CN111987241A - 减压干燥装置 - Google Patents

减压干燥装置 Download PDF

Info

Publication number
CN111987241A
CN111987241A CN202010390887.5A CN202010390887A CN111987241A CN 111987241 A CN111987241 A CN 111987241A CN 202010390887 A CN202010390887 A CN 202010390887A CN 111987241 A CN111987241 A CN 111987241A
Authority
CN
China
Prior art keywords
solvent
substrate
boiling point
reduced
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202010390887.5A
Other languages
English (en)
Chinese (zh)
Inventor
及川纯史
林辉幸
成本洋介
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN111987241A publication Critical patent/CN111987241A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F26—DRYING
    • F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
    • F26B21/00—Arrangements or duct systems, e.g. in combination with pallet boxes, for supplying and controlling air or gases for drying solid materials or objects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Drying Of Solid Materials (AREA)
CN202010390887.5A 2019-05-21 2020-05-11 减压干燥装置 Pending CN111987241A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019095437A JP7316095B2 (ja) 2019-05-21 2019-05-21 減圧乾燥装置
JP2019-095437 2019-05-21

Publications (1)

Publication Number Publication Date
CN111987241A true CN111987241A (zh) 2020-11-24

Family

ID=73441729

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010390887.5A Pending CN111987241A (zh) 2019-05-21 2020-05-11 减压干燥装置

Country Status (4)

Country Link
JP (1) JP7316095B2 (ko)
KR (1) KR20200134157A (ko)
CN (1) CN111987241A (ko)
TW (1) TW202100925A (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115366546A (zh) * 2021-05-21 2022-11-22 广东聚华印刷显示技术有限公司 干燥装置

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022234716A1 (ja) * 2021-05-06 2022-11-10 東京エレクトロン株式会社 減圧乾燥装置、減圧乾燥処理方法、減圧乾燥処理の所要時間の短縮方法
JP2023020269A (ja) * 2021-07-30 2023-02-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186419A (ja) * 2002-12-03 2004-07-02 Tokyo Electron Ltd 減圧乾燥装置、塗布膜形成装置及び減圧乾燥方法
JP2010169308A (ja) * 2009-01-22 2010-08-05 Panasonic Corp 乾燥装置
JP2013249998A (ja) * 2012-05-31 2013-12-12 Konica Minolta Inc 塗布膜の乾燥装置及び乾燥方法
CN104228329A (zh) * 2013-06-06 2014-12-24 东京毅力科创株式会社 干燥装置和干燥处理方法
CN107871828A (zh) * 2016-09-23 2018-04-03 东京毅力科创株式会社 减压干燥装置和减压干燥方法
CN108987310A (zh) * 2017-05-31 2018-12-11 东京毅力科创株式会社 减压干燥装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6909617B2 (ja) * 2016-09-30 2021-07-28 東京エレクトロン株式会社 減圧乾燥装置
JP2018059597A (ja) 2016-10-07 2018-04-12 大日本印刷株式会社 保冷保温箱

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004186419A (ja) * 2002-12-03 2004-07-02 Tokyo Electron Ltd 減圧乾燥装置、塗布膜形成装置及び減圧乾燥方法
JP2010169308A (ja) * 2009-01-22 2010-08-05 Panasonic Corp 乾燥装置
JP2013249998A (ja) * 2012-05-31 2013-12-12 Konica Minolta Inc 塗布膜の乾燥装置及び乾燥方法
CN104228329A (zh) * 2013-06-06 2014-12-24 东京毅力科创株式会社 干燥装置和干燥处理方法
CN107871828A (zh) * 2016-09-23 2018-04-03 东京毅力科创株式会社 减压干燥装置和减压干燥方法
CN108987310A (zh) * 2017-05-31 2018-12-11 东京毅力科创株式会社 减压干燥装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115366546A (zh) * 2021-05-21 2022-11-22 广东聚华印刷显示技术有限公司 干燥装置
CN115366546B (zh) * 2021-05-21 2024-03-29 广东聚华印刷显示技术有限公司 干燥装置

Also Published As

Publication number Publication date
TW202100925A (zh) 2021-01-01
JP7316095B2 (ja) 2023-07-27
JP2020190361A (ja) 2020-11-26
KR20200134157A (ko) 2020-12-01

Similar Documents

Publication Publication Date Title
CN111987241A (zh) 减压干燥装置
TWI657225B (zh) 乾燥裝置及乾燥處理方法（一）
KR102060059B1 (ko) 건조 장치
KR102023817B1 (ko) 감압 건조 장치
CN110048027B (zh) 干燥装置和干燥处理方法
KR20160045012A (ko) 액적 토출 장치, 액적 토출 방법
TWI766997B (zh) 減壓乾燥裝置及減壓乾燥方法
CN107878044B (zh) 减压干燥装置
KR20190017699A (ko) 감압 건조 장치
CN111834553A (zh) 减压干燥装置
KR20200132705A (ko) 감압 건조 장치 및 용매 포집 부재의 제조 방법
WO2022234716A1 (ja) 減圧乾燥装置、減圧乾燥処理方法、減圧乾燥処理の所要時間の短縮方法
JP2022170308A (ja) 減圧乾燥装置及び減圧乾燥処理方法
KR20210126504A (ko) 감압 건조 장치 및 감압 건조 방법
JP2022172684A (ja) 減圧乾燥装置、減圧乾燥処理方法、減圧乾燥処理の所要時間の短縮方法
JP2022172691A (ja) 減圧乾燥装置、減圧乾燥処理方法、減圧乾燥処理の所要時間の短縮方法
JP2022172679A (ja) 減圧乾燥装置、減圧乾燥処理方法、減圧乾燥処理の所要時間の短縮方法
KR102206766B1 (ko) 감압 건조 장치
CN111952483A (zh) 减压干燥装置和溶剂收集部件的制造方法
JP2020060367A (ja) 乾燥装置及び乾燥処理方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination