CN213409192U

CN213409192U - Coating device of wafer coating machine

Info

Publication number: CN213409192U
Application number: CN202022126284.2U
Authority: CN
Inventors: 戚孝峰; 周鹏程; 王哲琦
Original assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Current assignee: Zhengfeng Semiconductor Technology Suzhou Co ltd
Priority date: 2020-09-24
Filing date: 2020-09-24
Publication date: 2021-06-11
Anticipated expiration: 2030-09-24

Abstract

The application relates to the field of coating machines, especially, relate to a coating device of wafer coating machine, it is provided with and is used for the drive to place a set pivoted drive arrangement including placing the dish on placing the dish, and one side of placing the dish is provided with the belt cleaning device who is used for the water spray, and the opposite side of placing the dish is provided with the spray set who is used for spouting the solvent. The method has the effect of improving the quality of the wafer.

Description

Coating device of wafer coating machine

Technical Field

The application relates to the field of coating machines, in particular to a coating device of a wafer coating machine.

Background

The wafer is a silicon wafer used for manufacturing a semiconductor circuit, and is widely applied to the production and manufacturing of integrated circuits, and the current domestic wafer production line mainly takes 8 inches and 12 inches. Wafer coating with a solvent (e.g., photoresist) is performed for the subsequent processes such as evaporation and development.

When a conventional coating machine is used for coating, a solvent is directly sprayed on the surface of a wafer to perform coating operation, so that the coating effect is achieved.

In view of the above-mentioned related technologies, the inventors believe that the surface of the wafer may be slightly contaminated when the conventional coating machine performs the coating operation, and the quality of the wafer may be degraded when the coating machine directly performs the coating operation on the surface of the wafer.

SUMMERY OF THE UTILITY MODEL

In order to improve the quality of a wafer, the application provides a coating device of a wafer coating machine.

The application provides a coating unit of wafer coating machine adopts following technical scheme:

the utility model provides a coating device of wafer coating machine, is including placing the dish, it is provided with and is used for the drive to place a pivoted drive arrangement to place to coil, the one side of placing the dish is provided with the belt cleaning device who is used for the water spray, the opposite side of placing the dish is provided with the spray set who is used for solvent spraying.

Through adopting above-mentioned technical scheme, belt cleaning device sets up the back, can carry out earlier through belt cleaning device to placing the dish and spray water and wash through belt cleaning device before carrying out spraying of solvent through spray set, and then gets rid of the dirty of wafer surface existence, improves the quality of wafer.

Optionally, the driving device includes a driving motor, a motor shaft of the driving motor is arranged along a vertical direction, and the motor shaft of the driving motor is connected with the center of the bottom surface of the placing disc; the bottom fixedly connected with of driving motor promotes the hydro-cylinder, the piston rod that promotes the hydro-cylinder sets up and is connected with driving motor along vertical direction.

Through adopting above-mentioned technical scheme, promote the hydro-cylinder and can drive driving motor and place the dish and remove along vertical direction, driving motor can drive and place the dish and rotate. When coating operation is carried out, the oil cylinder is pushed to push the placing disc to rise, then the wafer is placed on the placing disc, the piston rod of the oil cylinder is pushed to retract, the motor is driven to rotate, the cleaning device is started, and cleaning operation is carried out. Convenient for cleaning operation

Optionally, a placing table is arranged at the bottom end of the placing disc, and a plurality of stabilizer bars are connected between the placing table and the driving motor.

Through adopting above-mentioned technical scheme, place the platform and can improve the stability when placing the dish and rotate after the stabilizer bar sets up.

Optionally, a blocking plate is arranged on the placing table, and the blocking plate is annular and surrounds the periphery of the placing disc.

Through adopting above-mentioned technical scheme, can prevent the cleaning process and spout solvent in-process liquid loss after the barrier plate sets up.

Optionally, the blocking plate is provided with a vent hole, and the vent hole is communicated with a vent pipe.

Through adopting above-mentioned technical scheme, because can produce a large amount of water smoke in the cleaning process, can conveniently get rid of the water smoke after the ventilation hole sets up.

Optionally, the cleaning device comprises a cleaning motor, a fixing plate is connected to a motor shaft of the cleaning motor, a cleaning pipe is connected to the fixing plate, one end of the cleaning pipe is connected with a cleaning nozzle, and the other end of the cleaning pipe is communicated with a water source.

By adopting the technical scheme, the surface of the wafer can be cleaned after the cleaning pipe and the cleaning nozzle are arranged, and the quality of the wafer is improved.

Optionally, the spraying device comprises a spraying motor, a motor shaft of the spraying motor is connected with a stabilizing plate, and the stabilizing plate is connected with a spraying pipe; one end of the spray pipe is connected with a spray nozzle, the other end of the spray pipe is connected with a booster pump, and one end of the booster pump, which is far away from the spray pipe, is communicated with a spray box.

By adopting the technical scheme, the solvent is contained in the spray box, and the spray nozzle can spray the solvent to the surface of the wafer for coating.

Optionally, be connected with a plurality of fixture block on placing the periphery wall of dish, the one end of fixture block with place a dish fixed connection, the other end upwards buckles.

Through adopting above-mentioned technical scheme, can play certain fixed action to the wafer after the fixture block sets up, prevent that the wafer from rocking at the rotation in-process.

In summary, the present application includes at least one of the following beneficial technical effects:

1. through the arrangement of the placing disc, the driving device, the cleaning device and the spraying device, the placing disc can be cleaned by spraying water through the cleaning device, so that dirt on the surface of the wafer is removed, and the quality of the wafer is improved;

2. through the setting of barrier plate, can prevent the liquid loss in the cleaning process and the solvent spraying process.

Drawings

Fig. 1 is a partial schematic view of a coating apparatus of a wafer coater shown in this embodiment;

fig. 2 is another partial schematic view of a coating apparatus of a wafer coater shown in the present embodiment;

fig. 3 is a schematic view of the overall configuration of a coating apparatus of a wafer coater according to the present embodiment.

Description of reference numerals: 1. placing a tray; 11. a clamping block; 12. a placing table; 13. a stabilizer bar; 14. a blocking plate; 16. a vent pipe; 17. an exhaust fan; 2. a drive motor; 21. pushing the oil cylinder; 3. cleaning the motor; 31. a fixing plate; 32. cleaning the tube; 33. cleaning the spray head; 34. cleaning the flowmeter; 35. cleaning the connecting plate; 4. a spray motor; 41. spraying a connecting plate; 42. a stabilizing plate; 43. a shower pipe; 44. a spray nozzle; 45. a booster pump; 46. a spray box; 47. and (4) spraying the flowmeter.

Detailed Description

The present application is described in further detail below with reference to figures 1-3.

The embodiment of the application discloses coating device of wafer coating machine. Referring to fig. 1, a coating apparatus of a wafer coater comprises a placing disc 1, a driving device for driving the placing disc 1 to rotate is arranged on the placing disc 1, a cleaning device for spraying water is arranged on one side of the placing disc 1, and a spraying device for spraying a solvent is arranged on the other side of the placing disc 1.

Referring to fig. 1, the outer peripheral wall of the placing disc 1 is connected with four fixture blocks 11 at equal intervals, one ends of the fixture blocks 11 are fixedly connected with the placing disc 1, the other ends of the fixture blocks are bent upwards to form an L shape, and the fixture blocks 11 are used for abutting against a wafer to fix the wafer.

Referring to fig. 1, the driving device includes a driving motor 2, a motor shaft of the driving motor 2 is arranged along a vertical direction, the motor shaft of the driving motor 2 is fixedly connected with a center of a bottom surface of the placing tray 1, and the driving motor 2 drives the placing tray 1 to rotate. The bottom end of the driving motor 2 is fixedly connected with a pushing oil cylinder 21, a piston rod of the pushing oil cylinder 21 is arranged along the vertical direction and is fixedly connected with the driving motor 2, and the pushing oil cylinder 21 pushes the driving motor 2 and the placing disc 1 to move up and down.

Referring to fig. 1 and 2, a placing table 12 is arranged below the placing disc 1, a through hole is formed in the center of the placing table 12, a motor shaft of the driving motor 2 passes through the through hole, four stabilizer bars 13 are fixedly connected between the placing table 12 and the driving motor 2, the placing disc 1 is located on the placing table 12, and after the driving motor 2 is started, the placing disc 1 rotates on the placing table 12. The placing table 12 is fixedly connected with a blocking plate 14, and the blocking plate 14 is annular and surrounds the periphery of the placing disc 1.

Referring to fig. 1, belt cleaning device includes cleaning motor 3, and cleaning motor 3 with place platform 12 through wasing even board 35 fixed connection, the vertical fixedly connected with fixed plate 31 up of motor shaft of cleaning motor 3, fixedly connected with scavenge pipe 32 on the fixed plate 31, the one end of scavenge pipe 32 is connected with washing shower nozzle 33, the other end and water source intercommunication, the intercommunication has washing flow meter 34 on the scavenge pipe 32.

Referring to fig. 1 and 2, the spraying device comprises a spraying motor 4, the spraying motor 4 is fixedly connected with a placing table 12 through a spraying connecting plate 41, a motor shaft of the spraying motor 4 is vertically and upwards fixedly connected with a stabilizing plate 42, a spraying pipe 43 is fixedly connected onto the stabilizing plate 42, one end of the spraying pipe 43 is connected with a spraying nozzle 44, the other end of the spraying pipe 43 is connected with a booster pump 45, one end, far away from the spraying pipe 43, of the booster pump 45 is communicated with a spraying box 46, a spraying required solvent is contained in the spraying box 46, and a spraying flowmeter 47 is communicated with the spraying pipe 43.

Referring to fig. 3, a vent hole is formed in the blocking plate 14, a vent pipe 16 is communicated with the vent hole, and an exhaust fan 17 is connected to one end, far away from the vent hole, of the vent pipe 16 and used for removing water mist in the cleaning process.

The application principle of the coating device of the wafer coater in the embodiment of the application is as follows:

when coating is carried out, the pushing oil cylinder 21 is started, the pushing oil cylinder 21 drives the placing disc 1 to move upwards, the wafer is placed on the placing disc 1, the wafer is clamped through the clamping block 11, and the piston rod of the pushing oil cylinder 21 is retracted. At this moment, the driving motor 2 and the cleaning motor 3 are started, the cleaning motor 3 drives the cleaning pipe 32 to rotate, the cleaning nozzle 33 is further rotated to the position above the wafer, the driving motor 2 drives the placing disc 1 to rotate, and the wafer rotates in the cleaning process to achieve the purpose of cleaning. After the cleaning, the exhaust fan 17 is started to remove the water mist. Then, the booster pump 45 and the spraying motor 4 are started, the spraying motor 4 drives the spraying pipe 43 to rotate, the spraying nozzle 44 rotates to the position above the wafer, the driving motor 2 drives the placing disc 1 to rotate, the purpose of spraying the solvent is achieved, and therefore coating operation is completed.

The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.

Claims

1. A coating device of a wafer coater is characterized in that: including placing dish (1), it is used for the drive to place dish (1) pivoted drive arrangement to place to be provided with on dish (1), the one side of placing dish (1) is provided with the belt cleaning device who is used for the water spray, the opposite side of placing dish (1) is provided with the spray set who is used for the solvent that spouts.

2. The coating apparatus of a wafer coater as set forth in claim 1, wherein: the driving device comprises a driving motor (2), a motor shaft of the driving motor (2) is arranged in the vertical direction, and the motor shaft of the driving motor (2) is connected with the center of the bottom surface of the placing disc (1); the bottom fixedly connected with of driving motor (2) promotes hydro-cylinder (21), the piston rod that promotes hydro-cylinder (21) sets up and is connected with driving motor (2) along vertical direction.

3. The coating apparatus of a wafer coater as set forth in claim 2, wherein: a placing table (12) is arranged below the placing disc (1), and a plurality of stabilizer bars (13) are connected between the placing table (12) and the driving motor (2).

4. The coating apparatus of a wafer coater as set forth in claim 3, wherein: the placing table (12) is provided with a blocking plate (14), and the blocking plate (14) is annular and surrounds the periphery of the placing disc (1).

5. The coating apparatus of a wafer coater as set forth in claim 4, wherein: the blocking plate (14) is provided with a vent hole, and the vent hole is communicated with a vent pipe (16).

6. The coating apparatus of a wafer coater as set forth in claim 1, wherein: the cleaning device comprises a cleaning motor (3), a fixing plate (31) is connected to a motor shaft of the cleaning motor (3), a cleaning pipe (32) is connected to the fixing plate (31), one end of the cleaning pipe (32) is connected with a cleaning nozzle (33), and the other end of the cleaning pipe is communicated with a water source.

7. The coating apparatus of a wafer coater as set forth in claim 1, wherein: the spraying device comprises a spraying motor (4), a motor shaft of the spraying motor (4) is connected with a stabilizing plate (42), and the stabilizing plate (42) is connected with a spraying pipe (43); one end of the spray pipe (43) is connected with a spray nozzle (44), the other end of the spray pipe is connected with a booster pump (45), and one end, far away from the spray pipe (43), of the booster pump (45) is communicated with a spray box (46).

8. The coating apparatus of a wafer coater as set forth in claim 1, wherein: the outer peripheral wall of the placing plate (1) is connected with a plurality of clamping blocks (11), one ends of the clamping blocks (11) are fixedly connected with the placing plate (1), and the other ends of the clamping blocks are bent upwards.