KR20200138286A - 광경화성 열경화성 수지 조성물 및 드라이 필름 및 경화물, 그리고 프린트 배선판 - Google Patents

광경화성 열경화성 수지 조성물 및 드라이 필름 및 경화물, 그리고 프린트 배선판 Download PDF

Info

Publication number
KR20200138286A
KR20200138286A KR1020207030286A KR20207030286A KR20200138286A KR 20200138286 A KR20200138286 A KR 20200138286A KR 1020207030286 A KR1020207030286 A KR 1020207030286A KR 20207030286 A KR20207030286 A KR 20207030286A KR 20200138286 A KR20200138286 A KR 20200138286A
Authority
KR
South Korea
Prior art keywords
mass
radical polymerizable
polymer
carboxyl group
monomer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020207030286A
Other languages
English (en)
Korean (ko)
Inventor
도모야 쿠도
가즈야 오카다
치호 우에타
사와코 시마다
노부히토 이토
마사토시 요시다
노부히로 마에다
노부아키 오츠키
Original Assignee
다이요 잉키 세이조 가부시키가이샤
가부시키가이샤 닛폰 쇼쿠바이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 다이요 잉키 세이조 가부시키가이샤, 가부시키가이샤 닛폰 쇼쿠바이 filed Critical 다이요 잉키 세이조 가부시키가이샤
Publication of KR20200138286A publication Critical patent/KR20200138286A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00Processes of polymerisation
    • C08F2/46Polymerisation initiated by wave energy or particle radiation
    • C08F2/48Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/027Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Materials For Photolithography (AREA)
  • Polymerisation Methods In General (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020207030286A 2018-03-29 2019-03-14 광경화성 열경화성 수지 조성물 및 드라이 필름 및 경화물, 그리고 프린트 배선판 Withdrawn KR20200138286A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-065923 2018-03-29
JP2018065923A JP7216480B2 (ja) 2018-03-29 2018-03-29 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板
PCT/JP2019/010702 WO2019188376A1 (ja) 2018-03-29 2019-03-14 光硬化性熱硬化性樹脂組成物及びドライフィルム及び硬化物ならびにプリント配線板

Publications (1)

Publication Number Publication Date
KR20200138286A true KR20200138286A (ko) 2020-12-09

Family

ID=68058181

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207030286A Withdrawn KR20200138286A (ko) 2018-03-29 2019-03-14 광경화성 열경화성 수지 조성물 및 드라이 필름 및 경화물, 그리고 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7216480B2 (enrdf_load_stackoverflow)
KR (1) KR20200138286A (enrdf_load_stackoverflow)
CN (1) CN111886545B (enrdf_load_stackoverflow)
TW (1) TW201942674A (enrdf_load_stackoverflow)
WO (1) WO2019188376A1 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116057088A (zh) * 2020-08-03 2023-05-02 株式会社日本触媒 共聚物、共聚物溶液、感光性树脂组合物、固化物、共聚物的制造方法以及共聚物溶液的制造方法
CN115160495B (zh) * 2022-08-15 2024-05-14 四川华造宏材科技有限公司 含马来酰亚胺结构的光刻胶成膜树脂及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001048495A (ja) 1999-08-05 2001-02-20 Toyota Autom Loom Works Ltd フォークリフト及びその移載方法
JP2002062651A (ja) 2000-08-18 2002-02-28 Mitsubishi Chemicals Corp 光重合性組成物及びそれを用いたカラーフィルタ

