CN111223836B - 半导体器件和电子设备 - Google Patents

半导体器件和电子设备 Download PDF

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Publication number
CN111223836B
CN111223836B CN201911158381.5A CN201911158381A CN111223836B CN 111223836 B CN111223836 B CN 111223836B CN 201911158381 A CN201911158381 A CN 201911158381A CN 111223836 B CN111223836 B CN 111223836B
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terminals
region
wiring substrate
semiconductor chip
wiring
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CN111223836A (zh
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冈安义隆
仮屋崎修一
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Renesas Electronics Corp
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Renesas Electronics Corp
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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    • H01L2924/161—Cap
    • H01L2924/162—Disposition
    • H01L2924/16251—Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
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    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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    • H01L2924/3511—Warping

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US11699645B2 (en) * 2021-11-18 2023-07-11 Renesas Electronics Corporation Semiconductor device having wiring substrate with lead-out wirings
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