CN216802105U

CN216802105U - Wafer surface treatment equipment

Info

Publication number: CN216802105U
Application number: CN202122874340.5U
Authority: CN
Inventors: 胡建军
Original assignee: Suzhou Yingerjie Semiconductor Co ltd
Current assignee: Suzhou Yingerjie Semiconductor Co ltd
Priority date: 2021-11-23
Filing date: 2021-11-23
Publication date: 2022-06-24
Anticipated expiration: 2031-11-23

Abstract

The utility model discloses a wafer surface treatment device which comprises a processing box, wherein a collecting box is fixedly arranged in an inner cavity of the processing box, clamping mechanisms are fixedly arranged on two sides of the processing box, a water tank is fixedly arranged at the upper end of the collecting box, a water outlet pipe is arranged at the lower end of the water tank, the other end of the water outlet pipe is connected with a spray head, a drying fan is fixedly arranged at the upper end of the processing box, one end of the drying fan is fixedly connected with an exhaust pipe, and the other end of the exhaust pipe is fixedly connected with an exhaust nozzle; the clamping mechanism comprises a mounting plate, a servo electric cylinder is fixedly mounted on one side of the mounting plate, a connecting plate is fixedly connected with the output end of the servo electric cylinder, a servo motor is fixedly mounted on the other side of the connecting plate, the output end of the servo motor is connected with a connecting rod through a coupler, and a clamp is fixedly connected to the other end of the connecting rod.

Description

Wafer surface treatment equipment

Technical Field

The utility model relates to the technical field of wafer processing, in particular to wafer surface treatment equipment.

Background

The wafer surface needs to be treated, such as cleaned, plated or etched, during the wafer production process. One commonly used method for cleaning a surface is to hold a wafer in a cleaning tank and spray a cleaning solution onto the wafer. The spraying device of the cleaning solution is continuously moved to clean the wafer comprehensively. Electroplating or etching is the same method. Although this apparatus can perform a predetermined treatment on the surface of the wafer, the wafer cannot be rotated, and uniform treatment of the surface cannot be ensured. Such surface devices are difficult to achieve horizontal cleaning, plating or etching, i.e., the wafer is horizontally disposed above the cleaning, plating or etching solution, and the cleaning, plating or etching solution flows from bottom to top to contact the wafer to clean the surface of the wafer.

Referring to the prior publication No. CN108807217A, a wafer surface treatment device and method are disclosed, wherein the wafer surface treatment device includes a worktable for bearing a wafer, a pulse laser and a water tank, the wafer has a surface structure, the pulse laser generates a laser beam, the water tank is provided with an opening, liquid in the water tank is sprayed out from the opening, and the laser beam is projected onto the surface structure together with the liquid through the opening.

According to the wafer surface treatment device and the wafer surface treatment method, the pulse laser generates the laser beam which is used for stripping the surface layer structure on the wafer, the water tank sprays liquid from the opening of the wafer, and the byproducts are taken away by flushing the liquid; in the utility model, the laser beam is projected onto the surface layer structure of the wafer through the opening and the liquid sprayed out of the opening, so that the surface layer structure can be stripped and the byproducts can be washed away, a reusable wafer can be formed through the surface treatment of the wafer, and the production cost is reduced. However, the above-mentioned wafer surface treatment apparatus and method still have some disadvantages, such as: the drying effect is not available, and the wafer can not be cleaned by changing the angle.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to a wafer surface treatment apparatus, which has a drying effect and can change the angle of a wafer during processing to clean the wafer, so as to solve the problems in the background art.

In order to achieve the purpose, the utility model provides the following technical scheme:

a wafer surface treatment device comprises a processing box, wherein a collecting box is fixedly arranged in an inner cavity of the processing box, clamping mechanisms are fixedly arranged on two sides of the processing box, a water tank is fixedly arranged at the upper end of the collecting box, a water outlet pipe is arranged at the lower end of the water tank and penetrates through the processing box, a spray head is connected to the other end of the water outlet pipe, a drying fan is fixedly arranged at the upper end of the processing box, an exhaust pipe is fixedly connected to one end of the drying fan and penetrates through the processing box, and an exhaust nozzle is fixedly connected to the other end of the exhaust pipe;

the clamping mechanism comprises a mounting plate, the mounting plate is fixedly mounted at the upper end of the collecting box, a servo electric cylinder is fixedly mounted on one side of the mounting plate, the output end of the servo electric cylinder is fixedly connected with a connecting plate, a servo motor is fixedly mounted on the other side of the connecting plate, the output end of the servo motor is connected with a connecting rod through a coupler, and the other end of the connecting rod is fixedly connected with a clamp.

