CN111606578B - Temperable low-reflection double-silver low-emissivity coated glass and preparation method thereof - Google Patents
Temperable low-reflection double-silver low-emissivity coated glass and preparation method thereof Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 82
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 24
- 239000004332 silver Substances 0.000 title claims abstract description 24
- 238000002360 preparation method Methods 0.000 title abstract description 10
- 239000010410 layer Substances 0.000 claims abstract description 308
- 239000011241 protective layer Substances 0.000 claims abstract description 75
- 239000002346 layers by function Substances 0.000 claims abstract description 59
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 25
- SBYXRAKIOMOBFF-UHFFFAOYSA-N copper tungsten Chemical compound [Cu].[W] SBYXRAKIOMOBFF-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910001120 nichrome Inorganic materials 0.000 claims abstract description 25
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000002131 composite material Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 238000007747 plating Methods 0.000 claims description 54
- 238000000034 method Methods 0.000 claims description 28
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 17
- 238000005496 tempering Methods 0.000 claims description 17
- 238000010438 heat treatment Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 abstract description 13
- 238000002310 reflectometry Methods 0.000 abstract description 9
- 230000007935 neutral effect Effects 0.000 abstract description 8
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical group [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 38
- 239000011787 zinc oxide Substances 0.000 description 19
- 238000000151 deposition Methods 0.000 description 14
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 10
- 239000012300 argon atmosphere Substances 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 230000008021 deposition Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 239000012298 atmosphere Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000005344 low-emissivity glass Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000002474 experimental method Methods 0.000 description 4
- 238000001579 optical reflectometry Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002120 nanofilm Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000005341 toughened glass Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3649—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer made of metals other than silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3626—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer one layer at least containing a nitride, oxynitride, boronitride or carbonitride
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3644—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the metal being silver
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
- C03C2218/156—Deposition methods from the vapour phase by sputtering by magnetron sputtering
Abstract
The invention discloses a toughened low-reflection double-silver low-emissivity coated glass and a preparation method thereof, wherein the toughened low-reflection double-silver low-emissivity coated glass comprises a glass substrate and a composite film layer plated on the glass substrate, and the composite film layer comprises a first dielectric layer, a tungsten copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged; the first dielectric layer is SiN x The second dielectric layer is ZnO x Layer or SiN x A layer or a composite layer thereof, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y The first seed layer and the second seed layer are ZnO x The first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers. The glass provided by the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
Description
Technical Field
The invention relates to the technical field of coated glass manufacturing, in particular to a toughened low-reflection double-silver low-radiation coated glass and a preparation method thereof.
Background
In the prior art, the low-emissivity coated glass generally refers to a low-emissivity coated glass which is formed by depositing a low-emissivity functional layer on the surface of float glass, so that near infrared rays in sunlight and far infrared rays in living environment are reflected, and the effect of reducing the absorption and radiation of the glass on the infrared rays is achieved, so that the low-emissivity coated glass is called as the low-emissivity coated glass.
The low-radiation coated glass can be used for doors and windows of families, glass curtain walls of shops, office buildings and high-grade hotels and other places where the glass is needed. Along with the large-scale application of the traditional low-emissivity coated glass, the light pollution is an urgent problem which puzzles urban residents due to the higher reflectivity of the glass to visible light. In order to reduce the phenomenon of light pollution caused by large-scale use of the glass curtain wall, governments in various places issue policy and regulations, and limit the external reflection of building glass.
The low-emissivity coated glass which can be subjected to high-temperature heat treatment at present can be subjected to bending treatment, so that the appearance design concept of a building can be better expressed, and on the other hand, the production and processing cost can be obviously reduced, so that the glass becomes a common product in the market. Although recent buildings using toughened coated glass are different in color when viewed from a distance, they all appear more distinct, uniform blue-green or yellow-green when viewed from a near distance.
The reason for the obvious greenish color of the temperable coating product is that the coated composite nano-film layer needs to withstand long-time high temperature, so that enough protective layer (such as silicon nitride SiN) is added into the film layer material x A nichrome layer NiCr to protect the low emissivity silver layer). The protective layers selectively penetrate green light, so that the color of the penetration color of the common toughened coating product on the market is light green, and the visual effect of people is affected.
Disclosure of Invention
The invention aims to provide toughened low-reflection double-silver low-emissivity coated glass and a preparation method thereof, and aims to solve the problem that the performance of the traditional toughened low-emissivity coated glass is still to be improved.
The embodiment of the invention provides toughened low-reflection double-silver low-radiation coated glass, which comprises a glass substrate and a composite film layer plated on the glass substrate, wherein the composite film layer comprises a first dielectric layer, a tungsten copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged;
the first dielectric layer is SiN x The second dielectric layer is ZnO x Layer or SiN x A layer or a composite layer thereof, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y The first seed layer and the second seed layer are ZnO x The first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer are NiCr layers.
Further, the thickness of the first dielectric layer is 26-38 nm, the thickness of the second dielectric layer is 50-90 nm, and the thickness of the third dielectric layer is 40-60 nm.
Further, the thickness of the first seed layer and the second seed layer is 15-20 nm.
Further, the thickness of the first functional layer is 9-15 nm.
Further, the thickness of the second functional layer is 6-18 nm.
Further, the thickness of the first protective layer is 2-4 nm, the thickness of the second protective layer is 1-4 nm, and the thickness of the third protective layer is 1-6 nm.
Further, the thickness of the tungsten-copper alloy layer is 6-12 nm.
Further, the thicknesses of the first AZO layer and the second AZO layer are 8-10 nm.
The embodiment of the invention also provides a preparation method of the toughened low-reflection double-silver low-emissivity coated glass, which comprises the following steps:
plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiN x A layer;
plating a tungsten copper alloy layer on the first dielectric layer;
plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
plating a first seed layer on the first protective layer, wherein the first seed layer is ZnO x A layer;
plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
plating a second protective layer on the first functional layer, wherein the second protective layer is a NiCr layer;
plating a first AZO layer on the first protective layer;
plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnO x Layer or SiN x A layer or a composite layer thereof;
plating a second seed layer on the second dielectric layer, wherein the second seed layer is ZnO x A layer;
plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
plating a third protective layer on the second functional layer, wherein the third protective layer is a NiCr layer;
plating a second AZO layer on the third protective layer;
plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y A layer or a composite layer thereof.
Furthermore, the plating is carried out by adopting a magnetron sputtering process.
The embodiment of the invention provides a toughened low-reflection double-silver low-emissivity coated glass and a preparation method thereof, wherein the toughened low-reflection double-silver low-emissivity coated glass comprises a glass substrate and a composite film layer plated on the glass substrate, and the composite film layer comprises a first dielectric layer, a tungsten copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged; the first dielectric layer is SiN x The second dielectric layer is ZnO x Layer or SiN x A layer or a composite layer thereof, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y The first seed layer and the second seed layer are ZnO x A layer, wherein the first functional layer and the second functional layer are Ag layers, and the first protective layerThe second protective layer and the third protective layer are NiCr layers. The glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a temperable low-reflection double-silver low-radiation coated glass according to an embodiment of the present invention;
fig. 2 is a schematic flow chart of a preparation method of a temperable low-reflection double-silver low-emissivity coated glass in an embodiment of the invention.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1, the toughened low-reflection dual-silver low-emissivity coated glass provided by the embodiment of the invention comprises a glass substrate 101 and a composite film layer plated on the glass substrate 101, wherein the composite film layer comprises a first dielectric layer 102, a tungsten copper alloy layer 103, a first protection layer 104, a first seed layer 105, a first functional layer 106, a second protection layer 107, a first AZO layer 108, a second dielectric layer 109, a second seed layer 110, a second functional layer 111, a third protection layer 112, a second AZO layer 113 and a third dielectric layer 114 which are sequentially arranged;
the first dielectric layer 102 is SiN x The second dielectric layer 109 is ZnO x Layer or SiN x A layer or a composite layer thereof, the third dielectric layer 114 being SiN x Layers or SiO x Layer or SiN x O y A layer or a composite layer thereof, wherein the first seed layer 105 and the second seed layer 110 are ZnO x The first functional layer 106 and the second functional layer 111 are Ag layers (i.e., silver layers), and the first protective layer 104, the second protective layer 107, and the third protective layer 112 are NiCr layers (i.e., nichrome layers).
According to the embodiment of the invention, the tungsten-copper alloy layer 103 is used as a sandwich layer, so that the reflectivity of a LOW-E (LOW emissivity) glass product is reduced, and the transmission color and the emissivity of the LOW-E glass product are improved; ag is used as the first functional layer 106 and the second functional layer 111 to improve the emissivity of the LOW-E glass product, and finally, the LOW-E glass product having ultra-LOW visible light reflectivity and having a neutral transmission color is achieved. In general, the glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
Specifically, the embodiment of the invention adopts the tungsten-copper alloy as the sandwich layer, the tungsten-copper alloy has an absorption effect on visible light, but not a reflection effect, and the reflectance of the visible light can be reduced. In addition, the tungsten metal has the characteristic of full spectrum absorption, so that the color of the glass cannot be greatly changed even if tungsten-copper alloy is added, and the production stability is facilitated.
In addition, copper has the effect of selectively absorbing visible light, so that the transparent color of the glass provided by the embodiment of the invention is neutral, and the problem that the transparent color of the traditional toughened glass product is greenish is solved.
In the embodiment of the invention, the first protective layer 104 (NiCr layer) is plated on the tungsten copper alloy layer 103, so that the oxidation resistance, scratch resistance and high temperature resistance of the toughened low-reflection double-silver low-radiation coated glass can be improved, and the NiCr layer enables the glass product to have good inhibition effect on typical surface defects such as disc printing, sucking disc printing, roller pressing and the like.
In the embodiment of the invention, znO is adopted x As a seed layer, the flatness of the film can be improved, a better growth platform is provided for the functional layer, and if the functional layer is deposited on other dielectric film materials, the quality of the obtained functional film is poorer, which leads to the performance degradation of the low-emissivity glass.
In the embodiment of the present invention, the second dielectric layer 109 may be ZnO x Layer or SiN x A layer, preferably ZnO x And SiN x Due to ZnO x The extinction coefficient K value of (C) is the lowest, and ZnO is added into the dielectric layer x Can relatively improve the transmittance of the film layer and reduce the visible light reflectivity.
Further, the thickness of the first dielectric layer 102 is 26-38 nm, the thickness of the second dielectric layer 109 is 50-90 nm, and the thickness of the third dielectric layer 114 is 40-60 nm. The dielectric layer with the thickness is matched with other layers, so that the performance of the glass product can be improved.
Further, the thickness of the first seed layer 105 and the second seed layer 110 is 15 to 20nm. The seed layer with the thickness can improve the quality of the functional layer deposited on the seed layer, thereby improving the performance of the product.
Further, the thickness of the first functional layer 106 is 9 to 15nm. The thickness of the second functional layer 111 is 6 to 18nm. Functional layers of the above thickness are respectively deposited on the corresponding seed layers, thereby improving emissivity.
Further, the thickness of the first protective layer 104 is 2-4 nm, the thickness of the second protective layer 107 is 1-4 nm, and the thickness of the third protective layer 112 is 1-6 nm. By adopting the protective layer with the thickness, better protective effects can be improved for the corresponding tungsten copper alloy layer 103, the first functional layer 106 and the second functional layer 111.
Further, the thickness of the tungsten copper alloy layer 103 is 6-12 nm. The tungsten copper alloy layer 103 with the thickness can better improve the transmission color and the emissivity of the LOW-E glass product.
Further, the thicknesses of the first AZO layer 108 and the second AZO layer 113 are 8-10 nm. AZO is aluminum-doped zinc oxide, and the final performance of the glass product can be improved by adding an AZO layer.
The embodiment of the invention also provides a preparation method of the toughened low-reflection double-silver low-emissivity coated glass, which is shown in fig. 2 and comprises the following steps:
s101, plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiN x A layer;
s102, plating a tungsten copper alloy layer on the first dielectric layer;
s103, plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
s104, plating a first seed layer on the first protective layer, wherein the first seed layer is ZnO x A layer;
s105, plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
s106, plating a second protective layer on the first functional layer, wherein the second protective layer is a NiCr layer;
s107, plating a first AZO layer on the first protective layer;
s108, plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnO x Layer or SiN x A layer or a composite layer thereof;
s109, plating a second seed layer on the second dielectric layer, wherein the second seed layer is ZnO x A layer;
s110, plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
s111, plating a third protective layer on the second functional layer, wherein the third protective layer is a NiCr layer;
s112, plating a second AZO layer on the third protective layer;
s113, plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y A layer or a composite layer thereof.
Furthermore, the plating is carried out by adopting a magnetron sputtering process. The magnetron sputtering process has the advantages of high deposition rate, low substrate deposition temperature, good film formation adhesion, easy control, low cost and capability of realizing large-area film formation.
The thickness of each layer involved in the preparation method is the same as that of the previous glass product, and the description is omitted.
The toughened low-reflection double-silver low-radiation coated glass obtained by the embodiment of the invention can be subjected to toughening treatment. The specific process of the tempering treatment is as follows:
the toughened low-reflection double-silver low-radiation coated glass is placed in a toughening furnace, the heating temperature of the coated surface of a glass substrate is 670-700 ℃, the heating temperature of the non-coated surface is 670-680 ℃ lower than the temperature of the coated surface, and the heat absorption capacity of the film layer is not as strong as that of the non-coated surface due to the fact that the film layer is coated with low radiation, so that the heat absorption of the coated surface is consistent with that of the non-coated surface, the glass is prevented from being burnt during toughening treatment, and the temperature of the coated surface is higher than that of the non-coated surface.
Examples:
plating a first dielectric layer on a glass substrate by adopting a magnetron sputtering process: under the control of medium-frequency alternating current power supply, the silicon target is in a mixed atmosphere of argon and nitrogen (Ar: N) 2 =9:7, volume ratio, same below) by sputter deposition, a first dielectric layer (SiN) with a film thickness of 41nm was deposited x A layer);
plating a tungsten-copper alloy layer on the first dielectric layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a tungsten copper alloy target is subjected to sputtering deposition in a pure argon atmosphere, and a tungsten copper alloy layer with the thickness of 7.8nm is deposited;
plating a first protective layer on the tungsten-copper alloy layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a first protective layer (NiCr layer) with the thickness of 3nm is deposited;
plating a first seed layer on the first protective layer by adopting a magnetron sputtering process: under the control of medium-frequency alternating current power supply, znAl target is in the mixed atmosphere of argon and oxygen (Ar: O) 2 =7:10, volume ratio, same below) by sputter deposition, a first seed layer (ZnO) was deposited with a film thickness of 17.3nm x A layer);
plating a first functional layer on the first seed layer by adopting a magnetron sputtering process: under the control of a direct current power supply, sputtering and depositing an Ag target in a pure argon atmosphere, and depositing a first functional layer (Ag layer) with the film thickness of 12.5 nm;
plating a second protective layer on the first functional layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a second protective layer (NiCr layer) with the film thickness of 2.6nm is deposited;
plating a first AZO layer on the second protective layer by adopting a magnetron sputtering process: under the control of an intermediate frequency alternating current power supply, performing sputter deposition on an AZO target in an argon atmosphere, and depositing a first AZO layer with the film thickness of 9.2 nm;
plating a second dielectric layer on the first AZO layer by adopting a magnetron sputtering process: under the control of medium-frequency alternating current power supply, the silicon target is in a mixed atmosphere of argon and nitrogen (Ar: N) 2 =9:7), a second dielectric layer (SiN) with a film thickness of 75.3nm was deposited x A layer);
