TW202000137A - 互補式金屬氧化物半導體感測器上超音波換能器的壓力口 - Google Patents

互補式金屬氧化物半導體感測器上超音波換能器的壓力口 Download PDF

Info

Publication number
TW202000137A
TW202000137A TW108115250A TW108115250A TW202000137A TW 202000137 A TW202000137 A TW 202000137A TW 108115250 A TW108115250 A TW 108115250A TW 108115250 A TW108115250 A TW 108115250A TW 202000137 A TW202000137 A TW 202000137A
Authority
TW
Taiwan
Prior art keywords
ultrasonic transducer
pressure
pressure port
cavity
ultrasonic
Prior art date
Application number
TW108115250A
Other languages
English (en)
Chinese (zh)
Inventor
凱斯 G 法菲
建威 劉
楊政昱
喬瑟夫 盧茨基
Original Assignee
美商蝴蝶網路公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 美商蝴蝶網路公司 filed Critical 美商蝴蝶網路公司
Publication of TW202000137A publication Critical patent/TW202000137A/zh

Links

Images

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/12Diagnosis using ultrasonic, sonic or infrasonic waves in body cavities or body tracts, e.g. by using catheters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/22Details, e.g. general constructional or apparatus details
    • G01N29/24Probes
    • G01N29/2406Electrostatic or capacitive probes, e.g. electret or cMUT-probes
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4494Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer characterised by the arrangement of the transducer elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0207Driving circuits
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/0292Electrostatic transducers, e.g. electret-type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/20Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators
    • H10N30/204Piezoelectric or electrostrictive devices with electrical input and mechanical output, e.g. functioning as actuators or vibrators using bending displacement, e.g. unimorph, bimorph or multimorph cantilever or membrane benders
    • H10N30/2047Membrane type
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4444Constructional features of the ultrasonic, sonic or infrasonic diagnostic device related to the probe
    • A61B8/4455Features of the external shape of the probe, e.g. ergonomic aspects
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B06GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06BMETHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B2201/00Indexing scheme associated with B06B1/0207 for details covered by B06B1/0207 but not provided for in any of its subgroups
    • B06B2201/20Application to multi-element transducer

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Pathology (AREA)
  • Molecular Biology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biophysics (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biomedical Technology (AREA)
  • Surgery (AREA)
  • Medical Informatics (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • Analytical Chemistry (AREA)
  • Immunology (AREA)
  • General Physics & Mathematics (AREA)
  • Gynecology & Obstetrics (AREA)
  • Micromachines (AREA)
  • Transducers For Ultrasonic Waves (AREA)
TW108115250A 2018-05-03 2019-05-02 互補式金屬氧化物半導體感測器上超音波換能器的壓力口 TW202000137A (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201862666556P 2018-05-03 2018-05-03
US62/666,556 2018-05-03
US201862696305P 2018-07-10 2018-07-10
US62/696,305 2018-07-10

Publications (1)

Publication Number Publication Date
TW202000137A true TW202000137A (zh) 2020-01-01

Family

ID=68384340

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108115250A TW202000137A (zh) 2018-05-03 2019-05-02 互補式金屬氧化物半導體感測器上超音波換能器的壓力口

Country Status (9)

Country Link
US (2) US12053323B2 (https=)
EP (1) EP3788798B1 (https=)
JP (1) JP2021522734A (https=)
KR (1) KR20210005208A (https=)
CN (1) CN112075090B (https=)
AU (1) AU2019263404A1 (https=)
CA (1) CA3098911A1 (https=)
TW (1) TW202000137A (https=)
WO (1) WO2019213388A1 (https=)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3233311B1 (en) * 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
CA3118563A1 (en) 2018-11-13 2020-05-22 Butterfly Network, Inc. Getter technology for micromachined ultrasonic transducer cavities
WO2020102492A1 (en) 2018-11-15 2020-05-22 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
US11583894B2 (en) 2019-02-25 2023-02-21 Bfly Operations, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
CN114555248A (zh) 2019-04-12 2022-05-27 布弗莱运营公司 用于微加工超声换能器器件的分段式吸气剂开口
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
FR3097091B1 (fr) * 2019-06-07 2021-07-23 Commissariat Energie Atomique dispositif pourvu d’une pluralité de résonateurs présentant collectivement un facteur de qualité amélioré
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11988640B2 (en) 2020-03-11 2024-05-21 Bfly Operations, Inc. Bottom electrode material stack for micromachined ultrasonic transducer devices
TWI742603B (zh) 2020-04-09 2021-10-11 伊諾司生技股份有限公司 一種具有空腔的感測器
US20210328564A1 (en) 2020-04-16 2021-10-21 Butterfly Network, Inc. Methods and circuitry for built-in self-testing of circuitry and/or transducers in ultrasound devices
US20210403321A1 (en) * 2020-06-30 2021-12-30 Butterfly Network, Inc. Formation of self-assembled monolayer for ultrasonic transducers
JP2023549917A (ja) 2020-11-19 2023-11-29 カトリーケ・ユニフェルシテイト・ルーヴァン 超音波トランスデューサアレイデバイス
TW202239483A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有不均勻柱腳的電容式微加工超音波換能器
TW202240165A (zh) 2021-03-04 2022-10-16 美商蝴蝶營運公司 具有柱腳的微加工超音波換能器

Family Cites Families (113)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4262399A (en) * 1978-11-08 1981-04-21 General Electric Co. Ultrasonic transducer fabricated as an integral park of a monolithic integrated circuit
JPH01296122A (ja) 1988-05-24 1989-11-29 Matsushita Electric Ind Co Ltd 圧力センサ
US4996627A (en) * 1989-01-30 1991-02-26 Dresser Industries, Inc. High sensitivity miniature pressure transducer
US5744898A (en) * 1992-05-14 1998-04-28 Duke University Ultrasound transducer array with transmitter/receiver integrated circuitry
US5311095A (en) * 1992-05-14 1994-05-10 Duke University Ultrasonic transducer array
US5639423A (en) * 1992-08-31 1997-06-17 The Regents Of The University Of Calfornia Microfabricated reactor
US5894452A (en) * 1994-10-21 1999-04-13 The Board Of Trustees Of The Leland Stanford Junior University Microfabricated ultrasonic immersion transducer
US5619476A (en) * 1994-10-21 1997-04-08 The Board Of Trustees Of The Leland Stanford Jr. Univ. Electrostatic ultrasonic transducer
US5982709A (en) * 1998-03-31 1999-11-09 The Board Of Trustees Of The Leland Stanford Junior University Acoustic transducers and method of microfabrication
JP2000050391A (ja) * 1998-07-31 2000-02-18 Olympus Optical Co Ltd 超音波トランスデューサーおよびその製造方法
US6323580B1 (en) * 1999-04-28 2001-11-27 The Charles Stark Draper Laboratory, Inc. Ferroic transducer
US6271620B1 (en) * 1999-05-20 2001-08-07 Sen Corporation Acoustic transducer and method of making the same
US6262946B1 (en) * 1999-09-29 2001-07-17 The Board Of Trustees Of The Leland Stanford Junior University Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling
US6430109B1 (en) * 1999-09-30 2002-08-06 The Board Of Trustees Of The Leland Stanford Junior University Array of capacitive micromachined ultrasonic transducer elements with through wafer via connections
US6443901B1 (en) * 2000-06-15 2002-09-03 Koninklijke Philips Electronics N.V. Capacitive micromachined ultrasonic transducers
US6854338B2 (en) * 2000-07-14 2005-02-15 The Board Of Trustees Of The Leland Stanford Junior University Fluidic device with integrated capacitive micromachined ultrasonic transducers
US6891711B1 (en) * 2004-04-08 2005-05-10 Kulite Semiconductor Products, Inc. Ultra-miniature, high temperature, capacitive inductive pressure transducer
WO2005114820A2 (en) * 2004-05-14 2005-12-01 The University Of Georgia Research Foundation, Inc. Implantable ultrasonic transducer systems and methods
JP4347885B2 (ja) * 2004-06-03 2009-10-21 オリンパス株式会社 静電容量型超音波振動子の製造方法、当該製造方法によって製造された静電容量型超音波振動子を備えた超音波内視鏡装置、静電容量型超音波プローブおよび静電容量型超音波振動子
US8454513B2 (en) * 2004-12-30 2013-06-04 Stc.Unm Micro-machined medical devices, methods of fabricating microdevices, and methods of medical diagnosis, imaging, stimulation, and treatment
GB0605576D0 (en) * 2006-03-20 2006-04-26 Oligon Ltd MEMS device
JP4271253B2 (ja) * 2006-10-11 2009-06-03 オリンパスメディカルシステムズ株式会社 超音波トランスデューサ、超音波トランスデューサの製造方法、及び超音波内視鏡
JP4271252B2 (ja) 2006-10-12 2009-06-03 オリンパスメディカルシステムズ株式会社 超音波振動子セル、超音波振動子エレメント、超音波振動子アレイ及び超音波診断装置
KR20130014618A (ko) * 2006-11-03 2013-02-07 리써치 트라이앵글 인스티튜트 굴곡 모드 압전 트랜스듀서를 사용하는 보강된 초음파 촬영 프로브
US7616077B1 (en) * 2007-03-22 2009-11-10 Sandia Corporation Microelectromechanical resonator and method for fabrication
JP5408935B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
JP5408937B2 (ja) * 2007-09-25 2014-02-05 キヤノン株式会社 電気機械変換素子及びその製造方法
NZ589503A (en) 2008-05-07 2013-07-26 Signostics Ltd Docking system for medical diagnostic scanning using a handheld device
JP5376982B2 (ja) * 2008-06-30 2013-12-25 キヤノン株式会社 機械電気変換素子と機械電気変換装置および機械電気変換装置の作製方法
JP5851238B6 (ja) * 2009-03-05 2023-12-15 株式会社日立メディコ 超音波トランスデューサ、その製造方法、および、それを用いた超音波探触子
ES2416182T3 (es) * 2009-03-26 2013-07-30 Norwegian University Of Science And Technology (Ntnu) Matriz CMUT de unión de ondas con vías conductoras
US9327316B2 (en) * 2009-06-30 2016-05-03 Avago Technologies General Ip (Singapore) Pte. Ltd. Multi-frequency acoustic array
US8324006B1 (en) * 2009-10-28 2012-12-04 National Semiconductor Corporation Method of forming a capacitive micromachined ultrasonic transducer (CMUT)
JP5671876B2 (ja) * 2009-11-16 2015-02-18 セイコーエプソン株式会社 超音波トランスデューサー、超音波センサー、超音波トランスデューサーの製造方法、および超音波センサーの製造方法
US8329053B2 (en) * 2009-11-23 2012-12-11 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Micromachined transducers and method of fabrication
JP5529577B2 (ja) * 2010-02-14 2014-06-25 キヤノン株式会社 電気機械変換装置及びその作製方法
JP2011244425A (ja) * 2010-04-23 2011-12-01 Canon Inc 電気機械変換装置及びその作製方法
US8471304B2 (en) 2010-06-04 2013-06-25 Carnegie Mellon University Method, apparatus, and system for micromechanical gas chemical sensing capacitor
US9420378B1 (en) * 2010-07-12 2016-08-16 Amkor Technology, Inc. Top port MEMS microphone package and method
CA2814123A1 (en) 2010-10-12 2012-04-19 Micralyne Inc. Soi-based cmut device with buried electrodes
JP5778914B2 (ja) * 2010-11-04 2015-09-16 キヤノン株式会社 電気機械変換装置の製造方法
JP5921079B2 (ja) * 2011-04-06 2016-05-24 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875243B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
JP5875244B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
MX2014008852A (es) * 2012-01-27 2014-10-06 Koninkl Philips Nv Transductor capacitivo micromaquinado y metodo de manufactura del mismo.
JP6209537B2 (ja) * 2012-01-27 2017-10-04 コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. 容量性マイクロマシン・トランスデューサ及びこれを製造する方法
WO2014080310A2 (en) * 2012-11-20 2014-05-30 Koninklijke Philips N.V. Capacitive micro-machined transducer and method of manufacturing the same
WO2014123922A1 (en) 2013-02-05 2014-08-14 Butterfly Network, Inc. Cmos ultrasonic transducers and related apparatus and methods
CA2903479C (en) 2013-03-15 2023-10-10 Butterfly Network, Inc. Monolithic ultrasonic imaging devices, systems and methods
JP6232124B2 (ja) 2013-03-15 2017-11-15 バタフライ ネットワーク,インコーポレイテッド 相補型金属酸化膜半導体(cmos)超音波振動子およびその形成方法
JP5901566B2 (ja) 2013-04-18 2016-04-13 キヤノン株式会社 トランスデューサ、トランスデューサの製造方法、及び被検体情報取得装置
EP2796210B1 (en) * 2013-04-25 2016-11-30 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
EP2796209B1 (en) * 2013-04-25 2020-06-17 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
TWI682817B (zh) 2013-07-23 2020-01-21 美商蝴蝶網路公司 可互連的超音波換能器探頭以及相關的方法和設備
JP6381195B2 (ja) * 2013-10-22 2018-08-29 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
US9834434B2 (en) * 2013-11-19 2017-12-05 Canon Kabushiki Kaisha Capacitive transducer and method of manufacturing the same
JP2015103821A (ja) * 2013-11-20 2015-06-04 キヤノン株式会社 静電容量型トランスデューサ及びその作製方法
CA2929723C (en) * 2013-12-12 2020-09-15 Qualcomm Incorporated Micromechanical ultrasonic transducers and display
WO2015112453A1 (en) * 2014-01-24 2015-07-30 The Regents Of The University Of California Medical devices comprising curved piezoelectric transducers
US9439000B1 (en) * 2014-02-28 2016-09-06 Google Inc. Systems and methods for improved audio output in electronic devices
KR102237662B1 (ko) 2014-04-18 2021-04-09 버터플라이 네트워크, 인크. 상보적 금속 산화물 반도체(cmos) 웨이퍼들 내의 초음파 트랜스듀서들 및 관련 장치 및 방법들
WO2015190429A1 (ja) * 2014-06-13 2015-12-17 株式会社村田製作所 圧電デバイスおよび圧電デバイスの製造方法
BR112017000134A2 (pt) * 2014-07-08 2017-11-07 Qualcomm Inc transdutor ultrassônico piezoelétrico e processo
US9067779B1 (en) 2014-07-14 2015-06-30 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
US9821340B2 (en) * 2014-07-28 2017-11-21 Kolo Medical Ltd. High displacement ultrasonic transducer
US10139479B2 (en) 2014-10-15 2018-11-27 Qualcomm Incorporated Superpixel array of piezoelectric ultrasonic transducers for 2-D beamforming
JP2016101417A (ja) * 2014-11-28 2016-06-02 キヤノン株式会社 静電容量型音響波トランスデューサ及びこれを備えた被検体情報取得装置
EP3233311B1 (en) 2014-12-21 2021-12-08 Chirp Microsystems, Inc. Piezoelectric micromachined ultrasonic transducers with low stress sensitivity and methods of fabrication
US20160219375A1 (en) * 2015-01-23 2016-07-28 Silicon Audio Directional, Llc Multi-mode Microphones
WO2017065691A1 (en) * 2015-10-14 2017-04-20 Agency For Science, Technology And Research Device arrangement
US10497748B2 (en) 2015-10-14 2019-12-03 Qualcomm Incorporated Integrated piezoelectric micromechanical ultrasonic transducer pixel and array
US10175347B2 (en) 2015-12-02 2019-01-08 Butterfly Network, Inc. Ultrasound receiver circuitry and related apparatus and methods
US10187020B2 (en) 2015-12-02 2019-01-22 Butterfly Network, Inc. Trans-impedance amplifier for ultrasound device and related apparatus and methods
JP6632431B2 (ja) * 2016-03-08 2020-01-22 キヤノン株式会社 超音波トランスデューサユニット及びそれを備える情報取得装置
US10082565B2 (en) 2016-03-31 2018-09-25 Butterfly Network, Inc. Multilevel bipolar pulser
US9778348B1 (en) 2016-03-31 2017-10-03 Butterfly Network, Inc. Symmetric receiver switch for bipolar pulser
EP3472829B1 (en) * 2016-06-17 2023-08-16 InvenSense, Inc. Piezoelectric micromachined ultrasonic transducers having stress relief features
TWI721183B (zh) 2016-06-20 2021-03-11 美商蝴蝶網路公司 用於微製造超音波傳感器的電接點配置
US10856840B2 (en) 2016-06-20 2020-12-08 Butterfly Network, Inc. Universal ultrasound device and related apparatus and methods
US10231713B2 (en) 2016-09-13 2019-03-19 Butterfly Network, Inc. Analog-to-digital drive circuitry having built-in time gain compensation functionality for ultrasound applications
JP6833544B2 (ja) * 2017-02-09 2021-02-24 キヤノン株式会社 静電容量型トランスデューサおよびその製造方法
EP3586093A4 (en) 2017-02-27 2021-01-06 Butterfly Network, Inc. CAPACITIVE MICRO-MACHINED ULTRASONIC TRANSDUCERS (CMUT), EQUIPMENT AND ASSOCIATED PROCESSES
US10196261B2 (en) 2017-03-08 2019-02-05 Butterfly Network, Inc. Microfabricated ultrasonic transducers and related apparatus and methods
EP3642611B1 (en) 2017-06-21 2024-02-14 Butterfly Network, Inc. Microfabricated ultrasonic transducer having individual cells with electrically isolated electrode sections
EP3641954B1 (en) 2017-06-23 2024-04-10 BFLY Operations, Inc. Differential ultrasonic transducer element for ultrasound devices
JP6904814B2 (ja) * 2017-06-30 2021-07-21 キヤノン株式会社 中空構造体の製造方法、及び中空構造体
AU2018330436A1 (en) 2017-09-07 2020-02-06 Butterfly Network, Inc. Wrist bound ultrasound-on-a-chip device
EP3709894B1 (en) 2017-11-15 2026-02-25 BFLY Operations, Inc. Ultrasound apparatuses and methods for fabricating ultrasound devices
WO2019099681A1 (en) 2017-11-15 2019-05-23 Butterfly Network, Inc. Ultrasound device with piezoelectric micromachined ultrasonic transducers
US20190299251A1 (en) 2017-11-15 2019-10-03 Butterfly Network, Inc. Apparatuses including a capacitive micromachined ultrasonic transducer directly coupled to an analog-to-digital converter
WO2019152340A1 (en) 2018-01-30 2019-08-08 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
EP3762155B1 (en) 2018-03-09 2023-12-13 BFLY Operations, Inc. Methods for fabricating ultrasound transducer devices
WO2019213449A2 (en) 2018-05-03 2019-11-07 Butterfly Network, Inc. Ultrasound devices
TW201947717A (zh) 2018-05-03 2019-12-16 美商蝴蝶網路公司 用於超音波晶片的垂直封裝及相關方法
CA3105492A1 (en) 2018-07-06 2020-01-09 Butterfly Network, Inc. Methods and apparatuses for packaging an ultrasound-on-a-chip
JP2020018469A (ja) * 2018-07-31 2020-02-06 キヤノン株式会社 静電容量型トランスデューサ、及びそれを用いた超音波プローブ
AU2019350989A1 (en) 2018-09-28 2021-03-25 Butterfly Network, Inc. Fabrication techniques and structures for gettering materials in ultrasonic transducer cavities
TW202034624A (zh) 2018-11-09 2020-09-16 美商蝴蝶網路公司 用於超音波裝置的跨阻抗放大器(tia)
CA3118563A1 (en) 2018-11-13 2020-05-22 Butterfly Network, Inc. Getter technology for micromachined ultrasonic transducer cavities
WO2020102492A1 (en) 2018-11-15 2020-05-22 Butterfly Network, Inc. Anti-stiction bottom cavity surface for micromachined ultrasonic transducer devices
AU2019392906A1 (en) 2018-12-07 2021-07-22 Octant, Inc. Systems for protein-protein interaction screening
TW202026941A (zh) 2018-12-07 2020-07-16 美商蝴蝶網路公司 超音波指紋偵測和相關設備及方法
EP3918886A4 (en) 2019-01-29 2022-11-02 Butterfly Network, Inc. PACKAGING STRUCTURES AND METHODS FOR ULTRASONIC ON-CHIP DEVICES
TW202045099A (zh) 2019-02-07 2020-12-16 美商蝴蝶網路公司 用於微加工超音波傳感器裝置的雙層金屬電極
US11583894B2 (en) 2019-02-25 2023-02-21 Bfly Operations, Inc. Adaptive cavity thickness control for micromachined ultrasonic transducer devices
US11484911B2 (en) 2019-04-12 2022-11-01 Bfly Operations, Inc. Bottom electrode via structures for micromachined ultrasonic transducer devices
CN114555248A (zh) 2019-04-12 2022-05-27 布弗莱运营公司 用于微加工超声换能器器件的分段式吸气剂开口
US20200348794A1 (en) 2019-04-30 2020-11-05 Butterfly Network, Inc. Ultrasound touch detection and related apparatuses and methods
US11501562B2 (en) 2019-04-30 2022-11-15 Bfly Operations, Inc. Ultrasound face scanning and identification apparatuses and methods
US11558062B2 (en) 2019-07-25 2023-01-17 Bfly Operations, Inc. Methods and apparatuses for turning on and off an ADC driver in an ultrasound device
US11684951B2 (en) 2019-08-08 2023-06-27 Bfly Operations, Inc. Micromachined ultrasonic transducer devices having truncated circle shaped cavities
US11921240B2 (en) 2019-09-19 2024-03-05 Bfly Operations, Inc. Symmetric receiver switch for ultrasound devices
WO2021126992A1 (en) 2019-12-17 2021-06-24 Butterfly Network, Inc. Methods and apparatuses for packaging ultrasound-on-chip devices

Also Published As

Publication number Publication date
EP3788798B1 (en) 2023-07-05
US12053323B2 (en) 2024-08-06
CN112075090A (zh) 2020-12-11
WO2019213388A1 (en) 2019-11-07
EP3788798A4 (en) 2022-01-19
US20190336099A1 (en) 2019-11-07
AU2019263404A1 (en) 2020-11-19
US20250090138A1 (en) 2025-03-20
EP3788798A1 (en) 2021-03-10
JP2021522734A (ja) 2021-08-30
KR20210005208A (ko) 2021-01-13
EP3788798C0 (en) 2023-07-05
CN112075090B (zh) 2022-10-14
CA3098911A1 (en) 2019-11-07

Similar Documents

Publication Publication Date Title
TW202000137A (zh) 互補式金屬氧化物半導體感測器上超音波換能器的壓力口
EP3132470B1 (en) Ultrasonic transducers in complementary metal oxide semiconductor (cmos) wafers and related apparatus and methods
CN103221795B (zh) 包括参考电容器的微机电压力传感器
US7545075B2 (en) Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same
US20110062535A1 (en) Mems transducers
US8955212B2 (en) Method for manufacturing a micro-electro-mechanical microphone
CN106575673A (zh) 密封腔体中的独立式和非独立式的基于金属和金属合金的mems结构的晶片级单片cmos集成及其形成方法
CN110798788B (zh) 一种mems结构及其形成方法
US9530692B2 (en) Method of forming through wiring
Helin et al. Poly-SiGe-based CMUT array with high acoustical pressure
TWI732688B (zh) 壓電微機械超聲波換能器及其製作方法
GB2459863A (en) MEMS ultrasonic transducer array
KR102832086B1 (ko) 마이크로머신된 초음파 변환자 및 그 제조 방법
GB2459866A (en) MEMS transducers
US20210403321A1 (en) Formation of self-assembled monolayer for ultrasonic transducers
TWI747362B (zh) 壓電微機械超聲波換能器及其製作方法
CN107215844A (zh) 一种膜片结构及其制作方法
Meloche A MEMS non-planar ultrasonic microarray.