Preferably, a drain pipe is arranged on one side of the collecting box and penetrates through the processing box, and a first electric control valve is fixedly mounted on the drain pipe.

Preferably, ventilation holes are formed in two sides of the processing box, and a first filter screen is fixedly mounted at the ventilation holes.

Preferably, the upper end of the water tank is provided with a water inlet pipe, and the upper end of the water inlet pipe is in threaded connection with a blocking cover.

Preferably, a second filter screen is arranged in the water inlet pipe.

Preferably, a second electric control valve is fixedly mounted on the water outlet pipe.

Preferably, the clamp is an arc clamp, a groove is formed in the clamp, and a rubber layer is arranged in the groove.

Compared with the prior art, the utility model has the beneficial effects that:

1. the wafer drying device is provided with a processing box, a collecting box is arranged in the processing box, a clamping mechanism is arranged on the collecting box, the clamping mechanism clamps a wafer, a water tank conveys water to a spray head through a water outlet pipe, the water cleans the wafer through the spray head, and after cleaning, a drying fan is started and dries the wafer through an exhaust pipe and an exhaust nozzle;

2. when the clamping mechanism clamps, the servo electric cylinder is started to adjust the distance of the clamp for clamping, wafers with different sizes can be clamped, and when the cleaning angle needs to be changed after clamping is finished, the servo electric cylinder is started to adjust the angle.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic cross-sectional view of the present invention;

fig. 3 is a schematic view of the structure of the clamp of the present invention.

In the figure: 1. a processing box; 2. a collection box; 3. a clamping mechanism; 301. mounting a plate; 302. a servo electric cylinder; 303. a connecting plate; 304. a servo motor; 305. a connecting rod; 306. a clamp; 307. a groove; 308. a rubber layer; 4. a water tank; 5. a water outlet pipe; 6. a spray head; 7. drying the fan; 8. an exhaust pipe; 9. an exhaust nozzle; 10. a drain pipe; 11. a first electrically controlled valve; 12. a vent hole; 13. a first filter screen; 14. a water inlet pipe; 15. a blocking cover; 16. a second filter screen; 17. a second electrically controlled valve.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution:

a wafer surface treatment device comprises a processing box 1, wherein a collecting box 2 is fixedly arranged in an inner cavity of the processing box 1, clamping mechanisms 3 are fixedly arranged on two sides of the processing box 1, a water tank 4 is fixedly arranged at the upper end of the collecting box 2, a water outlet pipe 5 is arranged at the lower end of the water tank 4, the water outlet pipe 5 penetrates through the processing box 1, the other end of the water outlet pipe 5 is connected with a spray head 6, a drying fan 7 is fixedly arranged at the upper end of the processing box 1, one end of the drying fan 7 is fixedly connected with an exhaust pipe 8, the exhaust pipe 8 penetrates through the processing box 1, and the other end of the exhaust pipe 8 is fixedly connected with an exhaust nozzle 9;

fixture 3 is including mounting panel 301, mounting panel 301 fixed mounting is in 2 upper ends of collecting box, and mounting panel 301 one side fixed mounting has servo electric jar 302, and servo electric jar 302 output fixedly connected with connecting plate 303, connecting plate 303 opposite side fixed mounting have servo motor 304, and servo motor 304 output has connecting rod 305, connecting rod 305 other end fixedly connected with anchor clamps 306 through the coupling joint.

Referring to fig. 2, since the drain pipe 10 is disposed at one side of the collecting box 2, the drain pipe 10 penetrates through the processing box 1, and the first electric control valve 11 is fixedly mounted on the drain pipe 10, the drain pipe 10 is convenient for discharging waste water, and the first electric control valve 11 is convenient for controlling the drainage.

Referring to fig. 2, because the processing box 1 is provided with vent holes 12 at both sides thereof, and the vent holes 12 are fixedly provided with the first filter screen 13, the vent holes 12 facilitate ventilation of the processing box 1, and the first filter screen 13 can prevent impurities from entering the processing box 1.

Referring to fig. 2, since the upper end of the water tank 4 is provided with the water inlet pipe 14, and the upper end of the water inlet pipe 14 is in threaded connection with the blocking cover 15, the water inlet pipe 14 is convenient for delivering water into the water tank 4, and the blocking cover 15 can prevent impurities from entering the water tank 4.

Referring to fig. 2, the second filter 16 is installed in the water inlet pipe 14, so that the water can be conveniently filtered during water delivery, and impurities can be prevented from entering the water tank 4.

Referring to fig. 2, the second electric control valve 17 is fixedly mounted on the water outlet pipe 5, so that the water spraying cleaning is convenient to control.

Referring to fig. 3, since the clamp 306 is an arc clamp, the clamp 306 has a groove 307 therein, and the rubber layer 308 is disposed in the groove 307, the wafer can be conveniently clamped and fixed by the groove 307, and the wear to the wafer can be reduced by the rubber layer 308.

The structure principle is as follows: the wafer cleaning machine is provided with a processing box 1, a collecting box 2 is arranged in the processing box 1, a clamping mechanism is arranged on the collecting box 2, a wafer is clamped by the clamping mechanism 3, a servo electric cylinder 302 is started to adjust the distance between clamps 306 for clamping, wafers with different sizes can be clamped, when the cleaning angle needs to be changed after clamping is completed, the servo electric cylinder 302 is started for angle adjustment, a water tank 4 conveys water to a spray head 6 through a water outlet pipe 5, the water cleans the wafer through the spray head 6, after cleaning, a drying fan 7 is started, and the drying fan 7 dries the wafer through an exhaust pipe 8 and an exhaust nozzle 9.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A wafer surface treatment apparatus includes a processing box (1), characterized in that: the processing box is characterized in that a collecting box (2) is fixedly arranged in an inner cavity of the processing box (1), clamping mechanisms (3) are fixedly arranged on two sides of the processing box (1), a water tank (4) is fixedly arranged at the upper end of the collecting box (2), a water outlet pipe (5) is arranged at the lower end of the water tank (4), the water outlet pipe (5) penetrates through the processing box (1), a spray head (6) is connected to the other end of the water outlet pipe (5), a drying fan (7) is fixedly arranged at the upper end of the processing box (1), an exhaust pipe (8) is fixedly connected to one end of the drying fan (7), the exhaust pipe (8) penetrates through the processing box (1), and an exhaust nozzle (9) is fixedly connected to the other end of the exhaust pipe (8);

fixture (3) is including mounting panel (301), mounting panel (301) fixed mounting be in collecting box (2) upper end, mounting panel (301) one side fixed mounting has servo electric jar (302), servo electric jar (302) output end fixedly connected with connecting plate (303), connecting plate (303) opposite side fixed mounting has servo motor (304), servo motor (304) output has connecting rod (305) through the coupling joint, connecting rod (305) other end fixedly connected with anchor clamps (306).

2. The wafer surface treatment apparatus according to claim 1, wherein: the water discharging pipe (10) is arranged on one side of the collecting box (2), the water discharging pipe (10) penetrates through the processing box (1), and a first electric control valve (11) is fixedly mounted on the water discharging pipe (10).

3. The wafer surface treatment apparatus according to claim 1, wherein: processing case (1) both sides have been seted up ventilation hole (12), ventilation hole (12) department fixed mounting has first filter screen (13).

4. The wafer surface treatment apparatus according to claim 1, wherein: the water tank (4) upper end is equipped with inlet tube (14), inlet tube (14) upper end threaded connection has fender lid (15).

5. The apparatus of claim 4, wherein: and a second filter screen (16) is arranged in the water inlet pipe (14).

6. The wafer surface treatment apparatus according to claim 1, wherein: and a second electric control valve (17) is fixedly arranged on the water outlet pipe (5).

7. The wafer surface treatment apparatus according to claim 1, wherein: the clamp (306) is an arc-shaped clamp, a groove (307) is formed in the clamp (306), and a rubber layer (308) is arranged in the groove (307).