plating a second seed layer on the second dielectric layer by adopting a magnetron sputtering process: under the control of medium-frequency alternating current power supply, the Zn target is in a mixed atmosphere of argon and oxygen (Ar: O) 2 =7:10), a second seed layer (ZnO) with a film thickness of 13.8nm was deposited x A layer);
plating a second functional layer on the second seed layer by adopting a magnetron sputtering process: under the control of a direct current power supply, sputtering and depositing an Ag target in a pure argon atmosphere, and depositing a second functional layer (Ag layer) with the film thickness of 13.2 nm;
plating a third protective layer on the second functional layer by adopting a magnetron sputtering process: under the control of a direct current power supply, a NiCr target is subjected to sputtering deposition in an argon atmosphere, and a third protective layer (NiCr layer) with the film thickness of 3.2nm is deposited;
plating a second AZO layer on the second protective layer by adopting a magnetron sputtering process: under the control of an intermediate frequency alternating current power supply, sputtering and depositing an AZO target in an argon atmosphere, and depositing a second AZO layer with the film thickness of 8.5 nm;
plating a third dielectric layer on the second AZO layer by adopting a magnetron sputtering process: under the control of medium-frequency alternating current power supply, the silicon target is in a mixed atmosphere of argon and nitrogen (Ar: N) 2 =9:7), a third dielectric layer (SiN) with a film thickness of 53.4nm was deposited x A layer);
the color of the glass prepared in this example before tempering is shown in Table 1: the color after tempering is shown in table 2.
The "glass surface before tempering" in table 1 refers to the surface of the prepared low-emissivity glass which is not coated before tempering, the "film surface before tempering" refers to the surface of the prepared low-emissivity glass which is coated before tempering, the "transmission before tempering" refers to the visible light transmittance of the prepared low-emissivity glass before tempering (the transmission of color, for example, the transmission of a colorless or white object, which is colored, is seen through the coated glass), and the "side surface before tempering" refers to the side surface of the prepared low-emissivity glass before tempering. Wherein R refers to visible light reflectance, g is an abbreviation for glass, here a glass surface, such as: r% g refers to the visible light reflectance of the glass face, f is an abbreviation for film, here the film face, for example: r% f means the visible light reflectance of the film surface, T means the visible light transmittance, and c means the side surface, for example: r% c is visible light reflectivity of the side surface, L is metric brightness, and the size is between 0 and 100; a is a metric chromaticity, a is a red-green axis, positive is red, negative is green, b is yellow Lan Zhou, positive is yellow, and negative is blue. Correspondingly, the data in table 2 are all test data after tempering.
TABLE 1
TABLE 2
Optical performance test:
before tempering, the emissivity of the single piece of low-emissivity coated glass is 0.031, the glass surface reflectivity is 5.03%, and the visible light transmittance is 43.2%;
the detection result after tempering shows that the emissivity of the single piece of low-emissivity coated glass is 0.025, the glass surface reflectivity is 6.95%, and the visible light transmittance is 52.47%; after tempering, a is equal to t= -0.67 and b is equal to t=0.12, so that the reflectivity after tempering is low, no pollution is basically achieved, and the transmission color is very neutral.
Physical properties:
according to GB9656-2003, the film layer is wiped and does not become film after being toughened, and the requirements of an impact experiment, an irradiation resistance experiment, a damp-heat circulation experiment and the like can be met. The knocking experiment grade is 4 grade after detection.
The toughened LOW-reflection double-silver LOW-emissivity coated glass prepared by the method can effectively improve the transmission color and the emissivity of LOW-E glass products; finally, LOW-E glass products with ultra-LOW visible light reflectivity and neutral transmission color are realized. In general, the glass provided by the embodiment of the invention has the advantages of low reflectivity, neutral transmission color and stable film color.
In the description, each embodiment is described in a progressive manner, and each embodiment is mainly described by the differences from other embodiments, so that the same similar parts among the embodiments are mutually referred. For the structure disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant points are referred to the description of the method section. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the invention can be made without departing from the principles of the invention and these modifications and adaptations are intended to be within the scope of the invention as defined in the following claims.
