CN112867228A - 陶瓷布线基板以及陶瓷布线基板的制造方法 - Google Patents
陶瓷布线基板以及陶瓷布线基板的制造方法 Download PDFInfo
- Publication number
- CN112867228A CN112867228A CN202010954233.0A CN202010954233A CN112867228A CN 112867228 A CN112867228 A CN 112867228A CN 202010954233 A CN202010954233 A CN 202010954233A CN 112867228 A CN112867228 A CN 112867228A
- Authority
- CN
- China
- Prior art keywords
- conductor
- layer
- ceramic wiring
- insulating layer
- insulating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 94
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 30
- 238000000034 method Methods 0.000 title claims description 63
- 239000004020 conductor Substances 0.000 claims abstract description 174
- 239000000758 substrate Substances 0.000 claims abstract description 70
- 230000002093 peripheral effect Effects 0.000 claims abstract description 47
- 230000007423 decrease Effects 0.000 claims abstract description 17
- 230000000149 penetrating effect Effects 0.000 claims abstract description 15
- 238000007639 printing Methods 0.000 claims description 32
- 238000004080 punching Methods 0.000 claims description 10
- 238000010304 firing Methods 0.000 claims description 8
- 239000000203 mixture Substances 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 218
- 239000000463 material Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 8
- 239000011521 glass Substances 0.000 description 6
- 238000005266 casting Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09563—Metal filled via
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019213315A JP7449076B2 (ja) | 2019-11-26 | 2019-11-26 | セラミック配線基板の製造方法 |
JP2019-213315 | 2019-11-26 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN112867228A true CN112867228A (zh) | 2021-05-28 |
Family
ID=75996209
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010954233.0A Pending CN112867228A (zh) | 2019-11-26 | 2020-09-11 | 陶瓷布线基板以及陶瓷布线基板的制造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7449076B2 (ja) |
CN (1) | CN112867228A (ja) |
TW (1) | TWI749872B (ja) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0391291A (ja) * | 1989-09-04 | 1991-04-16 | Toshiba Corp | 配線基板 |
TW201112906A (en) * | 2009-06-09 | 2011-04-01 | Ibiden Co Ltd | Double-sided circuit board and manufacturing method thereof |
JP2016115795A (ja) * | 2014-12-15 | 2016-06-23 | 京セラ株式会社 | セラミック配線基板および電子部品実装パッケージ |
JP2017175095A (ja) * | 2016-03-26 | 2017-09-28 | 日本カーバイド工業株式会社 | 積層回路基板 |
JP2018018886A (ja) * | 2016-07-26 | 2018-02-01 | 日本特殊陶業株式会社 | マスク及び配線基板の製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08125297A (ja) * | 1994-10-21 | 1996-05-17 | Nippondenso Co Ltd | スルーホール両面基板 |
JPH11289149A (ja) * | 1998-04-06 | 1999-10-19 | Hitachi Ltd | 薄型電子回路部品の製造装置及び薄型電子回路部品 |
US6211468B1 (en) | 1998-08-12 | 2001-04-03 | 3M Innovative Properties Company | Flexible circuit with conductive vias having off-set axes |
US6187418B1 (en) | 1999-07-19 | 2001-02-13 | International Business Machines Corporation | Multilayer ceramic substrate with anchored pad |
JP2002353160A (ja) | 2001-05-28 | 2002-12-06 | Murata Mfg Co Ltd | 回路基板及びその製造方法 |
JP3998984B2 (ja) | 2002-01-18 | 2007-10-31 | 富士通株式会社 | 回路基板及びその製造方法 |
JP4764718B2 (ja) * | 2005-12-28 | 2011-09-07 | 新光電気工業株式会社 | スルーホールの充填方法 |
JP2012234897A (ja) | 2011-04-28 | 2012-11-29 | Panasonic Corp | 基板、およびその基板を用いた電子回路モジュール |
JP2012238837A (ja) | 2011-04-28 | 2012-12-06 | Maruwa Co Ltd | スルーホールを有するセラミックグリーンシート及びその製造方法並びにそれより得られたセラミック基板 |
WO2016136222A1 (ja) * | 2015-02-23 | 2016-09-01 | 凸版印刷株式会社 | 印刷配線板及びその製造方法 |
JP6408423B2 (ja) | 2015-04-24 | 2018-10-17 | 京セラ株式会社 | パッケージおよび電子装置 |
JP7007882B2 (ja) * | 2017-12-08 | 2022-01-25 | 新光電気工業株式会社 | 配線基板及びその製造方法 |
JP2019186441A (ja) | 2018-04-13 | 2019-10-24 | 日本特殊陶業株式会社 | 配線基板およびその製造方法 |
-
2019
- 2019-11-26 JP JP2019213315A patent/JP7449076B2/ja active Active
-
2020
- 2020-09-11 CN CN202010954233.0A patent/CN112867228A/zh active Pending
- 2020-11-16 TW TW109139837A patent/TWI749872B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0391291A (ja) * | 1989-09-04 | 1991-04-16 | Toshiba Corp | 配線基板 |
TW201112906A (en) * | 2009-06-09 | 2011-04-01 | Ibiden Co Ltd | Double-sided circuit board and manufacturing method thereof |
JP2016115795A (ja) * | 2014-12-15 | 2016-06-23 | 京セラ株式会社 | セラミック配線基板および電子部品実装パッケージ |
JP2017175095A (ja) * | 2016-03-26 | 2017-09-28 | 日本カーバイド工業株式会社 | 積層回路基板 |
JP2018018886A (ja) * | 2016-07-26 | 2018-02-01 | 日本特殊陶業株式会社 | マスク及び配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2021086880A (ja) | 2021-06-03 |
JP7449076B2 (ja) | 2024-03-13 |
TW202121945A (zh) | 2021-06-01 |
TWI749872B (zh) | 2021-12-11 |
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