CN1129734A - 清洗组合物及清洗方法 - Google Patents
清洗组合物及清洗方法 Download PDFInfo
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- CN1129734A CN1129734A CN95115999A CN95115999A CN1129734A CN 1129734 A CN1129734 A CN 1129734A CN 95115999 A CN95115999 A CN 95115999A CN 95115999 A CN95115999 A CN 95115999A CN 1129734 A CN1129734 A CN 1129734A
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- cleaning
- cleaning combination
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- hydrocarbon solvent
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- 238000004140 cleaning Methods 0.000 title claims abstract description 108
- 238000000034 method Methods 0.000 title claims abstract description 18
- 239000000203 mixture Substances 0.000 title abstract description 13
- 239000002904 solvent Substances 0.000 claims abstract description 71
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 42
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 42
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 41
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 17
- 150000001875 compounds Chemical class 0.000 claims description 32
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims description 18
- 150000001455 metallic ions Chemical class 0.000 claims description 16
- 238000010926 purge Methods 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 11
- ATTZFSUZZUNHBP-UHFFFAOYSA-N Piperonyl sulfoxide Chemical compound CCCCCCCCS(=O)C(C)CC1=CC=C2OCOC2=C1 ATTZFSUZZUNHBP-UHFFFAOYSA-N 0.000 claims description 9
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims description 9
- 230000004907 flux Effects 0.000 abstract description 15
- 230000006378 damage Effects 0.000 abstract 1
- 229910021645 metal ion Inorganic materials 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 28
- WPPOGHDFAVQKLN-UHFFFAOYSA-N N-Octyl-2-pyrrolidone Chemical compound CCCCCCCCN1CCCC1=O WPPOGHDFAVQKLN-UHFFFAOYSA-N 0.000 description 22
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 19
- LOWMYOWHQMKBTM-UHFFFAOYSA-N 1-butylsulfinylbutane Chemical compound CCCCS(=O)CCCC LOWMYOWHQMKBTM-UHFFFAOYSA-N 0.000 description 10
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 10
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 10
- 238000001035 drying Methods 0.000 description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000005259 measurement Methods 0.000 description 6
- -1 octane-iso Chemical compound 0.000 description 6
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 5
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 5
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 5
