CN112234076A - 集成彩色led微显示器 - Google Patents
集成彩色led微显示器 Download PDFInfo
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- CN112234076A CN112234076A CN202011118790.5A CN202011118790A CN112234076A CN 112234076 A CN112234076 A CN 112234076A CN 202011118790 A CN202011118790 A CN 202011118790A CN 112234076 A CN112234076 A CN 112234076A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1420452.3A GB201420452D0 (en) | 2014-11-18 | 2014-11-18 | Integrated colour led micro-display |
| GB1420452.3 | 2014-11-18 | ||
| CN201580073686.XA CN107210315B (zh) | 2014-11-18 | 2015-11-18 | 集成彩色led微显示器 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580073686.XA Division CN107210315B (zh) | 2014-11-18 | 2015-11-18 | 集成彩色led微显示器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112234076A true CN112234076A (zh) | 2021-01-15 |
Family
ID=52248509
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011118790.5A Pending CN112234076A (zh) | 2014-11-18 | 2015-11-18 | 集成彩色led微显示器 |
| CN201580073686.XA Expired - Fee Related CN107210315B (zh) | 2014-11-18 | 2015-11-18 | 集成彩色led微显示器 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201580073686.XA Expired - Fee Related CN107210315B (zh) | 2014-11-18 | 2015-11-18 | 集成彩色led微显示器 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10008645B2 (enExample) |
| EP (2) | EP3955304B1 (enExample) |
| JP (1) | JP6505226B2 (enExample) |
| KR (1) | KR101968592B1 (enExample) |
| CN (2) | CN112234076A (enExample) |
| GB (1) | GB201420452D0 (enExample) |
| WO (1) | WO2016079505A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908196A (zh) * | 2021-01-29 | 2021-06-04 | 厦门天马微电子有限公司 | 一种显示面板以及显示装置 |
Families Citing this family (139)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201420452D0 (en) * | 2014-11-18 | 2014-12-31 | Mled Ltd | Integrated colour led micro-display |
| US10304811B2 (en) * | 2015-09-04 | 2019-05-28 | Hong Kong Beida Jade Bird Display Limited | Light-emitting diode display panel with micro lens array |
| KR102416470B1 (ko) * | 2015-12-21 | 2022-07-04 | 엘지디스플레이 주식회사 | 광효율 향상을 위한 표시패널, 표시장치 및 표시패널을 제조하는 방법 |
| CN112289821A (zh) * | 2016-04-14 | 2021-01-29 | 群创光电股份有限公司 | 显示装置 |
| US10134802B2 (en) * | 2016-05-12 | 2018-11-20 | Ostendo Technologies, Inc. | Nanophosphors-converted quantum photonic imagers and methods for making the same |
| KR102617466B1 (ko) * | 2016-07-18 | 2023-12-26 | 주식회사 루멘스 | 마이크로 led 어레이 디스플레이 장치 |
| DE102016113763A1 (de) * | 2016-07-26 | 2018-02-01 | Endress+Hauser Conducta Gmbh+Co. Kg | Sensoranordnung zum Einsatz in der Prozessautomatisierung |
| US10606121B2 (en) * | 2016-09-12 | 2020-03-31 | Seoul Semiconductor Co., Ltd. | Display apparatus |
| CN106444250A (zh) * | 2016-10-28 | 2017-02-22 | 江苏新广联半导体有限公司 | 3led微显示投影模块 |
| US10353204B2 (en) | 2016-10-31 | 2019-07-16 | Tectus Corporation | Femtoprojector optical systems |
| WO2018084919A1 (en) * | 2016-11-04 | 2018-05-11 | VerLASE TECHNOLOGIES LLC | Color-converting structures and light-emitting structures and visual displays made therewith |
| US10790330B2 (en) | 2016-11-24 | 2020-09-29 | Lg Innotek Co., Ltd. | Semiconductor device and display device comprising same |
| FR3061358B1 (fr) * | 2016-12-27 | 2021-06-11 | Aledia | Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine |
| JP7079940B2 (ja) | 2017-01-13 | 2022-06-03 | マサチューセッツ インスティテュート オブ テクノロジー | ピクセル化ディスプレイ用多層構造体を形成する方法およびピクセル化ディスプレイ用多層構造体 |
| DE102017100798A1 (de) | 2017-01-17 | 2018-07-19 | Osram Opto Semiconductors Gmbh | Anzeigevorrichtung |
| CN109564963B (zh) * | 2017-01-26 | 2021-04-16 | 株式会社Lg化学 | 微led和包括其的显示装置 |
| US10903194B2 (en) | 2017-04-24 | 2021-01-26 | Hewlett-Packard Development Company, L.P. | Micro light-emitting diode display with 3D orifice plating and light filtering |
| CN112510060B (zh) * | 2017-06-02 | 2023-06-30 | 南京昀光科技有限公司 | 一种全彩半导体发光微显示器及其制造工艺 |
| CN107230685A (zh) * | 2017-06-02 | 2017-10-03 | 南京迈智芯微光电科技有限公司 | 一种全彩化的半导体发光微显示器及其制造工艺 |
| KR102395993B1 (ko) * | 2017-06-05 | 2022-05-11 | 삼성전자주식회사 | 디스플레이 장치 |
| CN108987423B (zh) * | 2017-06-05 | 2023-09-12 | 三星电子株式会社 | 显示装置 |
| KR102399464B1 (ko) * | 2017-06-27 | 2022-05-19 | 주식회사 루멘스 | 엘이디 패널 |
| KR102455483B1 (ko) * | 2017-06-30 | 2022-10-19 | 삼성전자주식회사 | Led 장치 및 그 제조 방법 |
| CN111247369A (zh) * | 2017-08-24 | 2020-06-05 | 康宁公司 | 用于高动态范围微led背光的系统和方法 |
| CN111108613B (zh) * | 2017-09-13 | 2024-01-16 | 夏普株式会社 | Led单元、图像显示元件及其制造方法 |
| CN108323215B (zh) | 2017-09-28 | 2020-10-30 | 歌尔股份有限公司 | 微发光二极管转移方法、制造方法和显示装置 |
| US10768515B2 (en) | 2017-12-12 | 2020-09-08 | Tectus Corporation | Method for manufacturing ultra-dense LED projector using thinned gallium nitride |
| US10388641B2 (en) | 2017-10-19 | 2019-08-20 | Tectus Corporation | Ultra-dense LED projector |
| KR102486391B1 (ko) | 2017-11-09 | 2023-01-09 | 삼성전자주식회사 | 고해상도 디스플레이 장치 |
| KR102509639B1 (ko) | 2017-12-12 | 2023-03-15 | 삼성전자주식회사 | 발광소자 패키지 제조방법 |
| US11961875B2 (en) | 2017-12-20 | 2024-04-16 | Lumileds Llc | Monolithic segmented LED array architecture with islanded epitaxial growth |
| US10854794B2 (en) * | 2017-12-20 | 2020-12-01 | Lumileds Llc | Monolithic LED array structure |
| US20190198564A1 (en) * | 2017-12-20 | 2019-06-27 | Lumileds Llc | Monolithic segmented led array architecture with islanded epitaxial growth |
| US10957820B2 (en) | 2017-12-21 | 2021-03-23 | Lumileds Llc | Monolithic, segmented light emitting diode array |
| US20190198720A1 (en) * | 2017-12-22 | 2019-06-27 | Lumileds Llc | Particle systems and patterning for monolithic led arrays |
| KR102521100B1 (ko) | 2018-01-08 | 2023-04-14 | 삼성디스플레이 주식회사 | 표시 장치 |
| US11404400B2 (en) | 2018-01-24 | 2022-08-02 | Apple Inc. | Micro LED based display panel |
| TWI658446B (zh) * | 2018-02-01 | 2019-05-01 | 鴻海精密工業股份有限公司 | 微型led觸控顯示面板 |
| US10673414B2 (en) | 2018-02-05 | 2020-06-02 | Tectus Corporation | Adaptive tuning of a contact lens |
| KR102493479B1 (ko) | 2018-02-06 | 2023-02-01 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 |
| KR102136921B1 (ko) * | 2018-03-02 | 2020-07-28 | 주식회사 루멘스 | 차량 외판 부착형 플렉시블 디스플레이 장치 |
| US10503007B1 (en) | 2018-02-27 | 2019-12-10 | Facebook Technologies, Llc | Directional color conversion using photonic crystals with quantum dots |
| US10529290B1 (en) * | 2018-02-27 | 2020-01-07 | Facebook Technologies, Llc | Non-uniformly patterned photonic crystal structures with quantum dots for pixelated color conversion |
| CN110212064B (zh) | 2018-02-28 | 2020-10-09 | 华为技术有限公司 | 一种发光二极管芯片及其制备方法 |
| KR102521582B1 (ko) | 2018-04-03 | 2023-04-12 | 삼성전자주식회사 | 발광 다이오드 디스플레이 장치 |
| KR102022310B1 (ko) * | 2018-04-04 | 2019-09-18 | 한국광기술원 | 능동소자 집적형 미세 led 칩 및 이에 대한 제조방법 |
| KR102551354B1 (ko) * | 2018-04-20 | 2023-07-04 | 삼성전자 주식회사 | 반도체 발광 소자 및 그 제조 방법 |
| DE102018111417A1 (de) * | 2018-05-14 | 2019-11-14 | Osram Opto Semiconductors Gmbh | Konversionselement, optoelektronisches bauteil, verfahren zur herstellung einer vielzahl von konversionselementen, verfahren zur herstellung einer vielzahl von optoelektronischen bauteilen und verfahren zur herstellung eines optoelektronischen bauteils |
| US10649239B2 (en) | 2018-05-30 | 2020-05-12 | Tectus Corporation | Eyeglasses with embedded femtoprojectors |
| KR20190137458A (ko) | 2018-06-01 | 2019-12-11 | 삼성전자주식회사 | Led를 이용한 디스플레이 모듈 제조방법 |
| CN108987446A (zh) * | 2018-07-17 | 2018-12-11 | 南方科技大学 | 一种Micro-LED显示面板及其制造方法 |
| KR102591768B1 (ko) | 2018-07-17 | 2023-10-20 | 삼성디스플레이 주식회사 | 표시 장치 |
| EP3608959B1 (en) * | 2018-08-06 | 2023-11-15 | Nichia Corporation | Light emitting device and method for manufacturing same |
| TWI720339B (zh) * | 2018-08-31 | 2021-03-01 | 東貝光電科技股份有限公司 | 應用於微型led顯示器之led發光模組及應用該led發光模組所製成之顯示器 |
| WO2020049392A1 (ja) * | 2018-09-05 | 2020-03-12 | 株式会社半導体エネルギー研究所 | 表示装置、表示モジュール、電子機器、及び表示装置の作製方法 |
| KR102650659B1 (ko) | 2018-09-13 | 2024-03-25 | 삼성전자주식회사 | 디스플레이 장치 |
| CN109216590B (zh) * | 2018-09-21 | 2020-11-03 | 福州大学 | 一种柔性彩色micro-LED显示器件制备方法 |
| US20200135988A1 (en) | 2018-10-26 | 2020-04-30 | Tectus Corporation | Methods of modifying the composition of material layers |
| CN109449259B (zh) * | 2018-10-31 | 2020-07-10 | 海信视像科技股份有限公司 | 微型发光二极管灯板、其制作方法、背光模组及显示装置 |
| KR102698293B1 (ko) | 2018-11-27 | 2024-08-23 | 삼성전자주식회사 | 디스플레이 장치 및 제조 방법 |
| KR102733562B1 (ko) | 2018-12-03 | 2024-11-25 | 삼성전자주식회사 | 디스플레이 장치 |
| US10991865B2 (en) | 2018-12-20 | 2021-04-27 | Samsung Display Co., Ltd. | Display device |
| CN109860241B (zh) * | 2018-12-29 | 2021-07-27 | 苏州清越光电科技股份有限公司 | 高分辨率Micro-OLED显示模组及其制备方法 |
| JPWO2020157811A1 (ja) * | 2019-01-28 | 2021-11-25 | 堺ディスプレイプロダクト株式会社 | マイクロledデバイスおよびその製造方法 |
| KR102704782B1 (ko) | 2019-02-08 | 2024-09-10 | 삼성디스플레이 주식회사 | 표시 장치 |
| KR102690987B1 (ko) | 2019-02-25 | 2024-08-01 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
| US11637219B2 (en) | 2019-04-12 | 2023-04-25 | Google Llc | Monolithic integration of different light emitting structures on a same substrate |
| FR3095550B1 (fr) * | 2019-04-26 | 2021-05-21 | Commissariat Energie Atomique | Procede de realisation d’un dispositif photo-emetteur et/ou photo-recepteur a grille de separation optique metallique |
| KR20200142685A (ko) * | 2019-06-13 | 2020-12-23 | 삼성전자주식회사 | 마이크로 led 전사 방법 및 이에 의해 제조된 디스플레이 모듈 |
| KR102730932B1 (ko) | 2019-06-19 | 2024-11-19 | 삼성디스플레이 주식회사 | 표시 장치 |
| US11271032B2 (en) | 2019-06-20 | 2022-03-08 | Samsung Display Co., Ltd. | Display device |
