KR101968592B1 - 통합된 컬러 ｌｅｄ 마이크로 디스플레이 - Google Patents

통합된 컬러 ｌｅｄ 마이크로 디스플레이 Download PDF

Info

Publication number
KR101968592B1
KR101968592B1 KR1020177015032A KR20177015032A KR101968592B1 KR 101968592 B1 KR101968592 B1 KR 101968592B1 KR 1020177015032 A KR1020177015032 A KR 1020177015032A KR 20177015032 A KR20177015032 A KR 20177015032A KR 101968592 B1 KR101968592 B1 KR 101968592B1
Authority
KR
South Korea
Prior art keywords
delete delete
layer
light
color
color conversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020177015032A
Other languages
English (en)
Korean (ko)
Other versions
KR20170084139A (ko
Inventor
제임스 로날드 보나
가레쓰 존 발렌타인
스테픈 워렌 고튼
Original Assignee
페이스북 테크놀로지스, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 페이스북 테크놀로지스, 엘엘씨 filed Critical 페이스북 테크놀로지스, 엘엘씨
Publication of KR20170084139A publication Critical patent/KR20170084139A/ko
Application granted granted Critical
Publication of KR101968592B1 publication Critical patent/KR101968592B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H01L27/156—
    • H01L33/0079—
    • H01L33/505—
    • H01L33/507—
    • H01L33/58—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/882—Scattering means

Landscapes

  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020177015032A 2014-11-18 2015-11-18 통합된 컬러 ｌｅｄ 마이크로 디스플레이 Expired - Fee Related KR101968592B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1420452.3A GB201420452D0 (en) 2014-11-18 2014-11-18 Integrated colour led micro-display
GB1420452.3 2014-11-18
PCT/GB2015/053496 WO2016079505A1 (en) 2014-11-18 2015-11-18 Integrated colour led micro-display

Publications (2)

Publication Number Publication Date
KR20170084139A KR20170084139A (ko) 2017-07-19
KR101968592B1 true KR101968592B1 (ko) 2019-04-12

Family

ID=52248509

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177015032A Expired - Fee Related KR101968592B1 (ko) 2014-11-18 2015-11-18 통합된 컬러 ｌｅｄ 마이크로 디스플레이

Country Status (7)

Country Link
US (3) US10008645B2 (enExample)
EP (2) EP3955304B1 (enExample)
JP (1) JP6505226B2 (enExample)
KR (1) KR101968592B1 (enExample)
CN (2) CN107210315B (enExample)
GB (1) GB201420452D0 (enExample)
WO (1) WO2016079505A1 (enExample)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127343B2 (en) 2019-02-25 2021-09-21 Samsung Display Co., Ltd. Display device and method of fabricating the same
US11538973B2 (en) 2019-06-21 2022-12-27 Samsung Display Co. Ltd. Display device and method of fabricating the same
US11552063B2 (en) 2019-11-12 2023-01-10 Samsung Display Co., Ltd. Display device with different electrodes and light emitting elements
US11600756B2 (en) 2019-08-22 2023-03-07 Samsung Display Co., Ltd. Display device with bank pattern
US11784177B2 (en) 2021-10-13 2023-10-10 Samsung Display Co., Ltd. Display device and method for fabricating the same
US12261254B2 (en) 2019-06-19 2025-03-25 Samsung Display Co., Ltd. Display device having a pixel circuit layer including a lens pattern
US12336338B2 (en) 2021-04-30 2025-06-17 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US12336350B2 (en) 2021-04-30 2025-06-17 Samsung Display Co., Ltd. High resolution display device with reduced current consumption and load
US12446387B2 (en) 2021-04-30 2025-10-14 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US12457837B2 (en) 2021-04-30 2025-10-28 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US12532591B2 (en) 2021-04-30 2026-01-20 Samsung Display Co., Ltd. Display device having partition wall structure that finely divides wavelength conversion portions
US12604589B2 (en) 2021-10-13 2026-04-14 Samsung Display Co., Ltd. Display device and method for manufacturing the same
US12615900B2 (en) 2021-04-30 2026-04-28 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US12707793B2 (en) 2021-12-29 2026-08-11 Samsung Display Co., Ltd. Display device and method for fabricating the same

Families Citing this family (143)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201420452D0 (en) * 2014-11-18 2014-12-31 Mled Ltd Integrated colour led micro-display
US10304811B2 (en) * 2015-09-04 2019-05-28 Hong Kong Beida Jade Bird Display Limited Light-emitting diode display panel with micro lens array
KR102416470B1 (ko) * 2015-12-21 2022-07-04 엘지디스플레이 주식회사 광효율 향상을 위한 표시패널, 표시장치 및 표시패널을 제조하는 방법
CN112289821A (zh) * 2016-04-14 2021-01-29 群创光电股份有限公司 显示装置
US10134802B2 (en) * 2016-05-12 2018-11-20 Ostendo Technologies, Inc. Nanophosphors-converted quantum photonic imagers and methods for making the same
KR102617466B1 (ko) * 2016-07-18 2023-12-26 주식회사 루멘스 마이크로 led 어레이 디스플레이 장치
DE102016113763A1 (de) * 2016-07-26 2018-02-01 Endress+Hauser Conducta Gmbh+Co. Kg Sensoranordnung zum Einsatz in der Prozessautomatisierung
US10606121B2 (en) 2016-09-12 2020-03-31 Seoul Semiconductor Co., Ltd. Display apparatus
CN106444250A (zh) * 2016-10-28 2017-02-22 江苏新广联半导体有限公司 3led微显示投影模块
CN112230433A (zh) 2016-10-31 2021-01-15 德遁公司 毫微微投影仪光学系统
WO2018084919A1 (en) * 2016-11-04 2018-05-11 VerLASE TECHNOLOGIES LLC Color-converting structures and light-emitting structures and visual displays made therewith
EP3547376B1 (en) * 2016-11-24 2023-05-17 Lg Innotek Co., Ltd. Semiconductor device and display device comprising same
FR3061358B1 (fr) * 2016-12-27 2021-06-11 Aledia Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine
WO2018132070A1 (en) 2017-01-13 2018-07-19 Massachusetts Institute Of Technology A method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display
DE102017100798A1 (de) * 2017-01-17 2018-07-19 Osram Opto Semiconductors Gmbh Anzeigevorrichtung
TWI678411B (zh) * 2017-01-26 2019-12-01 南韓商Ｌｇ化學股份有限公司 微型led以及包含此微型led的顯示器
WO2018199901A1 (en) 2017-04-24 2018-11-01 Hewlett-Packard Development Company, L.P. Micro light-emitting diode display with 3d orifice plating and light filtering
CN107230685A (zh) * 2017-06-02 2017-10-03 南京迈智芯微光电科技有限公司 一种全彩化的半导体发光微显示器及其制造工艺
CN112510060B (zh) * 2017-06-02 2023-06-30 南京昀光科技有限公司 一种全彩半导体发光微显示器及其制造工艺
CN108987423B (zh) * 2017-06-05 2023-09-12 三星电子株式会社 显示装置
KR102395993B1 (ko) * 2017-06-05 2022-05-11 삼성전자주식회사 디스플레이 장치
KR102399464B1 (ko) * 2017-06-27 2022-05-19 주식회사 루멘스 엘이디 패널
KR102455483B1 (ko) * 2017-06-30 2022-10-19 삼성전자주식회사 Led 장치 및 그 제조 방법
WO2019040688A1 (en) * 2017-08-24 2019-02-28 Corning Incorporated HIGH DYNAMIC RANGE MICRO-LED BACKLIGHT SYSTEMS AND METHODS
CN111108613B (zh) * 2017-09-13 2024-01-16 夏普株式会社 Led单元、图像显示元件及其制造方法
CN108323215B (zh) 2017-09-28 2020-10-30 歌尔股份有限公司 微发光二极管转移方法、制造方法和显示装置
US10768515B2 (en) 2017-12-12 2020-09-08 Tectus Corporation Method for manufacturing ultra-dense LED projector using thinned gallium nitride
US10388641B2 (en) 2017-10-19 2019-08-20 Tectus Corporation Ultra-dense LED projector
KR102486391B1 (ko) 2017-11-09 2023-01-09 삼성전자주식회사 고해상도 디스플레이 장치
KR102509639B1 (ko) 2017-12-12 2023-03-15 삼성전자주식회사 발광소자 패키지 제조방법
US20190198564A1 (en) * 2017-12-20 2019-06-27 Lumileds Llc Monolithic segmented led array architecture with islanded epitaxial growth
US11335835B2 (en) 2017-12-20 2022-05-17 Lumileds Llc Converter fill for LED array
US11961875B2 (en) 2017-12-20 2024-04-16 Lumileds Llc Monolithic segmented LED array architecture with islanded epitaxial growth
US10957820B2 (en) 2017-12-21 2021-03-23 Lumileds Llc Monolithic, segmented light emitting diode array
US20190198720A1 (en) * 2017-12-22 2019-06-27 Lumileds Llc Particle systems and patterning for monolithic led arrays
KR102521100B1 (ko) 2018-01-08 2023-04-14 삼성디스플레이 주식회사 표시 장치
US11404400B2 (en) 2018-01-24 2022-08-02 Apple Inc. Micro LED based display panel
TWI658446B (zh) * 2018-02-01 2019-05-01 鴻海精密工業股份有限公司 微型led觸控顯示面板
US10673414B2 (en) 2018-02-05 2020-06-02 Tectus Corporation Adaptive tuning of a contact lens
KR102493479B1 (ko) 2018-02-06 2023-02-01 삼성디스플레이 주식회사 표시 장치의 제조 방법
KR102136921B1 (ko) * 2018-03-02 2020-07-28 주식회사 루멘스 차량 외판 부착형 플렉시블 디스플레이 장치
US10529290B1 (en) * 2018-02-27 2020-01-07 Facebook Technologies, Llc Non-uniformly patterned photonic crystal structures with quantum dots for pixelated color conversion
US10503007B1 (en) 2018-02-27 2019-12-10 Facebook Technologies, Llc Directional color conversion using photonic crystals with quantum dots
CN110212064B (zh) 2018-02-28 2020-10-09 华为技术有限公司 一种发光二极管芯片及其制备方法
KR102521582B1 (ko) 2018-04-03 2023-04-12 삼성전자주식회사 발광 다이오드 디스플레이 장치
KR102022310B1 (ko) * 2018-04-04 2019-09-18 한국광기술원 능동소자 집적형 미세 led 칩 및 이에 대한 제조방법
KR102551354B1 (ko) * 2018-04-20 2023-07-04 삼성전자 주식회사 반도체 발광 소자 및 그 제조 방법
DE102018111417A1 (de) 2018-05-14 2019-11-14 Osram Opto Semiconductors Gmbh Konversionselement, optoelektronisches bauteil, verfahren zur herstellung einer vielzahl von konversionselementen, verfahren zur herstellung einer vielzahl von optoelektronischen bauteilen und verfahren zur herstellung eines optoelektronischen bauteils
US10649239B2 (en) 2018-05-30 2020-05-12 Tectus Corporation Eyeglasses with embedded femtoprojectors
KR20190137458A (ko) 2018-06-01 2019-12-11 삼성전자주식회사 Led를 이용한 디스플레이 모듈 제조방법
KR102591768B1 (ko) 2018-07-17 2023-10-20 삼성디스플레이 주식회사 표시 장치
CN108987446A (zh) * 2018-07-17 2018-12-11 南方科技大学 一种Micro-LED显示面板及其制造方法
EP3608959B1 (en) 2018-08-06 2023-11-15 Nichia Corporation Light emitting device and method for manufacturing same
TWI720339B (zh) 2018-08-31 2021-03-01 東貝光電科技股份有限公司 應用於微型led顯示器之led發光模組及應用該led發光模組所製成之顯示器
KR20260018189A (ko) * 2018-09-05 2026-02-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치, 표시 모듈, 전자 기기, 및 표시 장치의 제작 방법
KR102650659B1 (ko) 2018-09-13 2024-03-25 삼성전자주식회사 디스플레이 장치
CN109216590B (zh) * 2018-09-21 2020-11-03 福州大学 一种柔性彩色micro-LED显示器件制备方法
US20200135988A1 (en) 2018-10-26 2020-04-30 Tectus Corporation Methods of modifying the composition of material layers
CN109449259B (zh) * 2018-10-31 2020-07-10 海信视像科技股份有限公司 微型发光二极管灯板、其制作方法、背光模组及显示装置
KR102698293B1 (ko) * 2018-11-27 2024-08-23 삼성전자주식회사 디스플레이 장치 및 제조 방법
KR102733562B1 (ko) 2018-12-03 2024-11-25 삼성전자주식회사 디스플레이 장치
US10991865B2 (en) 2018-12-20 2021-04-27 Samsung Display Co., Ltd. Display device
CN109860241B (zh) * 2018-12-29 2021-07-27 苏州清越光电科技股份有限公司 高分辨率Micro-OLED显示模组及其制备方法
JPWO2020157811A1 (ja) * 2019-01-28 2021-11-25 堺ディスプレイプロダクト株式会社 マイクロｌｅｄデバイスおよびその製造方法
KR102704782B1 (ko) 2019-02-08 2024-09-10 삼성디스플레이 주식회사 표시 장치
US11637219B2 (en) 2019-04-12 2023-04-25 Google Llc Monolithic integration of different light emitting structures on a same substrate
FR3095550B1 (fr) * 2019-04-26 2021-05-21 Commissariat Energie Atomique Procede de realisation d’un dispositif photo-emetteur et/ou photo-recepteur a grille de separation optique metallique
KR20200142685A (ko) 2019-06-13 2020-12-23 삼성전자주식회사 마이크로 led 전사 방법 및 이에 의해 제조된 디스플레이 모듈
US11271032B2 (en) 2019-06-20 2022-03-08 Samsung Display Co., Ltd. Display device
KR102746084B1 (ko) 2019-07-08 2024-12-26 삼성전자주식회사 발광소자 패키지 및 이를 이용한 디스플레이 패널
US11624882B2 (en) * 2019-09-13 2023-04-11 Avicenatech Corp. Optical interconnects using microLEDs
KR102739953B1 (ko) 2019-10-22 2024-12-06 삼성전자주식회사 마이크로 led 소자 및 그 제조 방법
US11121289B2 (en) 2019-11-20 2021-09-14 Tectus Corporation Ultra-dense quantum dot color converters
KR102877707B1 (ko) 2019-11-26 2025-10-29 삼성디스플레이 주식회사 표시패널 및 이의 제조 방법
US11674795B2 (en) 2019-12-18 2023-06-13 Lumileds Llc Miniature pattern projector using microLEDs and micro-optics
KR102856221B1 (ko) * 2019-12-19 2025-09-05 엘지디스플레이 주식회사 마이크로 엘이디 표시 장치 및 이의 제조방법
TWI725757B (zh) 2020-03-05 2021-04-21 財團法人工業技術研究院 子畫素結構、畫素結構以及應用於其的發光二極體晶粒
US11848402B2 (en) 2020-03-11 2023-12-19 Lumileds Llc Light emitting diode devices with multilayer composite film including current spreading layer
US11942507B2 (en) 2020-03-11 2024-03-26 Lumileds Llc Light emitting diode devices
US11569415B2 (en) 2020-03-11 2023-01-31 Lumileds Llc Light emitting diode devices with defined hard mask opening
US11735695B2 (en) 2020-03-11 2023-08-22 Lumileds Llc Light emitting diode devices with current spreading layer
JP2023523910A (ja) 2020-04-30 2023-06-08 ルミレッズ リミテッド ライアビリティ カンパニー 集積光学フィルタリング素子を有するカラーｌｅｄ
KR102906650B1 (ko) * 2020-05-11 2025-12-30 삼성전자주식회사 전자 소자, 이의 제조 방법, 및 이를 포함하는 표시 장치
WO2021231772A1 (en) 2020-05-15 2021-11-18 Lumileds Llc Light-emitting device with configurable spatial distribution of emission intensity
KR102787637B1 (ko) 2020-05-19 2025-03-27 삼성디스플레이 주식회사 표시 장치
GB2599065B (en) * 2020-05-22 2023-05-10 Plessey Semiconductors Ltd Light emitting device array
GB2595715B (en) * 2020-06-04 2022-08-17 Plessey Semiconductors Ltd Enhanced colour conversion and collimation of micro-LED devices
US11764095B2 (en) 2020-07-10 2023-09-19 Samsung Electronics Co., Ltd. Wet alignment method for micro-semiconductor chip and display transfer structure
KR102885870B1 (ko) 2020-09-08 2025-11-12 삼성전자주식회사 마이크로 발광 소자 및 이를 포함한 디스플레이 장치
US11626538B2 (en) 2020-10-29 2023-04-11 Lumileds Llc Light emitting diode device with tunable emission
US11901491B2 (en) 2020-10-29 2024-02-13 Lumileds Llc Light emitting diode devices
US12040432B2 (en) 2020-10-30 2024-07-16 Lumileds Llc Light emitting diode devices with patterned TCO layer including different thicknesses
KR102992813B1 (ko) * 2020-11-06 2026-07-20 삼성디스플레이 주식회사 반도체 나노입자, 이를 포함한 전자 장치 및 상기 반도체 나노입자의 제조 방법
EP4244896A4 (en) * 2020-11-11 2024-11-06 Applied Materials, Inc. FRONT PANEL DEVICE FOR DISPLAY UNIT
US11955583B2 (en) 2020-12-01 2024-04-09 Lumileds Llc Flip chip micro light emitting diodes
US11705534B2 (en) 2020-12-01 2023-07-18 Lumileds Llc Methods of making flip chip micro light emitting diodes
US11600656B2 (en) 2020-12-14 2023-03-07 Lumileds Llc Light emitting diode device
TW202226609A (zh) * 2020-12-21 2022-07-01 美商菲絲博克科技有限公司 用於微發光二極體的光束整形二次光學組件
DE102021101657B4 (de) 2021-01-26 2024-12-12 Infineon Technologies Ag Verfahren zur Herstellung eines hybriden Bauelements
CN112908196B (zh) * 2021-01-29 2023-12-19 厦门天马微电子有限公司 一种显示面板以及显示装置
DE102021106332A1 (de) 2021-03-16 2022-09-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronische baugruppe, displayanordnung und verfahren
US11721796B2 (en) 2021-03-29 2023-08-08 Tectus Corporation LED displays fabricated using hybrid bonding
KR102964174B1 (ko) 2021-04-29 2026-05-13 삼성디스플레이 주식회사 표시 장치
CN115274773A (zh) 2021-04-29 2022-11-01 三星显示有限公司 显示装置
KR102788201B1 (ko) 2021-04-30 2025-03-28 삼성디스플레이 주식회사 표시 장치 및 그 제조 방법