- 230000026030 halogenation Effects 0.000 description 5
- 238000005658 halogenation reaction Methods 0.000 description 5
- 229940094933 n-dodecane Drugs 0.000 description 5
- XTUSEBKMEQERQV-UHFFFAOYSA-N propan-2-ol;hydrate Chemical compound O.CC(C)O XTUSEBKMEQERQV-UHFFFAOYSA-N 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- ZMBHCYHQLYEYDV-UHFFFAOYSA-N trioctylphosphine oxide Chemical compound CCCCCCCCP(=O)(CCCCCCCC)CCCCCCCC ZMBHCYHQLYEYDV-UHFFFAOYSA-N 0.000 description 5
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000005406 washing Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000013543 active substance Substances 0.000 description 3
- KYKAJFCTULSVSH-UHFFFAOYSA-N chloro(fluoro)methane Chemical compound F[C]Cl KYKAJFCTULSVSH-UHFFFAOYSA-N 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- NNBZCPXTIHJBJL-UHFFFAOYSA-N decalin Chemical compound C1CCCC2CCCCC21 NNBZCPXTIHJBJL-UHFFFAOYSA-N 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- GXDHCNNESPLIKD-UHFFFAOYSA-N 2-methylhexane Natural products CCCCC(C)C GXDHCNNESPLIKD-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 2
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 2
- 239000003125 aqueous solvent Substances 0.000 description 2
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 2
- DCAYPVUWAIABOU-UHFFFAOYSA-N hexadecane Chemical compound CCCCCCCCCCCCCCCC DCAYPVUWAIABOU-UHFFFAOYSA-N 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- DDMOUSALMHHKOS-UHFFFAOYSA-N 1,2-dichloro-1,1,2,2-tetrafluoroethane Chemical compound FC(F)(Cl)C(F)(F)Cl DDMOUSALMHHKOS-UHFFFAOYSA-N 0.000 description 1
- MNZAKDODWSQONA-UHFFFAOYSA-N 1-dibutylphosphorylbutane Chemical compound CCCCP(=O)(CCCC)CCCC MNZAKDODWSQONA-UHFFFAOYSA-N 0.000 description 1
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical group CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 1
- NJPQAIBZIHNJDO-UHFFFAOYSA-N 1-dodecylpyrrolidin-2-one Chemical compound CCCCCCCCCCCCN1CCCC1=O NJPQAIBZIHNJDO-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 1
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 229920013701 VORANOL™ Polymers 0.000 description 1
- 238000013019 agitation Methods 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 150000003973 alkyl amines Chemical class 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- JBTWLSYIZRCDFO-UHFFFAOYSA-N ethyl methyl carbonate Chemical compound CCOC(=O)OC JBTWLSYIZRCDFO-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- WBJINCZRORDGAQ-UHFFFAOYSA-N formic acid ethyl ester Natural products CCOC=O WBJINCZRORDGAQ-UHFFFAOYSA-N 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 235000001510 limonene Nutrition 0.000 description 1
- 229940087305 limonene Drugs 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- CXWXQJXEFPUFDZ-UHFFFAOYSA-N tetralin Substances C1=CC=C2CCCCC2=C1 CXWXQJXEFPUFDZ-UHFFFAOYSA-N 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/755—Sulfoxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/02—Anionic compounds
- C11D1/04—Carboxylic acids or salts thereof
- C11D1/06—Ether- or thioether carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/79—Phosphine oxides
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5009—Organic solvents containing phosphorus, sulfur or silicon, e.g. dimethylsulfoxide
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/34—Organic compounds containing sulfur
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0783—Using solvent, e.g. for cleaning; Regulating solvent content of pastes or coatings for adjusting the viscosity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
一种包括烃溶剂和可与金属离子配位的有机化合物的清洗组合物;以及一种清洗方法,包括:使要清洗的制品与清洗组合物接触,然后再与一种溶剂接触。印刷电路板上的臭氧层造成破坏的有机卤化了的溶剂的条件下,通过将它们溶解而除去。
Description
本发明涉及一种清洗组合物和清洗方法。更确切地说,本发明涉及一种有机溶剂基清洗组合物,它不含任何卤素化合物,具有优良的清洗性且尤其适用于清洗印刷电路板;以及一种使用所述清洗组合物的清洗方法。
当电子部件焊接到印刷电路板上时,使用助熔剂(flux),以除去焊锡表面上的氧化物层以及防止焊接后焊锡的氧化。焊接后由助熔剂形成的残渣含有离子物质,它造成印刷电路板的腐蚀和电绝缘劣化。因此,印刷电路板必须彻底清洗,以在焊接后除去残渣。
迄今为止,有机氯化了的溶剂,如1,1.1-三氯乙烷等等,以及氯氟烃溶剂,如CFC-114,已广泛地用作清除残渣的清洗剂。不过,已经很清楚,这些溶剂造成臭氧层破坏;已经决定到1995年底,完全禁止使用这类溶剂。鉴于这种情况,急切需要研制能替代这些溶剂的新型清洗剂。
作为替代有机氯化了的溶剂和氯氟烃溶剂的清洗剂,开始普及水性溶剂和烃溶剂。不过,水性溶剂要求处理废水和采用干燥方法,从成本看不利。烃溶剂在除助熔剂残渣的清洗性方面较差(这是因为离子物质的溶解性低),一般不使用,即使这些溶剂的优点是比其它清洗剂低毒、对印刷电路板树脂材料影响不大且相当廉价。已提出通过加入有机极性基团如醇、醚、酯、羧酸或酮提高平均C8-C20脂肪烃清洗性的方法(日本专利申请公开未决号Heisei 3(1991)146597)。不过,该方法的清洗性不总是充分。
因此,本发明的一个目的是提供一种清洗组合物,它能替代常规有机卤化了的溶剂,不会造成臭氧层破坏且具有除助熔剂残渣的优良的清洗性。
本发明的另一目的是提供一种具有上述相同优点的清洗方法。
对于上述目的,本发明人进行了深入研究后发现:当烃溶剂与一种能与金属离子配位的有机化合物结合使用时可获得等同于或高于有机卤代烃溶剂如氯氟烃、三氯乙烷等等的清洗效果。基于以上发现便完成了本发明。
所以,本发明提供:
(1)一种包括烃溶剂和可与金属离子配位的有机化合物的清洗组合物;
(2)一种上款(1)中的清洗组合物,其中烃溶剂是C5-C20脂肪烃;
(3)一种上款(1)或(2)的清洗组合物,其中可与金属离子配位的有机化合物是一种具有氧原子作为配位原子的配位化合物;
(4)一种上款(3)的清洗组合物,其中具有氧原子作为配位原子的配位化合物是一种或多种选自1-烷基-2-吡咯烷酮(pyrrolidi-none)、三烷基氧化膦和二烷基亚砜的化合物;
(5)一种上款(4)的清洗组合物,其中1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的烷基是C3-C18直链烷基;
(6)一种上款(1)的清洗组合物,其中用清洗组合物清除粘到印刷电路板上的助溶剂残渣。
(7)一种上款(1),(2),(3),(4)或(5)的清洗组合物,其中清洗组合物含有可与金属离子配位的有机化合物,其含量为每升烃溶剂10—300g;
(8)一种清洗方法,包括使要清除的制品与含烃溶剂和可与金属离子配位的有机化合物的组合物接触,然后使清洗制品与一种溶剂接触;
(9)一种上款(8)的清洗方法,其中烃溶剂是一种C5-C20脂肪烃;
(10)一种上款(8)或(9)的清洗方法,其中可与金属离子配位的有机化合物是具有氧原子作为配位原子的配位化合物;
(11)一种上款(10)的清洗组合物,其中具有氧原子作为配位原子的配位化合物是选自1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的一种或多种化合物;
(12)一种上款(10)的清洗组合物,其中1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的烷基是C3-C18直链烷基;以及;
(13)一种上款(8)的清洗组合物,其中清洗的制品是粘有助溶剂残渣的印刷电路板;
(14)一种上款(8),(9),(10),(11)或(12)的清洗组合物,其中清洗组合物含有可与金属离子配位的有机化合物,其含量为每升烃溶剂10—300g。
用于本发明的烃溶剂没有特别限制,只要该烃溶剂能溶解助溶剂残渣便可。烃溶剂的例子有石蜡烃,如正戊烷,正己烷,异己烷,正庚烷,异庚烷,异辛烷,癸烷,十二烷,十六烷,二十碳烷等等;烯烃,如1-癸烯,1-十二碳烯等等;环烷烃,如环己烷,萘烷等等;萜烯烃,如苎烯,蒎烯,等等;芳烃,如苯,甲苯,二甲苯,乙苯,1,2,3,4-四氢化萘,等等;石油醚;石油挥发油;轻石油;溶剂萘;等等。在本发明中,烃溶剂可单独使用,也可以两种或多种混合物的形式使用。在这些烃溶剂中,C5-C20脂肪烃清洗性更优异,并优选使用。当强调安全性时,最好使用闪点70℃或以上的溶剂(按照Japanese Fire Services Act,属于第四类中的第三种石油材料的溶剂)。在本发明中,用于含可与金属离子配位的有机化合物的清洗组合物的烃溶剂可与清洗的制品与清洗组合物接触后再与清洗制品接触的那种溶剂相同或不同。
用于本发明的可与金属离子配位的有机化合物没有特别限制,只要化合物能溶于烃溶剂便可。可与金属离子配位的有机化合物,(以下称作配位化合物)的例子包括具有氧原子作为配位原子的化合物,如1-烷基-2-吡咯烷硐、三烷基氧化膦、二烷基亚砜等等。最好,上述化合物中的烷基是C3-C18直链烷基,尽管烷基可具有短的侧链。配位化合物的具体例子有1-正辛基-2-吡咯烷酮(NOP),1-正十二基-2-吡咯烷酮(NDP),三正辛基氧化膦(TOPO),二正丁基亚砜(DBSO),三正丁基氧化膦(TBPO),等等。本发明的清洗组合物可包括仅一类配位化合物或两类或两类以上的配位化合物。清洗组合物含每升烃溶剂优选10—300g、更优选30—250g配位化合物。当配位化合物含量为每升烃溶剂低于10g时,可能显示不出足够的清洗性。当配位化合物的含量为每升烃溶剂300g时,从含量预期的角度看清洗能力不够高,而且有时比预期的反到低了;印刷电路板的树脂可能受到组合物的不利影响,此外,清洗后要求大量的清洗液。
必要时,本发明的清洗组合物可含有其它组分。这样的其它组分的例子有表面活性剂,抗腐蚀剂,等等。作为表面活性剂,使用低HLB值的亲油基非离子表面活性剂比较有利。这样的表面活性剂的例子有聚氧乙烯烷基醚,烷基胺氧化物,硅氧烷表面活性剂,如用聚醚改性的硅氧烷等等。抗腐蚀剂的例子有巯基苯并噻唑,苯并三唑,等等。
在本发明的清洗方法中,先使要清洗的制品与包括烃溶剂和配位化合物的组合物接蚀。当要清洗的制品是涂覆了助熔剂和焊锡的印刷电路板时,本发明的清洗方法显示了特别优异的作用。粘到印刷电路板上的助溶剂残渣可以被有效地除去。要清洗的制品与清洗组合物的接触方式没有特别限制。例如,可将要清洗的制品浸入清洗组合物中,也可将清洗组合物喷到要清洗的制品上。当要清洗的制品浸入清洗组合物中时,必要时,可通过搅拌、摇动、超声波辐照等等加速清洗。当要清洗的制品是粘有助熔剂残渣的印刷电路板时,助熔剂的残渣中的金属组分通过与配位化合物形成金属配合物而溶解,再从印刷电路板的表面上除去。
在本发明的清理方法中,已与清洗组合物接触的要清洗的制品而后再与一种溶剂接触。通过使要清洗的制品与该溶剂接触,配位化合物及其附着在要清洗的制品上的金属配合物连同清洗组合物由于溶剂清洗作用从制品上除掉。在本发明中,与要清洗的制品(已与清洗组合物接触)接触的溶剂没有特别限制,只要该溶剂能与要清洗的组合物中的烃溶剂相容并能溶解配位化合物即可。溶剂的例子有可用于清洗组合物的烃溶剂;醇溶剂,如乙醇,异丙醇,等等;酯溶剂,如甲酸乙酯,乙酸乙酯,等等;以及酮溶剂,如丙酮,甲乙酮,等等。要清洗的制品与该溶剂接触的方式没有特别限制,可采用浸洗、喷洗、清洗,等等。
据认为,本发明的清洗组合物对清洗的粘有助熔剂残渣的印刷电路板具有特别优良的效果,因为配位化合物与印刷电路板上以及助熔剂残渣中存在的金属化合物相互作用,形成可溶于烃溶剂的配合物,由此提高了残渣的溶解度。
综上本发明的优点,按照本发明清洗组合物和清洗方法,印刷电路板上的助溶剂残渣可有效地被溶解和除去,而不用任何造成臭氧层破坏的有机卤化了的溶剂。
实施例
参考以下实施例将更容易地理解本发明;不过,这些实施例旨在说明本发明,而不是为了限制本发明的范围。
实施例1
小块印刷电路板[San Hayato Co.,Ltd.;ICB—86G;尺寸,36×46mm]用0.2ml助熔剂[Nippon Honda Co.,Ltd.的产物;Rapix RA]涂两遍,并静置干燥。干燥的电路板在260℃焊柜中焊接,该产品用作要清洗的制品。
往1,000ml正己烷中加入46.0g(0.233mol)1-正辛基-2-吡咯烷酮(NOP),并在搅拌下完全溶解,由此制备清洗组合物。
将制得的清洗组合物(75ml)置于不锈钢容器中,然后浸入到恒温水浴(25℃)中。当清洗组合物的温度达到25℃时,将要清洗的制品浸入清洗组合物中。在用搅拌器搅拌清洗组合物的条件下,要清洗的制品清洗2分钟。然后,从容器中取出清洗的制品,浸入正己烷中清洗30秒,然后用干燥器干燥。
由此清洗和干燥的小块印刷电路板浸入75ml 75%(体积)的异丙醇水溶液中,助熔剂残渣在超声波辐照下用溶液提取5分钟。测定提取液的导电率,经实测为0.85μS/cm。
实施例2
重复实施例1同样工序,只是1-正辛基-2-吡咯烷硐(NDP)的加入量为92.1g(0.467mol),而不是实施例1的46.0g(0.233mol)。提取液的导电率为0.62μS/cm。
实施例3
重复实施例1同样工序,只是1-正十二基-2-吡咯烷硐(NDP)的加入量为59.0g(0.233mol),而不是实施例1的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.81μS/cm。
实施例4
重复实施例3同样工序,只是1-正十二基-2-吡咯烷硐(NDP)的加入量为118.3g(0.467mol),而不是实施例3的59.0g(0.233mol)。提取液的导电率为0.65μS/cm。
实施例5
重复实施例1同样工序,只是加入36.0g(0.093mol)三丁辛基氧化膦(TOPO),替代实施例1的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.79μS/cm。
实施例6
重复实施例5同样工序,只是三正辛基氧化膦(TOPO)的加入量为90.1g(0.233mol),而不是实施例5的36.0g(0.093mol)。提取液的导电率为0.65μS/cm。
实施例7
重复实施例5同样工序,只是三正辛基氧化膦(TOPO)的加入量为180.6g(0.467mol),而不是实施例5的36.0g(0.093mol)。提取液的导电率为0.59μS/cm。
实施例8
重复实施例1同样工序,只是加入37.8g(0.233mol)二正丁基亚砜(DBSO),而不是实施例1的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.81μS/cm。
实施例9
重复实施例8同样工序,只是加入75.8g(0.467mol)二正丁基亚砜(DBSO),而不是实施例8的37.8g(0.233mol)。提取液的导电率为0.79μS/cm。
实施例10
重复实施例1同样工序,只是加入50.9g(0.233mol)三丁基氧化膦(TBPO),替代实施例1的46.0g(0.233mcl)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.70μS/cm。
实施例11
重复实施例1同样工序,只是用1000ml 1-十二烷替代1000ml正己烷,并加入59.0g(0.233mol)1-正十二基-2-吡咯烷硐(NDP),替代实施例1的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.87μS/cm。
实施例12
重复实施例1同样工序,只是用1000ml 1-十二碳烯替代1000ml正己烷,90.1g(0.233mol)三正辛基氧化膦(TOPO),替代实施例1的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为0.81μS/cm。
实施例13
重复实施例1同样工序,只是用1000ml萘烷替代1000ml正己烷,1-正辛基-2-吡咯烷硐(NOP)的加入量为92.1g(0.467mol),而不是实施例1的46.0g(0.33mol)。提取液的导电率为0.71μS/cm。
实施例14
重复实施例1同样工序,只是用1000ml Teclean N-20[NipponOil Co.,Ltd.的产物;一种环烷溶剂]替代1000ml正己烷,1-正辛基-2-吡咯烷硐(NOP)的加入量为92.1g(0.467mol),而不是实施例1的46.0g(0.233mol)。提取液的导电率为0.75μS/cm。
实施例15
重复实施例1同样工序,只是用1000ml1-十二碳烯替代1000ml正己烷,且加入92.1g(0.467mol)1-正辛基-2-吡咯烷硐(NOP),替代实施例1的46.0g(0.233mol)。提取液的导电率为0.83μS/cm。
比较例1
将含有95wt%CFC-113和5wt%乙醇(75ml)的清洗组合物置于不锈钢容器中,然后浸入恒温水浴(25℃)中。当清洗组合物的温度达到25℃时,将与实施例1使用的同样清洗制品浸入清洗组合物中。在用搅拌器搅拌清洗组合物的条件下,清洗要清洗的制品2分钟。之后,从容器中取出要清洗的制品,浸入CFC—113中清洗30秒,然后用干燥机干燥。
由此清洗和干燥的小块印刷电路板浸入75ml 75%(体积)异丙醇水溶液中,并在超声波辐照下提取助熔剂残渣5分钟。测定提取液的导电率,经实测为0.86μS/cm。
比较例2
将75ml 1,1,1-三氯乙烷置于不锈钢容器中,然后浸入恒温水浴(25℃)中。当清洗组合物的温度达到25℃时,将与实施例1使用的同样清洗制品浸入清洗组合物中。在用搅拌器搅拌清洗组合物的条件下,清洗要清洗的制品2分钟。之后,从容器中取出要清洗的制品,浸入1,1,1-三氯乙烷中清洗30秒,然后用干燥机干燥。
由此清洗和干燥的小块印刷电路板浸入75ml75%(体积)异丙醇水溶液中,并在超声波辐照下提取助熔剂残渣5分钟。测定提取液的导电率,经实测为0.88μS/cm。
比较例3
将75ml正己烷置于不锈钢容器中,然后浸入恒温水浴(25℃)中,当清洗组合物的温度达到25℃时,将与实施例1使用的同样清洗制品浸入清洗组合物中。在用搅拌器搅拌清洗组合物的条件下,清洗要清洗的制品2分钟。之后,从容器中取出要清洗的制品,浸入正己烷中清洗30秒,然后用干燥机干燥。
由此清洗和干燥的小块印刷电路板浸入75ml 75%(体积)异丙醇水溶液中,并在超声波辐照下提取助熔剂残渣5分钟。测定提取液的导电率,经实测为1.81μS/cm。
比较例4
将与实施例1使用的同样清洗制品直接浸入75ml 75%(体积)异丙醇水溶液中,并在超声波辐照下,用溶液提取助熔剂残渣5分钟。测定提取液的导电率,经实测为2.37μS/cm。
实施例1—15和比较例1—4的结果归纳在表1中。
表1
注:NOP:1-正辛基-2-吡咯烷酮
烃溶剂 | 配位化合物 | 导电率(μS/cm) | 清洗效果 | ||||
类型 | 用量(ml) | 类型 | 用量 | ||||
(mol) | (g) | ||||||
实施例1实施例2实施例3实施例4实施例5实施例6实施例7实施例8实施例9实施例10实施例11实施例12实施例13实施例14实施例15 | 正己烷正己烷正己烷正己烷正己烷正己烷正己烷正己烷正己烷正己烷正十二烷1-正十二碳烯萘烷TecleanN-201-正十二碳烯 | 1,0001,0001,0001,0001,0001,0001,0001,0001,0001,0001,0001,0001,0001,0001,000 | NOPNOPNDPNDPtopOtopOtopODBSODBSOTBPONDPtopONOPNOPNOP | 0.2330.4670.2330.4670.0930.2330.4670.2330.4670.2330.2330.2330.4670.4670.467 | 46.092.159.0118.336.090.1180.637.875.850.959.090.192.192.192.1 | 0.850.620.810.650.790.650.590.810.790.700.870.810.710.750.83 | △○○○○○○○○○△○○○○ |
比较例1比较例2比较例3比较例4 | CFC-113(95%重量)+乙醇(5%重量)1,1,1-三氯乙烷正己烷无清洗剂 | 0.860.881.812.37 | --×× |
NDP:1-正十二基-2-吡咯烷酮
TOPO:三正辛基氧化膦DBSO:二正丁基亚砜
TBPO:三正丁基氧化膦
Teclean N—20:Nippon Oil Co.,Ltd.的产物,一种环烷溶剂
提取液为导电率可视为清洗后印刷电路板上残存的助熔剂残渣量的指数。较小的导电率表明清洗助熔剂残渣程度更好。提取液导电率的测定结果归纳在表1中。在表1中,按照以下分类指出清洗效果,其中清洗效果与常规清洗剂例如CFC—113或1,2,2-三氯乙烷进行比较:
○:更好
△:约相同
×:差些
在比较例1中,其中清洗的制品用主组部分是常用的有机卤化溶剂的氯氟烃溶剂(CFC—113)清洗剂处理;在比较例2中,其中清洗的制品用主组部分是常用的有机卤化溶剂的1,1,1-三氯乙烷清洗剂处理,提取液的导电率分别为0.86和0.88μS/cm。在比较例3中,清洗的制品仅用烃溶剂类的正己烷处理,提取液的导电率为1.81μS/cm。结果表明,在本例中清洗效果要差。相比之下,在实施例1—10中,其中使用了本发明的清洗组合物(除了正己烷之外,还包括其用量足以使浓度变成为0.093—0.0467mol/升的配位化合物),显著提高了清洗效果,可获得等于或优于常用清洗剂的清洗效果。当使用不为正己烷的烃溶剂,如正十二烷(实施例11)、1-十二碳烯(实施例12和15)、萘烷(实施例13)或环烷溶剂(实施例14)时,通过添加配位化合物,可获得等于优于常用清洗剂的清洗效果。
比较例5
重复实施例1的同样工序,只是用23.4g(0.233mol)环己醇代替46.0g(0.233mol)实施例1中的1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为1.41μS/cm。
比较例6
重复实施例1的同样工序,只是环己醇用量为73.3g(0.732mol),而不是比较例5的23.4g(0.233mol)。环己醇在混合溶液中的含量为10%(重量)。提取液的导电率为1.19μS/cm。
比较例7
重复实施例1的同样工序,只是加入31.3g(0.233mol)二甘醇单乙醚替代实施例1中的46.0g(0.233mol)1-正辛基-2-吡咯烷硐(NOP)。提取液的导电率为1.27μS/cm。
比较例8
重复实施例11的同样工序,只是加入23.49g(0.233mol)环己醇代替实施例11中的59.0g1-正十二基-2-吡咯烷硐(NDP)。提取液的导电率为1.50μS/cm。
比较例9
重复实施例11的同样工序,只是加入31.3g(0.233mol)二甘醇单乙醚替代实施例11中的59.0g1-正十二基-2-吡咯烷硐(NDP)。提取液的导电率为1.42μS/cm。
表2中归纳了比较例5—9的结果。
表2
烃溶剂 | 添加的化合物 | 导电率(μS/cm) | ||||
类型 | 用量(ml) | 类型 | 用量 | |||
(mol) | (g) | |||||
对比例5对比例6对比例7对比例8对比例9 | 正己烷正己烷正己烷正十二烷正十二烷 | 1,0001,0001,0001,0001,000 | 环己醇环己醇二甘醇卑乙醚环己醇二甘醇单乙醚 | 0.2330.7320.2330.2330.233 | 23.473.331.323.431.3 | 1.411.191.271.501.42 |
可以看出,在比较例5和7(其中所用的清洗剂是通过往1000ml正己烷中加入0.233mol环己醇或二甘醇单乙醚替代配位化合物而制取的)中,提出液的导电率较高,与实施例1,3,6,8和10(其中使用通过加入等摩尔量配位化合物制得的清洗组合物)相比,清除助熔剂残渣不充分。此外,在比较例6(其中加入了更大量的环己醇且环己醇在清洗剂中的含量提高到10wt%)中,清洗效果改进不显著,且清洗效果要比常用的有机卤化了的溶剂的差。在比较例8和9(其中清洗剂中的烃溶剂由正己烷改成正十二烷)中,提取液的导电率反而比比较例5和7的高。这些结果表明,即使当使用正十二烷作为溶剂,充分的清洗效果也不能通过结合环己醇或二甘醇单乙醚而获得。
Claims (14)
- (1)一种包括烃溶剂和可与金属离子配位的有机化合物的清洗组合物。
- (2)一种权利要求(1)中的清洗组合物,其中烃溶剂是C5-C20脂肪烃。
- (3)一种权利要求(1)或(2)的清洗组合物,其中可与金属离子配位的有机化合物是一种具有氧原子作为配位原子的配位化合物。
- (4)一种权利要求(3)的清洗组合物,其中具有氧原子作为配位原子的配位化合物是一种或多种选自1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜的化合物。
- (5)一种权利要求(4)的清洗组合物,其中1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的烷基是C3-C18直链烷基。
- (6)一种权利要求(1)的清洗组合物,其中用清洗组合物清除粘到印刷电路板上的助溶剂残渣。
- (7)一种权利要求(1),(2),(3),(4)或(5)的清洗组合物,其中清洗组合物含有可与金属离子配位的有机化合物,其含量为每升烃溶剂10—300g。
- (8)一种清洗方法,包括使要清洗的制品与含烃溶剂和可与金属离子配位的有机化合物的组合相接触,然后使清洗制品与一种溶剂接触。
- (9)一种权利要求(8)的清洗方法,其中烃溶剂是一种C5-C20脂肪烃。
- (10)一种权利要求(8)或(9)的清洗方法,其中可与金属离子配位的有机化合物是具有氧原子作为配位原子的配位化合物。
- (11)一种权利要求(10)的清洗组合物,其中具有氧原子作为配位原子的配位化合物是选自1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的一种或多种化合物。
- (12)一种权利要求(10)的清洗组合物,其中1-烷基-2-吡咯烷酮、三烷基氧化膦和二烷基亚砜中的烷基是C3-C18直链烷基。
- (13)一种权利要求(8)的清洗组合物,其中清洗的制品是粘有助溶剂残渣的印刷电路板。
- (14)一种权利要求(8),(9),(10),(11)或(12)的清洗组合物,其中清洗组合物含有可与金属离子配位的有机化合物,其含量为每升烃溶剂10—300g。
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JP7059803A JPH08231989A (ja) | 1995-02-23 | 1995-02-23 | 洗浄剤組成物及び洗浄方法 |
JP59803/95 | 1995-02-23 |
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US (1) | US5767048A (zh) |
EP (1) | EP0728838A3 (zh) |
JP (1) | JPH08231989A (zh) |
KR (1) | KR960031584A (zh) |
CN (1) | CN1129734A (zh) |
SG (1) | SG43669A1 (zh) |
TW (1) | TW343996B (zh) |
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JP3390245B2 (ja) * | 1993-06-01 | 2003-03-24 | 富士通株式会社 | 洗浄液及び洗浄方法 |
KR20010002968A (ko) * | 1999-06-18 | 2001-01-15 | 김연천 | 터핀계 오일 및 계면활성제를 이용한 수용성 세정제 |
KR100766817B1 (ko) * | 2001-05-23 | 2007-10-16 | 애경정밀화학 주식회사 | 터핀 오일을 포함하는 o/w 타입 마이크로에멀젼 세정제조성물 및 그 제조 방법 |
KR20060006503A (ko) * | 2004-07-16 | 2006-01-19 | 박창진 | 모터용 권선 세척 및 코팅제 조성물 |
KR101192057B1 (ko) * | 2005-12-06 | 2012-10-17 | 에스케이종합화학 주식회사 | 노말헥산이 제거된 친환경 탄화수소계 용제 조성물 |
US20090255098A1 (en) * | 2008-04-11 | 2009-10-15 | John William Andberg | Clamp with a non-linear biasing member |
US8309502B2 (en) * | 2009-03-27 | 2012-11-13 | Eastman Chemical Company | Compositions and methods for removing organic substances |
US8614053B2 (en) | 2009-03-27 | 2013-12-24 | Eastman Chemical Company | Processess and compositions for removing substances from substrates |
US8444768B2 (en) | 2009-03-27 | 2013-05-21 | Eastman Chemical Company | Compositions and methods for removing organic substances |
EP2572814B1 (de) * | 2011-09-20 | 2016-03-30 | Heraeus Deutschland GmbH & Co. KG | Paste und Verfahren zum Verbinden von elektronischem Bauelement mit Substrat |
US9029268B2 (en) | 2012-11-21 | 2015-05-12 | Dynaloy, Llc | Process for etching metals |
KR102672421B1 (ko) | 2021-09-07 | 2024-06-05 | 이호열 | Pcb 준수계 세정제 조성물 |
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US4276186A (en) * | 1979-06-26 | 1981-06-30 | International Business Machines Corporation | Cleaning composition and use thereof |
US4617251A (en) * | 1985-04-11 | 1986-10-14 | Olin Hunt Specialty Products, Inc. | Stripping composition and method of using the same |
