CN111787690A - 电路板 - Google Patents

电路板 Download PDF

Info

Publication number
CN111787690A
CN111787690A CN201910268080.1A CN201910268080A CN111787690A CN 111787690 A CN111787690 A CN 111787690A CN 201910268080 A CN201910268080 A CN 201910268080A CN 111787690 A CN111787690 A CN 111787690A
Authority
CN
China
Prior art keywords
daughter
board
layer
circuit board
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201910268080.1A
Other languages
English (en)
Other versions
CN111787690B (zh
Inventor
周厚原
吴易炽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Hongfujin Precision Industry Wuhan Co Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hongfujin Precision Industry Wuhan Co Ltd, Hon Hai Precision Industry Co Ltd filed Critical Hongfujin Precision Industry Wuhan Co Ltd
Priority to CN201910268080.1A priority Critical patent/CN111787690B/zh
Priority to US16/405,348 priority patent/US10785873B1/en
Publication of CN111787690A publication Critical patent/CN111787690A/zh
Application granted granted Critical
Publication of CN111787690B publication Critical patent/CN111787690B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10159—Memory
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

本发明提出一种电路板，包括：一母板；以及多个子板层，多个所述子板层以堆栈的方式连接于所述母板，且每一子板层分别具有并排设置的多个子板；其中，多个子板层包含第一子板层与第二子板层；所述第一子板层的多个子板连接于所述母板；所述第二子板层的多个子板连接于所述第一子板层的多个子板。本发明的电路板能够节省成本并提供安装电子元件的空间。

Description

电路板
技术领域
本发明涉及一种电路板。
背景技术
目前，电脑主板上的各电子元件之间具有多条信号传输线以实现通信。在现有技术中，通常将电脑主板需要设置为多层印刷电路板来满足这些信号传输线的布线要求。
然而，主板上设置为多层数的印刷电路板将会增加产品的成本。此外，如若多条信号传输线均布线在多层数的印刷电路板内，那么主板的空间布局将会受到限制。
发明内容
有鉴于此，有必要提供一种电路板以解决上述问题。
一种电路板，包括：一母板；以及多个子板层，多个所述子板层以堆栈的方式连接于所述母板，且每一子板层分别具有并排设置的多个子板；其中，多个子板层包含第一子板层与第二子板层；所述第一子板层的多个子板连接于所述母板；所述第二子板层的多个子板连接于所述第一子板层的多个子板。
本发明的电路板通过将多个子板层以堆栈的方式连接于所述母板，使所述第一子板层在母板上留下间隙区域，所述第二子板层在第一子板层上留下间隙区域，以达到减少成本及留下空间安装电子元件等。
附图说明
图1是本发明实施方式的电路板的剖视图。
图2是本发明另一实施方式的电路板的剖视图。
图3是本发明的电路板的焊盘及过孔的剖视图。
图4是本发明实施方式的电路板的焊盘及开孔的俯视图。
图5是本发明另一实施方式的电路板的焊盘及开孔的俯视图。
图6是本发明另一实施方式的电路板的焊盘及开孔的俯视图。
图7是本发明另一实施方式的电路板的焊盘及开孔的俯视图。
图8是本发明实施方式的电路板的半孔的剖面示意图。
主要元件符号说明
电路板 100
母板 10
第一表面 101
第二表面 102
子板层 30
第一子板层 32
子板 321、341、361
第一端 3212、3412
第二端 3214、3414
第二子板层 34
第三子板层 36
电子元件 50
焊盘 71
开孔 710
过孔 72
半孔 81
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施例及实施例中的特征可以相互组合。
请参见图1，本发明一实施方式提供一种电路板100，包括母板10及多个子板层30。多个子板层30以堆栈的方式连接于所述母板10上。多个子板层30包括第一子板层32及第二子板层34。每一所述子板层30包括多个并排排列的子板。所述第一子板层32的多个子板321连接于所述母板10的一侧。所述第二子板层34的多个子板341连接于所述第一子板层32的多个子板321上。
所述第一子板层32的每一子板321包括第一端3212及第二端3214。所述第一端3212与第二端3214分别连接于所述母板10上。
所述第二子板层34的每一子板341包括第一端3412及第二端3414。所述第一端3412与第二端3414分别连接于所述第一子板层32的两个相邻子板321上。
所述电路板100还包括至少一个电子元件50。
在至少一实施例中，所述至少一个电子元件50装设于母板10上并位于第一子板层32的多个子板321之间的空出区域。
在至少一实施例中，所述至少一个电子元件50装设于第一子板层32的至少一子板321上并位于第二子板层34的多个子板341之间的空出区域。
在至少一实施例中，所述至少一个电子元件50装设于第二子板层34的至少一子板341上并位于背离所述母板10的一侧。
在至少一实施例中，所述至少一个电子元件50装设于第二子板层34的至少一子板341上并位于朝向所述母板10的一侧，并位于第一子板层32的多个子板321之间的空出区域。
可以理解，所述电子元件50可以是中央处理器(Central Processing Unit，CPU)、内存，但不限于此。
请参见图2，所述母板10包括相对设置的第一表面101及第二表面102。在至少一实施例中，所述多个子板层30还包括第三子板层36。所述第一子板层32的多个子板321连接于所述第一表面101上。所述第三子板层36的多个子板361并排连接于所述第二表面102上。
在至少一实施例中，所述第三子板层36的多个子板361为软性电路板。
在至少一实施例中，所述第三子板层36的相邻两子板361电性连接。
可以理解，在其他实施例中，所述子板层30还可以包括第四或更多子板层，所述第四或更多子板层设于所述第二子板层34和/或第三子板层36上并依次堆栈设置。
请参见图3，所述母板10和/或至少一子板上设有至少一焊盘71及至少一过孔(Viain pad，VIP)72。所述焊盘71用于焊接元件或导线。所述过孔72用于连接导线。所述母板10和子板之间或所述子板与子板之间通过焊盘与焊盘、焊盘与过孔或过孔与过孔进行电性连接。
请参见图4至图7，在至少一实施例中，所述焊盘71设有开孔710。所述开孔710在焊接时，增加了焊锡与焊盘的接触面积，从而提高连接强度。所述焊盘71及开孔710可以根据焊接需要设计成各种形状。图4至图7示出了焊接效果较佳的焊盘71及开孔710的俯视图。
请参见图8，在至少一实施例中，所述子板的边缘设有半孔81以方便切割拆分。
本发明的电路板通过将多个子板层以堆栈的方式连接于所述母板10，使所述第一子板层32在母板10上留下间隙区域，所述第二子板层34在第一子板层32上留下间隙区域，以达到减少成本及留下空间安装电子元件等。
以上所述，仅是本发明的较佳实施方式而已，并非对本发明任何形式上的限制，虽然本发明已是较佳实施方式揭露如上，并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当可利用上述揭示的技术内容做出些许更动或修饰为等同变化的等效实施方式，但凡是未脱离本发明技术方案内容，依据本发明的技术实质对以上实施方式所做的任何简单修改、等同变化与修饰，均仍属于本发明技术方案的范围内。