| KR102827322B1 (ko) | 2019-06-21 | 2025-07-02 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| KR102746084B1 (ko) | 2019-07-08 | 2024-12-26 | 삼성전자주식회사 | 발광소자 패키지 및 이를 이용한 디스플레이 패널 |
| KR102684757B1 (ko) | 2019-08-22 | 2024-07-16 | 삼성디스플레이 주식회사 | 표시 장치 |
| WO2021051100A1 (en) | 2019-09-13 | 2021-03-18 | Avicenatech Corp. | Optical interconnects using microleds |
| KR102739953B1 (ko) | 2019-10-22 | 2024-12-06 | 삼성전자주식회사 | 마이크로 led 소자 및 그 제조 방법 |
| KR102787185B1 (ko) | 2019-11-12 | 2025-03-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| US11121289B2 (en) | 2019-11-20 | 2021-09-14 | Tectus Corporation | Ultra-dense quantum dot color converters |
| KR102877707B1 (ko) | 2019-11-26 | 2025-10-29 | 삼성디스플레이 주식회사 | 표시패널 및 이의 제조 방법 |
| US11674795B2 (en) | 2019-12-18 | 2023-06-13 | Lumileds Llc | Miniature pattern projector using microLEDs and micro-optics |
| KR102856221B1 (ko) * | 2019-12-19 | 2025-09-05 | 엘지디스플레이 주식회사 | 마이크로 엘이디 표시 장치 및 이의 제조방법 |
| TWI725757B (zh) | 2020-03-05 | 2021-04-21 | 財團法人工業技術研究院 | 子畫素結構、畫素結構以及應用於其的發光二極體晶粒 |
| US11942507B2 (en) | 2020-03-11 | 2024-03-26 | Lumileds Llc | Light emitting diode devices |
| US11569415B2 (en) | 2020-03-11 | 2023-01-31 | Lumileds Llc | Light emitting diode devices with defined hard mask opening |
| US11735695B2 (en) | 2020-03-11 | 2023-08-22 | Lumileds Llc | Light emitting diode devices with current spreading layer |
| US11848402B2 (en) | 2020-03-11 | 2023-12-19 | Lumileds Llc | Light emitting diode devices with multilayer composite film including current spreading layer |
| KR20210137810A (ko) * | 2020-05-11 | 2021-11-18 | 삼성전자주식회사 | 전자 소자, 이의 제조 방법, 및 이를 포함하는 표시 장치 |
| WO2021231772A1 (en) | 2020-05-15 | 2021-11-18 | Lumileds Llc | Light-emitting device with configurable spatial distribution of emission intensity |
| KR102787637B1 (ko) | 2020-05-19 | 2025-03-27 | 삼성디스플레이 주식회사 | 표시 장치 |
| GB2599065B (en) * | 2020-05-22 | 2023-05-10 | Plessey Semiconductors Ltd | Light emitting device array |
| GB2595715B (en) * | 2020-06-04 | 2022-08-17 | Plessey Semiconductors Ltd | Enhanced colour conversion and collimation of micro-LED devices |
| US11764095B2 (en) | 2020-07-10 | 2023-09-19 | Samsung Electronics Co., Ltd. | Wet alignment method for micro-semiconductor chip and display transfer structure |
| KR102885870B1 (ko) | 2020-09-08 | 2025-11-12 | 삼성전자주식회사 | 마이크로 발광 소자 및 이를 포함한 디스플레이 장치 |
| US11901491B2 (en) | 2020-10-29 | 2024-02-13 | Lumileds Llc | Light emitting diode devices |
| US11626538B2 (en) | 2020-10-29 | 2023-04-11 | Lumileds Llc | Light emitting diode device with tunable emission |
| US12040432B2 (en) | 2020-10-30 | 2024-07-16 | Lumileds Llc | Light emitting diode devices with patterned TCO layer including different thicknesses |
| KR20220062213A (ko) * | 2020-11-06 | 2022-05-16 | 삼성디스플레이 주식회사 | 반도체 나노입자, 이를 포함한 전자 장치 및 상기 반도체 나노입자의 제조 방법 |
| JP2023549801A (ja) * | 2020-11-11 | 2023-11-29 | アプライド マテリアルズ インコーポレイテッド | ディスプレイフロントパネルデバイス |
| US11955583B2 (en) | 2020-12-01 | 2024-04-09 | Lumileds Llc | Flip chip micro light emitting diodes |
| US11705534B2 (en) | 2020-12-01 | 2023-07-18 | Lumileds Llc | Methods of making flip chip micro light emitting diodes |
| US11600656B2 (en) | 2020-12-14 | 2023-03-07 | Lumileds Llc | Light emitting diode device |
| TW202226609A (zh) * | 2020-12-21 | 2022-07-01 | 美商菲絲博克科技有限公司 | 用於微發光二極體的光束整形二次光學組件 |
| DE102021101657B4 (de) | 2021-01-26 | 2024-12-12 | Infineon Technologies Ag | Verfahren zur Herstellung eines hybriden Bauelements |
| DE102021106332A1 (de) | 2021-03-16 | 2022-09-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronische baugruppe, displayanordnung und verfahren |
| US11721796B2 (en) | 2021-03-29 | 2023-08-08 | Tectus Corporation | LED displays fabricated using hybrid bonding |
| US12453228B2 (en) | 2021-04-30 | 2025-10-21 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| US12446387B2 (en) | 2021-04-30 | 2025-10-14 | Samsung Display Co., Ltd. | Display device and manufacturing method thereof |
| US12336350B2 (en) | 2021-04-30 | 2025-06-17 | Samsung Display Co., Ltd. | High resolution display device with reduced current consumption and load |
| US12191340B2 (en) | 2021-04-30 | 2025-01-07 | Samsung Display Co., Ltd. | Display device |
| US20220352247A1 (en) * | 2021-04-30 | 2022-11-03 | Samsung Display Co., Ltd. | Display device and method of manufacturing the same |
| KR102877038B1 (ko) | 2021-04-30 | 2025-10-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| KR102788201B1 (ko) | 2021-04-30 | 2025-03-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| KR102866873B1 (ko) | 2021-04-30 | 2025-10-01 | 삼성디스플레이 주식회사 | 표시 장치 및 표시 장치의 제조 방법 |
| KR20220149880A (ko) | 2021-04-30 | 2022-11-09 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
| US20220406764A1 (en) * | 2021-05-14 | 2022-12-22 | Seoul Viosys Co., Ltd. | Light emiting module and display apparatus having the same |
| TWI799929B (zh) * | 2021-07-29 | 2023-04-21 | 錼創顯示科技股份有限公司 | 微型發光二極體顯示裝置及其製造方法 |
| KR102881169B1 (ko) | 2021-08-10 | 2025-11-05 | 삼성디스플레이 주식회사 | 표시 장치와 그의 제조 방법 |
| US20240355965A1 (en) * | 2021-08-30 | 2024-10-24 | Sony Group Corporation | Light emitting device and image display apparatus |
| US12402440B2 (en) | 2021-09-03 | 2025-08-26 | Lumileds Llc | Light emitting diode devices with bonding and/or ohmic contact-reflective material |
| US12484346B2 (en) | 2021-09-03 | 2025-11-25 | Lumileds Singapore Pte. Ltd. | Light emitting diode devices with bonding and/or ohmic contact-reflective material |
| US12419137B2 (en) | 2021-09-10 | 2025-09-16 | Lumileds Llc | Light emitting diodes with segmented anodes by pixel |
| US12433080B2 (en) | 2021-09-29 | 2025-09-30 | Lumileds Singapore Pte. Ltd. | Hybrid CMOS micro-LED display layout |
| US12431478B2 (en) | 2021-09-29 | 2025-09-30 | Lumileds Singapore Pte. Ltd. | Hybrid CMOS micro-LED display layout |
| KR20230053028A (ko) | 2021-10-13 | 2023-04-21 | 삼성디스플레이 주식회사 | 표시 장치와 그의 제조 방법 |
| US11935987B2 (en) | 2021-11-03 | 2024-03-19 | Lumileds Llc | Light emitting diode arrays with a light-emitting pixel area |
| US12490570B2 (en) | 2021-11-12 | 2025-12-02 | Lumileds Singapore Pte. Ltd. | Thin-film LED array with low refractive index patterned structures |
| KR102871988B1 (ko) | 2021-12-23 | 2025-10-16 | 삼성전자주식회사 | 적층형 디스플레이 구동 집적 회로 및 이를 포함하는 디스플레이 장치 |
