JP7576464B2 - 昇華によって正確な濃度の蒸気を生成する方法および装置 - Google Patents
昇華によって正確な濃度の蒸気を生成する方法および装置 Download PDFInfo
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- JP7576464B2 JP7576464B2 JP2020544229A JP2020544229A JP7576464B2 JP 7576464 B2 JP7576464 B2 JP 7576464B2 JP 2020544229 A JP2020544229 A JP 2020544229A JP 2020544229 A JP2020544229 A JP 2020544229A JP 7576464 B2 JP7576464 B2 JP 7576464B2
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- 230000008022 sublimation Effects 0.000 title claims description 254
- 238000000034 method Methods 0.000 title claims description 118
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- 239000002243 precursor Substances 0.000 claims description 204
- 238000011144 upstream manufacturing Methods 0.000 claims description 105
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- 238000005229 chemical vapour deposition Methods 0.000 description 33
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 14
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- IBEFSUTVZWZJEL-UHFFFAOYSA-N trimethylindium Chemical compound C[In](C)C IBEFSUTVZWZJEL-UHFFFAOYSA-N 0.000 description 10
- 230000003936 working memory Effects 0.000 description 8
- 239000007789 gas Substances 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 230000008020 evaporation Effects 0.000 description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
- C23C16/4481—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials by evaporation using carrier gas in contact with the source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/52—Controlling or regulating the coating process
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1283—Control of temperature, e.g. gradual temperature increase, modulation of temperature
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862642982P | 2018-03-14 | 2018-03-14 | |
| US62/642,982 | 2018-03-14 | ||
| US16/260,378 | 2019-01-29 | ||
| US16/260,378 US11168394B2 (en) | 2018-03-14 | 2019-01-29 | Method and apparatus for making a vapor of precise concentration by sublimation |
| PCT/US2019/021074 WO2019177851A1 (en) | 2018-03-14 | 2019-03-07 | Method and apparatus for making a vapor of precise concentration by sublimation |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| JP2021516723A JP2021516723A (ja) | 2021-07-08 |
| JP2021516723A5 JP2021516723A5 (https=) | 2022-03-10 |
| JPWO2019177851A5 JPWO2019177851A5 (https=) | 2022-03-10 |
| JP7576464B2 true JP7576464B2 (ja) | 2024-10-31 |
Family
ID=67904522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020544229A Active JP7576464B2 (ja) | 2018-03-14 | 2019-03-07 | 昇華によって正確な濃度の蒸気を生成する方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11168394B2 (https=) |
| EP (1) | EP3765418A4 (https=) |
| JP (1) | JP7576464B2 (https=) |
| CN (1) | CN111770900B (https=) |
| WO (1) | WO2019177851A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112553930B (zh) * | 2020-12-31 | 2023-04-07 | 濮阳圣恺环保新材料科技股份有限公司 | 一种利用可控温激光照射进行分散染料印花染色的工艺 |
| FI130131B (en) | 2021-09-07 | 2023-03-09 | Picosun Oy | Precursor container |
| TW202432241A (zh) * | 2022-10-13 | 2024-08-16 | 荷蘭商Asm Ip私人控股有限公司 | 蒸氣遞送設備、氣相反應器及用於監測及控制蒸氣遞送系統之方法 |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030072875A1 (en) | 2001-10-11 | 2003-04-17 | Sandhu Gurtej S. | Delivery of solid chemical precursors |
| JP2008522022A (ja) | 2004-11-30 | 2008-06-26 | セントレ・ナショナル・デ・ラ・レシェルシェ・サイエンティフィーク | 固体前駆物質の蒸気を処理装置に供給する装置 |
| JP2009239297A (ja) | 2002-08-23 | 2009-10-15 | Tokyo Electron Ltd | 処理システム |
| JP2009267388A (ja) | 2008-03-31 | 2009-11-12 | Sumitomo Chemical Co Ltd | 有機金属化合物供給装置 |
| JP2010502833A (ja) | 2006-08-31 | 2010-01-28 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 制御された固体モルフォロジを利用する、固体前駆体に基づいた流体の送出 |
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| CA1008667A (en) | 1972-06-30 | 1977-04-19 | Foster Wheeler Corporation | Catalytic steam reforming |
| US5377429A (en) | 1993-04-19 | 1995-01-03 | Micron Semiconductor, Inc. | Method and appartus for subliming precursors |
| US5553395A (en) | 1995-05-31 | 1996-09-10 | Hughes Aircraft Company | Bubbler for solid metal organic source material and method of producing saturated carrying gas |
| US5764849A (en) | 1996-03-27 | 1998-06-09 | Micron Technology, Inc. | Solid precursor injector apparatus and method |
| US6161398A (en) | 1998-04-09 | 2000-12-19 | Lucent Technologies, Inc. | Methods of and systems for vapor delivery control in optical preform manufacture |
| TW451275B (en) * | 1999-06-22 | 2001-08-21 | Tokyo Electron Ltd | Metal organic chemical vapor deposition method and apparatus |
| US6984415B2 (en) | 1999-08-20 | 2006-01-10 | International Business Machines Corporation | Delivery systems for gases for gases via the sublimation of solid precursors |
| JP3909792B2 (ja) | 1999-08-20 | 2007-04-25 | パイオニア株式会社 | 化学気相成長法における原料供給装置及び原料供給方法 |
| JP4866527B2 (ja) | 2000-03-23 | 2012-02-01 | 新日鐵化学株式会社 | 昇華精製方法 |
| US20030030010A1 (en) | 2001-08-07 | 2003-02-13 | Perel Alexander S. | Decaborane vaporizer having improved vapor flow |
| US7601225B2 (en) * | 2002-06-17 | 2009-10-13 | Asm International N.V. | System for controlling the sublimation of reactants |
| US6772072B2 (en) | 2002-07-22 | 2004-08-03 | Applied Materials, Inc. | Method and apparatus for monitoring solid precursor delivery |
| JP4585852B2 (ja) * | 2002-07-30 | 2010-11-24 | エーエスエム アメリカ インコーポレイテッド | 基板処理システム、基板処理方法及び昇華装置 |
| US6797337B2 (en) | 2002-08-19 | 2004-09-28 | Micron Technology, Inc. | Method for delivering precursors |
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| JP4013859B2 (ja) | 2003-07-17 | 2007-11-28 | 富士電機ホールディングス株式会社 | 有機薄膜の製造装置 |
| US20080073559A1 (en) * | 2003-12-12 | 2008-03-27 | Horsky Thomas N | Controlling the flow of vapors sublimated from solids |
| WO2005113857A1 (en) | 2004-05-20 | 2005-12-01 | Akzo Nobel N.V. | Bubbler for constant vapor delivery of a solid chemical |
| US8197898B2 (en) | 2005-03-29 | 2012-06-12 | Tokyo Electron Limited | Method and system for depositing a layer from light-induced vaporization of a solid precursor |
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| JP4317174B2 (ja) | 2005-09-21 | 2009-08-19 | 東京エレクトロン株式会社 | 原料供給装置および成膜装置 |
| EP1860208B1 (en) | 2006-05-22 | 2014-10-15 | Rohm and Haas Electronic Materials LLC | Film deposition method |
| EP2094406B1 (en) | 2006-11-22 | 2015-10-14 | Soitec | Method, apparatus and gate valve assembly for forming monocrystalline group iii-v semiconductor material |
| JP5306993B2 (ja) | 2007-03-30 | 2013-10-02 | 東京エレクトロン株式会社 | 蒸着源ユニット、蒸着装置および蒸着源ユニットの温度調整装置 |
| US8440021B2 (en) | 2007-08-16 | 2013-05-14 | The Regents Of The University Of Michigan | Apparatus and method for deposition for organic thin films |
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-
2019
- 2019-01-29 US US16/260,378 patent/US11168394B2/en active Active
- 2019-03-07 WO PCT/US2019/021074 patent/WO2019177851A1/en not_active Ceased
- 2019-03-07 EP EP19767105.0A patent/EP3765418A4/en active Pending
- 2019-03-07 JP JP2020544229A patent/JP7576464B2/ja active Active
- 2019-03-07 CN CN201980014314.8A patent/CN111770900B/zh active Active
-
2021
- 2021-04-12 US US17/227,695 patent/US11965243B2/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030072875A1 (en) | 2001-10-11 | 2003-04-17 | Sandhu Gurtej S. | Delivery of solid chemical precursors |
| JP2009239297A (ja) | 2002-08-23 | 2009-10-15 | Tokyo Electron Ltd | 処理システム |
| JP2008522022A (ja) | 2004-11-30 | 2008-06-26 | セントレ・ナショナル・デ・ラ・レシェルシェ・サイエンティフィーク | 固体前駆物質の蒸気を処理装置に供給する装置 |
| JP2010502833A (ja) | 2006-08-31 | 2010-01-28 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 制御された固体モルフォロジを利用する、固体前駆体に基づいた流体の送出 |
| JP2009267388A (ja) | 2008-03-31 | 2009-11-12 | Sumitomo Chemical Co Ltd | 有機金属化合物供給装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019177851A1 (en) | 2019-09-19 |
| US20210262085A1 (en) | 2021-08-26 |
| EP3765418A4 (en) | 2021-12-08 |
| CN111770900A (zh) | 2020-10-13 |
| US20190284690A1 (en) | 2019-09-19 |
| CN111770900B (zh) | 2022-10-18 |
| US11965243B2 (en) | 2024-04-23 |
| EP3765418A1 (en) | 2021-01-20 |
| JP2021516723A (ja) | 2021-07-08 |
| US11168394B2 (en) | 2021-11-09 |
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