CN112809802A - 切断装置及切断品的制造方法 - Google Patents

切断装置及切断品的制造方法 Download PDF

Info

Publication number
CN112809802A
CN112809802A CN202011276568.8A CN202011276568A CN112809802A CN 112809802 A CN112809802 A CN 112809802A CN 202011276568 A CN202011276568 A CN 202011276568A CN 112809802 A CN112809802 A CN 112809802A
Authority
CN
China
Prior art keywords
blade
cutting
cut
blocking plate
working fluid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202011276568.8A
Other languages
English (en)
Chinese (zh)
Inventor
坂上雄哉
堀聪子
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN112809802A publication Critical patent/CN112809802A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/08—Means for treating work or cutting member to facilitate cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0616—Grinders for cutting-off using a tool turning around the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B24B27/0683—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/14—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter
    • B26D1/143—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis
    • B26D1/15—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a circular cutting member, e.g. disc cutter rotating about a stationary axis with vertical cutting member
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2614—Means for mounting the cutting member
    • B26D7/2621—Means for mounting the cutting member for circular cutters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Dicing (AREA)
CN202011276568.8A 2019-11-18 2020-11-16 切断装置及切断品的制造方法 Pending CN112809802A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-207752 2019-11-18
JP2019207752A JP7203712B2 (ja) 2019-11-18 2019-11-18 切断装置、及び、切断品の製造方法

Publications (1)

Publication Number Publication Date
CN112809802A true CN112809802A (zh) 2021-05-18

Family

ID=75853218

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202011276568.8A Pending CN112809802A (zh) 2019-11-18 2020-11-16 切断装置及切断品的制造方法

Country Status (4)

Country Link
JP (1) JP7203712B2 (ko)
KR (1) KR102436774B1 (ko)
CN (1) CN112809802A (ko)
TW (1) TWI762038B (ko)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101992505B (zh) * 2009-08-21 2015-04-08 株式会社迪思科 切削装置
CN104752187A (zh) * 2013-12-27 2015-07-01 株式会社迪思科 切削装置
US20160311127A1 (en) * 2015-04-24 2016-10-27 Disco Corporation Cutting apparatus and cutting method
CN107045976A (zh) * 2016-02-09 2017-08-15 株式会社迪思科 切削装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0574759U (ja) * 1992-03-23 1993-10-12 光洋機械工業株式会社 心なし研削盤の空気流遮断構造
JP3485816B2 (ja) * 1998-12-09 2004-01-13 太陽誘電株式会社 ダイシング装置
TW440494B (en) * 1999-05-13 2001-06-16 Sumitomo Spec Metals Machining method of rare earth alloy and manufacture of rare earth magnet using it
JP4943688B2 (ja) * 2005-10-21 2012-05-30 株式会社ディスコ 切削装置
DE202006017778U1 (de) * 2006-11-22 2007-02-15 Kotz, Max Vorrichtung zum Auftrennen eines Schmuck- oder Fingerringes
JP6101140B2 (ja) * 2013-04-18 2017-03-22 株式会社ディスコ 切削装置
JP6110753B2 (ja) * 2013-08-12 2017-04-05 京セラクリスタルデバイス株式会社 電子部品の製造方法及びダイシング装置
JP6267977B2 (ja) 2014-01-30 2018-01-24 株式会社ディスコ 切削方法
JP6316652B2 (ja) * 2014-05-14 2018-04-25 株式会社ディスコ 研削装置
JP6844970B2 (ja) * 2016-08-18 2021-03-17 株式会社ディスコ 研磨装置
JP6218052B2 (ja) * 2016-09-16 2017-10-25 株式会社東京精密 ダイシング装置及びダイシング方法
JP6846214B2 (ja) 2017-01-20 2021-03-24 株式会社ディスコ 切削装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101992505B (zh) * 2009-08-21 2015-04-08 株式会社迪思科 切削装置
CN104752187A (zh) * 2013-12-27 2015-07-01 株式会社迪思科 切削装置
US20160311127A1 (en) * 2015-04-24 2016-10-27 Disco Corporation Cutting apparatus and cutting method
CN107045976A (zh) * 2016-02-09 2017-08-15 株式会社迪思科 切削装置

Also Published As

Publication number Publication date
TWI762038B (zh) 2022-04-21
KR102436774B1 (ko) 2022-08-26
TW202120253A (zh) 2021-06-01
KR20210060334A (ko) 2021-05-26
JP2021079474A (ja) 2021-05-27
JP7203712B2 (ja) 2023-01-13

Similar Documents

Publication Publication Date Title
JP2008160124A (ja) ワークピースを鋸断する装置及び方法
JP6338478B2 (ja) 切断方法及び製品の製造方法
JP6039512B2 (ja) 電子部品製造用の切削装置及び切削方法
KR102182562B1 (ko) 블레이드 커버 장치
JP6588215B2 (ja) パッケージ基板の切削方法
JP2007207865A (ja) ダイシング方法及びダイシング装置
TWI641037B (zh) Cutting device and cutting method
KR102365978B1 (ko) 절삭 장치
KR101560305B1 (ko) 기판 절단 시스템 및 기판 지지장치
CN112809802A (zh) 切断装置及切断品的制造方法
JP5843622B2 (ja) 切削装置
JP2007000967A (ja) 切削装置
TW201641242A (zh) 切削裝置
JP2019004040A (ja) 被加工物の切削方法
US20210394301A1 (en) Combined processing head capable of emitting laser and liquid jet to produce abrasive flow and working method thereof
JP5929992B2 (ja) ワイヤ放電加工装置、ワイヤ放電加工方法
JP2006225677A (ja) 連続部分めっき装置
JP2006218551A (ja) 切削装置
JP4880244B2 (ja) 切削装置
CN110534460B (zh) 一种改进型贴片设备
JP7121788B2 (ja) 切断装置、及び、切断品の製造方法
JP4783568B2 (ja) 切削装置及び被加工物の切削方法
WO2022113495A1 (ja) ブレードカバー、切断装置、及び、切断品の製造方法
JP2013157429A (ja) パッケージ基板の分割方法及び切削ブレード
JP2017185604A (ja) 放電マルチブレードソー

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20210518