CN111410524B - 一种ltcc微波介质材料及其制备方法 - Google Patents

一种ltcc微波介质材料及其制备方法 Download PDF

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CN111410524B
CN111410524B CN202010188993.5A CN202010188993A CN111410524B CN 111410524 B CN111410524 B CN 111410524B CN 202010188993 A CN202010188993 A CN 202010188993A CN 111410524 B CN111410524 B CN 111410524B
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equal
powder
microwave dielectric
glass
ball milling
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CN111410524A (zh
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陈涛
程凯
曹秀华
沓世我
付振晓
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Guangdong Fenghua Advanced Tech Holding Co Ltd
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Guangdong Fenghua Advanced Tech Holding Co Ltd
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Priority to JP2021544937A priority patent/JP7254195B2/ja
Priority to PCT/CN2021/078758 priority patent/WO2021185075A1/zh
Priority to KR1020217024601A priority patent/KR102618234B1/ko
Priority to US17/389,334 priority patent/US20210355035A1/en
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Abstract

本发明公开了一种LTCC微波介质材料,所述LTCC微波介质材料的材料组分如下:a Ba5Si8O21+(1‑a)(MgxCaySrzBa1‑x‑y‑z)WO4+Ba‑B‑Si玻璃;其中,0.4≤a≤0.8,0≤x≤1,0≤y≤1,0≤z≤1。本发明通过调整Ba5Si8O21及(MgxCaySrzBa1‑x‑y‑z)WO4的含量,可将谐振频率温度系数调节到近零,适用于高频通讯及射频领域。同时,本发明还公开一种LTCC微波介质材料的制备方法。

Description

一种LTCC微波介质材料及其制备方法
技术领域
本发明属于微波介质材料技术领域,具体涉及一种谐振频率温度系数近零的LTCC微波介质材料及其制备方法。
背景技术
随着5G通讯及万物互联时代的到来,高频应用成为趋势。小型化、高集成度和高可靠性成为5G通信器件的典型特点。用于5G通信器件集成技术的关键介质材料-低温共烧陶瓷材料(LTCC)成为研究热点。为减少信号传输损耗,加快信号传输速度,需要LTCC材料具备较低的介电常数及较高的Q值(即低损耗);为提高信号传输的稳定性,需要材料具备近零的谐振频率温度系数。
申请号为“200910113981.X”的中国发明专利,将Ba5-xLaxTixNbxO15与BaCuB2O5及BaWO4复合,得到了Qf值高于10000GHz的低温烧结微波介质陶瓷,且其谐振频率温度系数近零;但由于Ba5-xLaxTixNbxO15介电常数较高,导致体系介电常数较高(35~45),不符合低介电常数要求。为此,需开发新的复合材料体系,以满足低介电常数,且谐振频率温度系数近零的LTCC微波介质陶瓷需求。
发明内容
基于此,本发明的目的在于克服上述现有技术的不足之处而提供一种谐振频率温度系数近零的LTCC微波介质材料。
为实现上述目的,本发明所采取的技术方案为:一种LTCC微波介质材料,所述LTCC微波介质材料的材料组分如下:a Ba5Si8O21+(1-a)(MgxCaySrzBa1-x-y-z)WO4+Ba-B-Si玻璃;其中,0.4≤a≤0.8,0≤x≤1,0≤y≤1,0≤z≤1。
本发明通过将具有正谐振频率温度系数且介电常数较低的钡硅酸盐Ba5Si8O21与具有负谐振频率温度系数的钨酸盐(MgxCaySrzBa1-x-y-z)WO4复合,通过低熔点Ba-B-Si玻璃添加来降低体系烧结温度,得到了低介电常数,且谐振频率温度系数近零的LTCC微波介质陶瓷,适用于高频通讯及射频领域。
优选地,所述Ba-B-Si玻璃的重量为Ba5Si8O21、MgxCaySrzBa1-x-y-z重量之和的2~15%。这一选择可以更好的降低体系的烧结温度。
同时,本发明还提供一种所述的LTCC微波介质材料的制备方法,包括如下步骤:
(1)按照化学计量比Ba5Si8O21称取原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,球磨4-12h,取出、烘干、过筛,将过筛后的粉末在1100-1250℃下煅烧,保温1-5h,冷却至室温,得到Ba5Si8O21粉体;
(2)按照化学计量比(MgxCaySrzBa1-x-y-z)WO4称取原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨4-12h,取出、烘干、过筛,将过筛后的粉末在700-1000℃下煅烧,保温1-5h,冷却至室温,得到(MgxCaySrzBa1-x-y-z)WO4粉体;
(3)将Ba-B-Si玻璃放入球磨罐中,加入氧化锆球和去离子水,球磨2-6h,取出、烘干,得到Ba-B-Si玻璃粉;
(4)将步骤(1)得到的Ba5Si8O21粉体、步骤(2)得到的(MgxCaySrzBa1-x-y-z)WO4粉体、步骤(3)得到的Ba-B-Si玻璃粉加入球磨罐中,加入氧化锆球和去离子水,球磨2-6h,取出、烘干、打粉,得到用于制备LTCC微波介质陶瓷的瓷粉;
(5)在步骤(4)所得瓷粉中添加PVA溶液造粒,并压制成圆柱状块体,在850-900℃下烧结,保温0.5-3h,得到LTCC微波介质陶瓷。
优选地,所述步骤(3)中的Ba-B-Si玻璃通过以下方法制备所得:
以SiO2、H3BO3、BaCO3、Na2CO3、Li2CO3、BaCO3、SrCO3、K2CO3、Al2O3、MgO、TiO2为原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨1-4h,取出、烘干,将烘干后的粉末在1200-1500℃下熔融,保温1-3h,将玻璃液高温取出,倒入去离子水中淬火,得到Ba-B-Si玻璃。
本申请制备方法中,采用固相法合成谐振频率温度系数(τf)为正值的钡硅酸盐Ba5Si8O21及τf为负值的钨酸盐AWO4(A可以是碱土金属元素中的任意一种或一种以上的组合),采用高温熔融法制备Ba-B-Si(BBS)低熔点玻璃;通过控制Ba5Si8O21及AWO4的含量调节τf近零,通过BBS玻璃添加将体系烧结温度降低到900℃以下,得到τf近零的低介电常数LTCC微波介质陶瓷。
优选地,所述步骤(1)、步骤(2)中的过筛为:过200目筛。
优选地,所述步骤(5)中,PVA溶液的重量为瓷粉重量的7-10wt%。
优选地,所述步骤(2)中的原料为MgO、CaCO3、SrCO3、BaCO3和WO3
优选地,所述步骤(1)中的原料为BaCO3和SiO2
相对于现有技术,本发明的优势在于:
本申请所用原材料通过固相法合成,工艺简单、适合工业生产,所合成的Ba5Si8O21、(MgxCaySrzBa1-x-y-z)WO4及Ba-B-Si玻璃介电常数较低,经复合后得到的LTCC微波介质陶瓷具备较低的介电常数,通过调整Ba5Si8O21及(MgxCaySrzBa1-x-y-z)WO4的含量,可将谐振频率温度系数调节到近零,适用于高频通讯及射频领域。
具体实施方式
为更好的说明本发明的目的、技术方案和优点,下面将结合具体实施例对本发明作进一步说明。
本申请实施例中的LTCC微波介质材料的材料组分如下:a Ba5Si8O21+(1-a)(MgxCaySrzBa1-x-y-z)WO4+Ba-B-Si玻璃;其中,0.4≤a≤0.8,0≤x≤1,0≤y≤1,0≤z≤1;所述Ba-B-Si玻璃的重量为Ba5Si8O21、MgxCaySrzBa1-x-y-z重量之和的2~15%(b%);
本申请实施例中的LTCC微波介质材料的制备方法如下:
(1)按照化学计量比Ba5Si8O21称取BaCO3及SiO2原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨4-12h,取出、烘干、过200目筛,将过筛后的粉末放到氧化铝坩埚中,在马弗炉中以1100-1250℃煅烧,保温1-5h,冷却至室温,得到Ba5Si8O21粉体;
(2)按照化学计量比(MgxCaySrzBa1-x-y-z)WO4取MgO、BaCO3、SrCO3、BaCO3及WO3原料(其中0≤x≤1,0≤y≤1,0≤z≤1),将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨4-12h,取出、烘干、过200目筛,将过筛后的粉末放到氧化铝坩埚中,在马弗炉中以700-1000℃煅烧,保温1-5h,冷却至室温,得到(MgxCaySrzBa1-x-y-z)WO4粉体;
(3)按照配比SiO2(45.8wt%)、H3BO3(39.6wt%)、BaCO3(5.3wt%)、Na2CO3(1.6wt%)、Li2CO3(0.7wt%)、BaCO3(1.5wt%)、SrCO3(1.1wt%)、K2CO3(1.9wt%)、Al2O3(1.2wt%)、MgO(0.8wt%)、TiO2(0.5wt%),将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨1-4h,取出、烘干,将烘干后的粉末放到氧化铝坩埚中,在高温炉中1200-1500℃熔融,保温1-3h,将玻璃液高温取出,倒入去离子水中淬火,得到Ba-B-Si玻璃,将Ba-B-Si玻璃放入球磨罐中,加入氧化锆球和去离子水,行星球磨2-6h,取出、烘干,得到Ba-B-Si玻璃粉;
(4)按照a Ba5Si8O21+(1-a)(MgxCaySrzBa1-x-y-z)WO4+b wt%Ba-B-Si玻璃的比例称取上述所Ba5Si8O21、(MgxCaySrzBa1-x-y-z)WO4及Ba-B-Si玻璃粉体,其中0.4≤a≤0.8,2≤b≤15;将称量好的粉体倒入球磨罐中,加入氧化锆球和去离子水,行星球磨2-6h,取出、烘干、打粉,得到用于制备LTCC微波介质陶瓷的瓷粉;
(5)在上述瓷粉中添加7-10wt%的PVA溶液造粒并压制成圆柱状块体,在850-900℃之间烧结,保温0.5-3h,得到LTCC微波介质陶瓷。
具体各实施例LTCC微波介质材料的材料组分及性能如表1所示,其中,介电常数及Qf值采用网络分析仪,以平行板反射法测试得到;τf值根据公式
Figure BDA0002414475310000041
计算得到,其中,T2和T1分别为80℃及25℃,f2和f1分别为温度T2及T1下样品的谐振频率。
表1具体实施例材料组分及对应样品微波介电性能
Figure BDA0002414475310000042
Figure BDA0002414475310000051
从表1可以看出,本申请得到的LTCC微波介质陶瓷具备较低的介电常数,通过调整Ba5Si8O21及(MgxCaySrzBa1-x-y-z)WO4的含量,可将谐振频率温度系数调节到近零,适用于高频通讯及射频领域。
最后所应当说明的是,以上实施例仅用以说明本发明的技术方案而非对本发明保护范围的限制,尽管参照较佳实施例对本发明作了详细说明,本领域的普通技术人员应当理解,可以对本发明的技术方案进行修改或者等同替换,而不脱离本发明技术方案的实质和范围。

Claims (7)

1.一种LTCC微波介质材料,其特征在于,所述LTCC微波介质材料的材料组分如下:aBa5Si8O21 +(1-a)(MgxCaySrzBa1-x-y-z)WO4 + Ba-B-Si玻璃;其中,0.4 ≤ a ≤ 0.8,0 ≤ x≤ 1,0 ≤ y ≤ 1,0 ≤ z ≤ 1,所述Ba-B-Si玻璃的重量为Ba5Si8O21、MgxCaySrzBa1-x-y-z重量之和的2~15%。
2.一种如权利要求1所述的LTCC微波介质材料的制备方法,其特征在于,包括如下步骤:
(1)按照化学计量比Ba5Si8O21称取原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,球磨4-12h,取出、烘干、过筛,将过筛后的粉末在1100-1250℃下煅烧,保温1-5h,冷却至室温,得到Ba5Si8O21粉体;
(2)按照化学计量比(MgxCaySrzBa1-x-y-z)WO4称取原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨4-12h,取出、烘干、过筛,将过筛后的粉末在700-1000℃下煅烧,保温1-5h,冷却至室温,得到(MgxCaySrzBa1-x-y-z)WO4粉体;
(3)将Ba-B-Si玻璃放入球磨罐中,加入氧化锆球和去离子水,球磨2-6h,取出、烘干,得到Ba-B-Si玻璃粉;
(4)将步骤(1)得到的Ba5Si8O21粉体、步骤(2)得到的(MgxCaySrzBa1-x-y-z)WO4粉体、步骤(3)得到的Ba-B-Si玻璃粉加入球磨罐中,加入氧化锆球和去离子水,球磨2-6h,取出、烘干、打粉,得到用于制备LTCC微波介质陶瓷的瓷粉;
(5)在步骤(4)所得瓷粉中添加PVA溶液造粒,并压制成圆柱状块体,在850-900℃下烧结,保温0.5-3h,得到LTCC微波介质陶瓷。
3.如权利要求2所述的LTCC微波介质材料的制备方法,其特征在于,所述步骤(3)中的Ba-B-Si玻璃通过以下方法制备所得:
以SiO2、H3BO3、BaCO3、Na2CO3、Li2CO3、SrCO3、K2CO3、Al2O3、MgO、TiO2为原料,将称量好的原料倒入球磨罐中,加入氧化锆球和去离子水,行星球磨1-4h,取出、烘干,将烘干后的粉末在1200-1500℃下熔融,保温1-3h,将玻璃液高温取出,倒入去离子水中淬火,得到Ba-B-Si玻璃。
4.如权利要求2所述的LTCC微波介质材料的制备方法,其特征在于,所述步骤(1)、步骤(2)中的过筛为:过200目筛。
5.如权利要求2所述的LTCC微波介质材料的制备方法,其特征在于,所述步骤(5)中,PVA溶液的重量为瓷粉重量的7-10wt%。
6.如权利要求2所述的LTCC微波介质材料的制备方法,其特征在于,所述步骤(2)中的原料为MgO、CaCO3、SrCO3、BaCO3和WO3
7.如权利要求2所述的LTCC微波介质材料的制备方法,其特征在于,所述步骤(1)中的原料为BaCO3和SiO2
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