CN220049250U - Silicon wafer flat washing device for semiconductor production - Google Patents
Silicon wafer flat washing device for semiconductor production Download PDFInfo
- Publication number
- CN220049250U CN220049250U CN202321423836.3U CN202321423836U CN220049250U CN 220049250 U CN220049250 U CN 220049250U CN 202321423836 U CN202321423836 U CN 202321423836U CN 220049250 U CN220049250 U CN 220049250U
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- CN
- China
- Prior art keywords
- silicon wafer
- cleaning
- semiconductor production
- box
- wafer flat
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- 238000005406 washing Methods 0.000 title claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 31
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 31
- 239000010703 silicon Substances 0.000 title claims abstract description 31
- 239000004065 semiconductor Substances 0.000 title claims abstract description 26
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 24
- 238000004140 cleaning Methods 0.000 claims abstract description 59
- 239000002893 slag Substances 0.000 claims abstract description 20
- 239000007788 liquid Substances 0.000 claims description 16
- 238000003860 storage Methods 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 238000005507 spraying Methods 0.000 claims description 3
- 239000012535 impurity Substances 0.000 abstract description 12
- 235000012431 wafers Nutrition 0.000 description 18
- 239000000463 material Substances 0.000 description 5
- 239000012459 cleaning agent Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004855 amber Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000002381 plasma Anatomy 0.000 description 1
- -1 plasmas and the like Substances 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model relates to the technical field of semiconductor production, and provides a silicon wafer flat washing device for semiconductor production, which comprises a washing box, wherein a filter plate is fixedly arranged in the washing box, a cleaning plate is arranged above the filter plate, one side of the cleaning plate is in threaded connection with a threaded rod, one end of the threaded rod is fixedly connected with an output end of a driving motor, the rear end surface of the washing box is fixedly provided with a support frame, a collecting box is arranged in the support frame, and one surface of the collecting box, which is close to the washing box, is provided with a slag inlet. According to the utility model, the cleaning solution is filtered through the filter plate, and the threaded rod is driven to rotate by the drive motor, so that the cleaning plate moves above the filter plate, and impurities filtered from the surface of the filter plate can be pushed into the collecting box, so that impurities in the cleaning solution can be filtered and collected in time, and the impurities in the cleaning solution are effectively prevented from adhering to the surface of the silicon wafer again.
Description
Technical Field
The utility model relates to the technical field of semiconductor production, in particular to a silicon wafer flat washing device for semiconductor production.
Background
The semiconductor refers to materials with conductivity between conductors and insulators at normal temperature, various forms exist in substances, such as solids, liquids, gases, plasmas and the like, materials with poor conductivity, such as coal, artificial crystals, amber, ceramics and the like are generally called insulators, metals with good conductivity, such as gold, silver, copper, iron, tin, aluminum and the like are called conductors, the materials between the conductors and the insulators can be simply called semiconductors, compared with the conductors and the insulators, the discovery of the semiconductor materials is the latest, until the 20 th century 30, after the purification technology of the materials is improved, the existence of the semiconductors is truly accepted by the academia, silicon wafers, also called wafers, are processed by silicon ingots, millions of transistors can be etched on the silicon wafers through special processes, the silicon wafers are widely applied to the manufacture of integrated circuits, and the silicon wafers need cleaning after the manufacture of the integrated circuits.
The patent specification with the bulletin number of CN216606403U discloses a silicon wafer flat washing device for semiconductor production, which comprises a bottom bracket, a tabletop, a moving mechanism, a cleaning mechanism and a grabbing mechanism, wherein the bottom bracket is arranged below the tabletop, the moving mechanism is arranged above the tabletop, the cleaning mechanism is arranged on one side of the moving mechanism, and the grabbing mechanism is arranged above the moving mechanism and the cleaning mechanism; the cleaning mechanism comprises a cleaning frame, a placing frame, a positioning support, a liquid discharge pipe, a ball valve, a gear box, a driving motor, a stirring frame and a placing frame, wherein the cleaning frame is arranged above the tabletop, the stirring frame is driven to rotate through the driving motor, a cleaning agent is driven to rotate and stir, cleaning is accelerated, a first screw rod is driven to rotate by a first servo motor, a moving frame is moved, a second screw rod is driven to rotate by a second servo motor, a moving seat is moved, manual operation is reduced, and working efficiency and cleaning quality are improved.
According to the technical scheme, although manual operation can be reduced, the working efficiency and the cleaning quality are improved, in actual operation, the stirring frame is utilized to rotate, the cleaning agent is driven to clean the silicon wafer, and impurities in the cleaning agent cannot be filtered timely due to the fact that ash stains which are cleaned are immersed in the cleaning agent, so that part of impurities still remain when the silicon wafer is subsequently stood and dried. For this reason, we propose a silicon wafer flat washing apparatus for semiconductor production.
Disclosure of Invention
The utility model provides a silicon wafer flat washing device for semiconductor production, which solves the related problems of the silicon wafer flat washing device for semiconductor production.
