CN106824884A - A kind of silicon wafer turnover flusher - Google Patents
A kind of silicon wafer turnover flusher Download PDFInfo
- Publication number
- CN106824884A CN106824884A CN201710209910.4A CN201710209910A CN106824884A CN 106824884 A CN106824884 A CN 106824884A CN 201710209910 A CN201710209910 A CN 201710209910A CN 106824884 A CN106824884 A CN 106824884A
- Authority
- CN
- China
- Prior art keywords
- device body
- drive device
- disk
- support platform
- silicon wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 44
- 239000010703 silicon Substances 0.000 title claims abstract description 44
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 230000007306 turnover Effects 0.000 title claims abstract description 15
- 230000033001 locomotion Effects 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 abstract description 24
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005406 washing Methods 0.000 description 5
- 239000002351 wastewater Substances 0.000 description 5
- 239000002585 base Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000003921 oil Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003491 array Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 241000894006 Bacteria Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- -1 sodium etc. Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a kind of silicon wafer turnover flusher, including gear-box and polywater cover, the upper lid chute is arranged at the top of device body, it is placed on described inside lid chute and does reciprocating push-and-pull campaign, guidance panel is provided with the outer wall of described device body front, and guidance panel is located at the right side of observation window, the polywater cover is arranged at the bottom of support platform, the support platform is arranged at the inside of device body, and is connected to a fixed with the inwall of the device body left and right sides.The silicon wafer turnover flusher, by hydraulic cylinder piston formula stretching motion, linkage raises the height of disk to the upper base portion of device body, is easy to handling of the silicon chip from disk, reduces the time that handling silicon chip is wasted, improve operating efficiency, by the rotation of disk, the cleaning that the tow sides of silicon chip can be sprayed water with high pressure, cleaning performance more preferably cleaning it is more thorough, remove the operation at the manual overturning Wafer Cleaning back side from simultaneously, make the operating efficiency of device higher.
Description
Technical field
The present invention relates to workpiece cleaning technique field, specially a kind of silicon wafer turnover flusher.
Background technology
Silicon chip must be through strict cleaning in semiconductor devices production.Micropollution also results in component failure.The purpose of cleaning
It is to remove surface contamination impurity, including organic matter and inorganic matter.These impurity have with state of atom or ionic condition, have
In the form of a film or particle form is present in silicon chip surface.
Organic contamination includes that photoresist, organic solvent residual thing, synthetic wax and people contact device, instrument, vessel bring
Grease or fiber.Inorganic pollution has a strong impact on minority carrier lifetime and surface conductance including heavy metal gold, copper, iron, chromium etc.；
Alkali metal such as sodium etc., causes serious drain；Particle contamination including white residue, dust, bacterium, microorganism, organic colloid fiber etc., meeting
Cause various defects.
Handling inconvenience existing silicon wafer washing device has Wafer Cleaning when using when, effluent effect is poor, and high-volume is clear
Wash the problem of inconvenience.
The content of the invention
It is an object of the invention to provide a kind of silicon wafer turnover flusher, with the silicon for solving to be proposed in above-mentioned background technology
Handling inconvenience when piece is cleaned, effluent effect is poor, and high-volume cleans inconvenient problem.
To achieve the above object, the present invention provides following technical scheme：A kind of silicon wafer turnover flusher, including device sheet
Body, upper lid chute, water-proof CCD camera, disk, disc rotary drive device, silicon chip slot, upper lid, high-pressure nozzle, force (forcing) pump, drive
Dynamic device bucker, drive device mounting platform, roller, hydraulic means bucker, support platform, hydraulic means, bottom water outlet
Mouth, support bar, hydraulic cylinder, observation window, guidance panel, gear-box and polywater cover, the upper lid chute are arranged at device body
Top, it is described on be placed on inside lid chute and do reciprocating push-and-pull campaign, the water-proof CCD camera is arranged inside device body
On the inwall in left side, and positioned at the top of high pressure spray, the disk is installed on the top of gear-box, and is rotatedly connected with gear-box
Connect, the disc rotary drive device is arranged at the top of drive device mounting platform, and with gear-box inside pinion rotation
It is meshed, the bottom of described device body is provided with roller, and the silicon chip slot is fixed on the top of disc rotary drive device,
The high-pressure nozzle is provided with two, is placed on the inwall of the device body inside left and right sides, and the force (forcing) pump is provided with two,
And be respectively arranged on the outer wall of the device body left and right sides, the drive device bucker is placed on disc rotary drive device
Top, and be supported on drive device mounting platform, bottom and the top of hydraulic pressure of the drive device mounting platform are fixed
It is connected, the hydraulic means bucker is placed on the top of hydraulic means, and is supported in support platform, the hydraulic means
Be arranged at the top of support platform, and at two hydraulic cylinder centre, the bottom delivery port is arranged at the bottom of device body
Portion, and bottom delivery port is connected with polywater cover, the support bar is arranged at the bottom of support platform, and is supported in polywater cover
On, guidance panel is provided with the outer wall of described device body front, and guidance panel is located at the right side of observation window, the polywater cover
Be arranged at the bottom of support platform, the support platform is arranged at the inside of device body, and with the device body left and right sides
Inwall is connected to a fixed, and the touch-screen on the guidance panel is electrically connected with water-proof CCD camera.
