CN218996690U - Semiconductor chip is processing tank for belt cleaning device - Google Patents
Semiconductor chip is processing tank for belt cleaning device Download PDFInfo
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- CN218996690U CN218996690U CN202223535849.8U CN202223535849U CN218996690U CN 218996690 U CN218996690 U CN 218996690U CN 202223535849 U CN202223535849 U CN 202223535849U CN 218996690 U CN218996690 U CN 218996690U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model belongs to the technical field of chip cleaning, in particular to a processing tank for a semiconductor chip cleaning device, which comprises a supporting bottom plate, wherein the top of the supporting bottom plate is symmetrically and fixedly connected with a supporting side plate, and the top of the supporting bottom plate is provided with a semiconductor chip cleaning mechanism; the top of connecting the roof and the output fixed connection of cylinder, the one end of connecting the curb plate and the bottom one end fixed connection of connecting the roof, the both ends fixed connection of bottom plate is in the inner wall bottom of connecting the curb plate, grip block symmetry installs in the inner wall of connecting the curb plate, and the grip block slip joint at the connection curb plate at the inner wall of connecting the bottom plate top, adjusting screw's one end screw thread runs through the bottom rotation of connection bottom plate and grip block and is connected, and then rotate adjusting screw, adjusting screw can drive the grip block that is located the bottom and upwards move, consequently the distance between the grip block at bottom and the grip block at top has obtained corresponding adjustment, can carry out the centre gripping to the chip of equidimension steadily.
Description
Technical Field
The utility model belongs to the technical field of chip cleaning, and particularly relates to a processing tank for a semiconductor chip cleaning device.
Background
Etching is a technique of removing a material by using a chemical reaction or a physical impact action, namely removing a protective film in an area to be etched after exposure plate making and development, and contacting a chemical solution during etching to achieve the effect of dissolution and corrosion, thereby forming a concave-convex or hollow-out molding effect, and is widely applied to semiconductor chip manufacturing and circuit board manufacturing.
The existing semiconductor chip is not thoroughly cleaned in the process of cleaning in the processing tank after etching, impurities mixed in cleaning liquid still adhere to the surface of the semiconductor chip, the cleaning effect of the semiconductor chip cleaning device is affected, the manufacturing quality of the semiconductor chip can be affected even, meanwhile, the cleaning frame of the existing semiconductor chip is fixed in placing space during use, only one chip cleaning can be met, and the practicability is reduced.
In order to solve the above problems, the present application proposes a processing tank for a semiconductor chip cleaning apparatus.
Disclosure of Invention
To solve the problems set forth in the background art. The utility model provides a processing tank for a semiconductor chip cleaning device, which can solve the problems that the existing semiconductor chip is not thoroughly cleaned in the cleaning process in the processing tank after etching by adding a semiconductor chip cleaning mechanism and an auxiliary flushing mechanism, impurities mixed in cleaning liquid still adhere to the surface of the semiconductor chip after cleaning, the cleaning effect of the semiconductor chip cleaning device is affected, the manufacturing quality of the semiconductor chip is even affected, and meanwhile, the placing interval of the existing semiconductor chip cleaning frame is fixed during use, only one chip cleaning can be met, and the practicability is reduced.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the processing tank for the semiconductor chip cleaning device comprises a supporting bottom plate, wherein the top of the supporting bottom plate is symmetrically and fixedly connected with supporting side plates, and the top of the supporting bottom plate is provided with a semiconductor chip cleaning mechanism;
the semiconductor chip cleaning mechanism comprises a sliding bottom plate, a cleaning treatment groove, a supporting arm, a sliding sleeve plate, a sliding top plate, an air cylinder and a chip mounting assembly, wherein the sliding bottom plate is connected with the top of the supporting bottom plate in a sliding clamping mode, the cleaning treatment groove is arranged at the top of the sliding bottom plate, one end of the supporting arm is fixedly connected with one end of the top of the sliding bottom plate, the sliding sleeve plate is connected with the supporting arm in a sliding mode, the bottom of the sliding top plate is fixedly connected with the other end of the supporting arm in a sliding mode, the air cylinder is arranged at the top of the sliding top plate, the output end of the air cylinder penetrates through the top of the sliding top plate and is connected with the top of the chip mounting assembly, and two ends of the chip mounting assembly are connected with the outer wall of the sliding sleeve plate.
The chip mounting assembly comprises a connecting top plate, a connecting side plate, a connecting bottom plate, a clamping plate and an adjusting screw rod, wherein the top of the connecting top plate is fixedly connected with the output end of the air cylinder, one end of the connecting side plate is fixedly connected with one end of the bottom of the connecting top plate, two ends of the connecting bottom plate are fixedly connected to the bottom of the inner wall of the connecting side plate, the clamping plate is symmetrically arranged on the inner wall of the connecting side plate, the clamping plate positioned at the top of the connecting bottom plate is in sliding clamping connection with the inner wall of the connecting side plate, and one end of the adjusting screw rod penetrates through the connecting bottom plate and is in rotary connection with the bottom of the clamping plate.
The utility model relates to a treatment tank for a semiconductor chip cleaning device, which is preferable and further comprises an auxiliary flushing mechanism arranged on a supporting side plate, wherein the auxiliary flushing mechanism comprises a water tank, a water pump, a communication pipeline, a mounting plate and spray heads, the water tank is arranged at the bottom of the outer wall of the supporting side plate, the water pump is arranged on the outer wall of the supporting side plate, the communication pipeline is arranged between a water inlet of the water pump and a water outlet of the water tank and is connected with the water inlet of the water pump through the communication pipeline, one side of the mounting plate is arranged on the inner wall of the supporting side plate, one ends of the spray heads are arranged on the other side of the mounting plate at equal intervals, and the spray heads are communicated with a water outlet of the water pump.
As a preferable processing bath for a semiconductor chip cleaning apparatus of the present utility model, the holding plate is provided with holding grooves at equal intervals.
As a treatment tank for a semiconductor chip cleaning apparatus of the present utility model, preferably, the sliding sleeve plate and the connection side plate are fixedly connected to each other by a connection plate.
As a preferable treatment tank for the semiconductor chip cleaning device, the bottom of the sliding bottom plate is fixedly connected with a guide plate, and the top of the supporting bottom plate is provided with a guide groove matched with the guide plate.
As a preferable processing tank for the semiconductor chip cleaning device, the two ends of the sliding top plate are fixedly connected with guide plates, and the inner wall of the supporting side plate is provided with guide grooves matched with the guide plates.
In the processing tank for a semiconductor chip cleaning device of the present utility model, preferably, a baffle is fixedly connected to an inner wall of the supporting side plate, and the baffle has an inclined structure.
Preferably, the processing tank for the semiconductor chip cleaning device of the present utility model, two ends of the deflector are fixedly connected with bumps.
Compared with the prior art, the utility model has the beneficial effects that:
1. the top of the connecting top plate is fixedly connected with the output end of the air cylinder, one end of the connecting side plate is fixedly connected with one end of the bottom of the connecting top plate, two ends of the connecting bottom plate are fixedly connected to the bottom of the inner wall of the connecting side plate, the clamping plates are symmetrically arranged on the inner wall of the connecting side plate, the clamping plates positioned at the top of the connecting bottom plate are slidably clamped on the inner wall of the connecting side plate, one end thread of the adjusting screw rod penetrates through the connecting bottom plate and is rotationally connected with the bottom of the clamping plates, the adjusting screw rod is further rotated, the clamping plates positioned at the bottom can be driven to move upwards by the adjusting screw rod, and therefore, the distance between the clamping plates positioned at the bottom and the clamping plates positioned at the top can be correspondingly adjusted, and chips with different sizes can be stably clamped;
2. the water tank is installed in the outer wall bottom of supporting the curb plate, the water pump is installed in the outer wall of supporting the curb plate, be provided with the communication pipeline between the water inlet of water pump and the delivery port of water tank, and be connected through the communication pipeline, the inner wall at supporting the curb plate is installed to one side of mounting panel, the opposite side at the mounting panel is installed to the equidistant one end of a plurality of shower nozzle, the shower nozzle is linked together with the delivery port of water pump, and then take out the back from the washing processing inslot when the chip, through starting the water pump, the water pump can carry the washing liquid in the water tank to the shower nozzle blowout, carry out the secondary to the chip and wash, thereby avoided the surface of chip to have the problem of impurity.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of a connecting side plate according to the present utility model;
FIG. 3 is a schematic view of a clamping plate according to the present utility model;
fig. 4 is a schematic structural view of a baffle in the present utility model.
In the figure:
1. a support base plate;
2. supporting the side plates; 21. a deflector;
3. a semiconductor chip cleaning mechanism; 31. a sliding bottom plate; 32. cleaning the treatment tank; 33. a support arm; 34. a sliding sleeve plate; 35. a sliding top plate; 36. a cylinder; 37. a chip mounting assembly; 371. connecting a top plate; 372. connecting side plates; 373. a connecting bottom plate; 374. a clamping plate; 375. adjusting a screw rod;
4. an auxiliary flushing mechanism; 41. a water tank; 42. a water pump; 43. a communication pipe; 44. a mounting plate; 45. a spray head.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1;
the utility model provides a semiconductor chip is processing tank for belt cleaning device, includes supporting baseplate 1, and the top symmetry fixedly connected with supporting baseplate 1 supports curb plate 2, and the top of supporting baseplate 1 is provided with semiconductor chip wiper mechanism 3.
In this embodiment: under the general condition, the existing semiconductor chip is not thoroughly cleaned in the cleaning process in the processing tank after etching, impurities mixed in the cleaning liquid still adhere to the surface of the semiconductor chip, the cleaning effect of the semiconductor chip cleaning device is affected, the manufacturing quality of the semiconductor chip can be affected even, further, the chips with different sizes can be correspondingly clamped and adjusted in distance through the added semiconductor chip cleaning mechanism 3 and auxiliary flushing mechanism 4, meanwhile, the surface of the chip can be sufficiently cleaned, and the problem of residual impurities on the surface can be avoided.
As shown in fig. 1-4;
based on the processing tank for the existing semiconductor chip cleaning device, the problems that the existing semiconductor chip is not thoroughly cleaned in the processing tank after etching in the cleaning process can be solved by adding the semiconductor chip cleaning mechanism 3 and the auxiliary flushing mechanism 4, impurities mixed in cleaning liquid still adhere to the surface of the semiconductor chip, the cleaning effect of the semiconductor chip cleaning device is affected, the manufacturing quality of the semiconductor chip can be affected, and meanwhile, the cleaning frame of the existing semiconductor chip is fixed in placing interval during use, so that only one chip cleaning can be satisfied, and the problem of practicability is reduced.
Further, the method comprises the following steps:
in combination with the above, in order to perform corresponding clamping pitch adjustment on chips of different sizes, the top of the support base plate 1 is provided with the semiconductor chip cleaning mechanism 3, the semiconductor chip cleaning mechanism 3 includes the slide base plate 31, the cleaning processing tank 32, the support arm 33, the slide sleeve plate 34, the slide top plate 35, the air cylinder 36 and the chip mounting assembly 37, the slide base plate 31 is slidably clamped at the top of the support base plate 1, the cleaning processing tank 32 is mounted at the top of the slide base plate 31, one end of the support arm 33 is fixedly connected at one end of the top of the slide base plate 31, the slide sleeve plate 34 is slidably sleeved on the support arm 33, the bottom of the slide top plate 35 is fixedly connected with the other end of the support arm 33, the air cylinder 36 is mounted at the top of the slide top plate 35, and the output end of the air cylinder 36 penetrates through the top of the slide top plate 35 to be connected with the top of the chip mounting assembly 37, and both ends of the chip mounting assembly 37 are connected with the outer wall of the slide sleeve plate 34.
In this embodiment: because the sliding bottom plate 31 is slidably clamped at the top of the supporting bottom plate 1, the cleaning treatment tank 32 is mounted at the top of the sliding bottom plate 31, one end of the supporting arm 33 is fixedly connected at one end of the top of the sliding bottom plate 31, the sliding sleeve plate 34 is slidably sleeved on the supporting arm 33, the bottom of the sliding top plate 35 is fixedly connected with the other end of the supporting arm 33, the air cylinder 36 is mounted at the top of the sliding top plate 35, the output end of the air cylinder 36 penetrates through the top of the sliding top plate 35 and is connected with the top of the chip mounting assembly 37, the two ends of the chip mounting assembly 37 are connected with the outer wall of the sliding sleeve plate 34, and then the chip mounting assembly 37 is firstly mounted in the chip mounting assembly 37, and then the air cylinder 36 can drive the chip mounting assembly 37 to be immersed in the cleaning treatment tank 32 through the starting air cylinder 36, so that impurities on the surface of the chip can be cleaned efficiently in the cleaning treatment tank 32, and it should be understood that an ultrasonic cleaner is arranged in the cleaning treatment tank 32.
It should be understood that: the bottom fixedly connected with deflector of slip bottom plate 31, the guide way with deflector assorted is offered at the top of supporting baseplate 1, the both ends fixedly connected with deflector of slip roof 35, the guide way with deflector assorted is offered to the inner wall of supporting curb plate 2.
It should be noted that: the chip mounting assembly 37 includes connecting roof 371, connecting curb plate 372, connecting bottom plate 373, grip block 374 and accommodate the lead screw 375, the top of connecting roof 371 and the output fixed connection of cylinder 36, the one end of connecting curb plate 372 and the bottom one end fixed connection of connecting roof 371, the both ends fixed connection of connecting bottom plate 373 is in the inner wall bottom of connecting curb plate 372, grip block 374 symmetry installs the inner wall at connecting curb plate 372, and the grip block 374 slip joint at connecting the inner wall of curb plate 372 at connecting bottom plate 373 top, the one end screw thread of accommodate the lead screw 375 runs through connecting bottom plate 373 and the bottom rotation connection of grip block 374.
In this embodiment: because the top of connecting roof 371 and the output fixed connection of cylinder 36, the one end of connecting curb plate 372 and the bottom one end fixed connection of connecting roof 371, the both ends fixed connection of bottom plate 373 is in the inner wall bottom of connecting curb plate 372, grip block 374 symmetry installs the inner wall at connecting curb plate 372, and the grip block 374 slip joint at connecting curb plate 372 that is located the bottom plate 373 top, the one end screw thread penetration connection bottom plate 373 of accommodate screw 375 is rotated with the bottom of grip block 374 and is connected, and then rotate accommodate screw 375, accommodate screw 375 can drive the grip block 374 that is located the bottom upwards move, consequently, the distance between the grip block 374 that is located the bottom and the grip block 374 at top has obtained corresponding adjustment, can carry out the centre gripping to the chip of equidimension.
It should be understood that: clamping grooves are formed in the clamping plates 374 at equal intervals, and the sliding sleeve plate 34 and the connecting side plates 372 are fixedly connected with each other through connecting plates.
Still further, the method comprises: the auxiliary flushing mechanism 4 is arranged on the supporting side plate 2, the auxiliary flushing mechanism 4 comprises a water tank 41, a water pump 42, a communicating pipeline 43, a mounting plate 44 and spray nozzles 45, the water tank 41 is arranged at the bottom of the outer wall of the supporting side plate 2, the water pump 42 is arranged on the outer wall of the supporting side plate 2, a communicating pipeline 43 is arranged between a water inlet of the water pump 42 and a water outlet of the water tank 41 and is connected through the communicating pipeline 43, one side of the mounting plate 44 is arranged on the inner wall of the supporting side plate 2, one end of a plurality of spray nozzles 45 is arranged on the other side of the mounting plate 44 at equal intervals, and the spray nozzles 45 are communicated with the water outlet of the water pump 42.
In this embodiment: because the water tank 41 is installed in the outer wall bottom of supporting curb plate 2, the water pump 42 is installed in the outer wall of supporting curb plate 2, be provided with the pipeline 43 between the water inlet of water pump 42 and the delivery port of water tank 41, and be connected through pipeline 43, the inner wall at supporting curb plate 2 is installed to one side of mounting panel 44, the opposite side at mounting panel 44 is installed to the equidistant one end of a plurality of shower nozzle 45, shower nozzle 45 is linked together with the delivery port of water pump 42, and then after the chip is taken out from wasing in the processing tank 32, through starting water pump 42, water pump 42 can carry the washing liquid in the water tank 41 to shower nozzle 45 blowout, carry out the secondary to the chip and wash, thereby avoided the surface of chip to have the problem of impurity.
