CN211760527U - Equipment for removing waste after semiconductor unit forming - Google Patents
Equipment for removing waste after semiconductor unit forming Download PDFInfo
- Publication number
- CN211760527U CN211760527U CN201922450111.3U CN201922450111U CN211760527U CN 211760527 U CN211760527 U CN 211760527U CN 201922450111 U CN201922450111 U CN 201922450111U CN 211760527 U CN211760527 U CN 211760527U
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- box body
- gooseneck
- water
- water tank
- filter screen
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- 239000002699 waste material Substances 0.000 title claims abstract description 39
- 239000004065 semiconductor Substances 0.000 title claims abstract description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 84
- 244000261422 Lysimachia clethroides Species 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 40
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000005406 washing Methods 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 21
- 238000000227 grinding Methods 0.000 claims abstract description 14
- 238000007493 shaping process Methods 0.000 claims abstract description 7
- 238000001035 drying Methods 0.000 claims description 16
- 239000007921 spray Substances 0.000 claims description 13
- 238000005498 polishing Methods 0.000 claims description 10
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 6
- 230000008878 coupling Effects 0.000 claims description 5
- 238000010168 coupling process Methods 0.000 claims description 5
- 238000005859 coupling reaction Methods 0.000 claims description 5
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 3
- 239000004917 carbon fiber Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 claims description 3
- 238000013016 damping Methods 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 claims description 2
- 239000012528 membrane Substances 0.000 claims description 2
- 230000008030 elimination Effects 0.000 claims 1
- 238000003379 elimination reaction Methods 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 22
- 239000000919 ceramic Substances 0.000 abstract description 22
- 229910052710 silicon Inorganic materials 0.000 abstract description 22
- 239000010703 silicon Substances 0.000 abstract description 22
- 239000000428 dust Substances 0.000 abstract description 13
- 230000002349 favourable effect Effects 0.000 abstract description 5
- 239000003381 stabilizer Substances 0.000 abstract description 4
- 230000000694 effects Effects 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 7
- 239000000243 solution Substances 0.000 description 5
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Abstract
The utility model discloses a waste material clearing equipment after semiconductor unit's ware shaping, including platform, anchor clamps mounting panel, anchor clamps, box, wind fill, fan, first gooseneck, motor, mill, second gooseneck, water pump, shower nozzle, water pipe, electric putter, stabilizer blade, mounting panel, play liquid joint, water tank, feed liquor joint, the useless head of row and filter screen. The utility model discloses contain washing mechanism, when grinding mechanism has polished ceramic substrate or silicon chip, the water pump during operation of washing mechanism this moment, make water in the water tank draw forth by going out liquid joint, then through the shower nozzle blowout, shower nozzle spun water can wash away the abrasive dust on the ceramic substrate of water pipe or the silicon chip this moment, the abrasive dust after washing away is drawn forth then by the waste discharge head and is got into the water tank by the feed liquor joint along with water, this moment under the effect of filter screen in the water tank, filter the abrasive dust waste material in the rivers, and then make the water in the water tank can circulate and use, be favorable to the washing after ceramic substrate or silicon chip polish and the collection of abrasive dust waste material.
Description
Technical Field
The utility model relates to a waste material clearing equipment behind the shaping of semiconductor unit ware specifically is a waste material clearing equipment behind the shaping of semiconductor unit ware, belongs to the waste material clearing equipment application technology field behind the shaping of semiconductor unit ware.
Background
The semiconductor element device is an electronic device which has the conductivity between a good electric conductor and an insulator and can complete specific functions by utilizing the special electric characteristics of a semiconductor material, and can be used for generating, controlling, receiving, converting, amplifying signals and carrying out energy conversion.
The back is polished to current semiconductor components's ceramic substrate or silicon chip, mostly uses the waste material that the dust catcher will polish the production to suck away, and this kind of waste material clearance mode can't thoroughly clear away the waste material of adhesion on ceramic substrate or silicon chip of polishing, and the follow-up washing that need of ceramic substrate or silicon chip just can guarantee that the surface is clean, has increased the process step, has certain not enough. Therefore, the waste material removing device after the semiconductor device is formed is provided for solving the problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a waste material cleaning equipment after the shaping of semiconductor unit ware in order to solve above-mentioned problem.
The utility model discloses a technical scheme realizes above-mentioned mesh, a waste material clearing equipment after semiconductor unit ware shaping, including the platform, box, stabilizer blade, mounting panel, grinding mechanism, washing mechanism and auxiliary drying mechanism, the top surface rigid coupling of platform has the box, the vertical rigid coupling in four corners of platform bottom surface has the stabilizer blade, and four the bottom department horizontal rigid couplings between the stabilizer blade have the mounting panel, washing mechanism installs on the roof of mounting panel and box, grinding mechanism installs on the roof and the bottom plate of box, auxiliary drying mechanism installs on the roof of box;
the washing mechanism comprises a second gooseneck, a water pump, a spray head, a water pipe, a water tank, a waste discharge head and a filter screen, the water pump and the second gooseneck are sequentially installed on a top plate of the tank body, the bottom end of the second gooseneck extends into the tank body, the spray head is installed at the bottom end of the second gooseneck, the output end of the water pump is connected with the top end of the second gooseneck, the water tank is installed on the top surface of the installation plate, a liquid inlet joint and a liquid outlet joint are respectively installed at the bottom of the top plate and the bottom of a side plate of the water tank in a penetrating mode, one end of the liquid outlet joint is connected with the input end of the water pump through the water pipe, the filter screen is horizontally installed at the middle part of the water tank, the waste discharge head is installed on the bottom surface of the waste discharge head, the top end of the waste discharge;
the polishing mechanism comprises a clamp mounting plate, a clamp, a motor, a grinding disc and an electric push rod, wherein the motor is mounted on the top surface of a top plate of the box body, the output end of the motor extends into the box body, the grinding disc is mounted at the output end of the motor, the electric push rod is fixedly mounted at the center of the bottom surface of the electric push rod in a penetrating mode, the top end of the electric push rod extends into the box body, the clamp mounting plate is mounted at the top end of the electric push rod, and the clamp is mounted on the top surface;
supplementary drying mechanism includes fan and first gooseneck, the top surface at the box roof is installed in proper order to first gooseneck and fan, the bottom of first gooseneck extends to in the box, just the wind scoop is installed to the bottom of first gooseneck, the top of first gooseneck is connected with the output of fan.
Preferably, the bottom surface rigid coupling of anchor clamps has two screws, the screw rod passes under the anchor clamps mounting panel extends to the bottom surface of anchor clamps mounting panel, the nut is installed to the screw thread on the screw rod, the top surface of anchor clamps is opened there is the substrate draw-in groove.
Preferably, the air scoop is a carbon fiber air scoop, and an electric heating wire is installed in the air scoop.
Preferably, the first gooseneck and the second gooseneck are both metal goosenecks, and the spray head is a strip-shaped spray head.
Preferably, the box body is a stainless steel box body, and the inner wall of the box body is sprayed with a corrosion-resistant non-stick coating.
Preferably, a box door is hinged to one side face of the box body, a rubber strip is installed at the contact position of the box door and the box body, and a transparent window is installed on the box door in an embedded mode.
Preferably, a hollowed hole is formed in the top of one side plate of the box body, and the diameter of the hollowed hole is 10mm-20 mm.
Preferably, the contact positions of the fan, the motor and the water pump with the top plate of the box body are all provided with damping gaskets.
Preferably, the top plate of motor is run through and is installed with the water injection well choke, the cap is installed to the screw thread on the water injection well choke, just the embedding is installed the liquid level observation window on the curb plate of water tank.
Preferably, the filter screen is a metal filter screen, and the top surface of the filter screen is attached with a semipermeable membrane.
The utility model has the advantages that:
1. the utility model discloses contain the washing mechanism, when polishing mechanism has polished ceramic substrate or silicon chip, the water pump during operation of washing mechanism this moment makes the water in the water tank draw forth by going out liquid joint, then spout through the shower nozzle, the water of shower nozzle blowout can wash away the abrasive dust on the ceramic substrate or the silicon chip of water pipe this moment, the abrasive dust after washing away is drawn forth by the waste discharge head along with water then gets into the water tank by the feed liquor joint, at this moment under the effect of filter screen in the water tank, filter the abrasive dust waste material in the rivers, and then make the water in the water tank can circulate and use, be favorable to the washing after ceramic substrate or silicon chip polish and the collection of abrasive dust waste material;
2. the utility model discloses contain supplementary drying mechanism, wash the fan work that makes supplementary drying mechanism through control switch after accomplishing, the wind that the fan during operation produced is blown off by the wind scoop, and the wind that blows off this moment can be favorable to the abluent drying of ceramic substrate or silicon chip with the evaporation of accelerating the moisture on ceramic substrate or the silicon chip, device simple structure, and it is comparatively convenient to use.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise.
FIG. 1 is a perspective view of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a schematic view of the internal structure of the box body of the present invention;
fig. 4 is the schematic diagram of the internal structure of the water tank of the present invention.
In the figure: 1. the device comprises a platform, 2, a clamp mounting plate, 3, a clamp, 4, a box body, 5, an air hopper, 6, a fan, 7, a first gooseneck, 8, a motor, 9, a grinding disc, 10, a second gooseneck, 11, a water pump, 12, a spray head, 13, a water pipe, 14, an electric push rod, 15, a support leg, 16, a mounting plate, 17, a liquid outlet joint, 18, a water tank, 19, a liquid inlet joint, 20, a waste discharge head, 21 and a filter screen.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the drawings in the embodiments of the present invention are combined below to clearly and completely describe the technical solutions in the embodiments of the present invention, and obviously, the embodiments described below are only some embodiments of the present invention, but not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The technical solution of the present invention is further explained by the following embodiments with reference to the accompanying drawings.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Referring to fig. 1-4, the equipment for removing the waste after the semiconductor element device is formed comprises a platform 1, a box body 4, support legs 15, a mounting plate 16, a polishing mechanism, a washing mechanism and an auxiliary drying mechanism, wherein the box body 4 is fixedly connected to the top surface of the platform 1, the support legs 15 are vertically and fixedly connected to four corners of the bottom surface of the platform 1, the mounting plate 16 is horizontally and fixedly connected to the bottom among the four support legs 15, the washing mechanism is installed on the mounting plate 16 and a top plate of the box body 4, the polishing mechanism is installed on the top plate and a bottom plate of the box body 4, and the auxiliary drying mechanism is installed on the top plate of the box body 4;
the water washing mechanism comprises a second gooseneck 10, a water pump 11, a spray head 12, a water pipe 13, a water tank 18, a waste discharge head 20 and a filter screen 21, the water pump 11 and the second gooseneck 10 are sequentially arranged on the top plate of the box body 4, the bottom end of the second gooseneck 10 extends into the box body 4, a nozzle 12 is arranged at the bottom end of the second gooseneck 10, the output end of the water pump 11 is connected with the top end of the second gooseneck 10, the water tank 18 is arranged on the top surface of the mounting plate 16, the liquid inlet joint 19 and the liquid outlet joint 17 are respectively arranged at the bottom of the top plate and the bottom of one side plate of the water tank 18 in a penetrating way, one end of the liquid outlet joint 17 is connected with the input end of the water pump 11 through a water pipe 13, a filter screen 21 is horizontally arranged at the middle part in the water tank 18, the bottom surface of the waste discharge head 20 is provided with the waste discharge head 20, the top end of the waste discharge head 20 extends into the box body 4, and the bottom end of the waste discharge head 20 is connected with the top end of the liquid inlet joint 19;
the polishing mechanism comprises a clamp mounting plate 2, a clamp 3, a motor 8, a grinding disc 9 and an electric push rod 14, wherein the motor 8 is mounted on the top surface of the top plate of the box body 4, the output end of the motor 8 extends into the box body 4, the grinding disc 9 is mounted at the output end of the motor 8, the electric push rod 14 is fixedly mounted at the center of the bottom surface of the electric push rod 14 in a penetrating manner, the top end of the electric push rod 14 extends into the box body 4, the clamp mounting plate 2 is mounted at the top end of the electric push rod 14, and the clamp 3 is mounted on the top surface of the clamp;
supplementary drying mechanism includes fan 6 and first gooseneck 7, the top surface at 4 roofs of box is installed in proper order to first gooseneck 7 and fan 6, the bottom of first gooseneck 7 extends to in the box 4, just air scoop 5 is installed to the bottom of first gooseneck 7, the top of first gooseneck 7 is connected with the output of fan 6.
The bottom surface of the clamp 3 is fixedly connected with two screw rods, the screw rods penetrate through the clamp mounting plate 2 and extend to the position below the bottom surface of the clamp mounting plate 2, nuts are arranged on the screw rods in a threaded mode, and a substrate clamping groove is formed in the top surface of the clamp 3, so that ceramic substrates or silicon wafers can be clamped and fixed conveniently; the air scoop 5 is a carbon fiber air scoop, and the heating wire is arranged in the air scoop 5, so that the drying of the ceramic substrate or the silicon wafer after washing is accelerated; the first gooseneck 7 and the second gooseneck 10 are both metal goosenecks, and the spray head 12 is a strip-shaped spray head; the box body 4 is a stainless steel box body, and the inner wall of the box body 4 is sprayed with a corrosion-resistant non-stick coating; a box door is hinged to one side face of the box body 4, a rubber strip is arranged at the contact position of the box door and the box body 4, and a transparent window is embedded in the box door and is convenient for sealing the box body 4; a hollowed hole is formed in the top of one side plate of the box body 4, and the aperture of the hollowed hole is 10-20 mm, so that the balance of the air pressure inside and outside the box body 4 is kept; damping gaskets are arranged at the contact positions of the fan 6, the motor 8 and the water pump 11 and the top plate of the box body 4, so that the fan 6, the motor 8 and the water pump 11 can be damped during working; a water adding nozzle is arranged on a top plate of the motor 8 in a penetrating mode, a cap is arranged on the water adding nozzle in a threaded mode, and a liquid level observation window is embedded in one side plate of the water tank 18; filter screen 21 is the metal filter screen, the pellicle is installed to the top surface attachment of filter screen 21, is convenient for guarantee filter screen 21's filter capacity.
When the utility model is used, the electric elements appearing in the application are externally connected with a power supply and a control switch, when ceramic substrates or silicon wafers are polished, the ceramic substrates or the silicon wafers to be polished are placed in the substrate clamping grooves of the clamp 3, the electric push rod 14 is lifted through the control switch until the ceramic substrates or the silicon wafers are contacted with the grinding disc 9, then the motor 8 is driven to work through the control switch, at the moment, the motor 8 drives the grinding disc 9 to grind the ceramic substrates or the silicon wafers flat, more grinding scrap waste materials are generated during polishing, the ceramic substrates or the silicon wafers are required to be cleaned, the device comprises a washing mechanism, a proper amount of clean water is added into the water tank 18 of the washing mechanism, after the polishing mechanism is polished, the water pump 11 of the washing mechanism works through the control switch, when the water pump 11 works, the water in the water tank 18 is led out through the liquid outlet joint 17 and then is sprayed out through the spray head 12, the water of shower nozzle 12 spun this moment can wash away the abrasive dust on the ceramic substrate or the silicon chip of water pipe 13, the abrasive dust after washing away is drawn forth by waste discharge head 20 along with water then gets into in water tank 18 by liquid inlet joint 19, this moment under the effect of filter screen 21 in water tank 18, filter the abrasive dust waste material in the rivers, and then make the water in the water tank 18 circulated and use, be favorable to the washing after ceramic substrate or silicon chip are polished and the collection of abrasive dust waste material, the device contains supplementary drying mechanism, make fan 6 work through control switch after the washing is accomplished, the wind that fan 6 during operation produced is blown off by wind fill 5, the wind that blows off this moment can accelerate the evaporation of the moisture on ceramic substrate or the silicon chip, be favorable to the abluent drying of ceramic substrate or silicon chip.
It is well within the skill of those in the art to implement, without undue experimentation, the present invention does not relate to software and process improvements, as related to circuits and electronic components and modules.
It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. The utility model provides a waste material elimination equipment after semiconductor unit ware shaping which characterized in that: the drying device comprises a platform (1), a box body (4), support legs (15), mounting plates (16), a polishing mechanism, a washing mechanism and an auxiliary drying mechanism, wherein the box body (4) is fixedly connected to the top surface of the platform (1), the support legs (15) are vertically and fixedly connected to four corners of the bottom surface of the platform (1), the mounting plates (16) are horizontally and fixedly connected to the bottoms of the four support legs (15), the washing mechanism is installed on the top plates of the mounting plates (16) and the box body (4), the polishing mechanism is installed on the top plate and the bottom plate of the box body (4), and the auxiliary drying mechanism is installed on the top plate of the box body (4);
the washing mechanism comprises a second gooseneck (10), a water pump (11), a spray head (12), a water pipe (13), a water tank (18), a waste discharge head (20) and a filter screen (21), wherein the water pump (11) and the second gooseneck (10) are sequentially installed on a top plate of the box body (4), the bottom end of the second gooseneck (10) extends into the box body (4), the spray head (12) is installed at the bottom end of the second gooseneck (10), the output end of the water pump (11) is connected with the top end of the second gooseneck (10), the water tank (18) is installed on the top surface of the mounting plate (16), a liquid inlet joint (19) and a liquid outlet joint (17) are respectively installed at the bottom parts of the top plate and a side plate of the water tank (18) in a penetrating manner, one end of the liquid outlet joint (17) is connected with the input end of the water pump (11) through the water pipe (13), the filter screen (21) is horizontally installed at the middle part in the, the bottom surface of the waste discharge head (20) is provided with the waste discharge head (20), the top end of the waste discharge head (20) extends into the box body (4), and the bottom end of the waste discharge head (20) is connected with the top end of the liquid inlet joint (19);
the grinding mechanism comprises a clamp mounting plate (2), a clamp (3), a motor (8), a grinding disc (9) and an electric push rod (14), wherein the motor (8) is mounted on the top surface of a top plate of the box body (4), the output end of the motor (8) extends into the box body (4), the grinding disc (9) is mounted at the output end of the motor (8), the electric push rod (14) is fixedly installed at the center of the bottom surface of the electric push rod (14) in a penetrating mode, the top end of the electric push rod (14) extends into the box body (4), the clamp mounting plate (2) is mounted at the top end of the electric push rod (14), and the clamp (3) is mounted on the top surface of the clamp mounting plate;
supplementary drying mechanism includes fan (6) and first gooseneck (7), install the top surface at box (4) roof in proper order in first gooseneck (7) and fan (6), the bottom of first gooseneck (7) extends to in box (4), just wind scoop (5) are installed to the bottom of first gooseneck (7), the top of first gooseneck (7) is connected with the output of fan (6).
2. The apparatus of claim 1, wherein the apparatus further comprises: the bottom surface rigid coupling of anchor clamps (3) has two screw rods, the screw rod passes under anchor clamps mounting panel (2) extends to the bottom surface of anchor clamps mounting panel (2), the nut is installed to the screw thread on the screw rod, the top surface of anchor clamps (3) is opened there is the substrate draw-in groove.
3. The apparatus of claim 1, wherein the apparatus further comprises: the air hopper (5) is a carbon fiber air hopper, and an electric heating wire is installed in the air hopper (5).
4. The apparatus of claim 1, wherein the apparatus further comprises: the first gooseneck (7) and the second gooseneck (10) are both metal goosenecks, and the spray head (12) is a long-strip-shaped spray head.
5. The apparatus of claim 1, wherein the apparatus further comprises: the box body (4) is a stainless steel box body, and the inner wall of the box body (4) is sprayed with a corrosion-resistant non-stick coating.
6. The apparatus of claim 1, wherein the apparatus further comprises: a side face of the box body (4) is hinged with a box door, a rubber strip is installed at the contact position of the box door and the box body (4), and a transparent window is installed on the box door in an embedded mode.
7. The apparatus of claim 1, wherein the apparatus further comprises: the top of one side plate of the box body (4) is provided with a hollow hole, and the diameter of the hollow hole is 10-20 mm.
8. The apparatus of claim 1, wherein the apparatus further comprises: and damping gaskets are arranged at the contact positions of the fan (6), the motor (8), the water pump (11) and the top plate of the box body (4).
9. The apparatus of claim 1, wherein the apparatus further comprises: the water tank is characterized in that a water adding nozzle is installed on a top plate of the motor (8) in a penetrating mode, a cap is installed on the water adding nozzle in a threaded mode, and a liquid level observation window is installed on a side plate of the water tank (18) in an embedded mode.
10. The apparatus of claim 1, wherein the apparatus further comprises: the filter screen (21) is a metal filter screen, and a semipermeable membrane is attached to the top surface of the filter screen (21).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922450111.3U CN211760527U (en) | 2019-12-30 | 2019-12-30 | Equipment for removing waste after semiconductor unit forming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922450111.3U CN211760527U (en) | 2019-12-30 | 2019-12-30 | Equipment for removing waste after semiconductor unit forming |
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| Publication Number | Publication Date |
|---|---|
| CN211760527U true CN211760527U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922450111.3U Active CN211760527U (en) | 2019-12-30 | 2019-12-30 | Equipment for removing waste after semiconductor unit forming |
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| Country | Link |
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| CN (1) | CN211760527U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113183046A (en) * | 2020-11-18 | 2021-07-30 | 秦龙 | Use method of polishing equipment for automobile casting production |
| CN113927385A (en) * | 2021-11-17 | 2022-01-14 | 晋城市春晨兴汇实业有限公司 | Environment-friendly nodular cast iron pipe inner wall cleaning equipment that polishes |
| WO2023109464A1 (en) * | 2021-12-16 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | Semiconductor processing device |
-
2019
- 2019-12-30 CN CN201922450111.3U patent/CN211760527U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113183046A (en) * | 2020-11-18 | 2021-07-30 | 秦龙 | Use method of polishing equipment for automobile casting production |
| CN113183046B (en) * | 2020-11-18 | 2023-08-18 | 河北国恒机械制造有限公司 | Using method of polishing equipment for automobile casting production |
| CN113927385A (en) * | 2021-11-17 | 2022-01-14 | 晋城市春晨兴汇实业有限公司 | Environment-friendly nodular cast iron pipe inner wall cleaning equipment that polishes |
| WO2023109464A1 (en) * | 2021-12-16 | 2023-06-22 | 盛美半导体设备(上海)股份有限公司 | Semiconductor processing device |
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