The technical scheme of the utility model is as follows: the utility model provides a silicon wafer flat washing device for semiconductor production, includes washs the case, the inside fixed mounting who washs the case has the filter, the top of filter is provided with the clearance board, one side threaded connection of clearance board has the threaded rod, the one end fixedly connected with driving motor's of threaded rod output, the rear end face fixed mounting who washs the case has the support frame, the inside of support frame is provided with the collecting box, the slag notch has been seted up to the one side that is close to that washs the case of collecting box, the slag notch has been seted up to the rear end face that washs the case, just the outside of wasing the case is provided with the connecting pipe, the fixed surface of connecting pipe installs the water pump, just the upper end fixedly connected with hydrojet of connecting pipe.
Preferably, the surface of the filter plate is provided with uniformly distributed filter holes, and the lower surface of the filter plate is fixedly provided with uniformly distributed cleaning brushes, and the cleaning brushes are contacted with the upper surface of the filter plate.
The cleaning plate and the threaded rod are arranged in the cleaning box, the threaded rod is rotationally connected with the cleaning box, and the driving motor is fixedly connected with the outer surface of the cleaning box.
The slag outlet is communicated with the slag inlet, and the slag outlet is arranged above the filter plate.
The collecting box is movably connected with the supporting frame, and a handle is fixedly arranged at the upper end of the collecting box.
The bottom of the connecting pipe is fixedly connected with the lower end of one side of the cleaning box, and the upper end of the connecting pipe is fixedly connected with the center of the upper end of the cleaning box.
The connecting pipe is communicated with the cleaning box, and the liquid spraying head is arranged at the top end inside the cleaning box.
The opposite side slidable mounting of clearance board has the slide bar, the slide bar sets up in the inside of wasing the case, just slide bar and wasing case fixed connection.
The front end face of the cleaning box is provided with a storage groove, a storage frame is arranged in the storage groove, a liquid outlet which is evenly distributed is formed in the bottom end of the storage frame, and the front end face of the storage frame is fixedly connected with a handle.
The cleaning box is movably connected with the placing frame, the placing frame is arranged above the cleaning plate, and the placing frame is arranged below the liquid spraying head.
The working principle and the beneficial effects of the utility model are as follows:
according to the utility model, the cleaning solution is filtered through the filter plate, and the threaded rod is driven to rotate by the drive motor, so that the cleaning plate moves above the filter plate, and impurities filtered from the surface of the filter plate can be pushed into the collecting box, so that impurities in the cleaning solution can be filtered and collected in time, and the impurities in the cleaning solution are effectively prevented from adhering to the surface of the silicon wafer again.
Drawings
The utility model will be described in further detail with reference to the drawings and the detailed description.
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a rear view of the present utility model;
FIG. 3 is a schematic diagram of the activity of the present utility model;
fig. 4 is a cross-sectional view of the present utility model.
In the figure: 1. a cleaning box; 2. a storage groove; 3. placing a frame; 4. a liquid outlet; 5. a handle; 6. a filter plate; 7. a filter hole; 8. a cleaning plate; 9. cleaning brushes; 10. a threaded rod; 11. a slide bar; 12. a driving motor; 13. a support frame; 14. a collection box; 15. a handle; 16. a slag inlet; 17. a slag outlet; 18. a connecting pipe; 19. a water pump; 20. a liquid ejecting head.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1 to 4, this embodiment provides a silicon wafer flat washing device for semiconductor production, including wasing case 1, the inside fixed mounting who washs case 1 has filter 6, the top of filter 6 is provided with clearance board 8, one side threaded connection of clearance board 8 has threaded rod 10, the output of the one end fixedly connected with driving motor 12 of threaded rod 10, the rear end face fixed mounting who washs case 1 has support frame 13, the inside of support frame 13 is provided with collecting box 14, slag notch 16 has been seted up to the one side that is close to that washs case 1 of collecting box 14, slag notch 17 has been seted up to the rear end face that washs case 1, and the outside of wasing case 1 is provided with connecting pipe 18, the surface fixed mounting of connecting pipe 18 has water pump 19, and the upper end fixedly connected with hydrojet head 20 of connecting pipe 18. The surface of the filter plate 6 is provided with evenly distributed filter holes 7, and the lower surface of the filter plate 6 is fixedly provided with evenly distributed cleaning brushes 9, and the cleaning brushes 9 are contacted with the upper surface of the filter plate 6. The cleaning plate 8, the threaded rod 10 all set up in the inside of wasing case 1, and threaded rod 10 rotates with wasing case 1 to be connected, and driving motor 12 and the surface fixed connection who washs case 1. The slag outlet 17 is communicated with the slag inlet 16, and the slag outlet 17 is arranged above the filter plate 6. The collecting box 14 is movably connected with the supporting frame 13, and a handle 15 is fixedly arranged at the upper end of the collecting box 14. The bottom of the connecting pipe 18 is fixedly connected with the lower end of one side of the cleaning box 1, and the upper end of the connecting pipe 18 is fixedly connected with the center of the upper end of the cleaning box 1. The connection pipe 18 communicates with the cleaning tank 1, and the liquid ejecting head 20 is provided at the top end inside the cleaning tank 1. The other side sliding mounting of clearance board 8 has slide bar 11, and slide bar 11 sets up in the inside of wasing case 1, and slide bar 11 and wasing case 1 fixed connection.
In this embodiment, through the water pump 19 that sets up, wash the washing liquid of the inside of washing case 1 through connecting pipe 18 and hydrojet 20 to the surface of silicon wafer wash, then the washing liquid is after the processing of filter 6, impurity among the washing liquid is filtered on the upper surface of filter 6, then drive threaded rod 10 through the driving motor 12 that sets up and rotate, make cleaning plate 8 and cleaning brush 9 remove on the upper surface of filter, thereby can push the impurity of the upper surface of filter 6 in the collecting box 14 through slag notch 17 and slag notch 16, under the effect of handle 15 that sets up, conveniently remove the collecting box 14 that is equipped with the impurity, thereby conveniently handle the impurity.
Example 2
As shown in fig. 2 to 4, based on the same concept as that of the above embodiment 1, this embodiment further proposes that the front end surface of the cleaning tank 1 is provided with a storage tank 2, a placement frame 3 is disposed in the storage tank 2, the bottom end of the placement frame 3 is provided with evenly distributed liquid outlets 4, and the front end surface of the placement frame 3 is fixedly connected with a handle 5. The cleaning box 1 is movably connected with the placement frame 3, the placement frame 3 is arranged above the cleaning plate 8, and the placement frame 3 is arranged below the liquid spray head 20.
In this embodiment, place the silicon wafer through the frame 3 of placing that sets up, utilize the storage tank 2 that sets up to place frame 3 receiver spacing processing, avoid placing frame 3 and rock in the cleaning process, influence abluent effect. Through the handle 5 that sets up, the processing of installing and dismantling is conveniently carried out to placing frame 3.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.
Claims (10)
1. The utility model provides a silicon wafer flat washing device for semiconductor production, its characterized in that, including wasing case (1), the inside fixed mounting who washs case (1) has filter (6), the top of filter (6) is provided with clearance board (8), one side threaded connection of clearance board (8) has threaded rod (10), the one end fixedly connected with driving motor (12) of threaded rod (10) output, the rear end face fixed mounting who washs case (1) has support frame (13), the inside of support frame (13) is provided with collecting box (14), slag notch (16) have been seted up to the one side that is close to washs case (1) of collecting box (14), slag notch (17) have been seted up to the rear end face of washs case (1), just the outside of washs case (1) is provided with connecting pipe (18), the fixed surface of connecting pipe (18) installs water pump (19), just the upper end fixedly connected with hydrojet head (20).
2. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein uniformly distributed filter holes (7) are formed in the surface of the filter plate (6), uniformly distributed cleaning brushes (9) are fixedly arranged on the lower surface of the filter plate (6), and the cleaning brushes (9) are in contact with the upper surface of the filter plate (6).
3. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein the cleaning plate (8) and the threaded rod (10) are arranged inside the cleaning box (1), the threaded rod (10) is rotationally connected with the cleaning box (1), and the driving motor (12) is fixedly connected with the outer surface of the cleaning box (1).
4. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein the slag outlet (17) is communicated with the slag inlet (16), and the slag outlet (17) is arranged above the filter plate (6).
5. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein the collection box (14) is movably connected with the support frame (13), and a handle (15) is fixedly arranged at the upper end of the collection box (14).
6. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein the bottom end of the connecting pipe (18) is fixedly connected with the lower end of one side of the washing tank (1), and the upper end of the connecting pipe (18) is fixedly connected with the center of the upper end of the washing tank (1).
7. The silicon wafer flat washing apparatus for semiconductor production according to claim 6, wherein the connection pipe (18) is communicated with the washing tank (1), and the liquid ejecting head (20) is provided at a top end inside the washing tank (1).
8. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein a sliding rod (11) is slidably mounted on the other side of the cleaning plate (8), the sliding rod (11) is arranged in the cleaning box (1), and the sliding rod (11) is fixedly connected with the cleaning box (1).
9. The silicon wafer flat washing device for semiconductor production according to claim 1, wherein the front end face of the washing box (1) is provided with a storage groove (2), a placement frame (3) is arranged in the storage groove (2), liquid outlets (4) which are uniformly distributed are formed in the bottom end of the placement frame (3), and a handle (5) is fixedly connected to the front end face of the placement frame (3).
10. The silicon wafer flat washing device for semiconductor production according to claim 9, wherein the washing box (1) is movably connected with the placing frame (3), the placing frame (3) is arranged above the cleaning plate (8), and the placing frame (3) is arranged below the liquid spraying head (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321423836.3U CN220049250U (en) | 2023-06-06 | 2023-06-06 | Silicon wafer flat washing device for semiconductor production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321423836.3U CN220049250U (en) | 2023-06-06 | 2023-06-06 | Silicon wafer flat washing device for semiconductor production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220049250U true CN220049250U (en) | 2023-11-21 |
Family
ID=88758631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321423836.3U Active CN220049250U (en) | 2023-06-06 | 2023-06-06 | Silicon wafer flat washing device for semiconductor production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220049250U (en) |
-
2023
- 2023-06-06 CN CN202321423836.3U patent/CN220049250U/en active Active
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