CN112075090B - 用于cmos传感器上的超声换能器的压力端口 - Google Patents

用于cmos传感器上的超声换能器的压力端口 Download PDF

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Publication number
CN112075090B
CN112075090B CN201980029781.8A CN201980029781A CN112075090B CN 112075090 B CN112075090 B CN 112075090B CN 201980029781 A CN201980029781 A CN 201980029781A CN 112075090 B CN112075090 B CN 112075090B
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array
pressure
ultrasound
pressure port
micromachined
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CN112075090A (zh
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基思·G·菲费
刘建伟
杨君宇
约瑟夫·卢茨基
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Butterfly Network Inc
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Butterfly Network Inc
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12—Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292—Electrostatic transducers, e.g. electret-type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207—Driving circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22—Details, e.g. general constructional or apparatus details
    • G01N29/24—Probes
    • G01N29/2406—Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/20—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204—Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047—Membrane type
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4455—Features of the external shape of the probe, e.g. ergonomic aspects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00—Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20—Application to multi-element transducer

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pathology (AREA)
  • Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Public Health (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Radiology & Medical Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Gynecology & Obstetrics (AREA)
  • Micromachines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
CN201980029781.8A 2018-05-03 2019-05-02 用于cmos传感器上的超声换能器的压力端口 Active CN112075090B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201862666556P 2018-05-03 2018-05-03
US62/666,556 2018-05-03
US201862696305P 2018-07-10 2018-07-10
US62/696,305 2018-07-10
PCT/US2019/030388 WO2019213388A1 (en) 2018-05-03 2019-05-02 Pressure port for ultrasonic transducer on cmos sensor

Publications (2)

Publication Number Publication Date
CN112075090A CN112075090A (zh) 2020-12-11
CN112075090B true CN112075090B (zh) 2022-10-14

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Country Link
US (2) US12053323B2 (https=)
EP (1) EP3788798B1 (https=)
JP (1) JP2021522734A (https=)
KR (1) KR20210005208A (https=)
CN (1) CN112075090B (https=)
AU (1) AU2019263404A1 (https=)
CA (1) CA3098911A1 (https=)
TW (1) TW202000137A (https=)
WO (1) WO2019213388A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3233311B1 (en) * 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
WO2020069252A1 (en) 2018-09-28 2020-04-02 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
AU2019379545A1 (en) 2018-11-13 2021-05-27 Butterfly Network, Inc. Getter technology for micromachined ultrasonic transducer cavities
US11571711B2 (en) 2018-11-15 2023-02-07 Bfly Operations, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
WO2020163595A1 (en) 2019-02-07 2020-08-13 Butterfly Network, Inc Bi-layer metal electrode for micromachined ultrasonic transducer devices
WO2020176149A1 (en) 2019-02-25 2020-09-03 Butterfly Network, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
US12515240B2 (en) 2019-04-12 2026-01-06 Bfly Operations, Inc. Segmented getter openings for micromachined ultrasound transducer devices
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
FR3097091B1 (fr) * 2019-06-07 2021-07-23 Commissariat Energie Atomique dispositif pourvu d’une pluralité de résonateurs présentant collectivement un facteur de qualité amélioré
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
TWI742603B (zh) * 2020-04-09 2021-10-11 伊諾司生技股份有限公司 一種具有空腔的感測器
TW202210830A (zh) 2020-04-16 2022-03-16 美商蝴蝶網路公司 用於超音波裝置中之電路系統及/或換能器之內建自測試的方法和電路系統
US20210403321A1 (en) * 2020-06-30 2021-12-30 Butterfly Network, Inc. Formation of self-assembled monolayer for ultrasonic transducers
EP4247567B1 (en) 2020-11-19 2024-12-25 Katholieke Universiteit Leuven An ultrasonic transducer structure
TW202240165A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有柱腳的微加工超音波換能器
US12246348B2 (en) 2021-03-04 2025-03-11 BFLY Operations, Inc Capacitive Micromachined ultrasonic transducers (CMUTs) having non-uniform pedestals

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106659464A (zh) * 2014-04-18 2017-05-10 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法

