the cleaning process, the cleaning solvent can clean the contact part of the silicon carbide wafer, the positioning protrusion and the limiting clamping block, and the situation that the cleaning solvent cannot clean the contact part of the silicon carbide wafer, the positioning protrusion and the limiting clamping block due to the fact that the silicon carbide wafer is kept still in the limiting groove is avoided.
Drawings
Fig. 1 is a schematic perspective view of a silicon carbide wafer cleaning apparatus according to the present utility model;
fig. 2 is a schematic perspective view of a first cleaning bath in a silicon carbide wafer cleaning apparatus according to the present utility model;
FIG. 3 is a schematic view showing the connection between the mounting frame and the first mounting plate in a silicon carbide wafer cleaning device according to the present utility model;
FIG. 4 is an enlarged partial schematic view of FIG. 3A;
fig. 5 is a schematic diagram showing a connection relationship between the second mounting plate and the positioning plate in the silicon carbide wafer cleaning device according to the present utility model.
Legend description: 1. a bottom plate; 2. a first cleaning bath; 21. a water pump; 22. a spray head; 3. a second cleaning bath; 4. a mounting frame; 41. a chute; 411. a rack; 42. a first mounting plate; 421. a second rotary motor; 422. a gear; 43. a first electric telescopic rod; 44. a second mounting plate; 45. a second electric telescopic rod; 46. a positioning plate; 461. positioning a clamping ring; 462. positioning the bulge; 47. a connecting rod; 48. a third mounting plate; 481. a limit groove; 482. a limit clamping block; 483. a first rotating motor; 484. and a roller.
Description of the embodiments
In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.
Examples
As shown in fig. 1 and 2, the utility model provides a silicon carbide wafer cleaning device, which comprises a bottom plate 1, wherein a first cleaning bath tank 2 is fixedly connected to the middle part of the bottom plate 1, one side of the first cleaning bath tank 2 is fixedly communicated with a water pump 21, the output end of the water pump 21 is fixedly communicated with a spray head 22, one side of the spray head 22 is fixedly connected to one side of the inner wall of the first cleaning bath tank 2, one side of the first cleaning bath tank 2 is provided with a second cleaning bath tank 3, and the bottom end of the second cleaning bath tank 3 is fixedly connected to the top end of the bottom plate 1.
The specific arrangement and action of this embodiment will be described in detail below, the water pump 21 pumps out the cleaning solvent in the first cleaning bath 2, flows into the spray head 22 through the output end of the water pump 21, and then is sprayed out to one side of the positioning plate 46 through the output end of the spray head 22, so as to drive the cleaning solvent near the limiting groove 481 to flow, so that the cleaning solvent can sufficiently remove the oil and organic residues attached to the outer surface of the silicon carbide wafer, thereby improving the cleaning efficiency of the silicon carbide wafer cleaning device, the impact force of the cleaning solvent sprayed out by the spray head 22 is smaller, no loss is caused to the silicon carbide wafer movably clamped in the limiting groove 481, and the impact force of the cleaning solvent only drives the cleaning solvent near the limiting groove 481 to flow.
Examples
As shown in fig. 1, fig. 3, fig. 4 and fig. 5, the top surface fixedly connected with mounting bracket 4 of bottom plate 1, the top fixedly connected with spout 41 of mounting bracket 4, the inside slip joint of spout 41 has mounting panel 42 No. one, the bottom fixedly connected with electric telescopic handle 43 of mounting panel 42 No. one, the bottom fixedly connected with mounting panel 44 of electric telescopic handle 43 No. one, the bottom fixedly connected with electric telescopic handle 45 of No. two mounting panel 44, the even fixedly connected with locating plate 46 of bottom of electric telescopic handle 45 No. two, the even fixedly connected with location snap ring 461 of bottom of locating plate 46, the even fixedly connected with location arch 462 of bottom of location snap ring 461, the equal fixedly connected with connecting rod 47 all around of No. two mounting panel 44 bottom, the bottom fixedly connected with mounting panel 48 of connecting rod 47, the constant head tank 481 has evenly been seted up to the top surface of No. 48, the even fixedly connected with spacing fixture 482 of inner wall of constant head tank 481, the bottom surface evenly fixedly connected with motor 483 of No. one, the output fixedly connected with gyro wheel 484 of No. 483, the bottom fixedly connected with wheel 422 of motor 483 is provided with the bottom end of constant head tank inner wall of motor 481, the bottom end of constant head tank 421 is fixedly connected with gear 411, the two sides of the gear wheel 421 is fixedly connected with 411 at the outside of the middle part of motor 421, and the two fixedly connected with outside gear 411.
The effect that its whole embodiment reached is, at the in-process of wasing the carborundum wafer, rotation motor 483 drives gyro wheel 484 and rotates for the carborundum wafer rotates in the inside of spacing groove 481, and the cleaning solvent can wash the part that carborundum wafer contacted with location projection 462 and spacing fixture block 482, avoids the carborundum wafer to stew in the inside of spacing groove 481, leads to appearing the condition that the cleaning solvent can't wash the part that carborundum wafer contacted with location projection 462 and spacing fixture block 482.
The application method and the working principle of the device are as follows: the workman will place the silicon carbide wafer in proper order in the inside of spacing groove 481 first, at the electronic telescopic handle 45 downstream of start second, make the location arch 462 touch the silicon carbide wafer, but do not influence its rotation at spacing groove 481, the electronic telescopic handle 43 downstream of start again, make No. three mounting panel 48 soak in the inside of No. one washing bath 2, the inside cleaning solvent of No. one washing bath 2 is taken out to the water pump 21, flow into the inside of shower nozzle 22 through the output of water pump 21, spout one side to locating plate 46 through the output of shower nozzle 22, drive the cleaning solvent flow near spacing groove 481, make cleaning solvent can fully detach oil and organic residues that are attached to the surface of silicon carbide wafer, the inside of No. one washing bath 2 is lifted to No. one electronic telescopic handle 43 drive No. three mounting panel 48 after the washing is accomplished, no. two rotary motor 421 rolls on rack 411, drive No. one mounting panel 42 moves directly over No. two washing bath 3, no. 3's inside deionized water, no. one electronic telescopic handle 43 is soaked in the inside of No. one washing bath 3, make No. three mounting panel 48 contain the inside of No. three washing solvent and make No. three washing bath 48 have the subsequent washing solvent to dilute the inside of No. three washing bath 48.
The present utility model is not limited to the above-mentioned embodiments, and any equivalent embodiments which can be changed or modified by the technical content disclosed above can be applied to other fields, but any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical substance of the present utility model without departing from the technical content of the present utility model still belong to the protection scope of the technical solution of the present utility model.
Claims (7)
1. Silicon carbide wafer belt cleaning device, including bottom plate (1), its characterized in that: the middle part fixedly connected with of bottom plate (1) washs bathroom (2), one side of washing bathroom (2) fixedly communicates has water pump (21), the output fixedly connected with shower nozzle (22) of water pump (21), one side fixedly connected with of shower nozzle (22) is in one side of washing bathroom (2) inner wall, one side of washing bathroom (2) is equipped with No. two washings bathroom (3), the bottom fixed connection of No. two washings bathroom (3) is on the top of bottom plate (1).
2. A silicon carbide wafer cleaning apparatus according to claim 1, wherein: the top surface fixedly connected with mounting bracket (4) of bottom plate (1), the top fixedly connected with spout (41) of mounting bracket (4), the inside slip joint of spout (41) has mounting panel (42) No. one.
3. A silicon carbide wafer cleaning apparatus according to claim 2, wherein: the bottom fixedly connected with electric telescopic handle (43) of mounting panel (42), the bottom fixedly connected with mounting panel (44) of electric telescopic handle (43).
4. A silicon carbide wafer cleaning apparatus according to claim 3, wherein: the bottom fixedly connected with No. two electric telescopic handle (45) of No. two mounting panel (44), the even fixedly connected with locating plate (46) of bottom of No. two electric telescopic handle (45), the even fixedly connected with location snap ring (461) of bottom of locating plate (46), the even fixedly connected with location arch (462) of bottom of location snap ring (461).
5. The silicon carbide wafer cleaning device according to claim 4, wherein: the utility model discloses a connecting rod, including mounting panel (44) and spacing groove (481), connecting rod (47) are all fixedly connected with all around of No. two mounting panel (44) bottom, the bottom fixedly connected with mounting panel (48) of connecting rod (47), spacing groove (481) have evenly been seted up to the top surface of No. three mounting panel (48), the even fixedly connected with spacing fixture block (482) of inner wall of spacing groove (481).
6. The silicon carbide wafer cleaning device according to claim 5, wherein: the bottom surface of No. three mounting panel (48) evenly fixedly connected with is rotation motor (483) No. one, the output fixedly connected with gyro wheel (484) of rotation motor (483) No. one, gyro wheel (484) set up the lower extreme at spacing groove (481) inner wall.
7. A silicon carbide wafer cleaning apparatus according to claim 2, wherein: the middle part fixedly connected with No. two rotation motor (421) on mounting panel (42) top, no. two output fixedly connected with gear (422) of rotation motor (421), the outside meshing of gear (422) has rack (411), rack (411) fixed connection is in the both sides of spout (41).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322369799.9U CN220753402U (en) | 2023-09-01 | 2023-09-01 | Silicon carbide wafer belt cleaning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202322369799.9U CN220753402U (en) | 2023-09-01 | 2023-09-01 | Silicon carbide wafer belt cleaning device |
Publications (1)
Publication Number | Publication Date |
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CN220753402U true CN220753402U (en) | 2024-04-09 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202322369799.9U Active CN220753402U (en) | 2023-09-01 | 2023-09-01 | Silicon carbide wafer belt cleaning device |
Country Status (1)
Country | Link |
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CN (1) | CN220753402U (en) |
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2023
- 2023-09-01 CN CN202322369799.9U patent/CN220753402U/en active Active
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