CN111315799B - 树脂组合物及其应用、树脂组合物的制造方法 - Google Patents

树脂组合物及其应用、树脂组合物的制造方法 Download PDF

Info

Publication number
CN111315799B
CN111315799B CN201880072008.5A CN201880072008A CN111315799B CN 111315799 B CN111315799 B CN 111315799B CN 201880072008 A CN201880072008 A CN 201880072008A CN 111315799 B CN111315799 B CN 111315799B
Authority
CN
China
Prior art keywords
resin composition
mass
parts
resin
melt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201880072008.5A
Other languages
English (en)
Chinese (zh)
Other versions
CN111315799A (zh
Inventor
菊地重信
川崎达也
秋本真也
牧野繁男
真岸徳治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Princeton Technology Co ltd
Original Assignee
Princeton Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Princeton Technology Co ltd filed Critical Princeton Technology Co ltd
Publication of CN111315799A publication Critical patent/CN111315799A/zh
Application granted granted Critical
Publication of CN111315799B publication Critical patent/CN111315799B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Wood Science & Technology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyethers (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
CN201880072008.5A 2017-11-10 2018-09-07 树脂组合物及其应用、树脂组合物的制造方法 Active CN111315799B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-217211 2017-11-10
JP2017217211 2017-11-10
PCT/JP2018/033247 WO2019092968A1 (ja) 2017-11-10 2018-09-07 樹脂組成物

Publications (2)

Publication Number Publication Date
CN111315799A CN111315799A (zh) 2020-06-19
CN111315799B true CN111315799B (zh) 2022-12-27

Family

ID=66439182

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201880072008.5A Active CN111315799B (zh) 2017-11-10 2018-09-07 树脂组合物及其应用、树脂组合物的制造方法

Country Status (5)

Country Link
JP (1) JP7137576B2 (ja)
KR (1) KR102502897B1 (ja)
CN (1) CN111315799B (ja)
TW (1) TWI844517B (ja)
WO (1) WO2019092968A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI804280B (zh) * 2022-04-19 2023-06-01 台光電子材料股份有限公司 樹脂組合物及其製品

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101668806A (zh) * 2007-04-26 2010-03-10 日立化成工业株式会社 含有半ipn型复合体的热固性树脂的树脂清漆的制造方法以及使用有其的印刷线路板用树脂清漆、预浸料及贴金属箔层压板
JP2012180482A (ja) * 2011-03-02 2012-09-20 Jnc Corp マレイミド系高分子を含有する組成物、およびマレイミド系高分子共重合体の製造方法
JP2016088972A (ja) * 2014-10-30 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物
JP2017101152A (ja) * 2015-12-02 2017-06-08 株式会社プリンテック 変性ポリイミド樹脂組成物およびその製造方法、並びにそれを用いたプリプレグおよび積層板
WO2017170643A1 (ja) * 2016-03-31 2017-10-05 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、金属張積層板、樹脂基板、プリント配線基板および半導体装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004217941A (ja) * 1997-01-20 2004-08-05 Hitachi Chem Co Ltd 熱硬化性組成物及びその硬化物
JP4672930B2 (ja) 2001-09-04 2011-04-20 三井化学株式会社 変性ポリイミド樹脂組成物ならびにそれを用いたプリプレグおよび積層板
JP4317380B2 (ja) 2003-04-18 2009-08-19 三井化学株式会社 変性ポリイミド樹脂組成物ならびにそれを用いたプリプレグおよび積層板
JP5848638B2 (ja) * 2012-03-07 2016-01-27 株式会社日本触媒 硬化性樹脂組成物、その製造方法及びエレクトロニクス実装材料
JP6108561B2 (ja) * 2012-10-11 2017-04-05 国立大学法人横浜国立大学 熱硬化性樹脂、及び熱硬化性樹脂組成物
JP5743291B2 (ja) 2013-04-09 2015-07-01 住友化学株式会社 切削加工方法
KR101668855B1 (ko) * 2013-09-30 2016-10-28 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물과 이를 이용한 프리프레그 및 금속박 적층판
JP2015101669A (ja) * 2013-11-26 2015-06-04 住友ベークライト株式会社 半導体封止用樹脂組成物および半導体装置
JP2016074871A (ja) * 2014-03-04 2016-05-12 四国化成工業株式会社 ビスマレイミド樹脂組成物およびその利用
JP6770509B2 (ja) * 2015-03-31 2020-10-14 ナミックス株式会社 樹脂組成物、導電性樹脂組成物、接着剤、導電性接着剤、電極形成用ペースト、半導体装置
JP6680523B2 (ja) * 2015-12-07 2020-04-15 ソマール株式会社 粉体塗料
JP6614700B2 (ja) 2016-03-18 2019-12-04 京セラ株式会社 封止用成形材料及び電子部品装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101668806A (zh) * 2007-04-26 2010-03-10 日立化成工业株式会社 含有半ipn型复合体的热固性树脂的树脂清漆的制造方法以及使用有其的印刷线路板用树脂清漆、预浸料及贴金属箔层压板
JP2012180482A (ja) * 2011-03-02 2012-09-20 Jnc Corp マレイミド系高分子を含有する組成物、およびマレイミド系高分子共重合体の製造方法
JP2016088972A (ja) * 2014-10-30 2016-05-23 パナソニックＩｐマネジメント株式会社 封止用樹脂組成物
JP2017101152A (ja) * 2015-12-02 2017-06-08 株式会社プリンテック 変性ポリイミド樹脂組成物およびその製造方法、並びにそれを用いたプリプレグおよび積層板
WO2017170643A1 (ja) * 2016-03-31 2017-10-05 住友ベークライト株式会社 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、金属張積層板、樹脂基板、プリント配線基板および半導体装置