Family Cites Families (112)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262399A (en) * 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
JPH01296122A (ja) 1988-05-24 1989-11-29 Matsushita Electric Ind Co Ltd 圧力センサ
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
US5744898A (en) * 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
US5311095A (en) * 1992-05-14 1994-05-10 Duke University Ultrasonic transducer array
US5639423A (en) * 1992-08-31 1997-06-17 The Regents Of The University Of Calfornia Microfabricated reactor
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
US5894452A (en) * 1994-10-21 1999-04-13 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated ultrasonic immersion transducer
US5982709A (en) * 1998-03-31 1999-11-09 The Board Of Trustees Of The Leland Stanford Junior University Acoustic transducers and method of microfabrication
JP2000050391A (ja) * 1998-07-31 2000-02-18 Olympus Optical Co Ltd 超音波トランスデューサーおよびその製造方法
US6323580B1 (en) * 1999-04-28 2001-11-27 The Charles Stark Draper Laboratory, Inc. Ferroic transducer
US6271620B1 (en) * 1999-05-20 2001-08-07 Sen Corporation Acoustic transducer and method of making the same
US6262946B1 (en) * 1999-09-29 2001-07-17 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6443901B1 (en) * 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6854338B2 (en) * 2000-07-14 2005-02-15 The Board Of Trustees Of The Leland Stanford Junior University Fluidic device with integrated capacitive micromachined ultrasonic transducers
WO2005120130A1 (ja) * 2004-06-03 2005-12-15 Olympus Corporation 静電容量型超音波振動子とその製造方法、静電容量型超音波プローブ
US6891711B1 (en) * 2004-04-08 2005-05-10 Kulite Semiconductor Products, Inc. Ultra-miniature, high temperature, capacitive inductive pressure transducer
WO2005114820A2 (en) * 2004-05-14 2005-12-01 The University Of Georgia Research Foundation, Inc. Implantable ultrasonic transducer systems and methods
US8454513B2 (en) * 2004-12-30 2013-06-04 Stc.Unm Micro-machined medical devices, methods of fabricating microdevices, and methods of medical diagnosis, imaging, stimulation, and treatment
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
JP4271253B2 (ja) * 2006-10-11 2009-06-03 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡
JP4271252B2 (ja) 2006-10-12 2009-06-03 オリンパスメディカルシステムズ株式会社 超音波振動子セル、超音波振動子エレメント、超音波振動子アレイ及び超音波診断装置
WO2008054395A1 (en) * 2006-11-03 2008-05-08 Research Triangle Institute Enhanced ultrasound imaging probes using flexure mode piezoelectric transducers
US7616077B1 (en) * 2007-03-22 2009-11-10 Sandia Corporation Microelectromechanical resonator and method for fabrication
JP5408935B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
JP5408937B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
AU2009243918A1 (en) 2008-05-07 2009-11-12 Signostics Limited Docking system for medical diagnostic scanning using a handheld device
JP5376982B2 (ja) * 2008-06-30 2013-12-25 キヤノン株式会社 機械電気変換素子と機械電気変換装置および機械電気変換装置の作製方法
JP5851238B6 (ja) * 2009-03-05 2023-12-15 株式会社日立メディコ 超音波トランスデューサ、その製造方法、および、それを用いた超音波探触子
EP2669019A1 (en) * 2009-03-26 2013-12-04 Norwegian University of Science and Technology (NTNU) An acoustic damping structure for use in an ultrasound transducer
US9327316B2 (en) * 2009-06-30 2016-05-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-frequency acoustic array
US8324006B1 (en) * 2009-10-28 2012-12-04 National Semiconductor Corporation Method of forming a capacitive micromachined ultrasonic transducer (CMUT)
JP5671876B2 (ja) * 2009-11-16 2015-02-18 セイコーエプソン株式会社 超音波トランスデューサー、超音波センサー、超音波トランスデューサーの製造方法、および超音波センサーの製造方法
US8329053B2 (en) * 2009-11-23 2012-12-11 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Micromachined transducers and method of fabrication
JP5529577B2 (ja) * 2010-02-14 2014-06-25 キヤノン株式会社 電気機械変換装置及びその作製方法
JP2011244425A (ja) * 2010-04-23 2011-12-01 Canon Inc 電気機械変換装置及びその作製方法
