CN111470884A - 一种高硬度高耐磨全抛釉陶瓷砖及其制备方法 - Google Patents

一种高硬度高耐磨全抛釉陶瓷砖及其制备方法 Download PDF

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CN111470884A
CN111470884A CN202010587634.7A CN202010587634A CN111470884A CN 111470884 A CN111470884 A CN 111470884A CN 202010587634 A CN202010587634 A CN 202010587634A CN 111470884 A CN111470884 A CN 111470884A
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glaze
full
polishing
green brick
polished
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CN111470884B (zh
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刘一军
邓来福
杨元东
王贤超
张克林
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Monalisa Group Co Ltd
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Monalisa Group Co Ltd
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Priority to JP2022564844A priority patent/JP7441970B2/ja
Priority to US18/001,048 priority patent/US20230227374A1/en
Priority to PCT/CN2020/138894 priority patent/WO2021258691A1/zh
Priority to EP20942231.0A priority patent/EP4174046A1/en
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Abstract

本发明公开一种高硬度高耐磨全抛釉陶瓷砖及其制备方法。所述制备方法包括以下步骤:步骤(1),将坯体粉料压制成型后干燥,形成砖坯;步骤(2),在砖坯表面施底釉;步骤(3),在施底釉后的砖坯表面喷墨打印图案,并施隔离釉;步骤(4),在施隔离釉后的砖坯表面施全抛釉;步骤(5),将施全抛釉后的砖坯干燥,烧成,抛光,获得高硬度高耐磨全抛釉陶瓷砖;所述全抛釉烧成后物相组成为:以质量百分比计,刚玉10~20%、钡冰长石20~30%、赤铁矿0.5~1%和非晶相50~68%。通过调整全抛釉配方和施釉方式等很好地改善了全抛釉的耐磨性。

Description

一种高硬度高耐磨全抛釉陶瓷砖及其制备方法
技术领域
本发明涉及一种高硬度高耐磨全抛釉陶瓷砖及其制备方法,属于陶瓷砖生产制造技术领域。
背景技术
全抛釉系列产品由于设计图案丰富、工艺简单易操作而为广大消费者所青睐,从而在很大比例上取代了传统抛光砖的市场。但是随着使用年限的增加,全抛釉系列产品表面的划痕、磨损程度比抛光砖更为明显,甚至有些公共场所出现因为釉面磨损过度缺花而不得不重新装修的现象。目前市面上的全抛釉陶瓷砖,全抛釉配方基本采用低铝高钾钠的体系,这种配方体系的抛釉烧成后釉层形成的非晶相含量较高,硬度高的晶型物质较少,另外高钾钠配方体系的抛釉中Na-O、K-O的键强远低于Ca-O、Mg-O的键强,所以若要提高釉面的硬度及耐磨需要减少碱金属含量,并采用部分碱土金属代替的方式。上述抛釉的施釉方式目前普遍采用淋釉,淋釉的施釉量高,导致釉料成本在一定程度上有所上升,加上抛光深度的增加,也会在一定程度上减少其硬度及耐磨性能。出于耐磨性能方面的考虑,市场工程应用全抛釉系列产品的比例减少。因此,提升全抛釉的耐磨性能,扩大全抛釉的市场工程应用比例刻不容缓。
发明内容
本发明针对上述问题,提供一种高硬度高耐磨全抛釉陶瓷砖及其制备方法,通过调整全抛釉配方和施釉方式等很好地改善了全抛釉的耐磨性。
第一方面,本发明提供一种高硬度高耐磨全抛釉陶瓷砖的制备方法,包括以下步骤:
步骤(1),将坯体粉料压制成型后干燥,形成砖坯;
步骤(2),在砖坯表面施底釉;
步骤(3),在施底釉后的砖坯表面喷墨打印图案,并施隔离釉;
步骤(4),在施隔离釉后的砖坯表面施全抛釉;
步骤(5),将施全抛釉后的砖坯干燥,烧成,抛光,获得高硬度高耐磨全抛釉陶瓷砖。
其中,所述全抛釉烧成后物相组成为:以质量百分比计,刚玉10~20%、钡冰长石20~30%、赤铁矿0.5~1.0%和非晶相50~68%。
较佳地,所述全抛釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:8.5~10.5%、MgO:4.0~6.0%、K2O:0.5~1.5%、Na2O:0.5~1.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、ZrO2:0.5~2.0%、烧失:4.0~6.0%。
较佳地,所述全抛釉的施加方式为丝网印刷。优选地,所述全抛釉的比重为1.50~1.70 g/cm3,施釉量为90~140 g/ m2
较佳地,所述隔离釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:10.0~12.0%、MgO:1.0~2.0%、K2O:0.5~1.5%、Na2O:1.5~2.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、烧失:4.0~6.0%。
较佳地,所述隔离釉的施加方式为丝网印刷。优选地,所述隔离釉的比重为1.25~1.35 g/cm3。更优选地,所述丝网印刷使用120目~180目的网版。
较佳地,所述底釉的化学组成包括:以质量百分比计,SiO2:55~60%、Al2O3:21~24%、Fe2O3:0.16~0.46%、TiO2:0.15~0.25%、CaO:0.1~0.3%、MgO:0.1~0.3%、K2O:4.0~5.0%、Na2O:2.0~3.0%、ZrO2:6.0~10.0%、烧失:3.0~4.0%。
较佳地,所述底釉的施加方式为喷釉。优选地,所述底釉的比重为1.40~1.45 g/cm3,施加量为400~550 g/ m2
较佳地,最高烧成温度为1210℃~1230℃,烧成周期为60分钟~70分钟。
较佳地,步骤(1)中,干燥时间为1~1.5h,干燥后砖坯水分为0.3~0.5 wt %;步骤(5)中,干燥温度为100~150℃,干燥后砖坯水分控制在0.9wt%以内。
第二方面,本发明还提供上述任一项所述的制备方法获得的高硬度高耐磨全抛釉陶瓷砖。
附图说明
图1为本发明一实施方式高硬度高耐磨全抛釉陶瓷砖的制备流程图;
图2为本发明实施例1高硬度高耐磨全抛釉陶瓷砖的砖面效果图;
图3为本发明实施例1高硬度高耐磨全抛釉陶瓷砖抛光后砖面的XRD图;
图4中的A和B为本发明实施例1高硬度高耐磨全抛釉陶瓷砖抛光后电镜下不同放大倍数的釉面晶体形貌图;
图5中的A和B为本发明实施例1高硬度高耐磨全抛釉陶瓷砖抛光后全抛釉表面在光镜下不同放大倍数的釉面晶体形貌图;可以看出经过抛光后釉面依然存在较多的晶体,这些晶体为釉面提供了较高的硬度和良好的耐磨性能;
图6为对比例1全抛釉陶瓷砖电镜下的晶体形貌图;可以看出该全抛釉配方所生成的晶体比较杂乱,晶体总量比较少,从而釉面的硬度和耐磨较差;
图7为对比例2全抛釉陶瓷砖手工放大镜下(放大倍数为100倍)的毛孔效果图;可以看出淋抛釉的施釉量较多,使得釉层的厚度增加,釉面的透感变差,并造成釉层排气困难,导致抛光后的毛孔较多;
图8中的A为本发明实施例1使用的全抛釉的电镜能谱分析图;图8中的B为对部分区域(A中对应位置)取点后的背散射电子图像以及成分分析测试结果表;