It should also be noted that in this specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
Claims (2)
1. The toughened low-reflection double-silver low-radiation coated glass is characterized by comprising a glass substrate and a composite film layer plated on the glass substrate, wherein the composite film layer comprises a first dielectric layer, a tungsten-copper alloy layer, a first protective layer, a first seed layer, a first functional layer, a second protective layer, a first AZO layer, a second dielectric layer, a second seed layer, a second functional layer, a third protective layer, a second AZO layer and a third dielectric layer which are sequentially arranged;
the first dielectric layer is SiN x The second dielectric layer is ZnO x Layer and SiN x A composite layer of layers, the third dielectric layer being SiN x Layers or SiO x Layer or SiN x O y The first seed layer and the second seed layer are ZnO x The first functional layer and the second functional layer are Ag layers, and the first protective layer, the second protective layer and the third protective layer areA NiCr layer;
the thickness of the first dielectric layer is 26-38 nm, the thickness of the second dielectric layer is 50-90 nm, and the thickness of the third dielectric layer is 40-60 nm;
the thickness of the first seed layer and the second seed layer is 15-20 nm;
the thickness of the first functional layer is 9-15 nm;
the thickness of the second functional layer is 6-18 nm;
the thickness of the first protective layer is 2-4 nm, the thickness of the second protective layer is 1-4 nm, and the thickness of the third protective layer is 1-6 nm;
the thickness of the tungsten-copper alloy layer is 6-12 nm;
the thickness of the first AZO layer and the second AZO layer is 8-10 nm; when the toughened low-reflection double-silver low-radiation coated glass is subjected to toughening treatment, the heating temperature of the coated surface is 670-700 ℃, and the heating temperature of the non-coated surface is 670-680 ℃.
2. A method for preparing the toughened low-reflection double-silver low-emissivity coated glass of claim 1, comprising:
plating a first dielectric layer on a glass substrate, wherein the first dielectric layer is SiN x A layer;
plating a tungsten copper alloy layer on the first dielectric layer;
plating a first protective layer on the tungsten-copper alloy layer, wherein the first protective layer is a NiCr layer;
plating a first seed layer on the first protective layer, wherein the first seed layer is ZnO x A layer;
plating a first functional layer on the first seed layer, wherein the first functional layer is an Ag layer;
plating a second protective layer on the first functional layer, wherein the second protective layer is a NiCr layer;
plating a first AZO layer on the first protective layer;
plating a second dielectric layer on the first AZO layer, wherein the second dielectric layer is ZnO x Layer and SiN x A composite layer of layers;
in the second mediumPlating a second seed layer on the layer, wherein the second seed layer is ZnO x A layer;
plating a second functional layer on the second seed layer, wherein the second functional layer is an Ag layer;
plating a third protective layer on the second functional layer, wherein the third protective layer is a NiCr layer;
plating a second AZO layer on the third protective layer;
plating a third dielectric layer on the second AZO layer, wherein the third dielectric layer is SiN x Layers or SiO x Layer or SiN x O y A layer or a composite layer thereof;
the plating is carried out by adopting a magnetron sputtering process, and when the temperable low-reflection double-silver low-radiation coated glass is subjected to tempering treatment, the heating temperature of the coated surface is 670-700 ℃, and the heating temperature of the non-coated surface is 670-680 ℃.
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| CN112125535A (en) * | 2020-09-25 | 2020-12-25 | 山西隆腾机电科技有限公司 | Low-emissivity coated glass and preparation method thereof |
| CN111995258A (en) * | 2020-09-29 | 2020-11-27 | 咸宁南玻节能玻璃有限公司 | Medium-transmittance LOW-reflection temperable double-silver LOW-E glass and preparation method thereof |
| CN114349367A (en) * | 2021-12-27 | 2022-04-15 | 吴江南玻华东工程玻璃有限公司 | Preparation method of energy-saving toughened glass with neutral color |
| CN114940588A (en) * | 2022-05-05 | 2022-08-26 | 深圳南玻应用技术有限公司 | Photoelectric component, energy-saving glass and preparation method thereof |
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