US8471304B2 (en) 2010-06-04 2013-06-25 Carnegie Mellon University Method, apparatus, and system for micromechanical gas chemical sensing capacitor
US9420378B1 (en) * 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
CA2814123A1 (en) * 2010-10-12 2012-04-19 Micralyne Inc. Soi-based cmut device with buried electrodes
JP5778914B2 (ja) * 2010-11-04 2015-09-16 キヤノン株式会社 電気機械変換装置の製造方法
JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875244B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875243B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US9231496B2 (en) * 2012-01-27 2016-01-05 Koninklijke Philips N.V. Capacitive micro-machined transducer and method of manufacturing the same
BR112014018080A8 (pt) * 2012-01-27 2017-07-11 Koninklijke Philips Nv Método de fabricação de um transdutor microusinado capacitivo, e, transdutor microusinado capacitivo
JP6328131B2 (ja) * 2012-11-20 2018-05-23 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 容量性マイクロマシントランスデューサ及びその製造方法
US9533873B2 (en) 2013-02-05 2017-01-03 Butterfly Network, Inc. CMOS ultrasonic transducers and related apparatus and methods
WO2014151525A2 (en) 2013-03-15 2014-09-25 Butterfly Network, Inc. Complementary metal oxide semiconductor (cmos) ultrasonic transducers and methods for forming the same
CN109954646B (zh) 2013-03-15 2021-04-27 蝴蝶网络有限公司 超声装置
JP5901566B2 (ja) * 2013-04-18 2016-04-13 キヤノン株式会社 トランスデューサ、トランスデューサの製造方法、及び被検体情報取得装置
EP2796210B1 (en) * 2013-04-25 2016-11-30 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
EP2796209B1 (en) * 2013-04-25 2020-06-17 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
AU2014293274B2 (en) 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
JP6381195B2 (ja) * 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
US9834434B2 (en) * 2013-11-19 2017-12-05 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
JP2015103821A (ja) * 2013-11-20 2015-06-04 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
US10478858B2 (en) * 2013-12-12 2019-11-19 Qualcomm Incorporated Piezoelectric ultrasonic transducer and process
WO2015112453A1 (en) * 2014-01-24 2015-07-30 The Regents Of The University Of California Medical devices comprising curved piezoelectric transducers
US9439000B1 (en) * 2014-02-28 2016-09-06 Google Inc. Systems and methods for improved audio output in electronic devices
JPWO2015190429A1 (ja) * 2014-06-13 2017-04-20 株式会社村田製作所 圧電デバイスおよび圧電デバイスの製造方法
CN106660074B (zh) * 2014-07-08 2019-09-24 高通股份有限公司 压电超声换能器及工艺
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9821340B2 (en) 2014-07-28 2017-11-21 Kolo Medical Ltd. High displacement ultrasonic transducer
US10139479B2 (en) * 2014-10-15 2018-11-27 Qualcomm Incorporated Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
JP2016101417A (ja) * 2014-11-28 2016-06-02 キヤノン株式会社 静電容量型音響波トランスデューサ及びこれを備えた被検体情報取得装置
EP3233311B1 (en) 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
US20160219375A1 (en) * 2015-01-23 2016-07-28 Silicon Audio Directional, Llc Multi-mode Microphones
WO2017065691A1 (en) * 2015-10-14 2017-04-20 Agency For Science, Technology And Research Device arrangement
US10497748B2 (en) * 2015-10-14 2019-12-03 Qualcomm Incorporated Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
US10175347B2 (en) 2015-12-02 2019-01-08 Butterfly Network, Inc. Ultrasound receiver circuitry and related apparatus and methods
US10187020B2 (en) 2015-12-02 2019-01-22 Butterfly Network, Inc. Trans-impedance amplifier for ultrasound device and related apparatus and methods
JP6632431B2 (ja) * 2016-03-08 2020-01-22 キヤノン株式会社 超音波トランスデューサユニット及びそれを備える情報取得装置
US10082565B2 (en) 2016-03-31 2018-09-25 Butterfly Network, Inc. Multilevel bipolar pulser
US9778348B1 (en) 2016-03-31 2017-10-03 Butterfly Network, Inc. Symmetric receiver switch for bipolar pulser
EP3472829B1 (en) * 2016-06-17 2023-08-16 InvenSense, Inc. Piezoelectric micromachined ultrasonic transducers having stress relief features
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
CN113857023B (zh) 2016-06-20 2022-08-02 蝴蝶网络有限公司 用于微加工超声换能器的电接触布置