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5990202A (en) * 1997-10-31 1999-11-23 Hewlett-Packard Company Dual encapsulation technique for preparing ink-jets inks
US6294014B1 (en) * 1999-12-16 2001-09-25 Ppg Industries Ohio, Inc. Pigment dispersions containing dispersants prepared by controlled radical polymerization and having pendent hydrophilic polymeric segments
JP2006023716A (ja) * 2004-06-08 2006-01-26 Sumitomo Chemical Co Ltd 感光性樹脂組成物
JP5370727B2 (ja) * 2008-11-28 2013-12-18 日立化成株式会社 感光性樹脂組成物、これを用いた感光性フィルム及び永久レジスト
JP2011039165A (ja) * 2009-08-07 2011-02-24 Hitachi Chem Co Ltd アルカリ可溶性光硬化型組成物、該組成物を使用した硬化塗膜及び透明部材
JP5626574B2 (ja) * 2010-10-27 2014-11-19 日立化成株式会社 感光性樹脂組成物並びにこれを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP6084353B2 (ja) * 2010-12-28 2017-02-22 太陽インキ製造株式会社 光硬化性樹脂組成物の製造方法、ドライフィルムの製造方法、硬化物の製造方法およびプリント配線板の製造方法
JP2013003508A (ja) * 2011-06-21 2013-01-07 Hitachi Chem Co Ltd 感光性樹脂組成物、これを用いた感光性エレメント、画像表示装置の隔壁の形成方法及び画像表示装置の製造方法
JP5909468B2 (ja) * 2012-08-31 2016-04-26 富士フイルム株式会社 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子
JP6877816B2 (ja) * 2015-12-24 2021-05-26 株式会社日本触媒 重合体および該重合体を含んでなる樹脂組成物
JP6723788B2 (ja) * 2016-03-31 2020-07-15 太陽インキ製造株式会社 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
KR102247284B1 (ko) * 2016-08-30 2021-05-03 후지필름 가부시키가이샤 감광성 조성물, 경화막, 광학 필터, 적층체, 패턴 형성 방법, 고체 촬상 소자, 화상 표시 장치 및 적외선 센서

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001048495A (ja) 1999-08-05 2001-02-20 Toyota Autom Loom Works Ltd フォークリフト及びその移載方法
JP2002062651A (ja) 2000-08-18 2002-02-28 Mitsubishi Chemicals Corp 光重合性組成物及びそれを用いたカラーフィルタ

Also Published As

Publication number Publication date
CN111886545B (zh) 2024-07-05
WO2019188376A1 (ja) 2019-10-03
JP7216480B2 (ja) 2023-02-01
JP2019174761A (ja) 2019-10-10
TW201942674A (zh) 2019-11-01
CN111886545A (zh) 2020-11-03

Similar Documents

Publication Publication Date Title
JP5876925B2 (ja) 光硬化性樹脂組成物、そのドライフィルム及び硬化物並びにそれらを用いたプリント配線板
KR101604557B1 (ko) 광경화성 열경화성 수지 조성물
TWI778003B (zh) 負型光硬化性樹脂組成物、乾薄膜、硬化物及印刷配線板
TWI713578B (zh) 硬化性樹脂組成物、乾膜、硬化物及印刷配線板
KR100787341B1 (ko) 수지 조성물 및 그의 경화물 및 그것을 이용하여 얻어지는인쇄 배선판
CN102388077B (zh) 光固化性树脂及光固化性树脂组合物
CN102272677B (zh) 光固化性树脂组合物、其干膜及固化物以及使用它们的印刷电路板
TWI819431B (zh) 阻焊劑組合物、乾膜、印刷線路板及其製造方法
CN100569825C (zh) 光固化性·热固化性树脂组合物及其固化物
JP2022025366A (ja) ドライフィルム、ドライフィルムセット、その硬化物および電子部品
WO2020202691A1 (ja) 感光性樹脂組成物、ドライフィルム、硬化物、および、電子部品
KR20150128614A (ko) 경화성 수지 조성물, 드라이 필름 및 프린트 배선판
JP6995469B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
CN111913353B (zh) 固化性树脂组合物、干膜、固化物和印刷电路板
CN111886545B (zh) 光固化性热固化性树脂组合物和干膜和固化物以及印刷电路板
KR101394173B1 (ko) 강도, 경도 및 밀착성이 우수한 감광성 하이브리드 수지, 및 이것을 함유하는 알칼리현상이 가능한 경화성 조성물 및 그 경화물
JP6286395B2 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5847918B1 (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP5968007B2 (ja) 光硬化性樹脂組成物、ドライフィルムおよびプリント配線板
KR20160117238A (ko) 경화성 수지 조성물, 드라이 필름, 경화물 및 프린트 배선판
JP6783600B2 (ja) 硬化性樹脂組成物、ドライフィルム、プリント配線板、および、プリント配線板の製造方法
CN113196171B (zh) 固化性树脂组合物、干膜、固化物和电子部件
JP2017034226A (ja) 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板
JP2016139150A (ja) 光硬化性樹脂組成物、ドライフィルムおよびプリント配線板

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20201021

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination