JP2017036435A - ナノ粒子ポリマーレジスト - Google Patents
ナノ粒子ポリマーレジスト Download PDFInfo
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- JP2017036435A JP2017036435A JP2016145457A JP2016145457A JP2017036435A JP 2017036435 A JP2017036435 A JP 2017036435A JP 2016145457 A JP2016145457 A JP 2016145457A JP 2016145457 A JP2016145457 A JP 2016145457A JP 2017036435 A JP2017036435 A JP 2017036435A
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- alkyl
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- 239000002105 nanoparticle Substances 0.000 title claims abstract description 73
- 229920000642 polymer Polymers 0.000 title claims abstract description 40
- 239000000178 monomer Substances 0.000 claims abstract description 47
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 40
- 239000000203 mixture Substances 0.000 claims abstract description 35
- 239000012986 chain transfer agent Substances 0.000 claims abstract description 22
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 239000003446 ligand Substances 0.000 claims abstract description 17
- 239000002131 composite material Substances 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims description 42
- 125000000217 alkyl group Chemical group 0.000 claims description 39
- 238000000034 method Methods 0.000 claims description 29
- 150000003839 salts Chemical class 0.000 claims description 25
- 229910052799 carbon Inorganic materials 0.000 claims description 18
- 150000002148 esters Chemical class 0.000 claims description 18
- 238000006116 polymerization reaction Methods 0.000 claims description 18
- 150000001413 amino acids Chemical class 0.000 claims description 16
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 15
- 229910052739 hydrogen Inorganic materials 0.000 claims description 14
- 125000006651 (C3-C20) cycloalkyl group Chemical group 0.000 claims description 13
- 229910052731 fluorine Inorganic materials 0.000 claims description 13
- 150000002596 lactones Chemical class 0.000 claims description 12
- ABLZXFCXXLZCGV-UHFFFAOYSA-N Phosphorous acid Chemical compound OP(O)=O ABLZXFCXXLZCGV-UHFFFAOYSA-N 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 10
- 125000003709 fluoroalkyl group Chemical group 0.000 claims description 10
- 125000003367 polycyclic group Chemical group 0.000 claims description 10
- 150000001735 carboxylic acids Chemical class 0.000 claims description 9
- 150000001450 anions Chemical group 0.000 claims description 8
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 8
- 125000002950 monocyclic group Chemical group 0.000 claims description 8
- 125000003545 alkoxy group Chemical group 0.000 claims description 7
- 125000000962 organic group Chemical group 0.000 claims description 7
- 229910052717 sulfur Inorganic materials 0.000 claims description 7
- 125000002947 alkylene group Chemical group 0.000 claims description 6
- 229910052740 iodine Inorganic materials 0.000 claims description 6
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 5
- 150000002825 nitriles Chemical class 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 claims description 5
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 claims description 4
- 230000003213 activating effect Effects 0.000 claims description 4
- JHRWWRDRBPCWTF-OLQVQODUSA-N captafol Chemical compound C1C=CC[C@H]2C(=O)N(SC(Cl)(Cl)C(Cl)Cl)C(=O)[C@H]21 JHRWWRDRBPCWTF-OLQVQODUSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 125000005010 perfluoroalkyl group Chemical group 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 3
- 125000004104 aryloxy group Chemical group 0.000 claims description 3
- 125000004122 cyclic group Chemical group 0.000 claims description 3
- 125000004428 fluoroalkoxy group Chemical group 0.000 claims description 3
- 125000004407 fluoroaryl group Chemical group 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 125000000923 (C1-C30) alkyl group Chemical group 0.000 claims description 2
- 125000006376 (C3-C10) cycloalkyl group Chemical group 0.000 claims description 2
- 229910010413 TiO 2 Inorganic materials 0.000 claims description 2
- 229940124530 sulfonamide Drugs 0.000 claims description 2
- 150000003456 sulfonamides Chemical class 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 10
- 230000035945 sensitivity Effects 0.000 abstract description 2
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 35
- 239000002904 solvent Substances 0.000 description 29
- -1 malium Chemical compound 0.000 description 26
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 25
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 22
- 235000001014 amino acid Nutrition 0.000 description 17
- 229940024606 amino acid Drugs 0.000 description 17
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 14
- 229920001577 copolymer Polymers 0.000 description 14
- 239000003999 initiator Substances 0.000 description 14
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- 150000001768 cations Chemical class 0.000 description 11
- 229940116333 ethyl lactate Drugs 0.000 description 11
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 10
- 239000000047 product Substances 0.000 description 10
- 239000007787 solid Substances 0.000 description 10
- FAYMLNNRGCYLSR-UHFFFAOYSA-M triphenylsulfonium triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FAYMLNNRGCYLSR-UHFFFAOYSA-M 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 9
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 239000010408 film Substances 0.000 description 9
- 229910044991 metal oxide Inorganic materials 0.000 description 9
- 150000004706 metal oxides Chemical class 0.000 description 9
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 9
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 9
- 239000004926 polymethyl methacrylate Substances 0.000 description 9
- 238000002411 thermogravimetry Methods 0.000 description 9
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 8
- 150000001875 compounds Chemical group 0.000 description 8
- 238000002296 dynamic light scattering Methods 0.000 description 8
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 8
- 230000008569 process Effects 0.000 description 8
- 125000002733 (C1-C6) fluoroalkyl group Chemical group 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 150000003254 radicals Chemical class 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000001228 spectrum Methods 0.000 description 7
- 239000004094 surface-active agent Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 6
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 6
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 6
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 6
- 238000000089 atomic force micrograph Methods 0.000 description 6
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 6
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 6
- 125000001153 fluoro group Chemical group F* 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 6
- 238000012546 transfer Methods 0.000 description 6
- 239000000654 additive Substances 0.000 description 5
- 238000011161 development Methods 0.000 description 5
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 5
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 5
- 239000004810 polytetrafluoroethylene Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- ZGSOBQAJAUGRBK-UHFFFAOYSA-N propan-2-olate;zirconium(4+) Chemical compound [Zr+4].CC(C)[O-].CC(C)[O-].CC(C)[O-].CC(C)[O-] ZGSOBQAJAUGRBK-UHFFFAOYSA-N 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 4
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 4
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 150000001412 amines Chemical class 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- 238000012512 characterization method Methods 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 150000002576 ketones Chemical class 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 238000000746 purification Methods 0.000 description 4
- 239000011541 reaction mixture Substances 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 3
- 150000001408 amides Chemical class 0.000 description 3
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 125000004432 carbon atom Chemical group C* 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007334 copolymerization reaction Methods 0.000 description 3
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 238000000609 electron-beam lithography Methods 0.000 description 3
- 238000009472 formulation Methods 0.000 description 3
- 238000002955 isolation Methods 0.000 description 3
- 229960004592 isopropanol Drugs 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 3
- 238000001556 precipitation Methods 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
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- 230000002441 reversible effect Effects 0.000 description 3
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- 238000000371 solid-state nuclear magnetic resonance spectroscopy Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- FANGJHIVJLBOFM-UHFFFAOYSA-M 1,1-difluoro-2-(2-methylprop-2-enoyloxy)ethanesulfonate;triphenylsulfanium Chemical compound CC(=C)C(=O)OCC(F)(F)S([O-])(=O)=O.C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 FANGJHIVJLBOFM-UHFFFAOYSA-M 0.000 description 2
- WSLDOOZREJYCGB-UHFFFAOYSA-N 1,2-Dichloroethane Chemical compound ClCCCl WSLDOOZREJYCGB-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- MLRVZFYXUZQSRU-UHFFFAOYSA-N 1-chlorohexane Chemical compound CCCCCCCl MLRVZFYXUZQSRU-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- MISYYDHMQJZYMH-UHFFFAOYSA-N 2-ethenylnaphthalene-1-carboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=C(C=C)C=CC2=C1 MISYYDHMQJZYMH-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- WVYWICLMDOOCFB-UHFFFAOYSA-N 4-methyl-2-pentanol Chemical compound CC(C)CC(C)O WVYWICLMDOOCFB-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 2
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- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 2
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- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 235000011054 acetic acid Nutrition 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 125000002877 alkyl aryl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
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- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- 230000008034 disappearance Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
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- 125000004185 ester group Chemical group 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
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- 238000002474 experimental method Methods 0.000 description 2
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- 238000013467 fragmentation Methods 0.000 description 2
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- 125000000524 functional group Chemical group 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 2
- HMKGKDSPHSNMTM-UHFFFAOYSA-N hafnium;propan-2-ol Chemical compound [Hf].CC(C)O.CC(C)O.CC(C)O.CC(C)O HMKGKDSPHSNMTM-UHFFFAOYSA-N 0.000 description 2
- 150000008282 halocarbons Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 238000004128 high performance liquid chromatography Methods 0.000 description 2
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- 239000011572 manganese Substances 0.000 description 2
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- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
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- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- 238000000108 ultra-filtration Methods 0.000 description 2
- 230000004580 weight loss Effects 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
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- JGTNAGYHADQMCM-UHFFFAOYSA-N perfluorobutanesulfonic acid Chemical compound OS(=O)(=O)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F JGTNAGYHADQMCM-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- COLNVLDHVKWLRT-UHFFFAOYSA-N phenylalanine Natural products OC(=O)C(N)CC1=CC=CC=C1 COLNVLDHVKWLRT-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- PUDIUYLPXJFUGB-UHFFFAOYSA-N praseodymium atom Chemical compound [Pr] PUDIUYLPXJFUGB-UHFFFAOYSA-N 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- VQMWBBYLQSCNPO-UHFFFAOYSA-N promethium atom Chemical compound [Pm] VQMWBBYLQSCNPO-UHFFFAOYSA-N 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000425 proton nuclear magnetic resonance spectrum Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 229910052701 rubidium Inorganic materials 0.000 description 1
- IGLNJRXAVVLDKE-UHFFFAOYSA-N rubidium atom Chemical compound [Rb] IGLNJRXAVVLDKE-UHFFFAOYSA-N 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052706 scandium Inorganic materials 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- CIOAGBVUUVVLOB-UHFFFAOYSA-N strontium atom Chemical compound [Sr] CIOAGBVUUVVLOB-UHFFFAOYSA-N 0.000 description 1
- 150000004763 sulfides Chemical class 0.000 description 1
- 150000003462 sulfoxides Chemical class 0.000 description 1
- 230000002194 synthesizing effect Effects 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229910052713 technetium Inorganic materials 0.000 description 1
- GKLVYJBZJHMRIY-UHFFFAOYSA-N technetium atom Chemical compound [Tc] GKLVYJBZJHMRIY-UHFFFAOYSA-N 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- GZCRRIHWUXGPOV-UHFFFAOYSA-N terbium atom Chemical compound [Tb] GZCRRIHWUXGPOV-UHFFFAOYSA-N 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- WYKYCHHWIJXDAO-UHFFFAOYSA-N tert-butyl 2-ethylhexaneperoxoate Chemical compound CCCCC(CC)C(=O)OOC(C)(C)C WYKYCHHWIJXDAO-UHFFFAOYSA-N 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BWSZXUOMATYHHI-UHFFFAOYSA-N tert-butyl octaneperoxoate Chemical compound CCCCCCCC(=O)OOC(C)(C)C BWSZXUOMATYHHI-UHFFFAOYSA-N 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 231100000331 toxic Toxicity 0.000 description 1
- 230000002588 toxic effect Effects 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- HIZCIEIDIFGZSS-UHFFFAOYSA-L trithiocarbonate Chemical group [S-]C([S-])=S HIZCIEIDIFGZSS-UHFFFAOYSA-L 0.000 description 1
- OUYCCCASQSFEME-UHFFFAOYSA-N tyrosine Natural products OC(=O)C(N)CC1=CC=C(O)C=C1 OUYCCCASQSFEME-UHFFFAOYSA-N 0.000 description 1
- 239000004474 valine Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- NAWDYIZEMPQZHO-UHFFFAOYSA-N ytterbium Chemical compound [Yb] NAWDYIZEMPQZHO-UHFFFAOYSA-N 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/094—Multilayer resist systems, e.g. planarising layers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2037—Exposure with X-ray radiation or corpuscular radiation, through a mask with a pattern opaque to that radiation
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/325—Non-aqueous compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70008—Production of exposure light, i.e. light sources
- G03F7/70033—Production of exposure light, i.e. light sources by plasma extreme ultraviolet [EUV] sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
- H01L21/0274—Photolithographic processes
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- Engineering & Computer Science (AREA)
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- Structural Engineering (AREA)
- Architecture (AREA)
- Ceramic Engineering (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
Abstract
Description
金属酸化物ナノ粒子は、近年、フォトレジストにおける使用のために開発されている。有機リガンド(例えば、メタクリル酸)で取り囲まれた金属酸化物(例えば、HfO2またはZrO2)のうちのいくつかは、EUV波長でパターン形成され得る。このプロセス中に、リガンドが金属酸化物に添加されてナノ粒子凝集体を形成し、これが光酸発生剤と組み合わせられて、フォトレジストを形成する。(PGMEA等の)溶媒からコーティングされたこれらのフォトレジストは、ポジ型(塩基水溶液)またはネガ型(2−ヘプタノン)のいずれかとして現像され得る。
コア及びコアを取り囲むコーティングを含むナノ粒子と、
ポリマーと、を含むブレンドである複合体であって、
ナノ粒子のコーティングは、リガンドを含み、リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、複合体を提供する。
コア及びコアを取り囲むコーティングを含むナノ粒子と、
ポリマーと、を混合することを含み、
ナノ粒子のコーティングは、リガンドを含み、リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、方法を提供する。
ポリマーと、を含むブレンドである複合体であって、
ナノ粒子のコーティングは、リガンドを含み、リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、複合体が本明細書に開示される。
Xは、SまたはIであり、
各Rcは、ハロゲン化または非ハロゲン化であり、独立して、C1−30アルキル基、多環式または単環式C3−30シクロアルキル基、多環式または単環式C4−30アリール基であり、
XがSのとき、Rc基のうちの1つは、単結合により1つの隣接するRc基に任意選択的に結合し、zは、2または3であり、
XがIのとき、zは2であるか、またはXがSのとき、zは3である。
Xは、IまたはSであり、
Rh、Ri、Rj、及びRkは各々独立して、ヒドロキシ、ニトリル、ハロゲン、C1−10アルキル、C1−10フルオロアルキル、C1−10アルコキシ、C1−10フルオロアルコキシ、C6−20アリール、C6−20フルオロアリール、C6−20アリールオキシ、またはC6−20フルオロアリールオキシであり、
Ar1及びAr2は独立して、C10−30縮合または単結合多環式アリール基であり、
Rlは、XがIである孤立電子対であるか、またはXがSであるC6−20アリール基であり、
pは、2または3の整数であり、XがIのとき、pは2であり、XがSの場合、pは3であり、
q及びrは各々独立して、0〜5の整数であり、
s及びtは各々独立して、0〜4の整数である。
式中、各Raは独立して、H、F、C1−6アルキル、またはC1−6フルオロアルキルであり、
kは、0〜4の整数であり、
lは、0〜3の整数であり、
G+は、式(V)のカチオンである。
Rbは独立して、H、C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルであり、各Rbは分離しているか、または少なくとも1つのRbが隣接するRbに結合して、環状構造を形成する。ある実施形態において、式(IV)のRbを含む三級基は、t−ブチル基であり得る。別の実施形態において、式(IV)は、シクロアルキル構造を含み得、これは1−メチルシクロペンチル、1−エチルシクロペンチル、及び1−メチルシクロヘキシル等の2つ以上のRb基を組み込む。
Raは、H、F、C1−6アルキル、またはC1−6フルオロアルキルであり、Rは、C1−10アルキル、シクロアルキル、またはヘテロシクロアルキルであり、
wは、0〜6の整数である。
xは、0または1であり、
Zは、y価のC1−20有機基である。
Rmは、C1−10アルキル、C1−10アルコキシ、C3−10シクロアルキル、C6−10アリール、またはC7−10アラルキル基であり、zは、0〜5の整数であり、
Rcは、置換または非置換であり、かつC1−10アルキルまたはC6−10アリール基である。
式中、Rは独立して、H、C1−20アルキル、C1−20アルコキシ、C6−20アリール、またはC6−20アルキルアリールである。他の光破壊性塩基には、例えば、2−ニトロベンジル基及びベンゾイン基等の非イオンの光分解発色団に基づくものが挙げられる。例となる光塩基発生剤は、オルト−ニトロベンジルカルバメートである。
コア及びコアを取り囲むコーティングを含むナノ粒子と、
ポリマーと、を混合することを含み、
ナノ粒子のコーティングは、リガンドを含み、リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、方法がさらに提供される。
ジルコニウムイソプロポキシド及びハフニウムイソプロポキシドをStrem Chemicalsから購入した。ミリQ水(25℃で18.2MΩ.cm)をすべての実験で使用した。メチルメタクリレート(MMA)をAldrichから入手し、塩基性アルミナ(Aldrich)を通して濾過して、抑制物質を除去した。2,2’−アゾビスイソブチロニトリル(AIBN;Aldrich)をメタノールから再結晶化させた。2−シアノプロパン−2−イルジチオベンゾエート(CPDB)、イソ酪酸(IBA)、トリフェニルスルホニウムトリフレート(TPST)、及び乳酸エチルをAldrichから購入し、受け取ったままで使用した。トリフェニルスルホニウム1,1−ジフルオロ−2−(メタクリロイルオキシ)エタン−1−スルホン酸(TPS F2 PAGモノマー)はDow Chemicalsにより提供されており、受け取ったままで使用した。他のすべての溶媒及び化学物質は、試薬等級であった。
1H核磁気共鳴(NMR)分光法
すべてのNMRスペクトルを、外部ロック(CDCl3)を使用して400MHz及び298Kで動作し、かつ標準内部基準(溶媒基準)を利用するBruker AV3400分光計で記録した。スペクトルを256走査で収集した。試料を重水素化アセトンまたはクロロホルム中で調製した。
SS−NMRは非破壊的であり、分析のために非常に少量の材料(50mg以下)しか必要としない。すべてのSS−NMR試料を、2チャネルBruker Avance III分光計と連動する7.41テスラ(300MHz周波数)広口径超伝導磁石で行った。
TGAを、N2雰囲気下で、Mettler Toledo計器STARe熱重量分析器で行った。試料を10℃/分の加熱速度で、室温から550℃に加熱した。
流体力学的径測定(粒子サイズ及びナノ粒子の分布)を、173°の固定散乱角でZetasizer(Malvern Instrument)を使用して決定した。実験を25℃で行った。乳酸エチル中のナノ粒子の希釈溶液を分析した。
TEM画像を、Olympus soft imaging solutions veleta 2k×2k広角デジタルカメラを装備したJEOL 1010透過型電子顕微鏡で撮影した。
ATR−FTIRスペクトルを、Nicolet Smart Orbit一回反射ダイアモンドATR付属品を装備したNicolet Nexus 5700 FTIR分光計(Thermo Electron Corp.,Waltham,MA)で得た。スペクトルを8cm−1分解能、256走査で記録した。
空気中のAFMを、タッピングモードの独立型MFP−3D器具を使用して行った。AFMを防振台(Herzan LLC)に装着し、音響隔離包囲空間(TMC)内で動作させた。
ZrO2−IBAナノ粒子(ZrO2−イソ酪酸リガンドでキャッピングしたナノ粒子)の合成
ZrO2−IBAナノ粒子(20mg)及びTPST(3mg)を、25mg/mLのZrO2−IBAの濃度及びナノ粒子の重量に対して15%のTPSTを調合するように乳酸エチル(0.8mL)に溶解した。次いで、レジスト溶液を0.22μmのPTFEフィルタを通して濾過した。
HfO2−IBAナノ粒子(20mg)及びTPST(3mg)を、25mg/mLのHfO2−IBAの濃度及びナノ粒子の重量に対して15%のTPSTを調合するように乳酸エチル(0.8mL)に溶解した。次いで、レジスト溶液を0.22μmのPTFEフィルタを通して濾過した。
ZrO2−IBA(16.25mg)及びPMMA22−CO−PPAG2共重(1.69mg)を、25mg/mLのZrO2−IBAの濃度及びZrO2−IBAの重量に対して10%のPMMA22−CO−PPAG2共重(すなわち、システム中3%のPPAG当量)を調合するように乳酸エチル(0.65mL)に溶解した。次いで、レジスト溶液を0.22μmのPTFEフィルタを通して濾過した。
ZrO2−IBA(25mg/mL)及び特定の%のTPST(またはPMMA−CO−PPAG共重)を含有するレジスト溶液を、洗浄したベアSiウエハー(7.5mm×7.5mm)内にスピンコーティングした。スピンコーティング条件:1分当たり200回転(rpm)で3秒間(sec)、次いで2,000rpmで60秒間。膜厚をFilmTekによって測定した。
Siウエハーを、HPLC等級アセトン中で5分間超音波処理し、続いてHPLC等級IPA中でさらに5分間超音波処理した。次いで、Siウエハーを、窒素ガスを使用して乾燥させ、ホットプレート上に150℃で10分間載せた。
スピンコーティング後、ウエハーを、EBLを用いて10〜20kVの加速電圧で、10μmの開孔、20nmのステップサイズ、及び7.7mmの作動距離を使用してパターン形成した。パターンをRaithのソフトウェアを使用して設計し、100nmの限界寸法(CD)でのライン/間隔パターンを含んだ。
電子線の露光後、膜を溶媒系現像剤によって特定の持続時間下で現像し、N2ガス流で乾燥させ、ネガ型レジストを形成した。例えば、10%のPMMA22−CO−PPAG2共重(すなわち、3%のPPAG)とブレンドしたZrO2−IBA(25mg/mL)システムについては、露光した膜をIPA/アセトン(97/3%)下で2分間現像した。
13C−SS−NMRを使用して、反応中の金属酸化物前駆体の変換を確認した。図3が示す通り、ジルコニウムイソプロポキシド(図2)のCH(〜70ppm)ピーク及びCH3(〜27ppm)ピークの両方の消滅は、この金属前駆体が完全に反応したことを示した。さらに、〜183ppmでのピークの出現は、ナノ粒子へのカルボン酸リガンド結合の成功を示した。
1H−NMRを使用して、コポリマーの重合度(DP)、したがって数平均MW(Mn)を決定し、未反応のモノマーの完全除去を確認した。図10は、PMMA−CO−PPAG共重の典型的な1H−NMRを示す。
Claims (12)
- コア及び前記コアを取り囲むコーティングを含むナノ粒子と、
ポリマーと、を含むブレンドである複合体であって、
前記ナノ粒子の前記コーティングは、リガンドを含み、前記リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
前記ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む前記光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、前記複合体。 - 前記ナノ粒子の前記コアは、ZrO2、HfO2、TiO2、またはそれらの組み合わせを含む、請求項1に記載の前記複合体。
- 前記リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩である、請求項1に記載の前記複合体。
- 前記ナノ粒子の中央粒径は、10ナノメートル以下である、請求項1に記載の前記複合体。
- 重合性基を含む光酸発生剤は、式(II)によって表されるモノマーであり、
各Raは独立して、H、F、C1−10アルキル、またはC1−10フルオロアルキルであり、
Q2は、単結合、あるいはC1−20アルキレン、C3−20シクロアルキレン、C6−20アリーレン、及びC7−20アラルキレン基から選択されるエステル含有もしくはエステル非含有フッ素化または非フッ素化基であり、
Aは、C1−20アルキレン、C3−20シクロアルキレン、C6−20アリーレン、及びC7−20アラルキレンから選択されるエステル含有もしくはエステル非含有フッ素化または非フッ素化基であり、
Zは、スルホン酸塩を含むアニオン部分、スルホンアミドのアニオン、またはスルホンイミドのアニオンであり、
G+は、式(III)を有し、
- 重合性基を含む前記光酸発生剤とは異なる少なくとも1つの不飽和モノマーは、式(IV)の酸で脱保護可能なモノマー、式(V)の塩基可溶性モノマー、または式(VI)のラクトン含有モノマーであり、
Raは独立して、H、F、C1−10アルキル、またはC1−10フルオロアルキルであり、
Rbは独立して、H、C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルであり、各Rbは分離しているか、または少なくとも1つのRbが隣接するRbに結合して、環状構造を形成し、
Wは、−C(=O)−OH、−C(CF3)2OH、−NH−SO2−Y1(式中、Y1は、FもしくはC1−4ペルフルオロアルキルである)、芳香族−OH、または前述のうちのいずれかのビニルエーテルとの付加物を含む塩基反応性基であり、
aは、1〜3の整数であり、
Lは、単環式、多環式、または縮合多環式C4−20ラクトン含有基である、請求項1に記載の前記複合体。 - G+は、式(VII)、(VIII)、または(IX)を有し、
Xは、IまたはSであり、
Rh、Ri、Rj、及びRkは各々独立して、ヒドロキシ、ニトリル、ハロゲン、C1−10アルキル、C1−10フルオロアルキル、C1−10アルコキシ、C1−10フルオロアルコキシ、C6−20アリール、C6−20フルオロアリール、C6−20アリールオキシ、またはC6−20フルオロアリールオキシであり、
Ar1及びAr2は独立して、C10−30縮合または単結合多環式アリール基であり、
Rlは、XがIである孤立電子対であるか、またはXがSであるC6−20アリール基であり、pは、2または3の整数であり、XがIのとき、pは2であり、XがSの場合、pは3であり、
q及びrは各々独立して、0〜5の整数であり、
s及びtは各々独立して、0〜4の整数である、請求項1に記載の前記複合体。 - 式(I)の前記連鎖移動剤は、式(X)の構造を有し、
Rmは、C1−10アルキル、C1−10アルコキシ、C3−10シクロアルキル、C6−10アリール、またはC7−10アラルキル基であり、
Rcは、置換または非置換であり、C1−10アルキルまたはC6−10アリール基である、請求項1に記載の前記複合体。 - 請求項1に記載の前記複合体を含むフォトレジスト組成物。
- (a)層の表面上にパターン形成される1つ以上の層を有する基板と、(b)パターン形成される前記1つ以上の層上の請求項9に記載のフォトレジスト組成物の層と、を備えるコーティングされた基板。
- 電子デバイスを形成する方法であって、
(a)請求項9に記載の前記フォトレジスト組成物の層を前記基板の表面上に適用することと、
(b)前記フォトレジスト組成物層を活性化放射線にパターン状に露光することと、
(c)前記露光されたフォトレジスト組成物層を現像して、レジストレリーフ画像を提供することと、を含む、前記方法。 - 複合体を作製する方法であって、
コア及び前記コアを取り囲むコーティングを含むナノ粒子と、
ポリマーと、を接触させることを含み、
前記ナノ粒子の前記コーティングは、リガンドを含み、前記リガンドは、置換もしくは非置換C1−C16カルボン酸またはその塩、置換もしくは非置換C1−C16アミノ酸またはその塩、置換もしくは非置換C1−C16ホスホン酸ジアルキル、あるいはそれらの組み合わせであり、
前記ポリマーは、
重合性基を含む光酸発生剤と、
重合性基を含む前記光酸発生剤とは異なる少なくとも1つの不飽和モノマーと、
式(I)の連鎖移動剤であって、
Zは、y価のC1−20有機基であり、
xは、0または1であり、
Rdは、置換もしくは非置換C1−20アルキル、C3−20シクロアルキル、C6−20アリール、またはC7−20アラルキルである、連鎖移動剤と、の重合生成物である、前記方法。
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JP2017173537A (ja) * | 2016-03-23 | 2017-09-28 | 株式会社先端ナノプロセス基盤開発センター | 感光性組成物およびパターン形成方法 |
JPWO2017018084A1 (ja) * | 2015-07-29 | 2018-03-29 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、並びに、この組成物を用いた感活性光線性又は感放射線性組成物膜 |
WO2020004172A1 (ja) * | 2018-06-29 | 2020-01-02 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
CN111948904A (zh) * | 2020-08-13 | 2020-11-17 | 清华大学 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
WO2021131299A1 (ja) * | 2019-12-24 | 2021-07-01 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
WO2021200062A1 (ja) * | 2020-03-31 | 2021-10-07 | 三菱ケミカル株式会社 | 感光性粒子、レジスト用組成物、感光性組成物、感光性粒子の製造方法及びパターン形成方法 |
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Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017163610A1 (ja) * | 2016-03-25 | 2017-09-28 | 株式会社日本触媒 | 酸化ジルコニウムナノ粒子 |
JPWO2017169440A1 (ja) * | 2016-03-28 | 2019-02-14 | Jsr株式会社 | 感放射線性組成物及びパターン形成方法 |
WO2018063382A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | Ligand-capped main group nanoparticles as high absorption extreme ultraviolet lithography resists |
US11022890B2 (en) * | 2017-02-23 | 2021-06-01 | International Business Machines Corporation | Photoresist bridging defect removal by reverse tone weak developer |
US10095109B1 (en) * | 2017-03-31 | 2018-10-09 | Rohm And Haas Electronic Materials Llc | Acid-cleavable monomer and polymers including the same |
US11029602B2 (en) * | 2017-11-14 | 2021-06-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist composition and method of forming photoresist pattern |
US11054742B2 (en) * | 2018-06-15 | 2021-07-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | EUV metallic resist performance enhancement via additives |
US11287740B2 (en) * | 2018-06-15 | 2022-03-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Photoresist composition and method of forming photoresist pattern |
FR3093807B1 (fr) * | 2019-03-13 | 2021-04-16 | Myriade | Dispositif et procédé pour l’observation de microparticules et de nanoparticules. |
US11934101B2 (en) * | 2019-11-27 | 2024-03-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist composition and method of forming photoresist pattern |
CN111004354B (zh) * | 2019-12-24 | 2022-06-24 | 太原理工大学 | 固载l-脯氨酸温敏性毛发状聚合物微球及其制备方法 |
KR20210152291A (ko) * | 2020-06-08 | 2021-12-15 | 삼성전자주식회사 | 포토레지스트 조성물 |
KR20220115398A (ko) * | 2021-02-10 | 2022-08-17 | 삼성전자주식회사 | 포토레지스트 조성물과 이를 이용하는 집적회로 소자의 제조 방법 |
US20220334474A1 (en) * | 2021-04-16 | 2022-10-20 | Samsung Electronics Co., Ltd. | Photoresist composition and method of fabricating semiconductor device |
US20220365428A1 (en) * | 2021-05-14 | 2022-11-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist materials and associated methods |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008268661A (ja) * | 2007-04-23 | 2008-11-06 | Fujifilm Corp | ポジ型レジスト組成物及びこれを用いたパターン形成方法 |
US20110039105A1 (en) * | 2009-08-13 | 2011-02-17 | Zimmerman Paul A | Non-aggregating nanoparticles and the use thereof |
JP2013010956A (ja) * | 2011-06-27 | 2013-01-17 | Dow Global Technologies Llc | ポリマー組成物およびこれを含むフォトレジスト |
JP2014065896A (ja) * | 2012-08-31 | 2014-04-17 | Dow Global Technologies Llc | 光酸発生剤を含む末端基を含むポリマー、前記ポリマーを含むフォトレジストおよびデバイスの製造方法 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05163021A (ja) * | 1991-12-13 | 1993-06-29 | Ishihara Sangyo Kaisha Ltd | フォトレジスト用酸化チタン微粉末、およびそれを使用するフォトレジスト用組成物 |
CN1331851C (zh) * | 1996-07-10 | 2007-08-15 | 纳幕尔杜邦公司 | 链转移剂 |
DE59908549D1 (de) * | 1998-04-24 | 2004-03-25 | Infineon Technologies Ag | Strahlungsempfindliches Gemisch und dessen Verwendung |
US7265161B2 (en) * | 2002-10-02 | 2007-09-04 | 3M Innovative Properties Company | Multi-photon reactive compositions with inorganic particles and method for fabricating structures |
US6534235B1 (en) * | 2000-10-31 | 2003-03-18 | Kansai Research Institute, Inc. | Photosensitive resin composition and process for forming pattern |
US7049044B2 (en) * | 2002-12-19 | 2006-05-23 | The University Of North Carolina At Charlotte | Nanocomposite negative resists for next generation lithographies |
US7232650B2 (en) * | 2002-10-02 | 2007-06-19 | 3M Innovative Properties Company | Planar inorganic device |
WO2005003192A1 (en) * | 2003-06-26 | 2005-01-13 | Symyx Technologies, Inc. | Synthesis of photoresist polymers |
ATE370975T1 (de) * | 2003-06-26 | 2007-09-15 | Jsr Corp | Photoresistpolymerzusammensetzungen |
US7638266B2 (en) * | 2004-08-12 | 2009-12-29 | International Business Machines Corporation | Ultrathin polymeric photoacid generator layer and method of fabricating at least one of a device and a mask by using said layer |
CN102942981B (zh) * | 2004-10-25 | 2016-02-10 | 路博润公司 | 制备聚合物及其组合物的方法 |
JP4315195B2 (ja) * | 2006-12-21 | 2009-08-19 | ソニー株式会社 | 硬化性樹脂材料−微粒子複合材料及びその製造方法、光学材料、並びに発光装置 |
JP4554665B2 (ja) * | 2006-12-25 | 2010-09-29 | 富士フイルム株式会社 | パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液 |
EP2101217B1 (en) * | 2008-03-14 | 2011-05-11 | Shin-Etsu Chemical Co., Ltd. | Sulfonium salt-containing polymer, resist compositon, and patterning process |
EP2204694A1 (en) * | 2008-12-31 | 2010-07-07 | Rohm and Haas Electronic Materials LLC | Compositions and processes for photolithography |
US8734904B2 (en) * | 2010-11-30 | 2014-05-27 | International Business Machines Corporation | Methods of forming topographical features using segregating polymer mixtures |
JP5771570B2 (ja) * | 2011-06-30 | 2015-09-02 | 富士フイルム株式会社 | パターン形成方法、積層レジストパターン、及び、電子デバイスの製造方法 |
JP6019849B2 (ja) * | 2011-09-08 | 2016-11-02 | セントラル硝子株式会社 | 含フッ素スルホン酸塩類、含フッ素スルホン酸塩樹脂、レジスト組成物及びそれを用いたパターン形成方法 |
WO2014011603A1 (en) | 2012-07-09 | 2014-01-16 | Cornell University | Block copolymers and their composites with inorganic nanoparticles, and methods of making and using same |
JP6175226B2 (ja) | 2012-09-28 | 2017-08-02 | 富士フイルム株式会社 | パターン形成方法、半導体製造用の感活性光線性又は感放射線性樹脂組成物、及び電子デバイスの製造方法 |
JP5756134B2 (ja) | 2013-01-08 | 2015-07-29 | 信越化学工業株式会社 | 金属酸化物含有膜形成用組成物及びパターン形成方法 |
US20150234272A1 (en) * | 2014-02-14 | 2015-08-20 | Intel Corporation | Metal oxide nanoparticles and photoresist compositions |
-
2015
- 2015-07-29 US US14/812,238 patent/US9696624B2/en active Active
-
2016
- 2016-07-20 TW TW105122951A patent/TWI595033B/zh active
- 2016-07-22 CN CN201610587085.7A patent/CN106406026B/zh active Active
- 2016-07-25 JP JP2016145457A patent/JP6427539B2/ja active Active
- 2016-07-26 KR KR1020160094574A patent/KR101874485B1/ko active IP Right Grant
-
2017
- 2017-05-25 US US15/604,855 patent/US20170261853A1/en not_active Abandoned
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008268661A (ja) * | 2007-04-23 | 2008-11-06 | Fujifilm Corp | ポジ型レジスト組成物及びこれを用いたパターン形成方法 |
US20110039105A1 (en) * | 2009-08-13 | 2011-02-17 | Zimmerman Paul A | Non-aggregating nanoparticles and the use thereof |
JP2013010956A (ja) * | 2011-06-27 | 2013-01-17 | Dow Global Technologies Llc | ポリマー組成物およびこれを含むフォトレジスト |
JP2014065896A (ja) * | 2012-08-31 | 2014-04-17 | Dow Global Technologies Llc | 光酸発生剤を含む末端基を含むポリマー、前記ポリマーを含むフォトレジストおよびデバイスの製造方法 |
Non-Patent Citations (1)
Title |
---|
KENNETH E GONSALVES ET AL.: "High refractive-index resists composed of anionic photoacid generator(PAG) bound polymers for 193 nm", PROC. OF SPIE, vol. Vol.6923, JPN6017020122, 2008, US, pages 69231P1-69231P7 * |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017018084A1 (ja) * | 2015-07-29 | 2018-03-29 | 富士フイルム株式会社 | 感活性光線性又は感放射線性組成物、並びに、この組成物を用いた感活性光線性又は感放射線性組成物膜 |
JP2017173537A (ja) * | 2016-03-23 | 2017-09-28 | 株式会社先端ナノプロセス基盤開発センター | 感光性組成物およびパターン形成方法 |
US10095108B2 (en) | 2016-03-23 | 2018-10-09 | Evolving nano process infrastructure Development Center, Inc. | Photosensitive composition and pattern formation method |
WO2020004172A1 (ja) * | 2018-06-29 | 2020-01-02 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
WO2021131299A1 (ja) * | 2019-12-24 | 2021-07-01 | 国立研究開発法人産業技術総合研究所 | 有機修飾金属酸化物ナノ粒子、その製造方法、euvフォトレジスト材料およびエッチングマスクの製造方法 |
WO2021200062A1 (ja) * | 2020-03-31 | 2021-10-07 | 三菱ケミカル株式会社 | 感光性粒子、レジスト用組成物、感光性組成物、感光性粒子の製造方法及びパターン形成方法 |
CN111948904A (zh) * | 2020-08-13 | 2020-11-17 | 清华大学 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
CN111948904B (zh) * | 2020-08-13 | 2022-04-01 | 常州华睿芯材科技有限公司 | 光刻胶组合物、用它形成光刻图案的方法及其用途 |
JP7565043B2 (ja) | 2020-11-30 | 2024-10-10 | 東京応化工業株式会社 | レジスト組成物及びレジストパターン形成方法 |
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KR20170015183A (ko) | 2017-02-08 |
TW201704317A (zh) | 2017-02-01 |
JP6427539B2 (ja) | 2018-11-21 |
US20170031244A1 (en) | 2017-02-02 |
KR101874485B1 (ko) | 2018-07-05 |
TWI595033B (zh) | 2017-08-11 |
CN106406026B (zh) | 2020-02-04 |
CN106406026A (zh) | 2017-02-15 |
US20170261853A1 (en) | 2017-09-14 |
US9696624B2 (en) | 2017-07-04 |
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