CN111948904B - 光刻胶组合物、用它形成光刻图案的方法及其用途 - Google Patents
光刻胶组合物、用它形成光刻图案的方法及其用途 Download PDFInfo
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- CN111948904B CN111948904B CN202010811408.2A CN202010811408A CN111948904B CN 111948904 B CN111948904 B CN 111948904B CN 202010811408 A CN202010811408 A CN 202010811408A CN 111948904 B CN111948904 B CN 111948904B
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Classifications
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
Description
Claims (14)
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Application Number | Priority Date | Filing Date | Title |
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CN202010811408.2A CN111948904B (zh) | 2020-08-13 | 2020-08-13 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
PCT/CN2021/110474 WO2022033366A1 (zh) | 2020-08-13 | 2021-08-04 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
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CN202010811408.2A CN111948904B (zh) | 2020-08-13 | 2020-08-13 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
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CN111948904A CN111948904A (zh) | 2020-11-17 |
CN111948904B true CN111948904B (zh) | 2022-04-01 |
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CN (1) | CN111948904B (zh) |
WO (1) | WO2022033366A1 (zh) |
Families Citing this family (6)
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CN111965947B (zh) * | 2020-08-13 | 2022-04-01 | 常州华睿芯材科技有限公司 | 光刻胶、光刻胶的图案化方法及集成电路板的刻蚀方法 |
CN111948904B (zh) * | 2020-08-13 | 2022-04-01 | 常州华睿芯材科技有限公司 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
CN112462572B (zh) * | 2020-12-09 | 2022-08-16 | 清华大学 | 光刻胶、光刻胶的图案化方法及生成印刷电路板的方法 |
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WO2023246243A1 (zh) * | 2022-06-21 | 2023-12-28 | 清华大学 | 一种紫外光刻胶、紫外光刻胶图案化的方法及用途 |
CN115407607B (zh) * | 2022-06-28 | 2024-07-26 | 大连理工大学 | 一类锌氧簇化合物在光刻胶领域的应用 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120054152A (ko) * | 2010-11-19 | 2012-05-30 | (재)나노소자특화팹센터 | 나노 임프린트용 나노패턴 스탬프 제조 방법 |
CN104049457A (zh) * | 2013-03-11 | 2014-09-17 | 太阳油墨制造株式会社 | 光固化性树脂组合物、其干膜和固化物、以及具有使用它们形成的固化皮膜的印刷电路板 |
CN106030417A (zh) * | 2014-02-21 | 2016-10-12 | 东京毅力科创株式会社 | 光增感化学放大型抗蚀剂材料及使用了其的图案形成方法、半导体器件、光刻用掩模、以及纳米压印用模板 |
JP2017036435A (ja) * | 2015-07-29 | 2017-02-16 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | ナノ粒子ポリマーレジスト |
WO2018195143A1 (en) * | 2017-04-18 | 2018-10-25 | The University Of Chicago | Photoactive, inorganic ligand-capped inorganic nanocrystals |
WO2019005161A1 (en) * | 2017-06-30 | 2019-01-03 | Intel Corporation | METHOD AND COMPOUND FOR CONTROLLING PATTERN FORMATION ON RESIST MATERIAL |
CN109154772A (zh) * | 2016-05-19 | 2019-01-04 | Asml荷兰有限公司 | 抗蚀剂组合物 |
CN110361934A (zh) * | 2018-03-26 | 2019-10-22 | 东友精细化工有限公司 | 光转换树脂组合物 |
WO2019220835A1 (ja) * | 2018-05-14 | 2019-11-21 | Jsr株式会社 | パターン形成方法及び感放射線性組成物 |
CN110609443A (zh) * | 2018-06-15 | 2019-12-24 | 台湾积体电路制造股份有限公司 | 光阻化合物 |
WO2020004172A1 (ja) * | 2018-06-29 | 2020-01-02 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150234272A1 (en) * | 2014-02-14 | 2015-08-20 | Intel Corporation | Metal oxide nanoparticles and photoresist compositions |
CN107844028B (zh) * | 2017-11-07 | 2021-04-30 | 潍坊星泰克微电子材料有限公司 | 一种光刻胶、制备方法及其光刻工艺 |
CN111948904B (zh) * | 2020-08-13 | 2022-04-01 | 常州华睿芯材科技有限公司 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
-
2020
- 2020-08-13 CN CN202010811408.2A patent/CN111948904B/zh active Active
-
2021
- 2021-08-04 WO PCT/CN2021/110474 patent/WO2022033366A1/zh active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20120054152A (ko) * | 2010-11-19 | 2012-05-30 | (재)나노소자특화팹센터 | 나노 임프린트용 나노패턴 스탬프 제조 방법 |
CN104049457A (zh) * | 2013-03-11 | 2014-09-17 | 太阳油墨制造株式会社 | 光固化性树脂组合物、其干膜和固化物、以及具有使用它们形成的固化皮膜的印刷电路板 |
CN106030417A (zh) * | 2014-02-21 | 2016-10-12 | 东京毅力科创株式会社 | 光增感化学放大型抗蚀剂材料及使用了其的图案形成方法、半导体器件、光刻用掩模、以及纳米压印用模板 |
JP2017036435A (ja) * | 2015-07-29 | 2017-02-16 | ローム アンド ハース エレクトロニック マテリアルズ エルエルシーRohm and Haas Electronic Materials LLC | ナノ粒子ポリマーレジスト |
CN109154772A (zh) * | 2016-05-19 | 2019-01-04 | Asml荷兰有限公司 | 抗蚀剂组合物 |
WO2018195143A1 (en) * | 2017-04-18 | 2018-10-25 | The University Of Chicago | Photoactive, inorganic ligand-capped inorganic nanocrystals |
CN110832618A (zh) * | 2017-04-18 | 2020-02-21 | 芝加哥大学 | 光活性无机配体覆盖的无机纳米晶体 |
WO2019005161A1 (en) * | 2017-06-30 | 2019-01-03 | Intel Corporation | METHOD AND COMPOUND FOR CONTROLLING PATTERN FORMATION ON RESIST MATERIAL |
CN110361934A (zh) * | 2018-03-26 | 2019-10-22 | 东友精细化工有限公司 | 光转换树脂组合物 |
WO2019220835A1 (ja) * | 2018-05-14 | 2019-11-21 | Jsr株式会社 | パターン形成方法及び感放射線性組成物 |
CN110609443A (zh) * | 2018-06-15 | 2019-12-24 | 台湾积体电路制造股份有限公司 | 光阻化合物 |
WO2020004172A1 (ja) * | 2018-06-29 | 2020-01-02 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
Non-Patent Citations (9)
Title |
---|
Development of metal organic cluster EUV photoresists;Sakai, Kazunori等;《PROCEEDINGS OF SPIE》;2019;第1096015卷;全文 * |
EUV photolithography: resist progress and challenges;Ober Christopher等;《PROCEEDINGS OF SPIE》;2018;第10583卷;全文 * |
EUV photolithography: resist progress in metal–organic complex photoresists;Hong Xu等;《JOURNAL OF MICRO/NANOLITHOGRAPHY MEMS,AND MOEMS》;2018;第18卷(第1期);全文 * |
Mechanistic insights in Zr- and Hf-based molecular hybrid EUV photoresists;Wu, LJ等;《JOURNAL OF MICRO/NANOLITHOGRAPHY MEMS,AND MOEMS》;2019;第18卷(第1期);全文 * |
Metal Organic Cluster Photoresists for EUV Lithography;Kazunori Sakai等;《Journal of Photopolymer Science and Technology》;2019;第32卷(第5期);全文 * |
Metal organic cluster photoresists: new metal oxide systems;Sakai, Kazunori等;《PROCEEDINGS OF SPIE》;2019;第1096306卷;全文 * |
Radical sensitive zinc-based nanoparticle EUV photoresists;Yang Kou等;《PROCEEDINGS OF SPIE》;2019;第10960卷;全文 * |
The Challenges of Highly Sensitive EUV Photoresists;Ober, CK等;《JOURNAL OF PHOTOPOLYMER SCIENCE AND TECHNOLOGY》;20180625;第31卷(第2期);第261-264页 * |
Ti, Zr, and Hf-based molecular hybrid materials as EUV photoresists;Castellanos, S等;《Proceedings of SPIE》;2018;第10583卷;全文 * |
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