Preferably, the hydraulic cylinder is provided with everywhere, is symmetrical arranged in left-right and front-back.
Preferably, the disc rotary drive device drives disk and does 360 ° of rotary motions by gear-box.
Preferably, the silicon chip slot is one group at two, 15 groups to be provided with altogether, and circular array is distributed on disk.
Preferably, the support platform is provided with many places leaking hole.
Compared with prior art, the beneficial effects of the invention are as follows：The silicon wafer turnover flusher, by hydraulic cylinder piston formula
Stretching motion, linkage raises the height of disk to the upper base portion of device body, is easy to handling of the silicon chip from disk, reduces
The time that handling silicon chip is wasted, operating efficiency is improve, by the rotation of disk, the tow sides of silicon chip can obtain high pressure
The cleaning of water spray, it is more thorough that cleaning performance is more preferably cleaned, while removing the operation at the manual overturning Wafer Cleaning back side from, makes device
Operating efficiency it is higher, the silicon chip slot that the device is provided with is one group at two, the distribution of 15 groups of circular arrays to be provided with altogether
In on disk, being easy to carry out extensive washing and cleaning operation, the economic benefit of enterprise is improved, cleaning waste water flows into polywater by leaking hole
In cover, collect through polywater cover and be expelled to bottom delivery port, leaking hole constitutes drainage arrangement with polywater cover, drainage efficiency is high, waste water
Residual is few.
Brief description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is main structure diagram of the present invention；
Fig. 3 is overlooking the structure diagram of the present invention.
In figure：1- device bodies, the upper lid chutes of 2-, 3- water-proof CCD cameras, 4- disks, 5- disc rotary drive devices, 6-
Silicon chip slot, covers, 8- high-pressure nozzles, 9- force (forcing) pumps, 10- drive device buckers, 11- drive device mounting platforms, 12- on 7-
Roller, 13- hydraulic means buckers, 14- support platforms, 15- hydraulic means, 16- bottoms delivery port, 17- support bars, 18- liquid
Cylinder pressure, 19- observation windows.20- guidance panels, 21- gear-boxes, 22- polywater covers.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Fig. 1-3 are referred to, the present invention provides a kind of technical scheme：A kind of silicon wafer turnover flusher, including device body
1st, upper lid chute 2, water-proof CCD camera 3, disk 4, disc rotary drive device 5, silicon chip slot 6, upper lid 7, high-pressure nozzle 8, plus
Press pump 9, drive device bucker 10, drive device mounting platform 11, roller 12, hydraulic means bucker 13, support platform 14,
Hydraulic means 15, bottom delivery port 16, support bar 17, hydraulic cylinder 18, observation window 19, guidance panel 20, gear-box 21 and polywater
Cover 22, upper lid chute 2 is arranged at the top of device body 1, and upper lid 7 does reciprocating push-and-pull campaign, waterproof inside upper lid chute 2
Camera 3 is arranged on the inwall of the inside left of device body 1, and positioned at the top of high-pressure nozzle 8, disk 4 is installed on gear
The top of case 21, and be rotatedly connected with gear-box 21 and connect, disc rotary drive device 5 is arranged at drive device mounting platform 11
Top, and be meshed with the pinion rotation inside gear-box 21, the bottom of device body 1 is provided with roller 12, and silicon chip slot 6 is consolidated
Due to the top of disc rotary drive device 5, high-pressure nozzle 8 is provided with two, is placed in the interior of the inside left and right sides of device body 1
On wall, force (forcing) pump 9 is provided with two, and is respectively arranged on the outer wall of the left and right sides of device body 1, drive device bucker 10
The top of disc rotary drive device 5 is placed on, and is supported on drive device mounting platform 11, drive device mounting platform 11
Bottom be connected to a fixed with the top of hydraulic cylinder 18, hydraulic means bucker 13 is placed on the top of hydraulic means 15, and branch
Support in support platform 14, hydraulic means 15 is arranged at the top of support platform 14, and at two hydraulic cylinder 18 centre, bottom
Portion's delivery port 16 is arranged at the bottom of device body 1, and bottom delivery port 16 is connected with polywater cover 22, and support bar 17 is arranged at
The bottom of support platform 14, and be supported on polywater cover 22, guidance panel 20, and behaviour are provided with the front outer wall of device body 1
Make panel 20 positioned at the right side of observation window 19, polywater cover 22 is arranged at the bottom of support platform 14, and support platform 14 is arranged at dress
Put the inside of body 1, and be connected to a fixed with the inwall of the left and right sides of device body 1, the touch-screen on guidance panel 20 with it is anti-
Water camera 3 is electrically connected.
Specifically, hydraulic cylinder 18 is provided with everywhere, it is symmetrical arranged in left-right and front-back, by the flexible fortune of the piston type of hydraulic cylinder 18
Dynamic, linkage raises the height of disk 4 to the upper base portion of device body 1, is easy to silicon chip from the handling of disk 4, reduces dress
The time that silicon chip is wasted is unloaded, operating efficiency is improve；
Specifically, disc rotary drive device 5 drives disk 4 by gear-box 21 does 360 ° of rotary motions, by disk 4
Rotate, the cleaning that the tow sides of silicon chip can be sprayed water with high pressure, cleaning performance more preferably cleaning more thoroughly, while removing hand from
The operation at the dynamic upset Wafer Cleaning back side, makes the operating efficiency of device higher；
Specifically, silicon chip slot 6 is one group at two, 15 groups of circular arrays is provided with altogether and is distributed on disk 4, be easy to carry out
Extensive washing and cleaning operation, improves the economic benefit of enterprise；
Specifically, support platform 14 is provided with many places leaking hole, cleaning waste water is flowed into polywater cover 22 by leaking hole, through polywater
Cover 22 collects and is expelled to bottom delivery port 16, and leaking hole constitutes drainage arrangement with polywater cover 22, and drainage efficiency is high, waste water residual
It is few.
Operation principle：When being rinsed using a kind of silicon wafer turnover, lid 7, the rising on push panel 20 are pulled open
Button, hydraulic means 15 electricity output oil pressure promote hydraulic cylinder 18 do extensional motion so that link disk 4 be increased to device body 1
Upper base portion, silicon chip is positioned in silicon chip slot 6 in batch, the lid 7 on sliding closing after silicon chip slot 6 is all filled,
The decline button of pressing operations panel 20, hydraulic means 15, reversion rush down lower oil pressure, and hydraulic cylinder 18 does contractile motion and then the circle that links
The height reduction of disk 4 to operating position, the cleaning button disc rotary of push panel 20 drive device 5 obtains electric rotation linkage gear
The internal gear of case 21 is rotated, and the internal gear of gear-box 21 rotates rotation linkage disk 4 and does 360 ° of rotary motions, while force (forcing) pump 9
Obtain the electric water by pressurization to be sprayed at a high speed from high-pressure nozzle 8, device starts washing and cleaning operation, and the waste water in cleaning process is by leak
Hole is flowed into polywater cover 22, is collected through polywater cover 22 and is expelled to bottom delivery port 16, it is to be cleaned finish after press stopping cleaning by
Deactivation means stop washing and cleaning operation to button disc rotary drive device 5 simultaneously with force (forcing) pump 9, then upper on push panel 20
Rise button, hydraulic means 15 electricity output oil pressure promote hydraulic cylinder 18 do extensional motion so that link disk 4 be increased to device sheet
The upper base portion of body 1, pulls open lid 7 and silicon chip is taken out the whole work flow of completion from silicon chip slot 6.
To sum up, although being described in detail to the present invention with reference to the foregoing embodiments, for those skilled in the art
For, it can still modify to the technical scheme described in foregoing embodiments, or to which part technical characteristic
Equivalent, all any modification, equivalent substitution and improvements within the spirit and principles in the present invention, made etc. are carried out, all should be wrapped
It is contained within protection scope of the present invention.