图9为本发明实施例1使用的全抛釉的O、Mg、Al、Si、K、Ca、Ba、Zn元素的背散射电子图像。
具体实施方式
通过下述实施方式进一步说明本发明,应理解,下述实施方式仅用于说明本发明,而非限制本发明。在没有特殊说明的情况下,各百分含量指质量百分含量。
以下根据图1示例性说明本发明所述高硬度高耐磨全抛釉陶瓷砖的制备方法。
利用坯体粉料成型获得砖坯。可利用压机干压成型以形成砖坯。所述坯体粉料的组成不受限制,可采用本领域常规的陶瓷砖坯体粉料。例如,所述坯体粉料的化学组成包括,以质量百分比计,SiO2:60.0~70.0%、Al2O3:19.0~25.0%、Fe2O3:0.5~1.5%、TiO2:0.2~0.5%、CaO:0.2~0.8%、MgO:0.3~0.8%、K2O:2.0~4.0%、Na2O:1.50~3.5%、烧失:4.0~6.0%。
将砖坯干燥。干燥后的砖坯水分控制在0.3~0.5 wt %。上述干燥时间可为1~1.5h。
在干燥后的砖坯表面施底釉。底釉主要起到遮盖坯体底色和瑕疵,有助于抛釉的排气,以及减少抛光后毛孔的作用。
一些实施方式中,所述底釉的化学组成可包括:以质量百分比计,SiO2:55~60%、Al2O3:21~24%、Fe2O3:0.16~0.46%、TiO2:0.15~0.25%、CaO:0.1~0.3%、MgO:0.1~0.3%、K2O:4.0~5.0%、Na2O:2.0~3.0%、ZrO2:6.0~10.0%、烧失:3.0~4.0%。
所述底釉的施加方式可为喷釉。例如,所述底釉的比重可为1.40~1.45 g/cm3,施釉量可为400~550 g/ m2
在施加底釉后的砖坯表面喷墨打印图案。喷墨打印图案的颜色和图案依照版面设计效果而变化。
在喷墨打印后的砖坯表面施隔离釉。施隔离釉的作用是帮助发色以及减少抛光后产品黄边。
一些实施方式中,所述隔离釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:10.0~12.0%、MgO:1.0~2.0%、K2O:0.5~1.5%、Na2O:1.5~2.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、烧失:4.0~6.0%。
所述隔离釉的施加方式可为丝网印刷。采用丝网印刷的方式可以较好地控制施釉量并保证施釉的均匀性。所述隔离釉的比重可为1.25~1.35 g/cm3。所述隔离釉的施加量可为20~30g/ m2。如果隔离釉的施釉量过多,会在一定程度上降低全抛釉的耐磨度。这主要是因为隔离釉相对较低温,含有的钠含量也相对高,其中Na-O的键强要远低于Mg-O,因此如果隔离釉的施釉量过多则会与全抛釉反应生成过多的非晶相从而降低耐磨度。本发明通过采用不同目数的网版印刷和调整隔离釉的比重来达到控制隔离釉施釉量的目的。一些实施方式中,所述丝网印刷可使用120目~180目的网版。
上述隔离釉的熔融温度为1150~1170℃,这样可以保证釉面较高的硬度及耐磨性,同时釉面的毛孔较好,避免抛光出现抛黄边的现象。优选地,所述隔离釉的熔融温度低于全抛釉10-20℃,这样可以改善釉面的发色及减少抛光后的毛孔,同时可以避免全抛釉釉坑的缺陷。
在施隔离釉后的砖坯表面施全抛釉。一些实施方式中,全抛釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:8.5~10.5%、MgO:4.0~6.0%、K2O:0.5~1.5%、Na2O:0.5~1.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、ZrO2:0.5~2.0%、烧失:4.0~6.0%。
通过电镜结合能谱分析以及XRD分析(图3、图4、图8、图9),可知黑色部分的点是刚玉,柱状和针状晶体为钡冰长石。另外,通过XRD的定量分析,该全抛釉烧成后物相组成为:以质量百分比计,刚玉10~20%、钡冰长石20~30%、赤铁矿0.5~1%和非晶相50~68%。
上述全抛釉的原料组成可包括:以质量百分比计,刚玉9.0~15.0%、石英8.0~13.0%、硅灰石15.0~20.0%、烧滑石5.0~10.0%、钾长石8~13%、钠长石1.0~5.0%、氧化锌4~8%、高岭土8.0~13.0%、碳酸钡8.0~13.0%、氧化锆0.5~2.0%、堇青石10.0~15.0%。
该全抛釉配方中刚玉和堇青石含量较高,同时增加了配方中的碳酸钡,可以使得该全抛釉在烧成过程中形成更多的钡冰长石晶体,同时采用碱土金属钙、镁来代替配方中的部分钾、钠含量(这样做主要是因为K-O、Na-O的键强度要远低于Ca-O、Mg-O),可以有效提高釉面的硬度及耐磨性。另外,引入少量氧化锆(成核剂)来促进钡冰长石晶体的析出,从而达到实现高硬度高耐磨的目的。
一些实施方式中,所述全抛釉的制备方法可包括:称取配方量的上述原料,然后将原料粉碎后过200~250目的标准筛,得到颗粒原料;将颗粒原料和水球磨,制得釉浆。颗粒原料和水的质量比可为100:50。球磨至细度过325目标准筛余为0.6~1.0wt%。上述全抛釉的流速可为80-90秒。釉浆经过干燥制粉过筛网,制得全抛釉粉。
全抛釉的施加方式可为丝网印刷。淋抛釉方式不适用于本发明,主要是考虑到淋抛釉的施釉量较多,釉层的厚度增加,釉面的透感变差,以及造成釉层排气困难,容易出现抛光后的毛孔增多。施全抛釉形成的全抛釉层的厚度可为0.15-0.30mm。丝网印刷的目数可为80-120目。例如,全抛釉的施加工艺参数可为:采用100目加厚三次的网版印刷一次。
全抛釉的比重可为1.50~1.70 g/cm3。全抛釉的施釉量可为90~140g/m2,可以保证釉面的硬度和耐磨,同时透感和发色也较好。
调整之前全抛釉采用淋釉的施釉方式,该施釉方式导致全抛釉量较厚,坯釉中间层相对更薄,釉面的硬度和耐磨性也会相应下降。这主要是因为全抛釉的釉层析晶主要出现在釉面偏中上层以及与底釉交接的地方,如果施釉量过高,釉层的厚度增加,釉面的透感变差,以及造成釉层排气困难,容易出现抛光后的毛孔增多。因此,相应地如要获取更好的透感和镜面效果必然需要较高的抛光深度,随着抛光深度的增加,中上层的耐磨晶体被抛掉,露出更多的非晶相,因此会导致釉面的硬度及耐磨下降。
而调整全抛釉的施釉方式后,采用丝网印刷,可以较好地控制施釉量及均匀性,同时施釉量越少,釉层越薄,坯釉中间层相对越厚,釉面的硬度及耐磨性越好。另外,釉层薄也利于气体的排出,减少抛光后的毛孔,因此釉面硬度及耐磨得到提升。
将施完全抛釉后的砖坯干燥。干燥温度可为100~150℃,干燥后水分控制在0.9wt%以内。并将干燥后的坯体烧成。最高烧成温度可为1210℃~1230℃,烧成周期可为60~70分钟。由于刚玉的摩氏硬度为9,钡冰长石的摩氏硬度为6~6.5;如果釉面含有硬度高的晶体,其釉面也相应会表现出较高的摩氏硬度和耐磨性能。理论上来说硬度高的晶体含量越高,其硬度和耐磨性能越好。在适当范围内,烧成周期越长,越有利于析晶,其中高温区时间长可以使得原料得到充分的熔融和反应,在冷却带周期长可以确保有更多的晶体析出。因此,为促进晶体析出,本发明除了对全抛釉配方和施釉方式进行调整外,还对烧成制度进行调控以配合促进晶体析出。烧成周期越长,釉中氧化物熔融越充分,冷却保温时间越长,析出的晶体越多。一些实施方式,本发明烧成制度的高温区时间约为12-20分钟,例如可为15分钟。该高温区的温度为1210℃~1230℃。
将烧成后的陶瓷砖抛光,磨边分级,获得全抛釉陶瓷砖。
本发明制备的全抛釉陶瓷砖具备高硬度及良好的耐磨性能。其中莫氏硬度达5.5~6;耐磨方面浅色产品达到5级12000转。由于耐磨的测试方法是根据GB/T 3810.6-2016进行测试;而磨损痕迹是通过肉眼观察,相对来说深色砖的釉面磨损痕迹会明显很多,更容易被观察,因此判定的时候通常是浅色砖比深色砖耐磨等级更高。
下面进一步例举实施例以详细说明本发明。同样应理解,以下实施例只用于对本发明进行进一步说明,不能理解为对本发明保护范围的限制,本领域的技术人员根据本发明的上述内容作出的一些非本质的改进和调整均属于本发明的保护范围。下述示例具体的工艺参数等也仅是合适范围中的一个示例,即本领域技术人员可以通过本文的说明做合适的范围内选择,而并非要限定于下文示例的具体数值。
实施例1
(1)将坯体粉料使用压机干压成型;
(2)干燥以形成砖坯,干燥时间1~1.5h,干燥后砖坯水分0.3~0.5wt%;
(3)在干燥后的砖坯表面喷底釉,底釉比重1.40~1.45 g/cm3,施釉量400~550g/m2
(4)在喷底釉的砖坯表面喷墨打印图案;
(5)在喷墨打印图案后的砖坯表面使用140目丝网印隔离釉,隔离釉的比重为1.30 g/cm3,施釉量20~30g/m2
(6)印完隔离釉后,采用100目加厚三次网印全抛釉一遍,全抛釉的比重为1.56 g/cm3,全抛釉的施釉量为100g/m2;所述全抛釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:8.5~10.5%、MgO:4.0.~6.0%、K2O:0.5~1.5%、Na2O:0.5~1.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、ZrO2:0.5~2.0%、烧失:4.0~6.0%;
(7)将印全抛釉的砖坯干燥,干燥温度为100~150℃,干燥后砖坯水分控制在0.9wt%以内;
(8)将干燥后的砖坯烧成,最高烧成温度1220℃,烧成周期60分钟;
(9)抛光磨边分级。
该实施例所制得的全抛釉陶瓷砖,具备高硬度(莫氏硬度5.5~6.0)以及良好的耐磨性能5级12000转。
对比例1
(1)将坯体粉料使用压机干压成型;
(2)干燥以形成砖坯,干燥时间1~1.5h,干燥后砖坯水分0.3~0.5wt%;
(3)在干燥后的砖坯表面喷底釉,底釉比重1.40~1.45 g/cm3,施釉量400~550g/m2
(4)在喷底釉的砖坯表面喷墨打印图案;
(5)在喷墨打印图案后的砖坯表面使用140目丝网印隔离釉,隔离釉的比重为1.30 g/cm3,施釉量20~30g/m2
(6)印完隔离釉后,采用钟罩淋釉方式施传统全抛釉,全抛釉的比重为1.80 g/cm3,施釉量450~600 g/m2;该全抛釉的化学组成包括:以质量百分比计,SiO2:43.0~50.0%、Al2O3:12.0~16.0%、Fe2O3:0.1~0.5%、TiO2:0.1~0.3%、CaO:7.0~9.0%、MgO:3.5~4.5%、K2O:3.5~4.5%、Na2O:1.5~2.5%、ZnO:3.0~5.0%、BaO:7.0~12.0% 、烧失:6.0~9.0%;
(7)将淋全抛釉后的砖坯干燥,干燥温度为100~150℃,干燥后砖坯水分控制在0.9wt%以内;
(8)将干燥后的砖坯烧成,最高烧成温度1220℃,烧成周期60分钟;
(9)抛光磨边分级。
经烧成后全抛釉面物相组成为:以质量百分比计,刚玉1~3%、钡冰长石3~5%、倍长石3~5%、赤铁矿0.5~2%和非晶相85~90%。
该对比例1所制得的全抛釉陶瓷砖,莫氏硬度4.5、耐磨3级2100转。比较图4和图6可知,图6中抛光后釉面的晶体杂乱且刚玉数量较少,因此硬度和耐磨较差。
对比例2
(1)将坯体粉料使用压机干压成型;
(2)干燥以形成砖坯,干燥时间1~1.5h,干燥后砖坯水分0.3~0.5wt%;
(3)在干燥后的砖坯表面喷底釉,底釉比重1.40~1.45 g/cm3,施釉量400~550g/m2
(4)在喷底釉的砖坯表面喷墨打印图案;
(5)在喷墨打印图案后的砖坯表面使用140目丝网印隔离釉,隔离釉的比重为1.30 g/cm3,施釉量20~30g/m2
(6)印完隔离釉后,采用钟罩淋釉方式施全抛釉,全抛釉的比重为1.80 g/cm3,施釉量450~600 g/m2;所述全抛釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:8.5~10.5%、MgO:4.0~6.0%、K2O:0.5~1.5%、Na2O:0.5~1.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、ZrO2:0.5~2.0%、烧失:4.0~6.0%;
(7)将淋全抛釉后的砖坯干燥,干燥温度为100~150℃,干燥后砖坯水分控制在0.9wt%以内;
(8)将干燥后的砖坯烧成,最高烧成温度1220℃,烧成周期60分钟;
(9)抛光磨边分级。
该对比例2所制得的全抛釉陶瓷砖,釉面的透感较差,毛孔相对多,莫氏硬度5.0、耐磨4级6000转。所得陶瓷砖的硬度和耐磨性能稍差,说明淋抛釉方式不适用于本发明,主要是因为淋抛釉的施釉量较多,釉层的厚度增加,釉面的透感变差,以及造成釉层排气困难,容易出现抛光后的毛孔增多,见图7所示。

Claims (10)

1.一种高硬度高耐磨全抛釉陶瓷砖的制备方法,其特征在于,包括以下步骤:
步骤(1),将坯体粉料压制成型后干燥,形成砖坯;
步骤(2),在砖坯表面施底釉;
步骤(3),在施底釉后的砖坯表面喷墨打印图案,并施隔离釉;
步骤(4),在施隔离釉后的砖坯表面施全抛釉;
步骤(5),将施全抛釉后的砖坯干燥,烧成,抛光,获得高硬度高耐磨全抛釉陶瓷砖;
所述全抛釉烧成后物相组成为:以质量百分比计,刚玉10~20%、钡冰长石20~30%、赤铁矿0.5~1%和非晶相50~68%。
2.根据权利要求1所述的制备方法,其特征在于,所述全抛釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:8.5~10.5%、MgO:4.0~6.0%、K2O:0.5~1.5%、Na2O:0.5~1.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、ZrO2:0.5~2.0%、烧失:4.0~6.0%。
3.根据权利要求1所述的制备方法,其特征在于,所述全抛釉的施加方式为丝网印刷,所述全抛釉的比重为1.50~1.70 g/cm3,施釉量为90~140 g/m2
4.根据权利要求1所述的制备方法,其特征在于,所述隔离釉的化学组成包括:以质量百分比计,SiO2:42~50%、Al2O3:21~25%、Fe2O3:0.16~0.46%、TiO2:0.10~0.20%、CaO:10.0~12.0%、MgO:1.0~2.0%、K2O:0.5~1.5%、Na2O:1.5~2.5%、ZnO:4.5~7.5%、BaO:6.0~10.0%、烧失:4.0~6.0%。
5.根据权利要求1所述的制备方法,其特征在于,所述隔离釉的施加方式为丝网印刷,所述隔离釉的比重为1.25~1.35 g/cm3
6.根据权利要求1所述的制备方法,其特征在于,所述底釉的化学组成包括:以质量百分比计,SiO2:55~60%、Al2O3:21~24%、Fe2O3:0.16~0.46%、TiO2:0.15~0.25%、CaO:0.1~0.3%、MgO:0.1~0.3%、K2O:4.0~5.0%、Na2O:2.0~3.0%、ZrO2:6.0~10.0%、烧失:3.0~4.0%。
7.根据权利要求1所述的制备方法,其特征在于,所述底釉的施加方式为喷釉,所述底釉的比重为1.40~1.45 g/cm3,施釉量为400~550 g/ m2
8.根据权利要求1所述的制备方法,其特征在于,最高烧成温度为1210℃~1230℃,烧成周期为60分钟~70分钟。
9.根据权利要求1所述的制备方法,其特征在于,步骤(1)中,干燥时间为1~1.5h,干燥后砖坯水分为0.3~0.5 wt %;步骤(5)中,干燥温度为100~150℃,干燥后砖坯水分控制在0.9wt%以内。
10.根据权利要求1至9中任一项所述的制备方法获得的高硬度高耐磨全抛釉陶瓷砖。
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CN115304276B (zh) * 2022-08-03 2023-12-26 东莞市唯美陶瓷工业园有限公司 一种复合釉层、陶瓷板及其制备方法
CN115557701A (zh) * 2022-09-19 2023-01-03 江西新明珠建材有限公司 一种釉料组合物、肌肤釉瓷砖及其制备方法
CN115557701B (zh) * 2022-09-19 2024-03-29 江西新明珠建材有限公司 一种釉料组合物、肌肤釉瓷砖及其制备方法
CN115650583A (zh) * 2022-10-27 2023-01-31 广东道氏陶瓷材料有限公司 一种微立体感耐磨瓷砖的制备方法

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