US12453228B2 (en) 2021-04-30 2025-10-21 Samsung Display Co., Ltd. Display device and method of manufacturing the same
KR102866873B1 (ko) 2021-04-30 2025-10-01 삼성디스플레이 주식회사 표시 장치 및 표시 장치의 제조 방법
US12191340B2 (en) 2021-04-30 2025-01-07 Samsung Display Co., Ltd. Display device
US12610858B2 (en) * 2021-05-14 2026-04-21 Seoul Viosys Co., Ltd. Light emitting module and display apparatus having the same
TWI799929B (zh) * 2021-07-29 2023-04-21 錼創顯示科技股份有限公司 微型發光二極體顯示裝置及其製造方法
KR102881169B1 (ko) 2021-08-10 2025-11-05 삼성디스플레이 주식회사 표시 장치와 그의 제조 방법
EP4386876A4 (en) * 2021-08-30 2024-12-04 Sony Group Corporation LIGHT EMITTING DEVICE AND IMAGE DISPLAY DEVICE
US12484346B2 (en) 2021-09-03 2025-11-25 Lumileds Singapore Pte. Ltd. Light emitting diode devices with bonding and/or ohmic contact-reflective material
US12402440B2 (en) 2021-09-03 2025-08-26 Lumileds Llc Light emitting diode devices with bonding and/or ohmic contact-reflective material
US12419137B2 (en) 2021-09-10 2025-09-16 Lumileds Llc Light emitting diodes with segmented anodes by pixel
US12433080B2 (en) 2021-09-29 2025-09-30 Lumileds Singapore Pte. Ltd. Hybrid CMOS micro-LED display layout
US12431478B2 (en) 2021-09-29 2025-09-30 Lumileds Singapore Pte. Ltd. Hybrid CMOS micro-LED display layout
US12568728B2 (en) 2021-09-29 2026-03-03 Lumileds Singapore Pte. Ltd. Hybrid CMOS micro-LED display layout
US11935987B2 (en) 2021-11-03 2024-03-19 Lumileds Llc Light emitting diode arrays with a light-emitting pixel area
US12604572B2 (en) 2021-11-12 2026-04-14 Lumileds Singapore Pte. Ltd. Thin-film LED array with low refractive index patterned structures and reflector
US12490570B2 (en) 2021-11-12 2025-12-02 Lumileds Singapore Pte. Ltd. Thin-film LED array with low refractive index patterned structures
US12588326B2 (en) 2021-11-12 2026-03-24 Lumileds Singapore Pte. Ltd. Composite cathode contact for monolithically integrated micro-LEDs, mini-LEDs and LED arrays
KR102959281B1 (ko) 2021-11-15 2026-04-30 삼성디스플레이 주식회사 표시 장치
KR102871988B1 (ko) 2021-12-23 2025-10-16 삼성전자주식회사 적층형 디스플레이 구동 집적 회로 및 이를 포함하는 디스플레이 장치
CN114361145A (zh) * 2021-12-31 2022-04-15 湖北长江新型显示产业创新中心有限公司 一种显示面板及其制造方法、一种显示装置
US12625366B2 (en) * 2022-01-10 2026-05-12 Samsung Electronics Co., Ltd. Display device, augmented reality device including display device, and method of manufacturing display device
US12424599B2 (en) 2022-02-28 2025-09-23 The Hong Kong University Of Science And Technology Full-color light-emitting diode micro-display and the fabrication method thereof
US12610671B2 (en) 2022-03-22 2026-04-21 Apple Inc. Pixel optical structures for display optical efficiency
US12660401B2 (en) 2022-03-22 2026-06-16 Apple Inc. Pixel optical structures for display optical efficiency
EP4250379A1 (en) * 2022-03-24 2023-09-27 Micledi Microdisplays BV An optoelectronic device with color conversion and with conformal dbr and an associated fabrication method
US20250151479A1 (en) * 2022-03-24 2025-05-08 Micledi Microdisplays Bv An optoelectronic device with color conversion and with conformal dbr and an associated fabrication method
CN114937731B (zh) * 2022-04-29 2023-04-07 福建兆元光电有限公司 一种Micro LED光投射芯片及其制造方法
WO2023230932A1 (zh) * 2022-05-31 2023-12-07 京东方科技集团股份有限公司 芯片结构、芯片制备方法、显示基板和显示装置
KR20230171529A (ko) 2022-06-13 2023-12-21 삼성디스플레이 주식회사 표시 장치
JP2024070034A (ja) * 2022-11-10 2024-05-22 国立研究開発法人情報通信研究機構 半導体発光素子及び発光モジュール
JP2024070035A (ja) * 2022-11-10 2024-05-22 国立研究開発法人情報通信研究機構 半導体発光素子、半導体発光素子の製造方法、発光モジュール及び発光モジュールの製造方法
WO2024156371A1 (en) 2023-01-27 2024-08-02 Ams-Osram International Gmbh Optoelectronic device and method for manufacturing the same
JP2024154752A (ja) * 2023-04-19 2024-10-31 豊田合成株式会社 発光素子および発光装置
FR3153690B1 (fr) * 2023-09-29 2025-08-29 Aledia Dispositif optoélectronique et procédé de fabrication
US12666759B2 (en) 2023-10-31 2026-06-23 Lumileds Singapore Pte. Ltd. Tunnel-junction cascade LED with different pump wavelengths
CN117525254A (zh) * 2023-12-20 2024-02-06 西安赛富乐斯半导体科技有限公司 Led发光构件及其构造方法
TW202601586A (zh) * 2024-01-04 2026-01-01 加拿大商弗瑞爾公司 微顯示器
US12666774B2 (en) 2024-04-30 2026-06-23 Lumileds Singapore Pte. Ltd. High efficacy polychromic light-emitting diode (LED)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120223875A1 (en) * 2009-12-09 2012-09-06 Nano And Advanced Materials Institute Limited Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology
JP2013011803A (ja) * 2011-06-30 2013-01-17 Oki Data Corp ディスプレイモジュール及びその製造方法と表示装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5661371A (en) 1990-12-31 1997-08-26 Kopin Corporation Color filter system for light emitting display panels
US20050146258A1 (en) * 1999-06-02 2005-07-07 Shimon Weiss Electronic displays using optically pumped luminescent semiconductor nanocrystals
US6410942B1 (en) * 1999-12-03 2002-06-25 Cree Lighting Company Enhanced light extraction through the use of micro-LED arrays
CN1742384A (zh) * 2003-01-27 2006-03-01 3M创新有限公司 利用全内反射的基于荧光粉的光源
US7595511B2 (en) * 2003-08-08 2009-09-29 Sang-Kyu Kang Nitride micro light emitting diode with high brightness and method of manufacturing the same
JP2008010298A (ja) * 2006-06-29 2008-01-17 Idemitsu Kosan Co Ltd 色変換基板及びカラー表示装置
TWI367465B (en) * 2008-02-15 2012-07-01 Foxsemicon Integrated Tech Inc Led display
JP2010040976A (ja) * 2008-08-08 2010-02-18 Sony Corp 発光素子及びこれを用いた照明装置並びに表示装置
JP2010087224A (ja) * 2008-09-30 2010-04-15 Toyoda Gosei Co Ltd Ｌｅｄ表示装置およびｌｅｄ表示装置用隔壁の製造方法
US8513685B2 (en) * 2008-11-13 2013-08-20 3M Innovative Properties Company Electrically pixelated luminescent device incorporating optical elements
CN102341740B (zh) * 2009-06-22 2015-09-16 财团法人工业技术研究院 发光单元阵列、其制造方法和投影设备
JP2011216668A (ja) * 2010-03-31 2011-10-27 Sony Corp 発光装置
JP5512888B2 (ja) * 2010-06-29 2014-06-04 クーレッジ ライティング インコーポレイテッド 柔軟な基板を有する電子素子
US20150171372A1 (en) * 2012-07-04 2015-06-18 Sharp Kabushiki Kaisha Fluorescent material, fluorescent coating material, phosphor substrate, electronic apparatus, and led package
KR101452768B1 (ko) * 2012-08-21 2014-10-21 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치 및 이의 제조방법
KR101422037B1 (ko) * 2012-09-04 2014-07-23 엘지전자 주식회사 반도체 발광 소자를 이용한 디스플레이 장치
US9424775B2 (en) * 2012-10-15 2016-08-23 The Hong Kong University Of Science And Technology LEDoS projection system
US9153171B2 (en) * 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
JP6438978B2 (ja) * 2014-06-18 2018-12-19 エックス−セレプリント リミテッドＸ−Ｃｅｌｅｐｒｉｎｔ Ｌｉｍｉｔｅｄ マイクロ組立ｌｅｄディスプレイ
GB201420452D0 (en) * 2014-11-18 2014-12-31 Mled Ltd Integrated colour led micro-display
US10177127B2 (en) * 2015-09-04 2019-01-08 Hong Kong Beida Jade Bird Display Limited Semiconductor apparatus and method of manufacturing the same
US10700121B2 (en) * 2017-02-13 2020-06-30 Sct Ltd. Integrated multilayer monolithic assembly LED displays and method of making thereof
WO2019147738A1 (en) * 2018-01-23 2019-08-01 Light Share, LLC Full-color monolithic micro-led pixels

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120223875A1 (en) * 2009-12-09 2012-09-06 Nano And Advanced Materials Institute Limited Monolithic full-color led micro-display on an active matrix panel manufactured using flip-chip technology
JP2013011803A (ja) * 2011-06-30 2013-01-17 Oki Data Corp ディスプレイモジュール及びその製造方法と表示装置

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11514846B2 (en) 2019-02-25 2022-11-29 Samsung Display Co., Ltd. Display device and method of fabricating the same
US11127343B2 (en) 2019-02-25 2021-09-21 Samsung Display Co., Ltd. Display device and method of fabricating the same
US11817046B2 (en) 2019-02-25 2023-11-14 Samsung Display Co., Ltd. Display device and method of fabricating the same
US12223888B2 (en) 2019-02-25 2025-02-11 Samsung Display Co., Ltd. Display device and method of fabricating the same
US12261254B2 (en) 2019-06-19 2025-03-25 Samsung Display Co., Ltd. Display device having a pixel circuit layer including a lens pattern
US11538973B2 (en) 2019-06-21 2022-12-27 Samsung Display Co. Ltd. Display device and method of fabricating the same
US11990579B2 (en) 2019-06-21 2024-05-21 Samsung Display Co., Ltd. Display device and method of fabricating the same
US11600756B2 (en) 2019-08-22 2023-03-07 Samsung Display Co., Ltd. Display device with bank pattern
US12349526B2 (en) 2019-08-22 2025-07-01 Samsung Display Co., Ltd. Display device including bank pattern
US11552063B2 (en) 2019-11-12 2023-01-10 Samsung Display Co., Ltd. Display device with different electrodes and light emitting elements
US12457837B2 (en) 2021-04-30 2025-10-28 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US12336338B2 (en) 2021-04-30 2025-06-17 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US12336350B2 (en) 2021-04-30 2025-06-17 Samsung Display Co., Ltd. High resolution display device with reduced current consumption and load
US12446387B2 (en) 2021-04-30 2025-10-14 Samsung Display Co., Ltd. Display device and manufacturing method thereof
US12532591B2 (en) 2021-04-30 2026-01-20 Samsung Display Co., Ltd. Display device having partition wall structure that finely divides wavelength conversion portions
US12615900B2 (en) 2021-04-30 2026-04-28 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US12125838B2 (en) 2021-10-13 2024-10-22 Samsung Display Co., Ltd. Display device and method for fabricating the same
US11784177B2 (en) 2021-10-13 2023-10-10 Samsung Display Co., Ltd. Display device and method for fabricating the same
US12604589B2 (en) 2021-10-13 2026-04-14 Samsung Display Co., Ltd. Display device and method for manufacturing the same
US12707793B2 (en) 2021-12-29 2026-08-11 Samsung Display Co., Ltd. Display device and method for fabricating the same

Also Published As

Publication number Publication date
CN107210315B (zh) 2020-11-03
KR20170084139A (ko) 2017-07-19
JP6505226B2 (ja) 2019-04-24
EP3221890A1 (en) 2017-09-27
EP3955304B1 (en) 2024-01-03
EP3955304A1 (en) 2022-02-16
GB201420452D0 (en) 2014-12-31
US20170309798A1 (en) 2017-10-26
CN112234076A (zh) 2021-01-15
US20200028036A1 (en) 2020-01-23
JP2017538290A (ja) 2017-12-21
US10862010B2 (en) 2020-12-08
EP3221890B1 (en) 2022-01-12
CN107210315A (zh) 2017-09-26
US10367122B2 (en) 2019-07-30
WO2016079505A1 (en) 2016-05-26
US10008645B2 (en) 2018-06-26
US20180261736A1 (en) 2018-09-13

Similar Documents

Publication Publication Date Title
US10862010B2 (en) Integrated colour LED micro-display
KR102955267B1 (ko) 광전자 장치를 위한 집적 구조물 및 그 제조 방법
JP7402023B2 (ja) ディスプレイ装置及びその製造方法
KR102800331B1 (ko) 디스플레이 장치 및 그 제조 방법
CN111525006B (zh) 发光堆叠件和具有该发光堆叠件的显示装置
CN114649322B (zh) Micro LED显示器件及制备方法
US10205055B2 (en) Light engine array
JP4555880B2 (ja) 積層半導体発光装置及び画像形成装置
KR20250134175A (ko) 마이크로 led 마이크로디스플레이 칩 및 이의 제조 방법
KR20200096546A (ko) 디스플레이용 led 적층을 구비한 발광 소자 및 그것을 포함하는 디스플레이 장치
CN111725251A (zh) 高分辨率全彩化MicroLED显示器
US11482566B2 (en) Light emitting device for display and display apparatus having the same
US12154934B2 (en) Light emitting device for display and display apparatus having the same
JP7532731B2 (ja) 表示パネル、表示装置、および表示パネルの製造方法
CN114497106A (zh) 光源装置、显示装置以及光源装置的制造方法
KR20230092671A (ko) 마이크로 발광 소자 디스플레이 장치 및 그 제조 방법
CN113594196B (zh) 微型发光二极管显示装置及其制造方法

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R17-X000 Change to representative recorded

St.27 status event code: A-5-5-R10-R17-oth-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20220401

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20240409

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20240409