CN111770900B - 通过升华制备具有精确浓度的蒸气的方法和设备 - Google Patents
通过升华制备具有精确浓度的蒸气的方法和设备 Download PDFInfo
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- CN111770900B CN111770900B CN201980014314.8A CN201980014314A CN111770900B CN 111770900 B CN111770900 B CN 111770900B CN 201980014314 A CN201980014314 A CN 201980014314A CN 111770900 B CN111770900 B CN 111770900B
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- temperature
- carrier gas
- sublimation
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- pressure
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862642982P | 2018-03-14 | 2018-03-14 | |
| US62/642,982 | 2018-03-14 | ||
| US16/260,378 | 2019-01-29 | ||
| US16/260,378 US11168394B2 (en) | 2018-03-14 | 2019-01-29 | Method and apparatus for making a vapor of precise concentration by sublimation |
| PCT/US2019/021074 WO2019177851A1 (en) | 2018-03-14 | 2019-03-07 | Method and apparatus for making a vapor of precise concentration by sublimation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111770900A CN111770900A (zh) | 2020-10-13 |
| CN111770900B true CN111770900B (zh) | 2022-10-18 |
Family
ID=67904522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980014314.8A Active CN111770900B (zh) | 2018-03-14 | 2019-03-07 | 通过升华制备具有精确浓度的蒸气的方法和设备 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11168394B2 (https=) |
| EP (1) | EP3765418A4 (https=) |
| JP (1) | JP7576464B2 (https=) |
| CN (1) | CN111770900B (https=) |
| WO (1) | WO2019177851A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11873558B2 (en) | 2021-09-07 | 2024-01-16 | Picosun Oy | Precursor container |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112553930B (zh) * | 2020-12-31 | 2023-04-07 | 濮阳圣恺环保新材料科技股份有限公司 | 一种利用可控温激光照射进行分散染料印花染色的工艺 |
| TW202432241A (zh) * | 2022-10-13 | 2024-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 蒸氣遞送設備、氣相反應器及用於監測及控制蒸氣遞送系統之方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400309A (en) * | 1972-06-30 | 1983-08-23 | Foster Wheeler Energy Corporation | Process for activating a steam reforming catalyst and the catalyst produced by the process |
| TW200403721A (en) * | 2002-07-30 | 2004-03-01 | Asm Inc | An improved sublimation bed employing carrier gas guidance structures |
| WO2013145834A1 (ja) * | 2012-03-30 | 2013-10-03 | 出光興産株式会社 | 有機材料の精製装置 |
| US9034105B2 (en) * | 2008-01-10 | 2015-05-19 | American Air Liquide, Inc. | Solid precursor sublimator |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5377429A (en) | 1993-04-19 | 1995-01-03 | Micron Semiconductor, Inc. | Method and appartus for subliming precursors |
| US5553395A (en) | 1995-05-31 | 1996-09-10 | Hughes Aircraft Company | Bubbler for solid metal organic source material and method of producing saturated carrying gas |
| US5764849A (en) | 1996-03-27 | 1998-06-09 | Micron Technology, Inc. | Solid precursor injector apparatus and method |
| US6161398A (en) | 1998-04-09 | 2000-12-19 | Lucent Technologies, Inc. | Methods of and systems for vapor delivery control in optical preform manufacture |
| TW451275B (en) * | 1999-06-22 | 2001-08-21 | Tokyo Electron Ltd | Metal organic chemical vapor deposition method and apparatus |
| US6984415B2 (en) | 1999-08-20 | 2006-01-10 | International Business Machines Corporation | Delivery systems for gases for gases via the sublimation of solid precursors |
| JP3909792B2 (ja) | 1999-08-20 | 2007-04-25 | パイオニア株式会社 | 化学気相成長法における原料供給装置及び原料供給方法 |
| JP4866527B2 (ja) | 2000-03-23 | 2012-02-01 | 新日鐵化学株式会社 | 昇華精製方法 |
| US20030030010A1 (en) | 2001-08-07 | 2003-02-13 | Perel Alexander S. | Decaborane vaporizer having improved vapor flow |
| US6701066B2 (en) | 2001-10-11 | 2004-03-02 | Micron Technology, Inc. | Delivery of solid chemical precursors |
| US7601225B2 (en) * | 2002-06-17 | 2009-10-13 | Asm International N.V. | System for controlling the sublimation of reactants |
| US6772072B2 (en) | 2002-07-22 | 2004-08-03 | Applied Materials, Inc. | Method and apparatus for monitoring solid precursor delivery |
| US6797337B2 (en) | 2002-08-19 | 2004-09-28 | Micron Technology, Inc. | Method for delivering precursors |
| JP5152105B2 (ja) | 2002-08-23 | 2013-02-27 | 東京エレクトロン株式会社 | 処理システム |
| US7147713B2 (en) | 2003-04-30 | 2006-12-12 | Cree, Inc. | Phase controlled sublimation |
| JP4013859B2 (ja) | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
| US20080073559A1 (en) * | 2003-12-12 | 2008-03-27 | Horsky Thomas N | Controlling the flow of vapors sublimated from solids |
| WO2005113857A1 (en) | 2004-05-20 | 2005-12-01 | Akzo Nobel N.V. | Bubbler for constant vapor delivery of a solid chemical |
| FR2878453B1 (fr) | 2004-11-30 | 2007-03-16 | Centre Nat Rech Scient Cnrse | Dispositif de fourniture de vapeurs d'un precurseur solide a un appareil de traitement |
| US8197898B2 (en) | 2005-03-29 | 2012-06-12 | Tokyo Electron Limited | Method and system for depositing a layer from light-induced vaporization of a solid precursor |
| US7651570B2 (en) | 2005-03-31 | 2010-01-26 | Tokyo Electron Limited | Solid precursor vaporization system for use in chemical vapor deposition |
| JP4317174B2 (ja) | 2005-09-21 | 2009-08-19 | 東京エレクトロン株式会社 | 原料供給装置および成膜装置 |
| EP1860208B1 (en) | 2006-05-22 | 2014-10-15 | Rohm and Haas Electronic Materials LLC | Film deposition method |
| US20080241805A1 (en) | 2006-08-31 | 2008-10-02 | Q-Track Corporation | System and method for simulated dosimetry using a real time locating system |
| EP2094406B1 (en) | 2006-11-22 | 2015-10-14 | Soitec | Method, apparatus and gate valve assembly for forming monocrystalline group iii-v semiconductor material |
| JP5306993B2 (ja) | 2007-03-30 | 2013-10-02 | 東京エレクトロン株式会社 | 蒸着源ユニット、蒸着装置および蒸着源ユニットの温度調整装置 |
| US8440021B2 (en) | 2007-08-16 | 2013-05-14 | The Regents Of The University Of Michigan | Apparatus and method for deposition for organic thin films |
| JP5257197B2 (ja) | 2008-03-31 | 2013-08-07 | 住友化学株式会社 | 有機金属化合物供給装置 |
| JP4966922B2 (ja) * | 2008-07-07 | 2012-07-04 | 東京エレクトロン株式会社 | レジスト処理装置、レジスト塗布現像装置、およびレジスト処理方法 |
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| JP5779171B2 (ja) | 2009-03-26 | 2015-09-16 | トゥー‐シックス・インコーポレイテッド | SiC単結晶の昇華成長方法及び装置 |
| US20130089934A1 (en) * | 2011-10-07 | 2013-04-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Material Delivery System and Method |
| KR101389011B1 (ko) * | 2012-03-28 | 2014-04-24 | 주식회사 유니텍스 | 소스 컨테이너 및 기상 증착용 반응로 |
| WO2016160665A1 (en) * | 2015-03-30 | 2016-10-06 | Siva Power, Inc | Fluid-assisted thermal management of evaporation sources |
| US9869018B2 (en) | 2016-04-26 | 2018-01-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Solid precursor delivery method using liquid solvent for thin film deposition |
-
2019
- 2019-01-29 US US16/260,378 patent/US11168394B2/en active Active
- 2019-03-07 WO PCT/US2019/021074 patent/WO2019177851A1/en not_active Ceased
- 2019-03-07 EP EP19767105.0A patent/EP3765418A4/en active Pending
- 2019-03-07 JP JP2020544229A patent/JP7576464B2/ja active Active
- 2019-03-07 CN CN201980014314.8A patent/CN111770900B/zh active Active
-
2021
- 2021-04-12 US US17/227,695 patent/US11965243B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4400309A (en) * | 1972-06-30 | 1983-08-23 | Foster Wheeler Energy Corporation | Process for activating a steam reforming catalyst and the catalyst produced by the process |
| TW200403721A (en) * | 2002-07-30 | 2004-03-01 | Asm Inc | An improved sublimation bed employing carrier gas guidance structures |
| US9034105B2 (en) * | 2008-01-10 | 2015-05-19 | American Air Liquide, Inc. | Solid precursor sublimator |
| WO2013145834A1 (ja) * | 2012-03-30 | 2013-10-03 | 出光興産株式会社 | 有機材料の精製装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11873558B2 (en) | 2021-09-07 | 2024-01-16 | Picosun Oy | Precursor container |
| US12146218B2 (en) | 2021-09-07 | 2024-11-19 | Picosun Oy | Precursor container |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019177851A1 (en) | 2019-09-19 |
| US20210262085A1 (en) | 2021-08-26 |
| EP3765418A4 (en) | 2021-12-08 |
| JP7576464B2 (ja) | 2024-10-31 |
| CN111770900A (zh) | 2020-10-13 |
| US20190284690A1 (en) | 2019-09-19 |
| US11965243B2 (en) | 2024-04-23 |
| EP3765418A1 (en) | 2021-01-20 |
| JP2021516723A (ja) | 2021-07-08 |
| US11168394B2 (en) | 2021-11-09 |
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