CN1128893C - 腐蚀设备 - Google Patents

腐蚀设备 Download PDF

Info

Publication number
CN1128893C
CN1128893C CN95121846A CN95121846A CN1128893C CN 1128893 C CN1128893 C CN 1128893C CN 95121846 A CN95121846 A CN 95121846A CN 95121846 A CN95121846 A CN 95121846A CN 1128893 C CN1128893 C CN 1128893C
Authority
CN
China
Prior art keywords
substrate
etching
chamber
active layer
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN95121846A
Other languages
English (en)
Chinese (zh)
Other versions
CN1136599A (zh
Inventor
山崎舜平
须泽英臣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of CN1136599A publication Critical patent/CN1136599A/zh
Application granted granted Critical
Publication of CN1128893C publication Critical patent/CN1128893C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H10P72/0421—
    • H10P50/266—
    • H10P72/33—
    • H10P74/238—

Landscapes

  • Thin Film Transistor (AREA)
  • Drying Of Semiconductors (AREA)
CN95121846A 1994-11-26 1995-11-25 腐蚀设备 Expired - Fee Related CN1128893C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP315473/1994 1994-11-26
JP315473/94 1994-11-26
JP6315473A JPH08153711A (ja) 1994-11-26 1994-11-26 エッチング装置

Related Child Applications (2)

Application Number Title Priority Date Filing Date
CNB991107772A Division CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件
CN99117536A Division CN1248787A (zh) 1994-11-26 1999-08-05 制造半导体器件的方法

Publications (2)

Publication Number Publication Date
CN1136599A CN1136599A (zh) 1996-11-27
CN1128893C true CN1128893C (zh) 2003-11-26

Family

ID=18065785

Family Applications (4)

Application Number Title Priority Date Filing Date
CN95121846A Expired - Fee Related CN1128893C (zh) 1994-11-26 1995-11-25 腐蚀设备
CNB2006100054399A Expired - Fee Related CN100481466C (zh) 1994-11-26 1995-11-25 半导体器件
CNB991107772A Expired - Lifetime CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件
CN99117536A Pending CN1248787A (zh) 1994-11-26 1999-08-05 制造半导体器件的方法

Family Applications After (3)

Application Number Title Priority Date Filing Date
CNB2006100054399A Expired - Fee Related CN100481466C (zh) 1994-11-26 1995-11-25 半导体器件
CNB991107772A Expired - Lifetime CN1251331C (zh) 1994-11-26 1999-08-05 半导体器件
CN99117536A Pending CN1248787A (zh) 1994-11-26 1999-08-05 制造半导体器件的方法

Country Status (4)

Country Link
JP (1) JPH08153711A (enExample)
KR (1) KR100313386B1 (enExample)
CN (4) CN1128893C (enExample)
TW (1) TW279249B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3336975B2 (ja) * 1998-03-27 2002-10-21 日本電気株式会社 基板処理方法
DE10229037A1 (de) 2002-06-28 2004-01-29 Robert Bosch Gmbh Vorrichtung und Verfahren zur Erzeugung von Chlortrifluorid und Anlage zur Ätzung von Halbleitersubstraten mit dieser Vorrichtung
JP4134671B2 (ja) * 2002-10-17 2008-08-20 松下電器産業株式会社 プラズマ処理方法
KR101225312B1 (ko) * 2005-12-16 2013-01-22 엘지디스플레이 주식회사 프로세스 장치
US8207026B2 (en) * 2009-01-28 2012-06-26 Semiconductor Energy Laboratory Co., Ltd. Manufacturing method of thin film transistor and manufacturing method of display device
CN102074157B (zh) * 2011-01-07 2012-01-11 华南理工大学 一种敷铜板腐蚀设备
JP5924901B2 (ja) * 2011-10-17 2016-05-25 Hoya株式会社 転写用マスクの製造方法
KR102030797B1 (ko) 2012-03-30 2019-11-11 삼성디스플레이 주식회사 박막 트랜지스터 표시판 제조 방법
US10287499B2 (en) 2014-10-10 2019-05-14 Kanto Denka Kogyo Co., Ltd. Etching gas composition for silicon compound, and etching method
JP7072440B2 (ja) 2018-05-16 2022-05-20 東京エレクトロン株式会社 シリコン含有膜のエッチング方法、コンピュータ記憶媒体、及びシリコン含有膜のエッチング装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498953A (en) * 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
US5178721A (en) * 1990-08-09 1993-01-12 Fujitsu Limited Process and apparatus for dry cleaning by photo-excited radicals
US5320704A (en) * 1990-11-28 1994-06-14 Tokyo Electron Limited Plasma etching apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0410621A (ja) * 1990-04-27 1992-01-14 Kawasaki Steel Corp 窒化シリコン膜のエッチング処理方法、及びその装置
JPH04206822A (ja) * 1990-11-30 1992-07-28 Mitsubishi Electric Corp 半導体製造装置
JP3176118B2 (ja) * 1992-03-27 2001-06-11 株式会社東芝 多室型基板処理装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4498953A (en) * 1983-07-27 1985-02-12 At&T Bell Laboratories Etching techniques
US5178721A (en) * 1990-08-09 1993-01-12 Fujitsu Limited Process and apparatus for dry cleaning by photo-excited radicals
US5320704A (en) * 1990-11-28 1994-06-14 Tokyo Electron Limited Plasma etching apparatus

Also Published As

Publication number Publication date
KR100313386B1 (ko) 2003-06-12
CN1245976A (zh) 2000-03-01
KR960019566A (ko) 1996-06-17
CN1248787A (zh) 2000-03-29
CN1825600A (zh) 2006-08-30
TW279249B (enExample) 1996-06-21
CN100481466C (zh) 2009-04-22
CN1136599A (zh) 1996-11-27
JPH08153711A (ja) 1996-06-11
CN1251331C (zh) 2006-04-12

Similar Documents

Publication Publication Date Title
CN1078014C (zh) 半导体器件及其制造方法
CN1045688C (zh) 半导体薄膜及使用这种薄膜的半导体器件的制造方法
CN1173388C (zh) 具有薄膜晶体管的半导体器件
US7183229B2 (en) Semiconductor thin film forming method, production methods for semiconductor device and electrooptical device, devices used for these methods, and semiconductor device and electrooptical device
CN1057401C (zh) 半导体器件及其制造方法
CN1293607C (zh) 半导体膜、半导体器件和它们的生产方法
CN1249818C (zh) 半导体器件及其制造方法
CN1288715C (zh) 硅薄膜结晶方法、用该方法的薄膜晶体管及其平板显示器
CN1361551A (zh) 一种半导体器件的制造方法
CN1102908A (zh) 半导体器件及其制造方法
CN1128900A (zh) 半导体器件的制造方法
CN1097298C (zh) 制造结晶硅半导体和薄膜晶体管的方法
CN1156918C (zh) 半导体器件
WO2013052298A1 (en) Methods for depositing a silicon containing layer with argon gas dilution
CN1389899A (zh) 半导体膜、半导体器件和用于制造半导体膜、半导体器件的方法
CN1521858A (zh) 薄膜晶体管及其制造方法
CN1128893C (zh) 腐蚀设备
CN1719582A (zh) 制备多晶硅薄膜的方法以及用其制备半导体器件的方法
US7374976B2 (en) Method for fabricating thin film transistor
CN1725440A (zh) 制造半导体器件的方法和由此方法制造的半导体器件
JP4176362B2 (ja) 半導体装置の作製方法
CN1134600A (zh) 制造薄膜晶体管的方法及设备
JP4212844B2 (ja) 半導体装置の作製方法
JP2003173969A (ja) 半導体膜、半導体装置及びこれらの作製方法
CN1078068A (zh) 形成半导体器件的方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20031126

Termination date: 20121125