Claims (5)
1. a kind of silicon wafer turnover flusher, including device body（1）, upper lid chute（2）, water-proof CCD camera（3）, disk（4）、
Disc rotary drive device（5）, silicon chip slot（6）, upper lid（7）, high-pressure nozzle（8）, force (forcing) pump（9）, drive device bucker
（10）, drive device mounting platform（11）, roller（12）, hydraulic means bucker（13）, support platform（14）, hydraulic means
（15）, bottom delivery port（16）, support bar（17）, hydraulic cylinder（18）, observation window（19）, guidance panel（20）, gear-box（21）
With polywater cover（22）, it is characterised in that：The upper lid chute（2）It is arranged at device body（1）Top, the upper lid（7）In
Upper lid chute（2）Do reciprocating push-and-pull campaign, the water-proof CCD camera in inside（3）It is arranged at device body（1）Inside left
On inwall, and positioned at high-pressure nozzle（8）Top, the disk（4）It is installed on gear-box（21）Top, and and gear-box
（21）It is rotatedly connected and connects, the disc rotary drive device（5）It is arranged at drive device mounting platform（11）Top, and and tooth
Roller box（21）Internal pinion rotation is meshed, described device body（1）Bottom be provided with roller（12）, the silicon chip slot
（6）It is fixed on disc rotary drive device（5）Top, the high-pressure nozzle（8）It is provided with two, is placed in device body（1）
On the inwall of the internal left and right sides, the force (forcing) pump（9）It is provided with two, and is respectively arranged in device body（1）The left and right sides
Outer wall on, the drive device bucker（10）It is placed on disc rotary drive device（5）Top, and be supported in driving dress
Put mounting platform（11）On, the drive device mounting platform（11）Bottom and hydraulic cylinder（18）Top be connected to a fixed,
The hydraulic means bucker（13）It is placed on hydraulic means（15）Top, and be supported in support platform（14）On, the liquid
Pressure device（15）It is arranged at support platform（14）Top, and the hydraulic cylinder at two（18）Centre, the bottom delivery port
（16）It is arranged at device body（1）Bottom, and bottom delivery port（16）With polywater cover（22）It is connected, the support bar（17）
It is arranged at support platform（14）Bottom, and be supported in polywater cover（22）On, described device body（1）It is provided with the outer wall of front
Guidance panel（20）, and guidance panel（20）Positioned at observation window（19）Right side, the polywater cover（22）It is arranged at support platform
（14）Bottom, the support platform（14）It is arranged at device body（1）Inside, and and device body（1）The left and right sides
Inwall is connected to a fixed, the guidance panel（20）On touch-screen and water-proof CCD camera（3）It is electrically connected.
2. a kind of silicon wafer turnover flusher according to claim 1, it is characterised in that：The hydraulic cylinder（18）It is provided with
Everywhere, it is symmetrical arranged in left-right and front-back.
3. a kind of silicon wafer turnover flusher according to claim 1, it is characterised in that：The disc rotary drive device
（5）By gear-box（21）Drive disk（4）Do 360 ° of rotary motions.
4. a kind of silicon wafer turnover flusher according to claim 1, it is characterised in that：The silicon chip slot（6）It is two
Locate one group, 15 groups are provided with altogether, circular array is distributed in disk（4）On.
5. a kind of silicon wafer turnover flusher according to claim 1, it is characterised in that：The support platform（14）Set
There is many places leaking hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209910.4A CN106824884A (en) | 2017-03-31 | 2017-03-31 | A kind of silicon wafer turnover flusher |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710209910.4A CN106824884A (en) | 2017-03-31 | 2017-03-31 | A kind of silicon wafer turnover flusher |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106824884A true CN106824884A (en) | 2017-06-13 |
Family
ID=59141259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710209910.4A Pending CN106824884A (en) | 2017-03-31 | 2017-03-31 | A kind of silicon wafer turnover flusher |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106824884A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492489A (en) * | 2017-08-14 | 2017-12-19 | 通威太阳能（安徽）有限公司 | A kind of polysilicon chip polished backside technique |
| CN112033212A (en) * | 2020-09-10 | 2020-12-04 | 河北爱节能源科技有限公司 | Lifting device for cleaning heat exchange fins and using method thereof |
| CN113035742A (en) * | 2021-02-10 | 2021-06-25 | 江苏亚电科技有限公司 | Wafer cleaning and recycling device for semiconductor manufacturing |
| CN115301607A (en) * | 2022-07-19 | 2022-11-08 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
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| EP0860860A2 (en) * | 1997-02-21 | 1998-08-26 | Canon Kabushiki Kaisha | Wafer processing apparatus, wafer processing method, and semiconductor substrate fabrication method |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107492489A (en) * | 2017-08-14 | 2017-12-19 | 通威太阳能（安徽）有限公司 | A kind of polysilicon chip polished backside technique |
| CN112033212A (en) * | 2020-09-10 | 2020-12-04 | 河北爱节能源科技有限公司 | Lifting device for cleaning heat exchange fins and using method thereof |
| CN113035742A (en) * | 2021-02-10 | 2021-06-25 | 江苏亚电科技有限公司 | Wafer cleaning and recycling device for semiconductor manufacturing |
| CN115301607A (en) * | 2022-07-19 | 2022-11-08 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
| CN115301607B (en) * | 2022-07-19 | 2023-09-26 | 盐城矽润半导体有限公司 | Wet cleaning device for semiconductor wafer |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170613 |
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| RJ01 | Rejection of invention patent application after publication |