CN111606578A - Temperable low-reflection double-silver low-radiation coated glass and preparation method thereof - Google Patents
Temperable low-reflection double-silver low-radiation coated glass and preparation method thereof Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 87
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 30
- 239000004332 silver Substances 0.000 title claims abstract description 30
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 311
- 239000011241 protective layer Substances 0.000 claims abstract description 76
- 239000002346 layers by function Substances 0.000 claims abstract description 59
- 229910004205 SiNX Inorganic materials 0.000 claims abstract description 26
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 25
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910001120 nichrome Inorganic materials 0.000 claims abstract description 25
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 229910007667 ZnOx Inorganic materials 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 229910004286 SiNxOy Inorganic materials 0.000 claims abstract description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 32
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 17
- 230000005540 biological transmission Effects 0.000 abstract description 9
- 238000002310 reflectometry Methods 0.000 abstract description 9
- 230000007935 neutral effect Effects 0.000 abstract description 8
- 230000008569 process Effects 0.000 description 22
- 238000005496 tempering Methods 0.000 description 17
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 16
- 238000000151 deposition Methods 0.000 description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- 239000012300 argon atmosphere Substances 0.000 description 8
- 230000008021 deposition Effects 0.000 description 8
- 238000002834 transmittance Methods 0.000 description 8
- 239000011787 zinc oxide Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000005344 low-emissivity glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000001579 optical reflectometry Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
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- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000010020 roller printing Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3626—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer one layer at least containing a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3644—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
- C03C2218/156—Deposition methods from the vapour phase by sputtering by magnetron sputtering
Abstract
The invention discloses a temperable low-reflection double-silver low-radiation coated glass and a preparation method thereof, wherein the temperable low-reflection double-silver low-radiation coated glass comprises a glass substrate and a composite film layer plated on the glass substrate, and the composite film layer comprises a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged; the first dielectric layer is SiNxLayer of ZnO as the second dielectric layerxLayer or SiNxA layer or a composite layer thereof, the third dielectric layer being SiNxLayer or SiOxLayer or SiNxOyThe first seed layer and the second seed layer are ZnOxThe first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers. The glass provided by the invention has low reflectivity, neutral transmission color and filmThe color of the layer is stable.
Description
Technical Field
The invention relates to the technical field of coated glass manufacturing, in particular to temperable low-reflection double-silver low-emissivity coated glass and a preparation method thereof.
Background
In the prior art, low-radiation coated glass generally refers to low-radiation functional layers deposited on the surface of float glass, so as to reflect near infrared rays in sunlight and far infrared rays in a living environment, and achieve the effect of reducing the absorption and radiation of the glass to the infrared rays, so the low-radiation coated glass is called as low-radiation coated glass.
The low-emissivity coated glass can be used for doors and windows of families, and can also be used for glass curtain walls of markets, office buildings and high-grade hotels and other required places. With the large-scale application of the traditional low-emissivity coated glass, the light pollution becomes a problem which puzzles urban residents and needs to be solved urgently because the reflectivity of the traditional low-emissivity coated glass to visible light is higher. In order to reduce the phenomenon of light pollution caused by the large-scale use of the glass curtain wall, governments in various places issue policy and regulations to limit the foreign reflection of the building glass.
Because the low-radiation coated glass which can be subjected to high-temperature heat treatment can be subjected to bending treatment, the appearance design concept of a building can be better expressed, and on the other hand, the production and processing cost can be obviously reduced, so that the low-radiation coated glass becomes a common product in the market. Although the recent buildings adopting the toughened coated glass have different colors when observed at a long distance, the buildings show more obvious and uniform blue-green or yellow-green colors when observed at a short distance.
The reason why the transparent color of the toughened coating product is obviously greenish is that the composite nano-film layer coated by the toughened coating product needs to withstand high temperature for a long time, so that an enough protective layer (such as silicon nitride SiN) is added into the film layer materialxAnd a nichrome layer NiCr to protect the low-emissivity silver layer). The protective layers selectively transmit green light, so that the common toughened coating products on the market can transmitThe overcolor is light green, which affects the visual effect of people.
Disclosure of Invention
The invention aims to provide temperable low-reflection double-silver low-emissivity coated glass and a preparation method thereof, and aims to solve the problem that the performance of the existing temperable low-emissivity coated glass still needs to be improved.
The embodiment of the invention provides a temperable low-reflection double-silver low-radiation coated glass, which comprises a glass substrate and a composite film layer plated on the glass substrate, wherein the composite film layer comprises a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged;
the first dielectric layer is SiNxLayer of ZnO as the second dielectric layerxLayer or SiNxA layer or a composite layer thereof, the third dielectric layer being SiNxLayer or SiOxLayer or SiNxOyThe first seed layer and the second seed layer are ZnOxThe first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers.
Furthermore, the thickness of the first dielectric layer is 26-38 nm, the thickness of the second dielectric layer is 50-90 nm, and the thickness of the third dielectric layer is 40-60 nm.
Furthermore, the thickness of the first seed layer and the second seed layer is 15-20 nm.
Further, the thickness of the first functional layer is 9-15 nm.
Further, the thickness of the second functional layer is 6-18 nm.
Furthermore, the thickness of the first protective layer is 2-4 nm, the thickness of the second protective layer is 1-4 nm, and the thickness of the third protective layer is 1-6 nm.
Further, the thickness of the tungsten-copper alloy layer is 6-12 nm.
Furthermore, the thickness of the first AZO layer and the second AZO layer is 8-10 nm.
The embodiment of the invention also provides a preparation method of the temperable low-reflection double-silver low-emissivity coated glass, which comprises the following steps:
plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiNxA layer;
plating a tungsten-copper alloy layer on the first dielectric layer;
plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
plating a first seed layer on the first protective layer, wherein the first seed layer is ZnOxA layer;
plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
a second protective layer is plated on the first functional layer, and the second protective layer is a NiCr layer;
plating a first AZO layer on the first protective layer;
plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnOxLayer or SiNxA layer or a composite thereof;
plating a second seed layer on the second dielectric layer, wherein the second seed layer is ZnOxA layer;
plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
a third protective layer is plated on the second functional layer, and the third protective layer is a NiCr layer;
plating a second AZO layer on the third protective layer;
plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiNxLayer or SiOxLayer or SiNxOyA layer or a composite thereof.
Furthermore, the plating process adopts a magnetron sputtering process.
The embodiment of the invention provides a temperable low-reflection double-silver low-emissivity coated glass and a preparation method thereof, wherein the temperable low-reflection double-silver low-emissivity coated glass comprises a glass substrate and a composite film layer plated on the glass substrate, and the composite film layerThe film laminating layer comprises a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged; the first dielectric layer is SiNxLayer of ZnO as the second dielectric layerxLayer or SiNxA layer or a composite layer thereof, the third dielectric layer being SiNxLayer or SiOxLayer or SiNxOyThe first seed layer and the second seed layer are ZnOxThe first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers. The glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a temperable low-reflection double-silver low-emissivity coated glass provided by an embodiment of the invention;
fig. 2 is a schematic flow chart of a method for manufacturing a temperable low-reflection double-silver low-emissivity coated glass according to an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, a temperable low-reflectivity double-silver low-emissivity coated glass provided in an embodiment of the present invention includes a glass substrate 101 and a composite film layer plated on the glass substrate 101, where the composite film layer includes a first dielectric layer 102, a tungsten-copper alloy layer 103, a first protective layer 104, a first seed layer 105, a first functional layer 106, a second protective layer 107, a first AZO layer 108, a second dielectric layer 109, a second seed layer 110, a second functional layer 111, a third protective layer 112, a second AZO layer 113, and a third dielectric layer 114, which are sequentially disposed;
the first dielectric layer 102 is SiNxLayer of ZnO, the second dielectric layer 109xLayer or SiNxA layer or a composite layer thereof, the third dielectric layer 114 being SiNxLayer or SiOxLayer or SiNxOyA layer or a composite layer thereof, the first seed layer 105 and the second seed layer 110 being ZnOxThe first functional layer 106 and the second functional layer 111 are Ag layers (i.e., silver layers), and the first protective layer 104, the second protective layer 107, and the third protective layer 112 are NiCr layers (i.e., nichrome layers).
In the embodiment of the invention, the tungsten-copper alloy layer 103 is used as a sandwich layer to reduce the reflectivity of a LOW-E (LOW-emissivity) glass product and improve the transmittance and radiance of the LOW-E glass product; ag is used as the first functional layer 106 and the second functional layer 111 to improve the radiance of the LOW-E glass product, and finally the LOW-E glass product with ultralow visible light reflectivity and neutral transmission color is realized. Generally, the glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
Specifically, in the embodiment of the invention, the tungsten-copper alloy is used as the sandwich layer, and the tungsten-copper alloy has an absorption effect rather than a reflection effect on visible light, so that the reflectance of the visible light can be reduced. In addition, the metal tungsten has the characteristic of full-spectrum absorption, so that the color of the glass cannot be greatly changed even if the tungsten-copper alloy is added, and the production stability is facilitated.
In addition, the copper has the function of selectively absorbing visible light, so that the transmission color of the glass provided by the embodiment of the invention can be neutral, and the problem that the transmission color of the traditional toughened glass product is greenish is solved.
In the embodiment of the invention, the first protective layer 104(NiCr layer) is plated on the tungsten-copper alloy layer 103, so that the oxidation resistance, scratch resistance and high temperature resistance of the temperable low-reflection double-silver low-emissivity coated glass can be improved, and the NiCr layer enables the glass product to have a good inhibition effect on typical surface defects, such as disc printing, sucker printing, press roller printing and the like.
In the examples of the present invention, ZnO was usedxAs a seed layer, the flatness of the film layer can be improved, a better growth platform is provided for the functional layer, and if the functional layer is deposited on other dielectric film layer materials, the quality of the obtained functional film layer is poor, which leads to the performance reduction of the low-radiation glass.
In the embodiment of the present invention, the second dielectric layer 109 may be ZnOxLayer or SiNxLayer, preferably ZnOxAnd SiNxDue to ZnOxThe extinction coefficient K value is lowest, ZnO is added into the dielectric layerxThe transmittance of the film layer can be relatively improved, and the visible light reflectivity can be reduced.
Further, the thickness of the first dielectric layer 102 is 26-38 nm, the thickness of the second dielectric layer 109 is 50-90 nm, and the thickness of the third dielectric layer 114 is 40-60 nm. The dielectric layer with the thickness is matched with other layers, so that the performance of the glass product can be improved.
Further, the thickness of the first seed layer 105 and the second seed layer 110 is 15-20 nm. The seed layer with the thickness can improve the quality of the functional layer deposited on the seed layer, and further improve the product performance.
Further, the thickness of the first functional layer 106 is 9-15 nm. The thickness of the second functional layer 111 is 6-18 nm. And respectively depositing the functional layers with the thicknesses on the corresponding seed layers, thereby improving the radiance.
Further, the thickness of the first protection layer 104 is 2 to 4nm, the thickness of the second protection layer 107 is 1 to 4nm, and the thickness of the third protection layer 112 is 1 to 6 nm. With the protective layer having the above thickness, a better protective effect can be improved for the tungsten-copper alloy layer 103, the first functional layer 106, and the second functional layer 111.
Further, the thickness of the tungsten-copper alloy layer 103 is 6 to 12 nm. The tungsten-copper alloy layer 103 with the thickness can better improve the transmittance and emissivity of the LOW-E glass product.
Further, the thickness of the first AZO layer 108 and the second AZO layer 113 is 8-10 nm. AZO is aluminum-doped zinc oxide, and the final performance of the glass product can be improved by adding the AZO layer.
The embodiment of the invention also provides a preparation method of the temperable low-reflection double-silver low-emissivity coated glass, which comprises the following steps of:
s101, plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiNxA layer;
s102, plating a tungsten-copper alloy layer on the first dielectric layer;
s103, plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
s104, plating a first seed layer on the first protective layer, wherein the first seed layer is ZnOxA layer;
s105, plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
s106, plating a second protective layer on the first functional layer, wherein the second protective layer is a NiCr layer;
s107, plating a first AZO layer on the first protective layer;
s108, plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnOxLayer or SiNxA layer or a composite thereof;
s109, plating a second seed layer on the second dielectric layer, wherein the second seed layer is ZnOxA layer;
s110, plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
s111, plating a third protective layer on the second functional layer, wherein the third protective layer is a NiCr layer;
s112, plating a second AZO layer on the third protective layer;
s113, plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiNxLayer or SiOxLayer or SiNxOyA layer or a composite thereof.
Furthermore, the plating process adopts a magnetron sputtering process. The magnetron sputtering process has the advantages of high deposition rate, low substrate deposition temperature, good film-forming adhesion, easy control, low cost and capability of realizing large-area film preparation.
The thickness of each layer involved in the above preparation method is the same as that in the previous glass product, and is not described again.
The temperable low-reflection double-silver low-radiation coated glass obtained by the embodiment of the invention can be tempered. The specific process of the toughening treatment comprises the following steps:
the temperable low-reflection double-silver low-radiation coated glass is placed in a tempering furnace, the heating temperature of the coated surface of a glass substrate is 670-700 ℃, the heating temperature of the non-coated surface is 670-680 ℃ lower than the surface temperature of the coated surface, the heat absorption capacity of the film layer is determined to be not as strong as that of the non-coated surface due to the film layer being a low-radiation coating, and the temperature of the coated surface is higher than that of the non-coated surface in order to ensure that the coated surface and the non-coated surface absorb heat uniformly and prevent the glass from being bent during tempering treatment.
Example (b):
plating a first dielectric layer on a glass substrate by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, the silicon target is in the mixed atmosphere of argon and nitrogen (Ar: N)29:7 by volume ratio, the same applies below) was deposited by sputtering, depositing a first dielectric layer (SiN) with a film thickness of 41nmxA layer);
plating a tungsten-copper alloy layer on the first dielectric layer by adopting a magnetron sputtering process: under the control of a direct current power supply, sputtering and depositing a tungsten-copper alloy target under the pure argon atmosphere to deposit a tungsten-copper alloy layer with the film thickness of 7.8 nm;
plating a first protective layer on the tungsten-copper alloy layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a first protective layer (NiCr layer) with the film thickness of 3nm is deposited;
plating a first seed layer on the first protective layer by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, the ZnAl target is in the mixed atmosphere of argon and oxygen (Ar: O)2Volume ratio, same below) was sputter deposited with a first seed layer (ZnO) having a film thickness of 17.3nmxA layer);
plating a first functional layer on the first seed layer by adopting a magnetron sputtering process: under the control of a direct current power supply, an Ag target is sputtered and deposited in a pure argon atmosphere, and a first functional layer (Ag layer) with the film thickness of 12.5nm is deposited;
plating a second protective layer on the first functional layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a second protective layer (NiCr layer) with the film thickness of 2.6nm is deposited;
plating a first AZO layer on the second protective layer by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, performing sputtering deposition on an AZO target in an argon atmosphere to deposit a first AZO layer with the film thickness of 9.2 nm;
plating a second dielectric layer on the first AZO layer by adopting a magnetron sputtering process: under the control of the medium-frequency alternating-current power supply,the silicon target is in the mixed atmosphere of argon and nitrogen (Ar: N)29:7) and a second dielectric layer (SiN) with a film thickness of 75.3nm was depositedxA layer);
plating a second seed layer on the second dielectric layer by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, a Zn target is in a mixed atmosphere of argon and oxygen (Ar: O)2Sputter deposition under 7:10) with a second seed layer (ZnO) with a film thickness of 13.8nm depositedxA layer);
plating a second functional layer on the second seed layer by adopting a magnetron sputtering process: under the control of a direct current power supply, an Ag target is sputtered and deposited in a pure argon atmosphere, and a second functional layer (Ag layer) with the thickness of a deposited film layer being 13.2nm is deposited;
plating a third protective layer on the second functional layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a third protective layer (NiCr layer) with the film thickness of 3.2nm is deposited;
and plating a second AZO layer on the second protective layer by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, performing sputtering deposition on an AZO target in an argon atmosphere to deposit a second AZO layer with the film thickness of 8.5 nm;
plating a third dielectric layer on the second AZO layer by adopting a magnetron sputtering process: under the control of a medium-frequency alternating current power supply, the silicon target is in the mixed atmosphere of argon and nitrogen (Ar: N)2Sputtering deposition under 9:7) to deposit a third dielectric layer (SiN) with a film thickness of 53.4nmxA layer);
the color of the glass prepared in this example before tempering is shown in table 1: the color after tempering is shown in table 2.
In table 1, "glass surface before tempering" refers to a surface of the prepared low-emissivity glass that is not coated before tempering, "membrane surface before tempering" refers to a surface of the prepared low-emissivity glass that is coated before tempering, "transmission before tempering" refers to a visible light transmittance (color is transmitted, for example, a colorless or white object is seen through the coated glass, the object will appear color) of the prepared low-emissivity glass before tempering, and "side surface before tempering" refers to a side surface of the prepared low-emissivity glass before tempering. Where R denotes the visible light reflectance and g is the abbreviation for glass, here glass, for example: r% g refers to the visible reflectance of the glass side, f is an abbreviation for film, here the film side, for example: r% f refers to the visible light reflectance of the film surface, T refers to the visible light transmittance, c refers to the side surface, for example: r% c refers to the visible light reflectivity of the side face, L is the metric lightness and the size is between 0 and 100; and a, b, axis is yellow-blue axis, and positive is yellow and negative is blue. Correspondingly, the data in table 2 are all the test data after tempering.
TABLE 1
TABLE 2
And (3) testing optical performance:
before tempering, the emissivity of the single piece of low-emissivity coated glass is 0.031, the reflectivity of the glass surface is 5.03 percent, and the visible light transmittance is 43.2 percent;
the detection result after tempering shows that the emissivity of the single piece of low-emissivity coated glass is 0.025, the glass surface reflectivity is 6.95%, and the visible light transmittance is 52.47%; after tempering, a is-0.67, b is 0.12, and thus it can be seen that the reflectance is low after tempering, substantially no light pollution is achieved, and the transmitted color is also very neutral.
Physical properties:
according to GB9656-2003, the toughened film layer is wiped without demoulding, and an impact experiment, an irradiation resistance experiment, a damp-heat cycle experiment and the like can meet the requirements. The detection result shows that the knocking experiment grade is 4.
The temperable LOW-reflection double-silver LOW-emissivity coated glass prepared by the method can effectively improve the transmittance and emissivity of a LOW-E glass product; finally, the LOW-E glass product with ultralow visible light reflectivity and neutral transmission color is realized. Generally, the glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the structure disclosed by the embodiment, the structure corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. A temperable low-reflection double-silver low-radiation coated glass is characterized by comprising a glass substrate and a composite film layer plated on the glass substrate, wherein the composite film layer comprises a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged;
the first dielectric layer is SiNxLayer of ZnO as the second dielectric layerxLayer or SiNxA layer or a composite layer thereof, the third dielectric layer being SiNxLayer or SiOxLayer or SiNxOyThe first seed layer and the second seed layer are ZnOxThe first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers.
2. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the thickness of the first dielectric layer is 26-38 nm, the thickness of the second dielectric layer is 50-90 nm, and the thickness of the third dielectric layer is 40-60 nm.
3. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the first seed layer and the second seed layer have a thickness of 15-20 nm.
4. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the thickness of the first functional layer is 9-15 nm.
5. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the thickness of the second functional layer is 6-18 nm.
6. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the first protective layer has a thickness of 2 to 4nm, the second protective layer has a thickness of 1 to 4nm, and the third protective layer has a thickness of 1 to 6 nm.
7. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the tungsten-copper alloy layer has a thickness of 6-12 nm.
8. The temperable low-reflection double-silver low-emissivity coated glass according to claim 1, wherein the first AZO layer and the second AZO layer have a thickness of 8-10 nm.
9. The method for preparing the temperable low-reflection double-silver low-emissivity coated glass as claimed in any one of claims 1 to 8, wherein the method comprises the following steps:
plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiNxA layer;
plating a tungsten-copper alloy layer on the first dielectric layer;
plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
plating a first seed layer on the first protective layer, wherein the first seed layer is ZnOxA layer;
plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
a second protective layer is plated on the first functional layer, and the second protective layer is a NiCr layer;
plating a first AZO layer on the first protective layer;
plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnOxLayer or SiNxA layer or a composite thereof;
plating a second seed layer on the second dielectric layer, wherein the second seed layer is ZnOxA layer;
plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
a third protective layer is plated on the second functional layer, and the third protective layer is a NiCr layer;
plating a second AZO layer on the third protective layer;
plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiNxLayer or SiOxLayer or SiNxOyA layer or a composite thereof.
10. The method for preparing temperable low-reflection double-silver low-emissivity coated glass according to claim 9, wherein the plating is performed by magnetron sputtering.
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