CN112970099A - 前管道设备前端模块、侧存储舱及其操作方法 - Google Patents

前管道设备前端模块、侧存储舱及其操作方法 Download PDF

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Publication number
CN112970099A
CN112970099A CN201980070805.4A CN201980070805A CN112970099A CN 112970099 A CN112970099 A CN 112970099A CN 201980070805 A CN201980070805 A CN 201980070805A CN 112970099 A CN112970099 A CN 112970099A
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CN
China
Prior art keywords
end module
side storage
chamber
equipment front
return
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980070805.4A
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English (en)
Chinese (zh)
Inventor
保罗·B·路透
罗宾·C·阿姆斯特朗
约翰·C·门克
尼尔·玛利
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Applied Materials Inc
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Applied Materials Inc
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Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN112970099A publication Critical patent/CN112970099A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0464—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the transfer chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1924—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control
    • H10P72/1926—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrier
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3402—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/34—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H10P72/3406—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door or cover

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Ventilation (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Solid-Sorbent Or Filter-Aiding Compositions (AREA)
  • Absorbent Articles And Supports Therefor (AREA)
CN201980070805.4A 2018-10-26 2019-10-23 前管道设备前端模块、侧存储舱及其操作方法 Pending CN112970099A (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862751514P 2018-10-26 2018-10-26
US62/751,514 2018-10-26
US16/660,057 2019-10-22
US16/660,057 US11373891B2 (en) 2018-10-26 2019-10-22 Front-ducted equipment front end modules, side storage pods, and methods of operating the same
PCT/US2019/057650 WO2020086709A1 (en) 2018-10-26 2019-10-23 Front-ducted equipment front end modules, side storage pods, and methods of operating the same

Publications (1)

Publication Number Publication Date
CN112970099A true CN112970099A (zh) 2021-06-15

Family

ID=70325553

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201980070805.4A Pending CN112970099A (zh) 2018-10-26 2019-10-23 前管道设备前端模块、侧存储舱及其操作方法

Country Status (6)

Country Link
US (2) US11373891B2 (enExample)
JP (1) JP7365408B2 (enExample)
KR (1) KR102577683B1 (enExample)
CN (1) CN112970099A (enExample)
TW (2) TW202314930A (enExample)
WO (1) WO2020086709A1 (enExample)

Cited By (1)

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US11373891B2 (en) 2018-10-26 2022-06-28 Applied Materials, Inc. Front-ducted equipment front end modules, side storage pods, and methods of operating the same
US11244844B2 (en) * 2018-10-26 2022-02-08 Applied Materials, Inc. High flow velocity, gas-purged, side storage pod apparatus, assemblies, and methods
US11610794B2 (en) * 2018-10-26 2023-03-21 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating the same
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US12076854B2 (en) * 2021-03-18 2024-09-03 Applied Materials, Inc. Increased number of load ports on factory interface with robot that moves on track
US12370573B2 (en) * 2021-10-06 2025-07-29 Applied Materials, Inc. Equipment front end modules with induced gas mixing, and methods of use thereof
KR102780011B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102780012B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102729958B1 (ko) * 2022-06-15 2024-11-13 세메스 주식회사 장비 전단부 모듈 및 이의 동작 방법, 이를 포함하는 기판 처리 장치
US20260096386A1 (en) * 2024-09-30 2026-04-02 Applied Materials, Inc. Load lock chamber improvement

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CN112397426A (zh) * 2019-08-14 2021-02-23 罗泽系统株式会社 基板搬送装置
CN112397426B (zh) * 2019-08-14 2024-08-30 罗泽系统株式会社 基板搬送装置
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Also Published As

Publication number Publication date
US11373891B2 (en) 2022-06-28
KR20210068576A (ko) 2021-06-09
WO2020086709A8 (en) 2021-06-03
WO2020086709A1 (en) 2020-04-30
US20200135523A1 (en) 2020-04-30
KR102577683B1 (ko) 2023-09-11
TW202314930A (zh) 2023-04-01
TW202107600A (zh) 2021-02-16
US20220293444A1 (en) 2022-09-15
JP7365408B2 (ja) 2023-10-19
JP2022505473A (ja) 2022-01-14
TWI785279B (zh) 2022-12-01

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