JPS61276833A (ja) * | 1985-06-03 | 1986-12-06 | Nissan Motor Co Ltd | 合成樹脂成形品の塗装方法 |
US5093031A (en) * | 1986-06-27 | 1992-03-03 | Isp Investments Inc. | Surface active lactams |
US4952559A (en) * | 1986-10-24 | 1990-08-28 | Gaf Chemicals Corporation | Fragrance additive |
US4729797A (en) * | 1986-12-31 | 1988-03-08 | International Business Machines Corporation | Process for removal of cured epoxy |
US4983224A (en) * | 1988-10-28 | 1991-01-08 | Rd Chemical Company | Cleaning compositions and methods for removing soldering flux |
US5049201A (en) * | 1989-06-22 | 1991-09-17 | International Business Machines Corporation | Method of inhibiting corrosion in an electronic package |
US5011620A (en) * | 1989-08-07 | 1991-04-30 | E. I. Du Pont De Nemours And Company | Cleaning composition of dibasic ester and hydrocarbon solvent |
JPH03146597A (ja) * | 1989-11-01 | 1991-06-21 | Henkel Hakusui Kk | プリント基板の洗浄用組成物 |
NZ241574A (en) * | 1991-02-22 | 1993-08-26 | Ishihara Sangyo Kaisha | Substituted phenyl derivatives of hydrazone and pesticidal compositions |
US5431847A (en) * | 1991-07-17 | 1995-07-11 | Charles B. Barris | Aqueous cleaning concentrates |
US5207838A (en) * | 1991-08-29 | 1993-05-04 | Martin Marietta Energy Systems, Inc. | Nonhazardous solvent composition and method for cleaning metal surfaces |
DE69333877T2 (de) * | 1992-07-09 | 2006-06-14 | Ekc Technology Inc | Reinigungsmittelzusammensetzung, das einem Redox Aminverbindung enthält |
JPH06108097A (ja) * | 1992-08-07 | 1994-04-19 | Dr Ok Wack Chem Gmbh | 洗浄剤 |
JPH06340895A (ja) * | 1993-04-08 | 1994-12-13 | Nitto Chem Ind Co Ltd | フラックス洗浄剤 |
US5561215A (en) * | 1994-08-31 | 1996-10-01 | Arco Chemical Technology, L.P. | Pyrrolidones for cleanup of sulfur-containing polymers |
US5688753A (en) * | 1995-04-06 | 1997-11-18 | Church & Dwight Co.,Inc. | Flux removing composition |
-
1995
- 1995-02-23 JP JP7059803A patent/JPH08231989A/ja active Pending
- 1995-10-18 TW TW084110950A patent/TW343996B/zh active
- 1995-10-18 EP EP95116401A patent/EP0728838A3/en not_active Withdrawn
- 1995-10-18 SG SG1995001592A patent/SG43669A1/en unknown
- 1995-10-19 CN CN95115999A patent/CN1129734A/zh active Pending
- 1995-10-20 KR KR1019950036319A patent/KR960031584A/ko not_active Application Discontinuation
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EP0728838A2 (en) | 1996-08-28 |
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TW343996B (en) | 1998-11-01 |
KR960031584A (ko) | 1996-09-17 |
SG43669A1 (en) | 1997-11-14 |
JPH08231989A (ja) | 1996-09-10 |
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