CN112624744B - 一种具有高底面粘结强度的瓷砖及其制备方法和应用 - Google Patents

一种具有高底面粘结强度的瓷砖及其制备方法和应用 Download PDF

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CN112624744B
CN112624744B CN202011388948.0A CN202011388948A CN112624744B CN 112624744 B CN112624744 B CN 112624744B CN 202011388948 A CN202011388948 A CN 202011388948A CN 112624744 B CN112624744 B CN 112624744B
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赵光岩
徐思
沈磊
谢长红
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Guangxi Oushennuo Ceramic Co ltd
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Abstract

本发明属建筑陶瓷技术领域,公开了一种具有高底面粘结强度的瓷砖及其制备方法和应用,该瓷砖包括高温粉料和普通粉料,高温粉料按重量百分比计包括太平砂35‑55%、北流混合泥5‑25%、陆川石粉1‑15%、藤县石粉4‑24%、藤县钾砂1‑15%、玉林水洗泥1‑15%、北流水洗泥1‑14%和勒流砂1‑14%;普通粉料按重量百分比计包括太平砂1‑5%、北流混合泥10‑20%、陆川石粉4‑12%、藤县石粉12‑24%、藤县钾砂16‑30%、玉林水洗泥3‑7%、北流水洗泥3‑7%和勒流砂16‑30%。本发明通过对原料的合理搭配,大大提高了瓷砖的底面粘结强度,且与水泥砂浆的粘结强度高达8MPa,有效减少甚至杜绝了瓷砖脱落现象的发生,同时,本发明所得瓷砖的吸水率低至0.5%,符合国家标准,满足市场需求,适用于建筑、装修等领域中,应用前影响广泛。

Description

一种具有高底面粘结强度的瓷砖及其制备方法和应用
技术领域
本发明属于建筑陶瓷技术领域,具体涉及一种具有高底面粘结强度的瓷砖及其制备方法和应用。
背景技术
陶瓷砖是一种重要的装饰材料,广泛应用于建筑及装修等行业中,但是随着瓷质陶瓷砖的广泛应用,瓷砖的表面效果不断丰富,瓷砖的规格越来越大,瓷砖以其美观性好、防水性好、硬度高、易清洁等优点,广泛受到人们的欢迎,陶瓷在装修行业的使用量逐年增加,使用范围也越来越广泛。现有技术中,低吸水率的瓷砖具有吸湿膨胀小、不易龟裂和耐磨性好的特点,能够有效避免高吸水率陶瓷容易出现的龟裂和膨胀脱落的问题,因此人们在装修过程中,在选择陶瓷砖时也越来越倾向于选用低吸水率陶瓷砖,但低吸水率陶瓷砖在粘贴过程中容易出现瓷砖与水泥砂浆层结合不牢,容易出现脱落的现象。
因此,如何能既满足低吸水率的要求,又能解决瓷砖脱落现象的发生,已成为陶瓷行业中一个亟待解决的问题。
发明内容
本发明提出一种具有高底面粘结强度的瓷砖及其制备方法和应用,以解决现有技术中存在的一个或多个技术问题,至少提供一种有益的选择或创造条件。
为了克服上述技术问题,本发明采用的技术方案如下:
一种具有高底面粘结强度的瓷砖,包括高温粉料和普通粉料,所述高温粉料按重量百分比计包括:太平砂35-55%、北流混合泥5-25%、陆川石粉1-15%、藤县石粉4-24%、藤县钾砂1-15%、玉林水洗泥1-15%、北流水洗泥1-14%和勒流砂1-14%;所述普通粉料按重量百分比计包括太平砂1-5%、北流混合泥10-20%、陆川石粉4-12%、藤县石粉12-24%、藤县钾砂16-30%、玉林水洗泥3-7%、北流水洗泥3-7%和勒流砂16-30%。
其中泥料主要在粘结和高温时起到为坯体提供支撑的作用。
作为上述方案的进一步改进,所述高温粉料按重量百分比计包括:太平砂40-50%、北流混合泥10-20%、陆川石粉3-12%、藤县石粉10-20%、藤县钾砂1-8%、玉林水洗泥1-8%、北流水洗泥2-7%和勒流砂2-7%。优选地,所述高温粉料按重量百分比计包括:太平砂45%、北流混合泥15%、陆川石粉8%、藤县石粉14%、藤县钾砂5%、玉林水洗泥5%、北流水洗泥4%和勒流砂4%。
作为上述方案的进一步改进,所述普通粉料按重量百分比计包括:太平砂3%、北流混合泥15%、陆川石粉8%、藤县石粉18%、藤县钾砂23%、玉林水洗泥5%、北流水洗泥5%和勒流砂23%。
作为上述方案的进一步改进,按重量百分比份计,所述瓷砖的化学成分包括:SiO258.2-78.2%、Al2O310.2-30.2%、Fe2O30.5-2.5%、TiO20.01-0.4%、CaO 0.01-0.4%、MgO0.01-0.4%、K2O 1.4-3.4%和Na2O 0.1-2.1%,烧失率为5.2-7.2%;优选为SiO263.7%、Al2O320.4%、Fe2O31.4%、TiO20.2%、CaO 0.3%、MgO 0.3%、K2O 3.7%和Na2O 1.8%,烧失率为5.6%。
本发明所述的瓷砖的制备方法,包括如下步骤:
1)准备粉料:按所述普通粉料的原料配方称取原料,经球磨、喷粉后得普通粉料;按所述高温粉料的原料配方称取原料,经球磨、喷粉后得高温粉料;
2)再经布料和压制,得到底部具有高温坯料层的成型坯体,再经烧成,制得本发明所述的瓷砖。
具体地,采用反打成型的二次布料成型工艺,先布普通粉料,再在普通粉料的基础上布高温粉料,然后进行压制成型,最后经烧成,制得本发明所述瓷砖。同时,由于普通粉料与高温粉料中所含泥砂石的比例较为接近,因此二者在成型时排气、干燥排水都会比较接近,不容易出现压制分层和干燥裂的情况。
作为上述方案的进一步改进,所述粉料与所述成型坯体的厚度比为2.16~2.27。坯体成型前粉料的总厚度约为25mm,成型后坯体厚度为11.0~11.6mm;坯体成型前高温粉料的厚度为2-4mm,成型后高温粉料层的坯体厚度为0.9~1.8mm,并且高温粉料层呈片状不连续地分布在砖坯底部,可有效避免高温粉料聚集而造成产品强度大幅度下降。此外,高温粉料层在坯体底部作为多个高吸水率区域,其面积之和占所述瓷砖面积的0.2-2.2%,优选为1.2%。
进一步,有关后期产品性能的影响:由于高温料的比例比较小,因此可以控制瓷砖的吸水率小于0.5%,符合国家标准;并且,高温粉料不连续的分布的砖坯底部,且量比较少(约占粉料总量的0.1%),在普通粉料已经烧致密的情况,高温粉料吸水膨胀也不会造成砖坯后期变形。
作为上述方案的进一步改进,所述烧成的温度为1200-1250℃。在高温下陶瓷坯体可生成莫来石晶相,从而可以有效提高坯体的强度。
本发明所述的瓷砖在建筑、装修领域中的应用。
作为上述方案的进一步改进,所述的应用的过程中还使用水泥砂浆,所述瓷砖与所述水泥砂浆的粘结强度为1-8MPa。
本发明的有益效果是:
本发明提供了一种具有高底面粘结强度的瓷砖及其制备方法和应用,包括高温粉料和普通粉料,通过对高温粉料和普通粉料各自配方的合理搭配,拉开了烧成所得的成型坯体中高温粉料和普通粉料的吸水率,烧成后局部高温粉料的吸水率达到5-10%,普通粉料区域的吸水率为0.1%以下,其是局部高温粉料可与粘结剂(水泥、瓷砖胶等)之间形成较大的粘结,从而使最终所得的瓷砖依然能够与粘结剂有效地结合在一起,且粘结强度高达8MPa,有效减少甚至杜绝了瓷砖脱落现象的发生。此外本发明所得瓷砖的吸水率低至0.5%,符合国家标准,也完全满足市场需求,适用于建筑、装修等领域中,应用前影响广泛。
具体实施方式
下面结合实施例对本发明进行具体描述,以便于所属技术领域的人员对本发明的理解。有必要在此特别指出的是,实施例只是用于对本发明做进一步说明,不能理解为对本发明保护范围的限制,所属领域技术熟练人员,根据上述发明内容对本发明所作出的非本质性的改进和调整,应仍属于本发明的保护范围。同时,下述所提及的原料未详细说明的,均为市售产品;未详细提及的工艺步骤或提取方法为均为本领域技术人员所知晓的工艺步骤或提取方法。
实施例1
具有高底面粘结强度的瓷砖的制备方法,包括如下步骤:
1)按重量百分比计称取高温粉料原料:太平砂45%、北流混合泥15%、陆川石粉8%、藤县石粉14%、藤县钾砂5%、玉林水洗泥5%、北流水洗泥4%和勒流砂4%,经球磨、喷粉后得高温粉料;按重量百分比计称取普通粉料:太平砂3%、北流混合泥15%、陆川石粉8%、藤县石粉18%、藤县钾砂23%、玉林水洗泥5%、北流水洗泥5%和勒流砂23%,经球磨、喷粉后得普通粉料;
2)再经布料和压制为成型坯体,使得在坯体底部形成多个高温坯料区域,于1240℃下烧成,制得具有高底面粘结强度的瓷砖成品3。其中,所得粉料的厚度与成型坯体的厚度比为2.25:1。成型坯体的高温粉料厚度为11.35mm,且高吸水率区域的面积之和占瓷砖面积的1.2%。
对比例1
对比例1所得瓷砖的制备方法,包括如下步骤:按重量百分比计称取原普通配方原料(占主体的低温配方料):太平砂3%、北流混合泥15%、陆川石粉8%、藤县石粉18%、藤县钾砂23%、玉林水洗泥5%、北流水洗泥5%和勒流砂23%,经球磨、喷粉后得粉料,再经布料后压制为成型坯体,于1240℃下烧成,制得瓷砖成品4。
对比例2
对比例2与对比例1的区别在于,对比例2的烧成温度为1200℃,得瓷砖成品5。
对比例3
对比例3与实施例1的区别仅在于,对比例3的烧成温度为1250℃,得瓷砖成品6。
产品性能测试
将所得瓷砖成品3-6分别进行吸水率和粘结强度等性能测试,所得检测结果如下表1所示。
表1 瓷砖成品3 -6的吸水率和粘结强度性能测试结果
吸水率(%) 粘结强度(MPa)
实施例1 0.35 3.2
对比例1 0.13 1.6
对比例2 0.85 7.0
对比例3 0.12 1.5
对于本发明所属技术领域的普通技术人员来说,在不脱离本发明构思的前提下还可以做出若干简单推演或替换,而不必经过创造性的劳动。因此,本领域技术人员根据本发明的揭示,对本发明做出的简单改进都应该在本发明的保护范围之内。上述实施例为本发明的优选实施例,凡与本发明类似的工艺及所作的等效变化,均应属于本发明的保护范畴。

Claims (8)

1.一种具有高底面粘结强度的瓷砖,其特征在于,包括高温粉料和普通粉料,所述高温粉料按重量百分比计包括:太平砂35-55%、北流混合泥5-25%、陆川石粉1-15%、藤县石粉4-24%、藤县钾砂1-15%、玉林水洗泥1-15%、北流水洗泥1-14%和勒流砂1-14%;所述普通粉料按重量百分比计包括太平砂1-5%、北流混合泥10-20%、陆川石粉4-12%、藤县石粉12-24%、藤县钾砂16-30%、玉林水洗泥3-7%、北流水洗泥3-7%和勒流砂16-30%;
所述瓷砖由包括以下步骤的制备方法制得:
1)准备粉料:按所述普通粉料的原料配方称取原料,经球磨、喷粉后得普通粉料;按所述高温粉料的原料配方称取原料,经球磨、喷粉后得高温粉料;
2)再经布料和压制,得到底部具有高温坯料层的成型坯体,再经烧成,得所述的瓷砖;
所述布料和压制为采用反打成型的二次布料成型工艺,先布普通粉料,再在普通粉料的基础上布高温粉料,然后进行压制成型;
所述粉料与所述成型坯体的厚度之比为(2.16-2.27):1;
所述坯体成型后的厚度为11.0-11.6mm;所述高温粉料成型后的厚度为0.9-1.8mm;且高温粉料层呈片状不连续地分布在砖坯底部,高温粉料层在坯体底部作为多个高吸水率区域,其面积之和占所述瓷砖面积的0.2-2.2%。
2.根据权利要求1所述的瓷砖,其特征在于,所述高温粉料按重量百分比计包括:太平砂40-50%、北流混合泥10-20%、陆川石粉3-12%、藤县石粉10-20%、藤县钾砂1-8%、玉林水洗泥1-8%、北流水洗泥2-7%和勒流砂2-7%。
3.根据权利要求2所述的瓷砖,其特征在于,所述高温粉料按重量百分比计包括:太平砂45%、北流混合泥15%、陆川石粉8%、藤县石粉14%、藤县钾砂5%、玉林水洗泥5%、北流水洗泥4%和勒流砂4%。
4.根据权利要求1所述的瓷砖,其特征在于,所述普通粉料按重量百分比计包括:太平砂3%、北流混合泥15%、陆川石粉8%、藤县石粉18%、藤县钾砂23%、玉林水洗泥5%、北流水洗泥5%和勒流砂23%。
5.根据权利要求1所述的瓷砖,其特征在于,按重量百分比份计,所述瓷砖的化学成分包括:SiO2 58.2-78.2%、Al2O3 10.2-30.2%、Fe2O3 0.5-2.5%、TiO2 0.01-0.4%、CaO 0.01-0.4%、MgO 0.01-0.4%、K2O 1.4-3.4%和Na2O 0.1-2.1%,烧失率为5.2-7.2%。
6.根据权利要求1所述的瓷砖,其特征在于,所述烧成的温度为1200-1250℃。
7.权利要求1-6任一项所述瓷砖在建筑、装修领域中的应用。
8.根据权利要求7所述的应用,其特征在于,应用的过程中还使用水泥砂浆,所述瓷砖与所述水泥砂浆的粘结强度为1-8MPa。
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