US10231713B2 (en) 2016-09-13 2019-03-19 Butterfly Network, Inc. Analog-to-digital drive circuitry having built-in time gain compensation functionality for ultrasound applications
JP6833544B2 (ja) * 2017-02-09 2021-02-24 キヤノン株式会社 静電容量型トランスデューサおよびその製造方法
EP3586093A4 (en) 2017-02-27 2021-01-06 Butterfly Network, Inc. CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
WO2018237267A1 (en) 2017-06-23 2018-12-27 Butterfly Network, Inc. Differential ultrasonic transducer element for ultrasound devices
JP6904814B2 (ja) * 2017-06-30 2021-07-21 キヤノン株式会社 中空構造体の製造方法、及び中空構造体
TW201919542A (zh) 2017-09-07 2019-06-01 美商蝴蝶網路公司 腕戴式超音波晶片裝置
US20190299251A1 (en) 2017-11-15 2019-10-03 Butterfly Network, Inc. Apparatuses including a capacitive micromachined ultrasonic transducer directly coupled to an analog-to-digital converter
WO2019099681A1 (en) 2017-11-15 2019-05-23 Butterfly Network, Inc. Ultrasound device with piezoelectric micromachined ultrasonic transducers
JP2021502846A (ja) 2017-11-15 2021-02-04 バタフライ ネットワーク，インコーポレイテッド 超音波装置および超音波デバイスを製造するための方法
EP3745961B1 (en) 2018-01-30 2025-10-01 BFLY Operations, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
US11590532B2 (en) 2018-03-09 2023-02-28 Bfly Operations, Inc. Ultrasound transducer devices and methods for fabricating ultrasound transducer devices
TW201947717A (zh) 2018-05-03 2019-12-16 美商蝴蝶網路公司 用於超音波晶片的垂直封裝及相關方法
US11986349B2 (en) 2018-05-03 2024-05-21 Bfly Operations, Inc. Ultrasound devices
JP2021529459A (ja) 2018-07-06 2021-10-28 バタフライ ネットワーク，インコーポレイテッド 超音波オンチップをパッケージングする方法及び装置
JP2020018469A (ja) * 2018-07-31 2020-02-06 キヤノン株式会社 静電容量型トランスデューサ、及びそれを用いた超音波プローブ
WO2020069252A1 (en) 2018-09-28 2020-04-02 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
US11662447B2 (en) 2018-11-09 2023-05-30 Bfly Operations, Inc. Trans-impedance amplifier (TIA) for ultrasound devices
AU2019379545A1 (en) 2018-11-13 2021-05-27 Butterfly Network, Inc. Getter technology for micromachined ultrasonic transducer cavities
US11571711B2 (en) 2018-11-15 2023-02-07 Bfly Operations, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
US20200184176A1 (en) 2018-12-07 2020-06-11 Butterfly Network, Inc. Ultrasound fingerprint detection and related apparatus and methods
AU2019392906A1 (en) 2018-12-07 2021-07-22 Octant, Inc. Systems for protein-protein interaction screening
EP3918886A4 (en) 2019-01-29 2022-11-02 Butterfly Network, Inc. PACKAGING STRUCTURES AND METHODS FOR ULTRASONIC ON-CHIP DEVICES
WO2020163595A1 (en) 2019-02-07 2020-08-13 Butterfly Network, Inc Bi-layer metal electrode for micromachined ultrasonic transducer devices
WO2020176149A1 (en) 2019-02-25 2020-09-03 Butterfly Network, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
US12515240B2 (en) 2019-04-12 2026-01-06 Bfly Operations, Inc. Segmented getter openings for micromachined ultrasound transducer devices
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US20200348794A1 (en) 2019-04-30 2020-11-05 Butterfly Network, Inc. Ultrasound touch detection and related apparatuses and methods
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
US11558062B2 (en) 2019-07-25 2023-01-17 Bfly Operations, Inc. Methods and apparatuses for turning on and off an ADC driver in an ultrasound device
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11921240B2 (en) 2019-09-19 2024-03-05 Bfly Operations, Inc. Symmetric receiver switch for ultrasound devices
US20210183832A1 (en) 2019-12-17 2021-06-17 Butterfly Network, Inc. Methods and apparatuses for packaging ultrasound-on-chip devices

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106659464A (zh) * 2014-04-18 2017-05-10 蝴蝶网络有限公司 互补金属氧化物半导体(cmos)晶片中的超声换能器及相关装置和方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Michael L. Kuntzman ; Neal A. Hall.Rotational Capacitive Micromachined Ultrasonic Transducers (cMUTs).《Journal of Microelectromechanical Systems》.2013, *

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