| CN114361145A (zh) * | 2021-12-31 | 2022-04-15 | 湖北长江新型显示产业创新中心有限公司 | 一种显示面板及其制造方法、一种显示装置 |
| US12424599B2 (en) | 2022-02-28 | 2025-09-23 | The Hong Kong University Of Science And Technology | Full-color light-emitting diode micro-display and the fabrication method thereof |
| EP4250379A1 (en) * | 2022-03-24 | 2023-09-27 | Micledi Microdisplays BV | An optoelectronic device with color conversion and with conformal dbr and an associated fabrication method |
| WO2023180015A1 (en) * | 2022-03-24 | 2023-09-28 | Micledi Microdisplays Bv | An optoelectronic device with color conversion and with conformal dbr and an associated fabrication method |
| EP4293734A4 (en) * | 2022-04-29 | 2024-10-23 | Fujian Prima Optoelectronics Co., Ltd | Micro led light projection chip and method for manufacturing same |
| US20240413274A1 (en) * | 2022-05-31 | 2024-12-12 | Boe Technology Group Co., Ltd. | Chip structure and manufacturing method therefor, display substrate and display device |
| JP2024070035A (ja) * | 2022-11-10 | 2024-05-22 | 国立研究開発法人情報通信研究機構 | 半導体発光素子、半導体発光素子の製造方法、発光モジュール及び発光モジュールの製造方法 |
| JP2024070034A (ja) * | 2022-11-10 | 2024-05-22 | 国立研究開発法人情報通信研究機構 | 半導体発光素子及び発光モジュール |
| WO2024156371A1 (en) | 2023-01-27 | 2024-08-02 | Ams-Osram International Gmbh | Optoelectronic device and method for manufacturing the same |
| FR3153690B1 (fr) * | 2023-09-29 | 2025-08-29 | Aledia | Dispositif optoélectronique et procédé de fabrication |
| CN117525254A (zh) * | 2023-12-20 | 2024-02-06 | 西安赛富乐斯半导体科技有限公司 | Led发光构件及其构造方法 |
| WO2025145254A1 (en) * | 2024-01-04 | 2025-07-10 | Vuereal Inc. | Microdisplays |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1742382A (zh) * | 2003-01-27 | 2006-03-01 | 3M创新有限公司 | 具有反射式偏振器的基于荧光粉的光源 |
| US20080001528A1 (en) * | 2006-06-29 | 2008-01-03 | Idemitsu Kosan Co., Ltd. | Color conversion substrate and color display |
| US20120223875A1 (en) * | 2009-12-09 | 2012-09-06 | Nano And Advanced Materials Institute Limited | Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5661371A (en) * | 1990-12-31 | 1997-08-26 | Kopin Corporation | Color filter system for light emitting display panels |
| US20050146258A1 (en) * | 1999-06-02 | 2005-07-07 | Shimon Weiss | Electronic displays using optically pumped luminescent semiconductor nanocrystals |
| US6410942B1 (en) * | 1999-12-03 | 2002-06-25 | Cree Lighting Company | Enhanced light extraction through the use of micro-LED arrays |
| ES2356606T3 (es) * | 2003-08-08 | 2011-04-11 | Kang, Sang-Kyu | Microdiodo emisor de luz de nitruro con alto brillo y procedimiento de fabricación del mismo. |
| TWI367465B (en) * | 2008-02-15 | 2012-07-01 | Foxsemicon Integrated Tech Inc | Led display |
| JP2010040976A (ja) * | 2008-08-08 | 2010-02-18 | Sony Corp | 発光素子及びこれを用いた照明装置並びに表示装置 |
| JP2010087224A (ja) * | 2008-09-30 | 2010-04-15 | Toyoda Gosei Co Ltd | Led表示装置およびled表示装置用隔壁の製造方法 |
| WO2010056596A2 (en) | 2008-11-13 | 2010-05-20 | 3M Innovative Properties Company | Electrically pixelated luminescent device incorporating optical elements |
| WO2010149027A1 (en) * | 2009-06-22 | 2010-12-29 | Industrial Technology Research Institute | Light-emitting unit array, method for fabricating the same and projection apparatus |
| JP2011216668A (ja) * | 2010-03-31 | 2011-10-27 | Sony Corp | 発光装置 |
| CN102959708B (zh) * | 2010-06-29 | 2016-05-04 | 柯立芝照明有限公司 | 具有易弯曲基板的电子装置 |
| JP5643720B2 (ja) * | 2011-06-30 | 2014-12-17 | 株式会社沖データ | ディスプレイモジュール及びその製造方法と表示装置 |
| JPWO2014006987A1 (ja) * | 2012-07-04 | 2016-06-02 | シャープ株式会社 | 蛍光材料、蛍光塗料、蛍光体基板、電子機器およびledパッケージ |
| KR101452768B1 (ko) | 2012-08-21 | 2014-10-21 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법 |
| KR101422037B1 (ko) * | 2012-09-04 | 2014-07-23 | 엘지전자 주식회사 | 반도체 발광 소자를 이용한 디스플레이 장치 |
| US9424775B2 (en) * | 2012-10-15 | 2016-08-23 | The Hong Kong University Of Science And Technology | LEDoS projection system |
| US9153171B2 (en) * | 2012-12-17 | 2015-10-06 | LuxVue Technology Corporation | Smart pixel lighting and display microcontroller |
| CN107155373B (zh) * | 2014-06-18 | 2019-01-15 | 艾克斯瑟乐普林特有限公司 | 微组装led显示器 |
| GB201420452D0 (en) * | 2014-11-18 | 2014-12-31 | Mled Ltd | Integrated colour led micro-display |
| US10177127B2 (en) * | 2015-09-04 | 2019-01-08 | Hong Kong Beida Jade Bird Display Limited | Semiconductor apparatus and method of manufacturing the same |
| US10700121B2 (en) * | 2017-02-13 | 2020-06-30 | Sct Ltd. | Integrated multilayer monolithic assembly LED displays and method of making thereof |
| WO2019147738A1 (en) * | 2018-01-23 | 2019-08-01 | Light Share, LLC | Full-color monolithic micro-led pixels |
-
2014
- 2014-11-18 GB GBGB1420452.3A patent/GB201420452D0/en not_active Ceased
-
2015
- 2015-11-18 CN CN202011118790.5A patent/CN112234076A/zh active Pending
- 2015-11-18 WO PCT/GB2015/053496 patent/WO2016079505A1/en not_active Ceased
- 2015-11-18 US US15/526,279 patent/US10008645B2/en active Active
- 2015-11-18 CN CN201580073686.XA patent/CN107210315B/zh not_active Expired - Fee Related
- 2015-11-18 EP EP21200332.1A patent/EP3955304B1/en active Active
- 2015-11-18 JP JP2017526124A patent/JP6505226B2/ja not_active Expired - Fee Related
- 2015-11-18 KR KR1020177015032A patent/KR101968592B1/ko not_active Expired - Fee Related
- 2015-11-18 EP EP15801484.5A patent/EP3221890B1/en active Active
-
2018
- 2018-05-08 US US15/974,581 patent/US10367122B2/en active Active
-
2019
- 2019-06-14 US US16/442,324 patent/US10862010B2/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1742382A (zh) * | 2003-01-27 | 2006-03-01 | 3M创新有限公司 | 具有反射式偏振器的基于荧光粉的光源 |
| US20080001528A1 (en) * | 2006-06-29 | 2008-01-03 | Idemitsu Kosan Co., Ltd. | Color conversion substrate and color display |
| US20120223875A1 (en) * | 2009-12-09 | 2012-09-06 | Nano And Advanced Materials Institute Limited | Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112908196A (zh) * | 2021-01-29 | 2021-06-04 | 厦门天马微电子有限公司 | 一种显示面板以及显示装置 |
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| US10367122B2 (en) | 2019-07-30 |
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| JP2017538290A (ja) | 2017-12-21 |
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| GB201420452D0 (en) | 2014-12-31 |
| EP3955304B1 (en) | 2024-01-03 |
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