JP6505226B2 - 集積型カラーledマイクロディスプレイ - Google Patents
集積型カラーledマイクロディスプレイ Download PDFInfo
- Publication number
- JP6505226B2 JP6505226B2 JP2017526124A JP2017526124A JP6505226B2 JP 6505226 B2 JP6505226 B2 JP 6505226B2 JP 2017526124 A JP2017526124 A JP 2017526124A JP 2017526124 A JP2017526124 A JP 2017526124A JP 6505226 B2 JP6505226 B2 JP 6505226B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- light
- color
- color converter
- color conversion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/018—Bonding of wafers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
- H10H20/82—Roughened surfaces, e.g. at the interface between epitaxial layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Led Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1420452.3 | 2014-11-18 | ||
| GBGB1420452.3A GB201420452D0 (en) | 2014-11-18 | 2014-11-18 | Integrated colour led micro-display |
| PCT/GB2015/053496 WO2016079505A1 (en) | 2014-11-18 | 2015-11-18 | Integrated colour led micro-display |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017538290A JP2017538290A (ja) | 2017-12-21 |
| JP2017538290A5 JP2017538290A5 (enExample) | 2018-07-19 |
| JP6505226B2 true JP6505226B2 (ja) | 2019-04-24 |
Family
ID=52248509
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017526124A Expired - Fee Related JP6505226B2 (ja) | 2014-11-18 | 2015-11-18 | 集積型カラーledマイクロディスプレイ |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US10008645B2 (enExample) |
| EP (2) | EP3955304B1 (enExample) |
| JP (1) | JP6505226B2 (enExample) |
| KR (1) | KR101968592B1 (enExample) |
| CN (2) | CN107210315B (enExample) |
| GB (1) | GB201420452D0 (enExample) |
| WO (1) | WO2016079505A1 (enExample) |
Families Citing this family (143)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201420452D0 (en) * | 2014-11-18 | 2014-12-31 | Mled Ltd | Integrated colour led micro-display |
| US10304811B2 (en) * | 2015-09-04 | 2019-05-28 | Hong Kong Beida Jade Bird Display Limited | Light-emitting diode display panel with micro lens array |
| KR102416470B1 (ko) * | 2015-12-21 | 2022-07-04 | 엘지디스플레이 주식회사 | 광효율 향상을 위한 표시패널, 표시장치 및 표시패널을 제조하는 방법 |
| CN112289821A (zh) * | 2016-04-14 | 2021-01-29 | 群创光电股份有限公司 | 显示装置 |
| US10134802B2 (en) * | 2016-05-12 | 2018-11-20 | Ostendo Technologies, Inc. | Nanophosphors-converted quantum photonic imagers and methods for making the same |
| KR102617466B1 (ko) * | 2016-07-18 | 2023-12-26 | 주식회사 루멘스 | 마이크로 led 어레이 디스플레이 장치 |
| DE102016113763A1 (de) * | 2016-07-26 | 2018-02-01 | Endress+Hauser Conducta Gmbh+Co. Kg | Sensoranordnung zum Einsatz in der Prozessautomatisierung |
| US10606121B2 (en) * | 2016-09-12 | 2020-03-31 | Seoul Semiconductor Co., Ltd. | Display apparatus |
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| WO2018084919A1 (en) * | 2016-11-04 | 2018-05-11 | VerLASE TECHNOLOGIES LLC | Color-converting structures and light-emitting structures and visual displays made therewith |
| EP3547376B1 (en) | 2016-11-24 | 2023-05-17 | Lg Innotek Co., Ltd. | Semiconductor device and display device comprising same |
| FR3061358B1 (fr) * | 2016-12-27 | 2021-06-11 | Aledia | Procede de fabrication d’un dispositif optoelectronique comportant des plots photoluminescents de photoresine |
| US10847553B2 (en) | 2017-01-13 | 2020-11-24 | Massachusetts Institute Of Technology | Method of forming a multilayer structure for a pixelated display and a multilayer structure for a pixelated display |
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| US10903194B2 (en) | 2017-04-24 | 2021-01-26 | Hewlett-Packard Development Company, L.P. | Micro light-emitting diode display with 3D orifice plating and light filtering |
| CN107230685A (zh) * | 2017-06-02 | 2017-10-03 | 南京迈智芯微光电科技有限公司 | 一种全彩化的半导体发光微显示器及其制造工艺 |
| CN107195654B (zh) * | 2017-06-02 | 2020-11-13 | 南京昀光科技有限公司 | 一种全彩半导体发光微显示器及其制造工艺 |
| CN108987423B (zh) * | 2017-06-05 | 2023-09-12 | 三星电子株式会社 | 显示装置 |
| KR102395993B1 (ko) * | 2017-06-05 | 2022-05-11 | 삼성전자주식회사 | 디스플레이 장치 |
| KR102399464B1 (ko) * | 2017-06-27 | 2022-05-19 | 주식회사 루멘스 | 엘이디 패널 |
| KR102455483B1 (ko) * | 2017-06-30 | 2022-10-19 | 삼성전자주식회사 | Led 장치 및 그 제조 방법 |
| WO2019040688A1 (en) * | 2017-08-24 | 2019-02-28 | Corning Incorporated | HIGH DYNAMIC RANGE MICRO-LED BACKLIGHT SYSTEMS AND METHODS |
| US11393963B2 (en) * | 2017-09-13 | 2022-07-19 | Sharp Kabushiki Kaisha | LED unit, image display element, and method of manufacturing the same |
| WO2019061171A1 (en) * | 2017-09-28 | 2019-04-04 | Goertek. Inc | MICRO-LED TRANSFER METHOD, MANUFACTURING METHOD, AND DISPLAY DEVICE |
| US10768515B2 (en) | 2017-12-12 | 2020-09-08 | Tectus Corporation | Method for manufacturing ultra-dense LED projector using thinned gallium nitride |
| US10388641B2 (en) | 2017-10-19 | 2019-08-20 | Tectus Corporation | Ultra-dense LED projector |
| KR102486391B1 (ko) | 2017-11-09 | 2023-01-09 | 삼성전자주식회사 | 고해상도 디스플레이 장치 |
| KR102509639B1 (ko) | 2017-12-12 | 2023-03-15 | 삼성전자주식회사 | 발광소자 패키지 제조방법 |
| US20190198564A1 (en) | 2017-12-20 | 2019-06-27 | Lumileds Llc | Monolithic segmented led array architecture with islanded epitaxial growth |
| US11961875B2 (en) | 2017-12-20 | 2024-04-16 | Lumileds Llc | Monolithic segmented LED array architecture with islanded epitaxial growth |
| US11335835B2 (en) | 2017-12-20 | 2022-05-17 | Lumileds Llc | Converter fill for LED array |
| US10957820B2 (en) | 2017-12-21 | 2021-03-23 | Lumileds Llc | Monolithic, segmented light emitting diode array |
| US20190198720A1 (en) * | 2017-12-22 | 2019-06-27 | Lumileds Llc | Particle systems and patterning for monolithic led arrays |
| KR102521100B1 (ko) | 2018-01-08 | 2023-04-14 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN111615749B (zh) * | 2018-01-24 | 2024-11-19 | 苹果公司 | 发光结构 |
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| US10673414B2 (en) | 2018-02-05 | 2020-06-02 | Tectus Corporation | Adaptive tuning of a contact lens |
| KR102493479B1 (ko) | 2018-02-06 | 2023-02-01 | 삼성디스플레이 주식회사 | 표시 장치의 제조 방법 |
| KR102136921B1 (ko) * | 2018-03-02 | 2020-07-28 | 주식회사 루멘스 | 차량 외판 부착형 플렉시블 디스플레이 장치 |
| US10529290B1 (en) * | 2018-02-27 | 2020-01-07 | Facebook Technologies, Llc | Non-uniformly patterned photonic crystal structures with quantum dots for pixelated color conversion |
| US10503007B1 (en) | 2018-02-27 | 2019-12-10 | Facebook Technologies, Llc | Directional color conversion using photonic crystals with quantum dots |
| CN110212064B (zh) | 2018-02-28 | 2020-10-09 | 华为技术有限公司 | 一种发光二极管芯片及其制备方法 |
| KR102521582B1 (ko) | 2018-04-03 | 2023-04-12 | 삼성전자주식회사 | 발광 다이오드 디스플레이 장치 |
| KR102022310B1 (ko) * | 2018-04-04 | 2019-09-18 | 한국광기술원 | 능동소자 집적형 미세 led 칩 및 이에 대한 제조방법 |
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| KR102650659B1 (ko) | 2018-09-13 | 2024-03-25 | 삼성전자주식회사 | 디스플레이 장치 |
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| US20200135988A1 (en) | 2018-10-26 | 2020-04-30 | Tectus Corporation | Methods of modifying the composition of material layers |
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| KR102733562B1 (ko) | 2018-12-03 | 2024-11-25 | 삼성전자주식회사 | 디스플레이 장치 |
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| KR102690987B1 (ko) | 2019-02-25 | 2024-08-01 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
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| KR102730932B1 (ko) | 2019-06-19 | 2024-11-19 | 삼성디스플레이 주식회사 | 표시 장치 |
| US11271032B2 (en) | 2019-06-20 | 2022-03-08 | Samsung Display Co., Ltd. | Display device |
| KR102827322B1 (ko) | 2019-06-21 | 2025-07-02 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
| KR102746084B1 (ko) | 2019-07-08 | 2024-12-26 | 삼성전자주식회사 | 발광소자 패키지 및 이를 이용한 디스플레이 패널 |
| KR102684757B1 (ko) | 2019-08-22 | 2024-07-16 | 삼성디스플레이 주식회사 | 표시 장치 |
| EP4029165A4 (en) * | 2019-09-13 | 2022-11-09 | Avicenatech Corp. | OPTICAL CONNECTIONS WITH MICRO-LEDS |
| KR102739953B1 (ko) | 2019-10-22 | 2024-12-06 | 삼성전자주식회사 | 마이크로 led 소자 및 그 제조 방법 |
| KR102787185B1 (ko) | 2019-11-12 | 2025-03-28 | 삼성디스플레이 주식회사 | 표시 장치 및 그의 제조 방법 |
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| US10008645B2 (en) | 2018-06-26 |
| CN112234076A (zh) | 2021-01-15 |
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