Also Published As

Publication number Publication date
TWI844517B (zh) 2024-06-11
CN111315799A (zh) 2020-06-19
KR20200078638A (ko) 2020-07-01
JP7137576B2 (ja) 2022-09-14
KR102502897B1 (ko) 2023-02-23
WO2019092968A1 (ja) 2019-05-16
TW201918378A (zh) 2019-05-16
JPWO2019092968A1 (ja) 2021-01-28

Similar Documents

Publication Publication Date Title
KR101466181B1 (ko) 수지 조성물, 이를 이용한 프리프레그 및 라미네이트
TWI577729B (zh) 樹脂組成物及藉由該組成物之接著薄膜及覆蓋薄膜
TWI781304B (zh) 樹脂組成物、清漆、積層板以及印刷配線基板
US20050159516A1 (en) Halogen-free flame-retardant resin composition and prepreg and laminate using the same
JP6509009B2 (ja) ビスマレイミド化合物、それを含む組成物、及び硬化物
JP2017101152A (ja) 変性ポリイミド樹脂組成物およびその製造方法、並びにそれを用いたプリプレグおよび積層板
KR101813527B1 (ko) 인계 에폭시 화합물 및 이의 제조방법, 이를 포함하는 에폭시 조성물
CN111315799B (zh) 树脂组合物及其应用、树脂组合物的制造方法
JP5214235B2 (ja) フェノール性水酸基を有する新規ビスマレイミド類及びこれを必須成分とする熱硬化性樹脂組成物、及びその硬化物
JP2001288339A (ja) エポキシ樹脂組成物の難燃化方法および難燃性エポキシ樹脂組成物
JP5441477B2 (ja) 難燃性リン含有エポキシ樹脂組成物及びその硬化物
JP7061944B2 (ja) ワニスおよびその製造方法
WO2023276379A1 (ja) 樹脂組成物、ワニス、積層板、プリント配線基板および成形品
JP2653604B2 (ja) 熱硬化性樹脂組成物
JP5918425B1 (ja) イミド基含有ナフトール樹脂製造方法、熱硬化性樹脂組成物およびその硬化物ならびに用途
JP3912747B2 (ja) 難燃性熱硬化性樹脂組成物
JP6867894B2 (ja) 組成物、エポキシ樹脂硬化剤、エポキシ樹脂組成物、熱硬化性組成物、硬化物、半導体装置、および層間絶縁材料
JPH04224859A (ja) 樹脂組成物
JP2003041118A (ja) 半導体封止材用樹脂組成物
JP2023039293A (ja) ベンゾオキサジン組成物およびその利用
JPH04226559A (ja) 樹脂組成物
JPH0288622A (ja) 低誘電率エポキシ樹脂組成物
JPH0453811A (ja) 熱硬化性樹脂組成物
JPH04328119A (ja) 樹脂組成物
JP2013185034A (ja) ベンゾオキサジン樹脂組成物及びその製造方法、並びにその成形体及び硬化体

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant