CN212559996U - Double-silver low-emissivity coated glass - Google Patents
Double-silver low-emissivity coated glass Download PDFInfo
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- CN212559996U CN212559996U CN202022386639.1U CN202022386639U CN212559996U CN 212559996 U CN212559996 U CN 212559996U CN 202022386639 U CN202022386639 U CN 202022386639U CN 212559996 U CN212559996 U CN 212559996U
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Abstract
The utility model discloses a double-silver low-emissivity coated glass. The coating comprises a glass substrate and a coating layer, wherein the coating layer comprises a first SiN layer which is sequentially compounded from the glass substrate to the outsidexLayer, first ZnO layer, first Ag layer, first NiCr layer, first AZO layer, second SiN layerxA layer, a ZnSnO layer or a second ZnO layer, a second Ag layer, a second NiCr layer and a third SiN layerxAnd (3) a layer. The double-silver low-emissivity coated glass has the advantages that the appearance color is silver gray, the side color is more gray than the front color, the color change of the indoor and outdoor front sides is small, and the like.
Description
Technical Field
The utility model relates to a coated glass technical field especially relates to a two silver low emissivity coated glass.
Background
The LOW-E glass (i.e. LOW emissivity glass) is made by plating silver (or other LOW emissivity materials) and metal oxide film on the surface of the glass, so that the emissivity E of the glass is reduced from 0.84 to below 0.15, thereby reducing the U value (i.e. heat transfer coefficient) of the glass. The LOW-E glass has high visible light transmittance and high infrared reflectance, and is characterized in that:
1. the infrared reflectivity is high, and the far infrared heat radiation can be directly reflected.
2. The surface emissivity E is low and the ability to absorb extraneous energy is small, so that the amount of re-radiated heat is small.
3. The sun-shading coefficient Sc is wide in range, and can meet the requirements of different regions according to the transmission amount of solar energy.
The division is carried out according to the number of layers of the functional layer silver, and the Low-E glass can be divided into the following parts: single silver Low-E glass, double silver Low-E glass and triple silver Low-E glass.
With the aging of the LOW-E technology, the market has higher and higher requirements for the appearance color of the product, but with the market development and the current situation of high production cost of the three-silver glass, the double-silver LOW-E glass becomes a relatively mature energy-saving scheme in the field of architectural glass, but for most double-silver LOW-E products in the market, the outdoor side color is heavier than the front color, which is generally represented by the condition of being relatively blue or relatively purple, and the front side color of the film surface has large change and poor visual effect.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a two silver low emissivity coated glass, aim at solving the indoor outer positive side color of current two silver-colored glass and change greatly, and the heavier problem of positive colour of outdoor side color.
The embodiment of the utility model provides a two silver low-emissivity coated glass, including glass substrate and coating film layer, the coating film layer includes from the glass substrate outwards compound in proper order the secondA SiN layerxLayer, first ZnO layer, first Ag layer, first NiCr layer, first AZO layer, second SiN layerxA layer, a ZnSnO layer, a second ZnO layer, or a mixed layer of them, a second Ag layer, a second NiCr layer, and a third SiN layerxAnd (3) a layer.
Further, the first SiNxThe thickness of the layer is 10-22 nm, and the thickness of the first ZnO layer is 30-42 nm.
Further, the thickness of the first Ag layer is 4-7 nm.
Furthermore, the thickness of the first NiCr layer is 1.5-4 nm.
Furthermore, the thickness of the first AZO layer is 4-6 nm.
Further, the second SiNxThe thickness of the layer is 20-25 nm, and the thickness of the ZnSnO layer or the second ZnO layer or the mixed layer of the ZnSnO layer and the second ZnO layer is 35-55 nm.
Further, the thickness of the second Ag layer is 12-20 nm.
Furthermore, the thickness of the second NiCr layer is 3-6 nm.
Further, the third SiNxThe thickness of the layer is 45-55 nm.
Furthermore, the total thickness of the coating layer is 180-210 nm.
The embodiment of the utility model provides a two silver low emissivity coated glass, two silver low emissivity coated glass include glass substrate and coating film layer, the coating film layer includes outwards compounding in proper order first SiN from the glass substratexLayer, first ZnO layer, first Ag layer, first NiCr layer, first AZO layer, second SiN layerxA layer, a ZnSnO layer, a second ZnO layer, or a mixed layer of them, a second Ag layer, a second NiCr layer, and a third SiN layerxAnd (3) a layer. The embodiment of the utility model provides a two silver low-emissivity coated glass have the outward appearance colour be silver gray, side colour than positive grey, indoor outer positive side colour change advantage such as little.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without any creative effort.
Fig. 1 is a schematic structural view of a double-silver low-emissivity coated glass provided by an embodiment of the present invention;
fig. 2 is a schematic view of glass surface reflectivity of a double-silver low-emissivity coated glass provided by an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to FIG. 1, FIG. 1 shows the present inventionThe structural schematic diagram of the double-silver low-emissivity coated glass provided by the embodiment is shown in the specification. The double-silver low-emissivity coated glass comprises a glass substrate 100 and a coated layer, wherein the coated layer comprises first SiN sequentially compounded from the glass substrate 100 to the outsidex A layer 101, a first ZnO layer 102, a first Ag layer 103, a first NiCr layer 104, a first AZO layer 105, a second SiNx layer 106, a ZnSnO layer 107, a second ZnO layer, or a mixed layer of both, a second Ag layer 108, a second NiCr layer 109, and a third SiNx layer 110.
In this embodiment, the double-silver low-emissivity coated glass comprises a glass substrate 100 and 10 film layers coated on the glass substrate 100 in sequence, wherein the first SiNxThe layer 101 and the first ZnO layer 102 are first dielectric combined layers, the first Ag layer 103 is a first low-emissivity functional layer, the first NiCr layer 104 is a first blocking protective layer, the first AZO layer 105 is a crystal bed dielectric layer, a mixed layer of the second SiNx layer 106 and the ZnSnO layer 107 or the second ZnO layer or both is a second dielectric combined layer, the second Ag layer 108 is a second low-emissivity functional layer, the second NiCr layer 109 is a second blocking protective layer, and the third SiNx layer 110 is a third dielectric layer. The double-silver low-emissivity coated glass has the advantages that the outdoor color is silver gray, the side color is larger than the front color, the color change of the indoor and outdoor front sides is small, and the like.
In addition, the first SiNxThe layer 101 and the first ZnO layer 102 can provide a functional layer (silver layer) growth environment, and the color of the film layers is adjusted through the interference effect between the film layers; the first Ag layer 103 can improve the energy-saving property of the film layer and adjust the color of the film layer; the first NiCr layer 104 can protect the silver layer, increase the absorption of the film layer to visible light, reduce the transmission of the visible light and reduce the sun-shading coefficient of the product; the first AZO layer 105 can protect the silver layer and prevent NiCr from being oxidized; the second SiNx layer 106 and the ZnSnO layer 107 or the second ZnO layer or a mixed layer of the two can provide a silver layer growing environment, and the color of the film layers can be adjusted through the interference effect between the film layers; the second Ag layer 108 can improve the energy-saving property of the film layer and adjust the color of the film layer; the second NiCr layer 109 can protect the silver layer, increase the absorption of the film layer to visible light, reduce the transmission of visible light and reduce the productA shading coefficient; the third SiNx layer 110 can improve the physical and chemical properties of the film layer and adjust the color.
In the embodiment, on the premise of meeting color requirements, the debugging efficiency is improved by controlling the thickness of each film layer and increasing the color sensitivity of the external film layer, and the industrial production is facilitated. Meanwhile, simulation parameters of the film design software under the condition of corresponding gas proportion are determined through the thickness of each film determined by software design, process debugging and experiments and the stable process gas proportion of each target determined by multiple experiments.
In one embodiment, the first SiNxThe thickness of the layer 101 is 10 to 22nm, for example 10nm, 16nm or 20 nm.
In one embodiment, the thickness of the first ZnO layer 102 is 30-42 nm, such as 35nm, 38nm or 40 nm.
In one embodiment, the first Ag layer 103 has a thickness of 4 to 7nm, such as 4nm, 5.5nm, or 7 nm.
In one embodiment, the first NiCr layer 104 has a thickness of 1.5-4 nm, such as 2nm, 3nm, or 4 nm.
In one embodiment, the thickness of the first AZO layer 105 is 4 to 6nm, such as 4.5nm, 5.5nm, or 6 nm.
In one embodiment, the thickness of the second SiNx layer 106 is 20 to 25nm, such as 20nm, 22nm or 24 nm.
In one embodiment, the thickness of the ZnSnO layer 107 or the second ZnO layer or the mixed layer of the ZnSnO layer and the second ZnO layer is 35 to 55nm, such as 40nm, 45nm or 50 nm.
In one embodiment, the second Ag layer 108 has a thickness of 12 to 20nm, such as 13nm, 15nm, or 17 nm.
In one embodiment, the thickness of the second NiCr layer 109 is 3-6 nm, such as 3.5nm, 4.5nm or 5.5 nm.
In one embodiment, the thickness of the third SiNx layer 110 is 45-55 nm.
In one embodiment, the total thickness of the coating layer is 180 to 210 nm.
In the embodiment, the total thickness of the coating layers of the double-silver low-emissivity coated glass is set to be 180-210 nm, so that the double-silver low-emissivity coated glass has good permeability, and the whole thickness is thinner and clearer.
The appearance color of the double-silver low-emissivity coated glass in the embodiment is silver gray, the front side of the double-silver low-emissivity coated glass is slightly gray when being observed outdoors, and the side is slightly gray compared with the front side. Specifically, the Lab color space colorimetric result of the double-silver low-emissivity coated glass is as follows: a 6mm single-chip transmittance T ∈ [50, 62 ]; the color of the film surface a is in the form of f E [0,3], b is in the form of f E [ 3-10 ], the color of the glass surface a is in the form of g E [ 2-4 ], b is in the form of g E [ 4-6 ]; the side colors a c e-1.5, -3.5, b c e-3, -5. The surface emissivity E of the double-silver low-emissivity coated glass is less than 0.05, the low-emissivity coated glass is excellent in low-emissivity performance, the heat transfer coefficient K is less than 1.7, and the sun-shading coefficient SC belongs to [0.36,0.39 ]. The shape of the glass surface reflection curve of the double-silver low-emissivity coated glass is shown in figure 2.
In one embodiment, the first SiNxThe thickness of the layer 101 is 18nm, the thickness of the first ZnO layer 102 is 38nm, the thickness of the first Ag layer 103 is 5.6nm, the thickness of the first NiCr layer 104 is 3.2nm, the thickness of the first AZO layer 105 is 5nm, the thickness of the second SiNx layer 106 is 22nm, the thickness of the ZnSnO layer 107 or the second ZnO layer or a mixed layer of the ZnSnO layer and the second ZnO layer is 45nm, the thickness of the second Ag layer 108 is 15.3nm, the thickness of the second NiCr layer 109 is 4.9nm, and the thickness of the third SiNx layer 110 is 48 nm.
In this embodiment, the appearance color of the double-silver low-emissivity coated glass is silver gray, the front side of the double-silver low-emissivity coated glass has small color change when being observed outdoors, and the side is slightly gray compared with the front side. The Lab color space color measurement result of the double-silver low-emissivity coated glass is as follows: the 6mm single-chip transmittance T is 55; the color of the film surface a is 0.9, b is-3, the color of the glass surface a is-2.5, b is-4.9; the side color a c-2.1, b c-4.1. The surface emissivity E of the double-silver low-emissivity coated glass is 0.04, the low-emissivity coated glass is excellent in low emissivity, the heat transfer coefficient K is 1.65, and the sun-shading coefficient SC is 0.36.