Claims (10)

1.一种电路板，其特征在于，包括：
一母板；以及
多个子板层，多个所述子板层以堆栈的方式连接于所述母板，且每一子板层分别具有并排设置的多个子板；其中，多个子板层包含第一子板层与第二子板层；所述第一子板层的多个子板连接于所述母板；所述第二子板层的多个子板连接于所述第一子板层的多个子板。
2.如权利要求1所述的电路板，其特征在于，所述第一子板层与所述第二子板层的每一子板分别具有第一端与第二端；所述第一子板层的子板的第一端与第二端连接于所述母板上；所述第二子板层的子板的第一端与第二端分别连接于所述第一子板层的相邻两子板上。
3.如权利要求1所述的电路板，其特征在于，所述电路板包括至少一电子元件，所述至少一电子元件设置于所述母板上；所述电子元件为中央处理器或内存器。
4.如权利要求1所述的电路板，其特征在于，所述电路板包括至少一电子元件，所述至少一电子元件设置于所述第一子板层或第二子板层的子板上；所述电子元件为中央处理器或内存器。
5.如权利要求1所述的电路板，其特征在于，所述电路板包括至少一电子元件，所述至少一个电子元件设置于所述第二子板层的子板朝向所述母板的一侧，并位于所述第一子板层的多个子板之间的空出区域。
6.如权利要求1所述的电路板，其特征在于，所述母板包含第一表面与第二表面；多个子板层进一步包含第三子板层；所述第一子板层设置于所述母板的第一表面；所述第三子板层设置于所述母板的第二表面，所述第三子板层包含连接于所述母板的第一表面的多个并排设置的子板。
7.如权利要求6所述的电路板，其特征在于，所述第三子板层的子板为软性电路板；所述第三子板层的相邻两子板电性连接。
8.如权利要求1所述的电路板，其特征在于，所述母板或多个子板层的子板包括至少一过孔，所述过孔用于连接导线。
9.如权利要求8所述的电路板，其特征在于，所述母板或多个子板层的子板包括至少一焊盘，所述焊盘设有开孔以增加焊锡与焊盘的接触面积。
10.如权利要求1所述的电路板，其特征在于，多个子板层的至少一子板的边缘设有半孔。
CN201910268080.1A 2019-04-03 2019-04-03 电路板 Active CN111787690B (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910268080.1A CN111787690B (zh) 2019-04-03 2019-04-03 电路板
US16/405,348 US10785873B1 (en) 2019-04-03 2019-05-07 Circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910268080.1A CN111787690B (zh) 2019-04-03 2019-04-03 电路板

Publications (2)

Publication Number Publication Date
CN111787690A true CN111787690A (zh) 2020-10-16
CN111787690B CN111787690B (zh) 2023-10-27

Family

ID=72516728

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201910268080.1A Active CN111787690B (zh) 2019-04-03 2019-04-03 电路板

Country Status (2)

Country Link
US (1) US10785873B1 (zh)
CN (1) CN111787690B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7265443B2 (ja) * 2019-07-31 2023-04-26 日本航空電子工業株式会社 配線板組立体

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076561A (ja) * 2000-08-24 2002-03-15 Sony Corp 立体的回路基板装置及び立体的回路基板装置の製造方法
JP2004228165A (ja) * 2003-01-20 2004-08-12 Fujikura Ltd 多層配線板およびその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
CN102984881A (zh) * 2012-11-21 2013-03-20 华为技术有限公司 电路板连接结构
US20130153269A1 (en) * 2011-12-14 2013-06-20 Michimasa Takahashi Wiring board and method for manufacturing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5201038A (en) * 1989-12-06 1993-04-06 Videologic Limited Address bus for stackable computer board connectors
US5280193A (en) * 1992-05-04 1994-01-18 Lin Paul T Repairable semiconductor multi-package module having individualized package bodies on a PC board substrate
JP2000277944A (ja) * 1999-03-24 2000-10-06 Ando Electric Co Ltd 増設用の基板および基板の増設方法
JP2002158312A (ja) * 2000-11-17 2002-05-31 Oki Electric Ind Co Ltd ３次元実装用半導体パッケージ、その製造方法、および半導体装置
US20040190274A1 (en) * 2003-03-27 2004-09-30 Yoshio Saito Compact low cost plastic MCM to PCB
WO2007116790A1 (ja) * 2006-04-03 2007-10-18 Panasonic Corporation アンテナ内蔵半導体メモリモジュール
US8379403B2 (en) * 2009-04-02 2013-02-19 Qualcomm, Incorporated Spacer-connector and circuit board assembly
US8417071B2 (en) * 2010-05-24 2013-04-09 Xyratex Technology Limited Data storage system, a modular printed circuit board, a backplane and a backplane component
US9519319B2 (en) * 2014-03-14 2016-12-13 Sandisk Technologies Llc Self-supporting thermal tube structure for electronic assemblies
CN110611990A (zh) * 2018-06-14 2019-12-24 鸿富锦精密工业(武汉)有限公司 印刷电路板组合及应用所述印刷电路板组合的电子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002076561A (ja) * 2000-08-24 2002-03-15 Sony Corp 立体的回路基板装置及び立体的回路基板装置の製造方法
JP2004228165A (ja) * 2003-01-20 2004-08-12 Fujikura Ltd 多層配線板およびその製造方法
JP2005079402A (ja) * 2003-09-01 2005-03-24 Fujikura Ltd 回路基板およびその製造方法
US20130153269A1 (en) * 2011-12-14 2013-06-20 Michimasa Takahashi Wiring board and method for manufacturing the same
CN102984881A (zh) * 2012-11-21 2013-03-20 华为技术有限公司 电路板连接结构

Also Published As

Publication number Publication date
US20200323080A1 (en) 2020-10-08
US10785873B1 (en) 2020-09-22
CN111787690B (zh) 2023-10-27

Similar Documents

Publication Publication Date Title
US9131602B2 (en) Printed circuit board for mobile platforms
US20140144678A1 (en) Soldering structure for mounting connector on flexible circuit board
US10630002B2 (en) Circuit board and card
US9699887B2 (en) Circuit board and electronic device
CN109041418B (zh) 一种电路板结构及电子设备
CN105792512A (zh) 一种焊盘加固结构
US10039192B1 (en) Ultra-thin dual-channel flexible circuit bridge connector
JP7206474B2 (ja) プリント回路基板
US20130329393A1 (en) Printed circuit board with daughterboard
CN111787690A (zh) 电路板
US9510462B2 (en) Method for fabricating circuit board structure
KR101729507B1 (ko) 회로기판유닛 및 이를 가지는 컴퓨터 디바이스
CN110611990A (zh) 印刷电路板组合及应用所述印刷电路板组合的电子装置
CN102769993B (zh) 电路板
US20180168045A1 (en) Electronic Module
JP4398626B2 (ja) 積層回路
JP4141491B2 (ja) パターンアンテナ内蔵回路基板
CN211481587U (zh) 一种服务器转接卡
JP6428764B2 (ja) チップ型電子部品
CN114731763A (zh) 内埋电路板及其制造方法
US9565765B2 (en) Printed circuit board
US20080017305A1 (en) Method for fabricating multi-layered printed circuit board without via holes
CN213880388U (zh) 刚挠结合电路板及电连接装置
CN109121293B (zh) 印刷电路板组件及电子设备
JP4645261B2 (ja) フレキシブルプリント基板

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant