CN111741614A - 一种精细线路pcb板加工方法 - Google Patents
一种精细线路pcb板加工方法 Download PDFInfo
- Publication number
- CN111741614A CN111741614A CN202010506450.3A CN202010506450A CN111741614A CN 111741614 A CN111741614 A CN 111741614A CN 202010506450 A CN202010506450 A CN 202010506450A CN 111741614 A CN111741614 A CN 111741614A
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- base material
- copper
- processing method
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- electroplating
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- 238000003672 processing method Methods 0.000 title claims abstract description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 110
- 239000000463 material Substances 0.000 claims abstract description 99
- 229910052802 copper Inorganic materials 0.000 claims abstract description 85
- 239000010949 copper Substances 0.000 claims abstract description 85
- 238000009713 electroplating Methods 0.000 claims abstract description 35
- 238000005553 drilling Methods 0.000 claims abstract description 33
- 238000000034 method Methods 0.000 claims abstract description 29
- 239000011889 copper foil Substances 0.000 claims abstract description 25
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000005530 etching Methods 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 27
- 239000003292 glue Substances 0.000 claims description 26
- 239000002887 superconductor Substances 0.000 claims description 19
- 238000001514 detection method Methods 0.000 claims description 18
- 239000002245 particle Substances 0.000 claims description 18
- 238000007747 plating Methods 0.000 claims description 17
- 239000004743 Polypropylene Substances 0.000 claims description 14
- 239000007788 liquid Substances 0.000 claims description 14
- -1 polypropylene Polymers 0.000 claims description 11
- 229920001155 polypropylene Polymers 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 10
- 239000000758 substrate Substances 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 238000007688 edging Methods 0.000 claims description 2
- 230000000903 blocking effect Effects 0.000 abstract 1
- 101100201843 Cyprinus carpio rsph1 gene Proteins 0.000 description 4
- 101100328516 Mus musculus Cnpy2 gene Proteins 0.000 description 4
- 238000000151 deposition Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000006087 Brown hydroboration reaction Methods 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 238000009966 trimming Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/421—Blind plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
- H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
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CN202010506450.3A CN111741614B (zh) | 2020-06-05 | 2020-06-05 | 一种精细线路pcb板加工方法 |
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CN202010506450.3A CN111741614B (zh) | 2020-06-05 | 2020-06-05 | 一种精细线路pcb板加工方法 |
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CN111741614A true CN111741614A (zh) | 2020-10-02 |
CN111741614B CN111741614B (zh) | 2021-12-17 |
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CN202010506450.3A Active CN111741614B (zh) | 2020-06-05 | 2020-06-05 | 一种精细线路pcb板加工方法 |
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Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112996259A (zh) * | 2021-02-09 | 2021-06-18 | 盐城维信电子有限公司 | 一种不同铜厚线路板的制作方法 |
CN113279034A (zh) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | 用于Mini LED微盲孔的填孔电镀加工方法 |
CN113347799A (zh) * | 2021-06-04 | 2021-09-03 | 珠海中京电子电路有限公司 | MiniLED板的制备方法 |
CN113573486A (zh) * | 2021-09-28 | 2021-10-29 | 广东科翔电子科技股份有限公司 | 一种rf-ic载板制作装置以及制作方法 |
CN113950203A (zh) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | 一种高精密Mini-LED PCB的孔中盘制作方法 |
CN114554702A (zh) * | 2022-02-28 | 2022-05-27 | 广东骏亚电子科技股份有限公司 | 一种超薄铜厚印制线路板制作方法 |
CN117881112A (zh) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 一种28层8阶Ultra HDI及其制作方法 |
Citations (13)
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---|---|---|---|---|
JPH01128591A (ja) * | 1987-11-13 | 1989-05-22 | Matsushita Electric Ind Co Ltd | セラミック回路基板 |
CN1849715A (zh) * | 2003-09-11 | 2006-10-18 | 艾迪森股份公司 | 超导复合带及其制造方法 |
CN101029409A (zh) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | 印制线路板直接孔金属化的前处理溶液及方法 |
CN102638936A (zh) * | 2012-04-19 | 2012-08-15 | 蔡新民 | 一种超导热、高耐压led照明类铝基电路板的制作方法 |
CN102821558A (zh) * | 2012-08-24 | 2012-12-12 | 电子科技大学 | 一种印制电路板盲孔的金属化方法 |
CN103987198A (zh) * | 2014-05-27 | 2014-08-13 | 中国科学院微电子研究所 | 一种无辅助结构的无芯基板的制造方法 |
CN104752234A (zh) * | 2014-12-17 | 2015-07-01 | 安捷利电子科技(苏州)有限公司 | 一种柔性封装基板的微盲孔制作方法 |
CN105101681A (zh) * | 2015-07-22 | 2015-11-25 | 深圳崇达多层线路板有限公司 | 一种改善盲孔脱垫的hdi板制作工艺 |
CN105307407A (zh) * | 2015-10-22 | 2016-02-03 | 安捷利电子科技(苏州)有限公司 | 一种半加成法线铜面针孔的制作方式 |
CN106231817A (zh) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | 一种hdi板的制作方法 |
CN106535505A (zh) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | 用于印制板制造的黑孔液 |
CN106852003A (zh) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | 一种无抗蚀层精细线路板的制作方法 |
US20170178018A1 (en) * | 2015-12-21 | 2017-06-22 | D-Wave Systems Inc. | Systems, methods and apparatus for use with superconducting based computing systems |
-
2020
- 2020-06-05 CN CN202010506450.3A patent/CN111741614B/zh active Active
Patent Citations (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01128591A (ja) * | 1987-11-13 | 1989-05-22 | Matsushita Electric Ind Co Ltd | セラミック回路基板 |
CN1849715A (zh) * | 2003-09-11 | 2006-10-18 | 艾迪森股份公司 | 超导复合带及其制造方法 |
CN101029409A (zh) * | 2006-11-24 | 2007-09-05 | 江苏工业学院 | 印制线路板直接孔金属化的前处理溶液及方法 |
CN102638936A (zh) * | 2012-04-19 | 2012-08-15 | 蔡新民 | 一种超导热、高耐压led照明类铝基电路板的制作方法 |
CN102821558A (zh) * | 2012-08-24 | 2012-12-12 | 电子科技大学 | 一种印制电路板盲孔的金属化方法 |
CN103987198A (zh) * | 2014-05-27 | 2014-08-13 | 中国科学院微电子研究所 | 一种无辅助结构的无芯基板的制造方法 |
CN104752234A (zh) * | 2014-12-17 | 2015-07-01 | 安捷利电子科技(苏州)有限公司 | 一种柔性封装基板的微盲孔制作方法 |
CN105101681A (zh) * | 2015-07-22 | 2015-11-25 | 深圳崇达多层线路板有限公司 | 一种改善盲孔脱垫的hdi板制作工艺 |
CN105307407A (zh) * | 2015-10-22 | 2016-02-03 | 安捷利电子科技(苏州)有限公司 | 一种半加成法线铜面针孔的制作方式 |
US20170178018A1 (en) * | 2015-12-21 | 2017-06-22 | D-Wave Systems Inc. | Systems, methods and apparatus for use with superconducting based computing systems |
CN106231817A (zh) * | 2016-07-27 | 2016-12-14 | 江苏博敏电子有限公司 | 一种hdi板的制作方法 |
CN106535505A (zh) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | 用于印制板制造的黑孔液 |
CN106852003A (zh) * | 2017-04-06 | 2017-06-13 | 宜兴硅谷电子科技有限公司 | 一种无抗蚀层精细线路板的制作方法 |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112996259A (zh) * | 2021-02-09 | 2021-06-18 | 盐城维信电子有限公司 | 一种不同铜厚线路板的制作方法 |
CN112996259B (zh) * | 2021-02-09 | 2022-07-19 | 盐城维信电子有限公司 | 一种不同铜厚线路板的制作方法 |
CN113279034A (zh) * | 2021-05-14 | 2021-08-20 | 惠州中京电子科技有限公司 | 用于Mini LED微盲孔的填孔电镀加工方法 |
CN113347799A (zh) * | 2021-06-04 | 2021-09-03 | 珠海中京电子电路有限公司 | MiniLED板的制备方法 |
CN113573486A (zh) * | 2021-09-28 | 2021-10-29 | 广东科翔电子科技股份有限公司 | 一种rf-ic载板制作装置以及制作方法 |
CN113573486B (zh) * | 2021-09-28 | 2021-12-14 | 广东科翔电子科技股份有限公司 | 一种rf-ic载板制作装置以及制作方法 |
CN113950203A (zh) * | 2021-12-20 | 2022-01-18 | 广东科翔电子科技股份有限公司 | 一种高精密Mini-LED PCB的孔中盘制作方法 |
CN114554702A (zh) * | 2022-02-28 | 2022-05-27 | 广东骏亚电子科技股份有限公司 | 一种超薄铜厚印制线路板制作方法 |
CN117881112A (zh) * | 2024-03-12 | 2024-04-12 | 四川英创力电子科技股份有限公司 | 一种28层8阶Ultra HDI及其制作方法 |
CN117881112B (zh) * | 2024-03-12 | 2024-05-07 | 四川英创力电子科技股份有限公司 | 一种28层8阶Ultra HDI及其制作方法 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Processing Method of Fine PCB Effective date of registration: 20221213 Granted publication date: 20211217 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
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Date of cancellation: 20230425 Granted publication date: 20211217 Pledgee: Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2022980026350 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
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Denomination of invention: A Fine Circuit PCB Processing Method Effective date of registration: 20230512 Granted publication date: 20211217 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20211217 Pledgee: Agricultural Bank of China Limited Guangzhou Development Zone Branch Pledgor: GUANGZHOU MEADVILLE ELECTRONICS Co.,Ltd. Registration number: Y2023980040495 |