CN111886545B - 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 - Google Patents
光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 Download PDFInfo
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- CN111886545B CN111886545B CN201980020641.4A CN201980020641A CN111886545B CN 111886545 B CN111886545 B CN 111886545B CN 201980020641 A CN201980020641 A CN 201980020641A CN 111886545 B CN111886545 B CN 111886545B
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- 150000003462 sulfoxides Chemical class 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000001308 synthesis method Methods 0.000 description 1
- 239000012209 synthetic fiber Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- MVQLEZWPIWKLBY-UHFFFAOYSA-N tert-butyl 2-benzoylbenzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 MVQLEZWPIWKLBY-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 125000000101 thioether group Chemical group 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- 150000003573 thiols Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
- 150000007964 xanthones Chemical class 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Polymerisation Methods In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018-065923 | 2018-03-29 | ||
| JP2018065923A JP7216480B2 (ja) | 2018-03-29 | 2018-03-29 | 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板 |
| PCT/JP2019/010702 WO2019188376A1 (ja) | 2018-03-29 | 2019-03-14 | 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111886545A CN111886545A (zh) | 2020-11-03 |
| CN111886545B true CN111886545B (zh) | 2024-07-05 |
Family
ID=68058181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980020641.4A Active CN111886545B (zh) | 2018-03-29 | 2019-03-14 | 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7216480B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20200138286A (enrdf_load_stackoverflow) |
| CN (1) | CN111886545B (enrdf_load_stackoverflow) |
| TW (1) | TW201942674A (enrdf_load_stackoverflow) |
| WO (1) | WO2019188376A1 (enrdf_load_stackoverflow) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116057088A (zh) * | 2020-08-03 | 2023-05-02 | 株式会社日本触媒 | 共聚物、共聚物溶液、感光性树脂组合物、固化物、共聚物的制造方法以及共聚物溶液的制造方法 |
| CN115160495B (zh) * | 2022-08-15 | 2024-05-14 | 四川华造宏材科技有限公司 | 含马来酰亚胺结构的光刻胶成膜树脂及其制备方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010128275A (ja) * | 2008-11-28 | 2010-06-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性フィルム及び永久レジスト |
| JP2017119819A (ja) * | 2015-12-24 | 2017-07-06 | 株式会社日本触媒 | 重合体および該重合体を含んでなる樹脂組成物 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5990202A (en) * | 1997-10-31 | 1999-11-23 | Hewlett-Packard Company | Dual encapsulation technique for preparing ink-jets inks |
| JP2001048495A (ja) | 1999-08-05 | 2001-02-20 | Toyota Autom Loom Works Ltd | フォークリフト及びその移載方法 |
| US6294014B1 (en) * | 1999-12-16 | 2001-09-25 | Ppg Industries Ohio, Inc. | Pigment dispersions containing dispersants prepared by controlled radical polymerization and having pendent hydrophilic polymeric segments |
| JP2002062651A (ja) | 2000-08-18 | 2002-02-28 | Mitsubishi Chemicals Corp | 光重合性組成物及びそれを用いたカラーフィルタ |
| JP2006023716A (ja) * | 2004-06-08 | 2006-01-26 | Sumitomo Chemical Co Ltd | 感光性樹脂組成物 |
| JP2011039165A (ja) * | 2009-08-07 | 2011-02-24 | Hitachi Chem Co Ltd | アルカリ可溶性光硬化型組成物、該組成物を使用した硬化塗膜及び透明部材 |
| JP5626574B2 (ja) * | 2010-10-27 | 2014-11-19 | 日立化成株式会社 | 感光性樹脂組成物並びにこれを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 |
| JP6084353B2 (ja) * | 2010-12-28 | 2017-02-22 | 太陽インキ製造株式会社 | 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法 |
| JP2013003508A (ja) * | 2011-06-21 | 2013-01-07 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法 |
| JP5909468B2 (ja) * | 2012-08-31 | 2016-04-26 | 富士フイルム株式会社 | 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子 |
| JP6723788B2 (ja) * | 2016-03-31 | 2020-07-15 | 太陽インキ製造株式会社 | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 |
| KR102247284B1 (ko) * | 2016-08-30 | 2021-05-03 | 후지필름 가부시키가이샤 | 감광성 조성물, 경화막, 광학 필터, 적층체, 패턴 형성 방법, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서 |
-
2018
- 2018-03-29 JP JP2018065923A patent/JP7216480B2/ja active Active
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2019
- 2019-03-14 CN CN201980020641.4A patent/CN111886545B/zh active Active
- 2019-03-14 KR KR1020207030286A patent/KR20200138286A/ko not_active Withdrawn
- 2019-03-14 WO PCT/JP2019/010702 patent/WO2019188376A1/ja active Application Filing
- 2019-03-28 TW TW108110929A patent/TW201942674A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010128275A (ja) * | 2008-11-28 | 2010-06-10 | Hitachi Chem Co Ltd | 感光性樹脂組成物、これを用いた感光性フィルム及び永久レジスト |
| JP2017119819A (ja) * | 2015-12-24 | 2017-07-06 | 株式会社日本触媒 | 重合体および該重合体を含んでなる樹脂組成物 |
Non-Patent Citations (1)
| Title |
|---|
| 热固性树脂改性氰酸酯树脂的研究进展;陶凌云;;绝缘材料;20191225(第12期);10-13 * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019188376A1 (ja) | 2019-10-03 |
| JP7216480B2 (ja) | 2023-02-01 |
| KR20200138286A (ko) | 2020-12-09 |
| JP2019174761A (ja) | 2019-10-10 |
| TW201942674A (zh) | 2019-11-01 |
| CN111886545A (zh) | 2020-11-03 |
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