CN112867228A - 陶瓷布线基板以及陶瓷布线基板的制造方法 - Google Patents

陶瓷布线基板以及陶瓷布线基板的制造方法 Download PDF

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Publication number
CN112867228A
CN112867228A CN202010954233.0A CN202010954233A CN112867228A CN 112867228 A CN112867228 A CN 112867228A CN 202010954233 A CN202010954233 A CN 202010954233A CN 112867228 A CN112867228 A CN 112867228A
Authority
CN
China
Prior art keywords
conductor
layer
ceramic wiring
insulating layer
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010954233.0A
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English (en)
Chinese (zh)
Inventor
绪方孝友
伊藤阳彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
NGK Electronics Devices Inc
Original Assignee
NGK Insulators Ltd
NGK Electronics Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd, NGK Electronics Devices Inc filed Critical NGK Insulators Ltd
Publication of CN112867228A publication Critical patent/CN112867228A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09563—Metal filled via

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
CN202010954233.0A 2019-11-26 2020-09-11 陶瓷布线基板以及陶瓷布线基板的制造方法 Pending CN112867228A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019213315A JP7449076B2 (ja) 2019-11-26 2019-11-26 セラミック配線基板の製造方法
JP2019-213315 2019-11-26

Publications (1)

Publication Number Publication Date
CN112867228A true CN112867228A (zh) 2021-05-28

Family

ID=75996209

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010954233.0A Pending CN112867228A (zh) 2019-11-26 2020-09-11 陶瓷布线基板以及陶瓷布线基板的制造方法

Country Status (3)

Country Link
JP (1) JP7449076B2 (ja)
CN (1) CN112867228A (ja)
TW (1) TWI749872B (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0391291A (ja) * 1989-09-04 1991-04-16 Toshiba Corp 配線基板
TW201112906A (en) * 2009-06-09 2011-04-01 Ibiden Co Ltd Double-sided circuit board and manufacturing method thereof
JP2016115795A (ja) * 2014-12-15 2016-06-23 京セラ株式会社 セラミック配線基板および電子部品実装パッケージ
JP2017175095A (ja) * 2016-03-26 2017-09-28 日本カーバイド工業株式会社 積層回路基板
JP2018018886A (ja) * 2016-07-26 2018-02-01 日本特殊陶業株式会社 マスク及び配線基板の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08125297A (ja) * 1994-10-21 1996-05-17 Nippondenso Co Ltd スルーホール両面基板
JPH11289149A (ja) * 1998-04-06 1999-10-19 Hitachi Ltd 薄型電子回路部品の製造装置及び薄型電子回路部品
US6211468B1 (en) 1998-08-12 2001-04-03 3M Innovative Properties Company Flexible circuit with conductive vias having off-set axes
US6187418B1 (en) 1999-07-19 2001-02-13 International Business Machines Corporation Multilayer ceramic substrate with anchored pad
JP2002353160A (ja) 2001-05-28 2002-12-06 Murata Mfg Co Ltd 回路基板及びその製造方法
JP3998984B2 (ja) 2002-01-18 2007-10-31 富士通株式会社 回路基板及びその製造方法
JP4764718B2 (ja) * 2005-12-28 2011-09-07 新光電気工業株式会社 スルーホールの充填方法
JP2012234897A (ja) 2011-04-28 2012-11-29 Panasonic Corp 基板、およびその基板を用いた電子回路モジュール
JP2012238837A (ja) 2011-04-28 2012-12-06 Maruwa Co Ltd スルーホールを有するセラミックグリーンシート及びその製造方法並びにそれより得られたセラミック基板
WO2016136222A1 (ja) * 2015-02-23 2016-09-01 凸版印刷株式会社 印刷配線板及びその製造方法
JP6408423B2 (ja) 2015-04-24 2018-10-17 京セラ株式会社 パッケージおよび電子装置
JP7007882B2 (ja) * 2017-12-08 2022-01-25 新光電気工業株式会社 配線基板及びその製造方法
JP2019186441A (ja) 2018-04-13 2019-10-24 日本特殊陶業株式会社 配線基板およびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0391291A (ja) * 1989-09-04 1991-04-16 Toshiba Corp 配線基板
TW201112906A (en) * 2009-06-09 2011-04-01 Ibiden Co Ltd Double-sided circuit board and manufacturing method thereof
JP2016115795A (ja) * 2014-12-15 2016-06-23 京セラ株式会社 セラミック配線基板および電子部品実装パッケージ
JP2017175095A (ja) * 2016-03-26 2017-09-28 日本カーバイド工業株式会社 積層回路基板
JP2018018886A (ja) * 2016-07-26 2018-02-01 日本特殊陶業株式会社 マスク及び配線基板の製造方法

Also Published As

Publication number Publication date
JP2021086880A (ja) 2021-06-03
JP7449076B2 (ja) 2024-03-13
TW202121945A (zh) 2021-06-01
TWI749872B (zh) 2021-12-11

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