Plating a first SiN layer on the glass substrate by magnetron sputteringxLayer 101, number of targets used: 1-2 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows:argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 10-22 nm;
magnetron sputtering on the first SiN layerxWhen the first ZnO layer 102 is plated on the layer 101, the number of targets used is: 3-4 alternating current rotary targets; the target material is configured to be zinc aluminum (ZnAl); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 30-42 nm;
when the first Ag layer 103 is plated on the first ZnO layer 102 by magnetron sputtering, the number of targets used is: 1 direct current plane target; the target material is configured to be silver (Ag); process gas: pure argon with sputtering pressure of 2-3 x 10 < -4 > mbar; the thickness of the plated film is 4-7 nm;
when the first NiCr layer 104 is plated on the first Ag layer 103 by magnetron sputtering, the number of targets used is: 1 direct current plane target; the target material is configured to be nickel-chromium alloy (NiCr); process gas: pure argon with sputtering pressure of 2-3 x 10 < -4 > mbar; the thickness of the coating film is 1.5-4 nm;
when the first AZO layer 105 is plated on the first NiCr layer 104 by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be zinc aluminum oxide (AZO); process gas: pure argon with sputtering pressure of 3-4 x 10 < -4 > mbar; the thickness of the plated film is 4-6 nm;
when the second SiNx layer 106 is plated on the first AZO layer 105 by magnetron sputtering, the number of the adopted targets is as follows: 2-3 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the coating film is 20-25 nm;
when the ZnSnO layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted targets is as follows: 4-6 alternating-current rotating targets; the target material is configured to be zinc tin (ZnSn); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 35-55 nm;
or when the ZnO layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted target materials is as follows: 4-6 alternating-current rotating targets; the target material is configured to be zinc aluminum (ZnAl); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 35-55 nm;
or when the ZnO/ZnSnO mixed layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted target materials is as follows: 4-6 alternating-current rotating targets; 1-4 zinc-aluminum (ZnAl) targets are configured; the process gas proportion is as follows: argon and oxygen in a ratio of 1:1, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 10-38 nm; and 2-3 zinc tin (ZnSn) targets are arranged; the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 18-26 nm;
when the second Ag layer 108 is plated on the ZnSnO layer 107 or the second ZnO layer or the mixed layer of the two by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be silver (Ag); the process gas is pure argon, and the sputtering pressure is 2-3 x 10 < -4 > mbar; the thickness of the plated film is 12-20 nm;
when the second NiCr layer 109 is plated on the second Ag layer 108 by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be nickel chromium (NiCr); the process gas is pure argon, and the sputtering pressure is 2-3 multiplied by 10 < -4 > mbar; the thickness of the plated film is 3-6 nm;
when the third SiNx layer 110 is plated on the second NiCr layer 109 by magnetron sputtering, the number of targets used is as follows: 5-6 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 45-55 nm.
In one embodiment, magnetron sputtering is used to plate a first SiN layer on the glass substratexLayer 101, number of targets used: 2 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 18 nm;
magnetron sputtering on the first SiN layerxWhen the first ZnO layer 102 is plated on the layer 101, the method ofThe number of targets: 4 alternating current rotating targets; the target material is configured to be zinc aluminum (ZnAl); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 38 nm;
when the first Ag layer 103 is plated on the first ZnO layer 102 by magnetron sputtering, the number of targets used is: 1 direct current plane target; the target material is configured to be silver (Ag); process gas: pure argon with sputtering pressure of 2-3 x 10 < -4 > mbar; the thickness of the coating film is 5.6 nm;
when the first NiCr layer 104 is plated on the first Ag layer 103 by magnetron sputtering, the number of targets used is: 1 direct current plane target; the target material is configured to be nickel-chromium alloy (NiCr); process gas: pure argon with sputtering pressure of 2-3 x 10 < -4 > mbar; the thickness of the coating film is 3.2 nmnm;
when the first AZO layer 105 is plated on the first NiCr layer 104 by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be zinc aluminum oxide (AZO); process gas: pure argon with sputtering pressure of 3-4 x 10 < -4 > mbar; the thickness of the coating film is 5 nm;
when the second SiNx layer 106 is plated on the first AZO layer 105 by magnetron sputtering, the number of the adopted targets is as follows: 2 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 22 nm;
when the ZnSnO layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted targets is as follows: 5 alternating current rotating targets; the target material is configured to be zinc tin (ZnSn); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the coating film is 45 nm;
or when the ZnO layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted target materials is as follows: 4 alternating current rotating targets; the target material is configured to be zinc aluminum (ZnAl); the process gas proportion is as follows: argon and oxygen in a ratio of 1:1, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 44 nm;
or when the ZnO/ZnSnO mixed layer 107 is plated on the second SiNx layer 106 by magnetron sputtering, the number of the adopted target materials is as follows: 4-6 alternating-current rotating targets; wherein 2 zinc-aluminum (ZnAl) targets are configured; the process gas proportion is as follows: argon and oxygen in a ratio of 1:1, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 22 nm; 3 zinc tin (ZnSn) targets are arranged; the process gas proportion is as follows: argon and oxygen in a ratio of 1:1.42, wherein the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 22 nm;
when the second Ag layer 108 is plated on the ZnSnO layer 107 or the second ZnO layer or the mixed layer of the two by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be silver (Ag); the process gas is pure argon, and the sputtering pressure is 2-3 x 10 < -4 > mbar; the thickness of the coating film is 15.3 nm;
when the second NiCr layer 109 is plated on the second Ag layer 108 by magnetron sputtering, the number of targets used is: 1 alternating current rotating target; the target material is configured to be nickel chromium (NiCr); the process gas is pure argon, and the sputtering pressure is 2-3 multiplied by 10 < -4 > mbar; the thickness of the plated film is 4.9 nm;
when the third SiNx layer 110 is plated on the second NiCr layer 109 by magnetron sputtering, the number of targets used is as follows: 5 alternating current rotating targets; the target material is configured to be silicon aluminum (SiAl); the process gas proportion is as follows: argon and nitrogen, wherein the ratio of argon to nitrogen is 1:0.8, and the sputtering pressure is 8-9 x 10 < -4 > mbar; the thickness of the plated film is 48 nm.
The embodiments are described in a progressive manner in the specification, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description. It should be noted that, for those skilled in the art, it is possible to make several improvements and modifications to the present application without departing from the principle of the present application, and such improvements and modifications also fall within the scope of the claims of the present application.
It is further noted that, in the present specification, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
Claims (10)
1. The double-silver low-emissivity coated glass is characterized by comprising a glass substrate and a coated layer, wherein the coated layer comprises first SiN sequentially compounded from the glass substrate to the outsidexLayer, first ZnO layer, first Ag layer, first NiCr layer, first AZO layer, second SiN layerxA layer, a ZnSnO layer or a second ZnO layer, a second Ag layer, a second NiCr layer and a third SiN layerxAnd (3) a layer.
2. The double silver low emissivity coated glass of claim 1, wherein said first SiN comprisesxThe thickness of the layer is 10-22 nm, and the thickness of the first ZnO layer is 30-42 nm.
3. The double-silver low-emissivity coated glass according to claim 1, wherein the first Ag layer has a thickness of 4-7 nm.
4. The double-silver low-emissivity coated glass according to claim 1, wherein the first NiCr layer has a thickness of 1.5-4 nm.
5. The double-silver low-emissivity coated glass according to claim 1, wherein the first AZO layer has a thickness of 4-6 nm.
6. The double silver low emissivity coated glass of claim 1, wherein said second SiN is selected from the group consisting ofxThe thickness of the layer is 20-25 nm, and the thickness of the ZnSnO layer or the second ZnO layer is 35-55 nm.
7. The double-silver low-emissivity coated glass according to claim 1, wherein the second Ag layer has a thickness of 12-20 nm.
8. The double-silver low-emissivity coated glass according to claim 1, wherein the second NiCr layer has a thickness of 3-6 nm.
9. The double silver low emissivity coated glass of claim 1, wherein said third SiNxThe thickness of the layer is 45-55 nm.
10. The double-silver low-emissivity coated glass according to claim 1, wherein the total thickness of the coating layer is 180 to 210 nm.
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