CN106944394A - A kind of silicon wafer turnover flusher - Google Patents
A kind of silicon wafer turnover flusher Download PDFInfo
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- CN106944394A CN106944394A CN201710188309.1A CN201710188309A CN106944394A CN 106944394 A CN106944394 A CN 106944394A CN 201710188309 A CN201710188309 A CN 201710188309A CN 106944394 A CN106944394 A CN 106944394A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 30
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 30
- 239000010703 silicon Substances 0.000 title claims abstract description 30
- 230000007306 turnover Effects 0.000 title 1
- 238000011010 flushing procedure Methods 0.000 claims abstract description 65
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 63
- 238000004140 cleaning Methods 0.000 claims abstract description 36
- 239000007921 spray Substances 0.000 claims abstract description 20
- 230000005540 biological transmission Effects 0.000 claims abstract description 8
- 238000005406 washing Methods 0.000 claims abstract description 8
- 239000007788 liquid Substances 0.000 claims description 19
- 239000012530 fluid Substances 0.000 claims 1
- 238000005086 pumping Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 231100001240 inorganic pollutant Toxicity 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 239000002957 persistent organic pollutant Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/001—Drying-air generating units, e.g. movable, independent of drying enclosure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
- F26B21/004—Nozzle assemblies; Air knives; Air distributors; Blow boxes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明公开了一种硅片翻转冲洗装置,包括冲洗箱、喷气盒和热风机,所述冲洗箱上设置有一个冲洗箱门,所述冲洗箱的一侧设置有一个电动机箱,所述电动机箱的外侧安装有一个控制面板,所述冲洗箱的底部设置有一个出水口,所述喷水管的一侧与水泵连接,所述喷水管的另一侧嵌入到冲洗箱内部,且喷水管的另一侧管壁上设置有若干个喷嘴,所述冲洗箱内部还安装有一个一号转轴,所述一号转轴和二号转轴通过传动带传动连接,所述冲洗箱的顶部安装有一个热风机,所述热风机通过管道与冲洗箱顶部内侧的喷气盒连接。该硅片翻转冲洗装置设有两个转轴,可以安装更多的硅片,并且清洗箱内部的喷头分布较均匀,清洗效果较好,工作效率高,用水量少。The invention discloses a silicon wafer flipping flushing device, which comprises a flushing box, an air jet box and a hot air blower. A flushing box door is arranged on the flushing box, and a motor box is arranged on one side of the flushing box. The motor A control panel is installed on the outside of the box, a water outlet is provided at the bottom of the flushing box, one side of the water spray pipe is connected to the water pump, the other side of the water spray pipe is embedded in the flushing box, and the spray A number of nozzles are arranged on the other side of the water pipe, and a No. 1 rotating shaft is installed inside the flushing tank. The No. 1 rotating shaft and the No. 2 rotating shaft are connected by a transmission belt. The top of the flushing tank is equipped with A hot air blower, said hot air blower is connected with the jet box on the inside of the top of the flushing box through a pipeline. The silicon wafer turning and washing device is provided with two rotating shafts, and more silicon wafers can be installed, and the nozzles inside the cleaning box are evenly distributed, the cleaning effect is good, the working efficiency is high, and the water consumption is small.
Description
技术领域technical field
本发明涉及机械技术领域,具体为一种硅片翻转冲洗装置。The invention relates to the field of mechanical technology, in particular to a silicon wafer flipping flushing device.
背景技术Background technique
随着大规模集成电路的发展、集成电路的集成度不断提高、线宽不断减小,集成电路对硅片表面的洁净度、表面化学态、氧化膜厚度的要求也越来越高。半导体器件生产中的硅片必须经严格清洗,否则即使微量污染也会导致器件失效。With the development of large-scale integrated circuits, the integration level of integrated circuits continues to increase, and the line width continues to decrease. Integrated circuits have higher and higher requirements for the cleanliness, surface chemical state, and oxide film thickness of the silicon wafer surface. Silicon wafers in the production of semiconductor devices must be strictly cleaned, otherwise even a small amount of contamination can cause device failure.
清洗的目的在于清除表面污染杂质,包括无机物和有机物。这些杂质有的以原子状态或离子状态,有的以薄膜形式或颗粒形式存在于硅片表面。有机污染物包括光刻胶、有机溶剂残留物、合成蜡和人接触器件、工具、器皿带来的油脂或纤维。无机污染物包括重金属金、铜、铁、铬等,严重影响少数载流子寿命和表面电导;碱金属和钠等会引起严重漏电。颗粒污染包括硅渣、尘埃、细菌、微生物、有机胶体纤维等会导致各种缺陷。The purpose of cleaning is to remove surface contamination impurities, including inorganic and organic matter. Some of these impurities exist in the atomic state or ion state, and some exist in the form of thin films or particles on the surface of the silicon wafer. Organic pollutants include photoresists, organic solvent residues, synthetic waxes, and grease or fibers from human contact with devices, tools, and utensils. Inorganic pollutants include heavy metals such as gold, copper, iron, and chromium, which seriously affect the lifetime of minority carriers and surface conductance; alkali metals and sodium can cause severe leakage. Particle pollution including silicon slag, dust, bacteria, microorganisms, organic colloidal fibers, etc. can cause various defects.
现有的硅片冲洗装置在清洗过程中硅片表面水喷淋不均匀,导致硅片表面有大量的药液残留,清洗效果不佳,工作效率低,用水量大,并且清洗后还需要取出烘干,浪费时间。The existing silicon wafer rinsing device sprays water unevenly on the surface of the silicon wafer during the cleaning process, resulting in a large amount of liquid medicine residue on the surface of the silicon wafer, poor cleaning effect, low work efficiency, large water consumption, and needs to be taken out after cleaning Dry, waste of time.
发明内容Contents of the invention
本发明的目的在于提供一种硅片翻转冲洗装置,以解决上述背景技术中提出的喷淋不均匀,导致硅片表面有大量的药液残留,清洗效果不佳,工作效率低,用水量大,并且清洗后还需要取出烘干,浪费时间的问题。The object of the present invention is to provide a device for flipping and rinsing silicon wafers to solve the problem of uneven spraying in the above background technology, resulting in a large amount of liquid medicine remaining on the surface of silicon wafers, poor cleaning effect, low work efficiency, and large water consumption. , and after cleaning, it needs to be taken out and dried, which is a waste of time.
为实现上述目的,本发明提供如下技术方案:一种硅片翻转冲洗装置,包括冲洗箱、冲洗箱门、电动机箱、控制面板、冲洗箱门锁扣、电动机、传动带、支撑架、集水箱、出水口、二号转轴、清洗液箱、抽水管、喷水管、一号转轴、喷气盒、热风机、喷嘴和水泵,所述冲洗箱上设置有一个冲洗箱门,所述冲洗箱的一侧设置有一个电动机箱,所述电动机箱的外侧安装有一个控制面板,所述冲洗箱门上设置有一个冲洗箱门锁扣,所述电动机箱内安装有一个电动机,所述电动机的一侧设置有一根二号转轴,所述电动机箱的底部安装有两根支撑架,所述冲洗箱的底部设置有一个出水口,所述出水口的底部设置有一个集水箱,所述冲洗箱的另一侧设置有一个清洗液箱,所述清洗液箱的底部安装有两根支撑架,所述抽水管的一侧嵌入清洗液箱内部,所述抽水管的另一侧与水泵连接,所述喷水管的一侧与水泵连接,所述喷水管的另一侧嵌入到冲洗箱内部,且喷水管的另一侧管壁上设置有若干个喷嘴,所述冲洗箱内部还安装有一个一号转轴,所述一号转轴和二号转轴通过传动带传动连接,所述冲洗箱的顶部安装有一个热风机,所述热风机通过管道与冲洗箱顶部内侧的喷气盒连接。In order to achieve the above object, the present invention provides the following technical solutions: a silicon wafer flip flushing device, including a flushing box, a flushing box door, a motor box, a control panel, a flushing box door lock, a motor, a transmission belt, a support frame, a water collection box, Water outlet, No. 2 rotating shaft, cleaning liquid tank, water suction pipe, water spray pipe, No. 1 rotating shaft, air jet box, hot air blower, nozzle and water pump, a flushing box door is arranged on the described flushing box, and a flushing box door is arranged on the flushing box. A motor box is arranged on the side, a control panel is installed on the outside of the motor box, a flushing box door lock is arranged on the flushing box door, a motor is installed in the motor box, and one side of the motor A No. 2 rotating shaft is provided, two supporting frames are installed at the bottom of the electric motor box, a water outlet is arranged at the bottom of the flushing box, a water collection box is arranged at the bottom of the water outlet, and the other of the flushing box is One side is provided with a cleaning liquid tank, the bottom of the cleaning liquid tank is equipped with two support frames, one side of the suction pipe is embedded in the cleaning liquid tank, the other side of the suction pipe is connected to the water pump, and the One side of the water spray pipe is connected to the water pump, the other side of the water spray pipe is embedded in the flushing box, and several nozzles are arranged on the other side of the water spray pipe, and the flushing box is also equipped with A No. 1 rotating shaft, the No. 1 rotating shaft and the No. 2 rotating shaft are connected by a transmission belt, and a hot air blower is installed on the top of the flushing tank, and the hot blower is connected with the jet box on the inside of the flushing tank top through a pipeline.
优选的,所述冲洗箱的底部为一个漏斗状结构。Preferably, the bottom of the flushing tank is a funnel-shaped structure.
优选的,所述清洗液箱上设置有一个观察窗。Preferably, an observation window is provided on the cleaning liquid tank.
优选的,所述一号转轴和二号转轴上设置有夹子。Preferably, clips are provided on the first rotating shaft and the second rotating shaft.
优选的,所述喷气盒的底部设置有若干个透气小孔。Preferably, the bottom of the air jet box is provided with several small ventilation holes.
优选的,所述集水箱为可移动装置,底部安装有四个万向轮。Preferably, the water collection tank is a movable device with four universal wheels installed at the bottom.
与现有技术相比,本发明的有益效果是:该硅片翻转冲洗装置设有两个转轴,可以安装更多的硅片,并且清洗箱内部的喷头分布较均匀,清洗效果较好,工作效率高,用水量少,清洗箱顶部还安装有一个热风机,热风机和清洗箱内部的喷气盒连接,喷气盒上设置有若干个小孔,喷气范围较广,烘干效果较好,使用方便,设计较为人性化。Compared with the prior art, the beneficial effects of the present invention are: the silicon wafer flipping flushing device is provided with two rotating shafts, more silicon wafers can be installed, and the nozzles inside the cleaning box are more evenly distributed, the cleaning effect is better, and the working High efficiency, less water consumption, a hot air blower is installed on the top of the cleaning box, the hot air blower is connected to the air jet box inside the washing box, and there are several small holes on the air jet box, the air jet range is wider, and the drying effect is better. Convenient, more user-friendly design.
附图说明Description of drawings
图1为本发明结构示意图;Fig. 1 is a structural representation of the present invention;
图2为本发明冲洗箱俯视结构示意图;Fig. 2 is a schematic diagram of the overhead structure of the flushing box of the present invention;
图3为本发明喷气盒俯视结构示意图。Fig. 3 is a schematic top view structure diagram of the air jet box of the present invention.
图中:冲洗箱-1;冲洗箱门-2;电动机箱-3;控制面板-4;冲洗箱门锁扣-5;电动机-6;传动带-7;支撑架-8;集水箱-9;出水口-10;二号转轴-11;清洗液箱-12;抽水管-13;喷水管-14;一号转轴-15;喷气盒-16;热风机-17;喷嘴-18;水泵-19。In the figure: flushing box-1; flushing box door-2; motor box-3; control panel-4; flushing box door lock-5; motor-6; transmission belt-7; support frame-8; Water outlet-10; No. 2 rotating shaft-11; Cleaning liquid tank-12; Suction pipe-13; Water spray pipe-14; No. 1 rotating shaft-15; 19.
具体实施方式detailed description
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
请参阅图1-3,本发明提供一种技术方案:一种硅片翻转冲洗装置,包括冲洗箱1、冲洗箱门2、电动机箱3、控制面板4、冲洗箱门锁扣5、电动机6、传动带7、支撑架8、集水箱9、出水口10、二号转轴11、清洗液箱12、抽水管13、喷水管14、一号转轴15、喷气盒16、热风机17、喷嘴18和水泵19,冲洗箱1上设置有一个冲洗箱门2,冲洗箱1的一侧设置有一个电动机箱3,电动机箱3的外侧安装有一个控制面板4,冲洗箱门2上设置有一个冲洗箱门锁扣5,电动机箱3内安装有一个电动机6,电动机6的一侧设置有一根二号转轴11,电动机箱3的底部安装有两根支撑架8,冲洗箱1的底部设置有一个出水口10,出水口10的底部设置有一个集水箱9,冲洗箱1的另一侧设置有一个清洗液箱12,清洗液箱12的底部安装有两根支撑架8,抽水管13的一侧嵌入清洗液箱12内部,抽水管13的另一侧与水泵19连接,喷水管14的一侧与水泵19连接,喷水管14的另一侧嵌入到冲洗箱1内部,且喷水管14的另一侧管壁上设置有若干个喷嘴18,冲洗箱1内部还安装有一个一号转轴15,一号转轴15和二号转轴11通过传动带7传动连接,冲洗箱1的顶部安装有一个热风机17,热风机17通过管道与冲洗箱1顶部内侧的喷气盒16连接。Please refer to Figures 1-3, the present invention provides a technical solution: a silicon wafer flip flushing device, including a flushing box 1, a flushing box door 2, a motor box 3, a control panel 4, a flushing box door lock 5, and a motor 6 , transmission belt 7, support frame 8, water collection tank 9, water outlet 10, No. 2 rotating shaft 11, cleaning liquid tank 12, water suction pipe 13, water spray pipe 14, No. 1 rotating shaft 15, air jet box 16, hot air blower 17, nozzle 18 and the water pump 19, the flushing box 1 is provided with a flushing box door 2, one side of the flushing box 1 is provided with a motor box 3, a control panel 4 is installed on the outside of the motor box 3, and a flushing box door 2 is provided with a flushing Box door lock 5, a motor 6 is installed in the motor box 3, a No. Water outlet 10, the bottom of water outlet 10 is provided with a water collecting tank 9, and the other side of flushing tank 1 is provided with a cleaning liquid tank 12, and the bottom of cleaning liquid tank 12 is equipped with two support frames 8, and one of suction pipe 13 One side is embedded in the cleaning liquid tank 12, the other side of the water suction pipe 13 is connected with the water pump 19, one side of the water spray pipe 14 is connected with the water pump 19, and the other side of the water spray pipe 14 is embedded in the flushing tank 1, and the water spray Several nozzles 18 are arranged on the other side of the pipe 14, and a No. 1 rotating shaft 15 is also installed inside the flushing box 1. The No. 1 rotating shaft 15 and the No. 2 rotating shaft 11 are connected by transmission belt 7. The top of the flushing box 1 is installed There is a hot air blower 17, and the hot air blower 17 is connected with the jet box 16 on the inside of the flushing box 1 top by pipeline.
上述实施例中,具体的,冲洗箱1的底部为一个漏斗状结构,漏斗状结构便于水流向下流出;In the above embodiment, specifically, the bottom of the flushing tank 1 is a funnel-shaped structure, which is convenient for water to flow downward;
上述实施例中,具体的,清洗液箱12上设置有一个观察窗,方便观察内部清洗液余量,及时添加清洗液;In the above embodiment, specifically, an observation window is provided on the cleaning liquid tank 12, which is convenient for observing the residual amount of internal cleaning liquid and adding cleaning liquid in time;
上述实施例中,具体的,一号转轴15和二号转轴11上设置有夹子,可以将硅片夹住,使用方便;In the above embodiment, specifically, the No. 1 rotating shaft 15 and the No. 2 rotating shaft 11 are provided with clips, which can clamp the silicon wafer and are easy to use;
上述实施例中,具体的,喷气盒16的底部设置有若干个透气小孔,喷气压力增大,并且使喷气范围更广;In the above-mentioned embodiment, specifically, the bottom of the jet box 16 is provided with several air-ventilating holes, the jet pressure is increased, and the jet range is wider;
上述实施例中,具体的,集水箱9为可移动装置,底部安装有四个万向轮,便于移动清理集水箱9内的使用过的清洗液。In the above embodiment, specifically, the water collecting tank 9 is a movable device, and four universal wheels are installed at the bottom, which is convenient for moving and cleaning the used cleaning solution in the water collecting tank 9 .
工作原理:使用时先将冲洗箱门2打开,将要冲洗的硅片用夹子固定在一号转轴15和二号转轴11上,关闭冲洗箱门2,接通外部电源,使用控制面板4控制电动机6和水泵19开始运行,电动机6直接带动二号转轴11转动,二号转轴11通过传动带7带动一号转轴15转动,水泵19将清洗液箱12内的清洗液输送到喷水管14,并从喷水管14上的喷嘴18喷向一号转轴15和二号转轴11上的硅片,达到清洗的目的,落下的清洗液从出水口10流入集水箱9,清洗完成后,使用控制面板4控制热风机17运行,热风从喷气盒16底部的小孔吹向硅片,将硅片烘干,烘干后可将硅片取出,进而完成一系列的操作流程。Working principle: when using, first open the washing box door 2, fix the silicon wafer to be washed on the first rotating shaft 15 and the second rotating shaft 11 with clips, close the washing box door 2, connect the external power supply, and use the control panel 4 to control the motor 6 and water pump 19 start running, and motor 6 directly drives No. 2 rotating shaft 11 to rotate, and No. 2 rotating shaft 11 drives No. 1 rotating shaft 15 to rotate through transmission belt 7, and water pump 19 delivers the cleaning liquid in cleaning liquid tank 12 to spray pipe 14, and Spray from the nozzle 18 on the water spray pipe 14 to the silicon wafers on the first rotating shaft 15 and the second rotating shaft 11 to achieve the purpose of cleaning. The falling cleaning liquid flows into the water collection tank 9 from the water outlet 10. After the cleaning is completed, use the control panel 4 Control the operation of the hot air blower 17, and the hot air blows to the silicon chip from the small hole at the bottom of the jet box 16 to dry the silicon chip. After drying, the silicon chip can be taken out to complete a series of operation processes.
综上所述,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换,凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。In summary, although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments, or modify some of the technical features. Equivalent replacement, within the spirit and principles of the present invention, any modification, equivalent replacement, improvement, etc., shall be included in the protection scope of the present invention.
Claims (6)
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