It should be understood that: the inner wall fixedly connected with guide plate 21 of supporting curb plate 2, and guide plate 21 is the slope structure, can be with the washing liquid after the secondary washings in the washing treatment tank 32 through guide plate 21, the lug of both ends fixedly connected with of guide plate 21, the drainage pipe is installed to one side of washing treatment tank 32.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (9)
1. The utility model provides a semiconductor chip belt cleaning device is with processing tank, includes supporting baseplate (1), the top symmetry fixedly connected with of supporting baseplate (1) supports curb plate (2), its characterized in that: the top of the supporting bottom plate (1) is provided with a semiconductor chip cleaning mechanism (3);
semiconductor chip wiper mechanism (3) are including slip bottom plate (31), wash processing groove (32), support arm (33), slip sleeve board (34), slip roof (35), cylinder (36) and chip installation component (37), slip bottom plate (31) slip joint is in the top of supporting baseplate (1), wash processing groove (32) are installed the top of slip bottom plate (31), the one end fixed connection of support arm (33) is in the top one end of slip bottom plate (31), slip sleeve board (34) slip cup joint on support arm (33), the bottom of slip roof (35) with the other end fixed connection of support arm (33), cylinder (36) are installed the top of slip roof (35), just the output of cylinder (36) runs through the top of slip roof (35) with the top of chip installation component (37) is connected, the both ends of chip installation component (37) with the outer wall of slip sleeve board (34) is connected.
2. The processing bath for a semiconductor chip cleaning apparatus according to claim 1, wherein: the chip mounting assembly (37) comprises a connecting top plate (371), a connecting side plate (372), a connecting bottom plate (373), a clamping plate (374) and an adjusting screw rod (375), wherein the top of the connecting top plate (371) is fixedly connected with the output end of the air cylinder (36), one end of the connecting side plate (372) is fixedly connected with one end of the bottom of the connecting top plate (371), two ends of the connecting bottom plate (373) are fixedly connected with the bottom of the inner wall of the connecting side plate (372), the clamping plate (374) is symmetrically mounted on the inner wall of the connecting side plate (372), the clamping plate (374) is located at the top of the connecting bottom plate (373) and is in sliding clamping connection with the inner wall of the connecting side plate (372), and one end thread of the adjusting screw rod (375) penetrates through the connecting bottom plate (373) and the bottom of the clamping plate (374) is connected in a rotating mode.
3. The processing bath for a semiconductor chip cleaning apparatus according to claim 1, wherein: the water tank (41) is installed at the bottom of the outer wall of the supporting side plate (2), the water pump (42) is installed at the outer wall of the supporting side plate (2), the water inlet of the water pump (42) is provided with the communicating pipeline (43) between the water outlet of the water tank (41), and the water pump is connected through the communicating pipeline (43), one side of the mounting plate (44) is installed on the inner wall of the supporting side plate (2), one end of the spray heads (45) is installed at the other side of the mounting plate (44) at equal intervals, and the spray heads (45) are communicated with the water outlet of the water pump (42).
4. The processing bath for a semiconductor chip cleaning apparatus according to claim 2, wherein: clamping grooves are formed in the clamping plates (374) at equal intervals.
5. The processing bath for a semiconductor chip cleaning apparatus according to claim 2, wherein: the sliding sleeve plate (34) and the connecting side plate (372) are fixedly connected with each other through a connecting plate.
6. The processing bath for a semiconductor chip cleaning apparatus according to claim 1, wherein: the bottom of the sliding bottom plate (31) is fixedly connected with a guide plate, and the top of the supporting bottom plate (1) is provided with a guide groove matched with the guide plate.
7. The processing bath for a semiconductor chip cleaning apparatus according to claim 1, wherein: guide plates are fixedly connected to the two ends of the sliding top plate (35), and guide grooves matched with the guide plates are formed in the inner walls of the supporting side plates (2).
8. The processing bath for a semiconductor chip cleaning apparatus according to claim 1, wherein: the inner wall of the supporting side plate (2) is fixedly connected with a guide plate (21), and the guide plate (21) is of an inclined structure.
9. The processing bath for a semiconductor chip cleaning apparatus according to claim 8, wherein: two ends of the guide plate (21) are fixedly connected with protruding blocks.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223535849.8U CN218996690U (en) | 2022-12-29 | 2022-12-29 | Semiconductor chip is processing tank for belt cleaning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223535849.8U CN218996690U (en) | 2022-12-29 | 2022-12-29 | Semiconductor chip is processing tank for belt cleaning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218996690U true CN218996690U (en) | 2023-05-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223535849.8U Active CN218996690U (en) | 2022-12-29 | 2022-12-29 | Semiconductor chip is processing tank for belt cleaning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218996690U (en) |
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2022
- 2022-12-29 CN CN202223535849.8U patent/CN218996690U/en active Active
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