CN111182735B - 一种led灯带用高透射单面板及其制备方法 - Google Patents
一种led灯带用高透射单面板及其制备方法 Download PDFInfo
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- CN111182735B CN111182735B CN202010119996.3A CN202010119996A CN111182735B CN 111182735 B CN111182735 B CN 111182735B CN 202010119996 A CN202010119996 A CN 202010119996A CN 111182735 B CN111182735 B CN 111182735B
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- film
- copper foil
- controlled
- dry film
- stripping
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000002360 preparation method Methods 0.000 title claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 100
- 239000011889 copper foil Substances 0.000 claims abstract description 72
- 238000005530 etching Methods 0.000 claims abstract description 55
- 239000010410 layer Substances 0.000 claims abstract description 55
- 239000010949 copper Substances 0.000 claims abstract description 39
- 239000000758 substrate Substances 0.000 claims abstract description 37
- 230000001681 protective effect Effects 0.000 claims abstract description 29
- 229910052802 copper Inorganic materials 0.000 claims abstract description 28
- 239000000853 adhesive Substances 0.000 claims abstract description 23
- 230000001070 adhesive effect Effects 0.000 claims abstract description 23
- 239000012790 adhesive layer Substances 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 14
- 238000002834 transmittance Methods 0.000 claims abstract description 14
- 238000004519 manufacturing process Methods 0.000 claims description 23
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 18
- 238000006116 polymerization reaction Methods 0.000 claims description 17
- 239000007788 liquid Substances 0.000 claims description 11
- 229920002799 BoPET Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- 238000003825 pressing Methods 0.000 claims description 9
- 238000005406 washing Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 7
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 6
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 238000012546 transfer Methods 0.000 claims description 5
- 229910021591 Copper(I) chloride Inorganic materials 0.000 claims description 4
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 claims description 4
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000011127 biaxially oriented polypropylene Substances 0.000 claims description 3
- 229920006378 biaxially oriented polypropylene Polymers 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000009719 polyimide resin Substances 0.000 claims description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 3
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000007921 spray Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000003292 glue Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract description 4
- 238000000576 coating method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 7
- 230000005540 biological transmission Effects 0.000 description 5
- 230000008093 supporting effect Effects 0.000 description 5
- 238000011161 development Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000036632 reaction speed Effects 0.000 description 3
- 229940045803 cuprous chloride Drugs 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000536 complexating effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010119996.3A CN111182735B (zh) | 2020-02-26 | 2020-02-26 | 一种led灯带用高透射单面板及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010119996.3A CN111182735B (zh) | 2020-02-26 | 2020-02-26 | 一种led灯带用高透射单面板及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111182735A CN111182735A (zh) | 2020-05-19 |
CN111182735B true CN111182735B (zh) | 2024-01-26 |
Family
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CN202010119996.3A Active CN111182735B (zh) | 2020-02-26 | 2020-02-26 | 一种led灯带用高透射单面板及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN111182735B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112996259B (zh) * | 2021-02-09 | 2022-07-19 | 盐城维信电子有限公司 | 一种不同铜厚线路板的制作方法 |
CN114945248B (zh) * | 2022-06-08 | 2024-04-02 | 广东新思科技有限公司 | 一种精密电路板的加工工艺 |
CN114867219A (zh) * | 2022-06-08 | 2022-08-05 | 深圳市志凌伟业技术股份有限公司 | 采用侧蚀工艺制作精细线路 |
Citations (20)
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JPS61110489A (ja) * | 1984-11-02 | 1986-05-28 | 株式会社日立製作所 | 導体打抜配線板の製造方法 |
JPH04372193A (ja) * | 1991-06-20 | 1992-12-25 | Ibiden Co Ltd | プリント配線板 |
JPH1067978A (ja) * | 1996-06-14 | 1998-03-10 | Shin Etsu Chem Co Ltd | ポリカルボジイミド樹脂含有接着剤及びフレキシブルプリント配線用基板 |
JPH11112126A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | 微細パターンの製造方法 |
JP2000188451A (ja) * | 1998-12-22 | 2000-07-04 | Toagosei Co Ltd | フレキシブル印刷配線板、カバーレイフィルム及び接着剤組成物 |
JP2001127117A (ja) * | 1999-10-26 | 2001-05-11 | Hitachi Cable Ltd | Tabテープの製造方法 |
CN1383706A (zh) * | 2000-07-07 | 2002-12-04 | 三井金属鉱业株式会社 | 附载箔的复合铜箔、带电阻电路的印刷电路板的制造方法、和带电阻电路的印刷电路板 |
JP2005044925A (ja) * | 2003-07-25 | 2005-02-17 | Kyocera Corp | 複合シートの製造方法、並びに積層部品の製造方法 |
JP2005064280A (ja) * | 2003-08-14 | 2005-03-10 | Shin Etsu Polymer Co Ltd | 電磁波シールド体及びその製造方法 |
JP2008218576A (ja) * | 2007-03-01 | 2008-09-18 | Fujikura Ltd | フレキシブルプリント基板 |
JP2009029933A (ja) * | 2007-07-27 | 2009-02-12 | Toyo Ink Mfg Co Ltd | エステル型エポキシ樹脂及びそれを含む樹脂組成物及び接着剤組成物 |
TW201128949A (en) * | 2010-02-11 | 2011-08-16 | Jess Link Products Co Ltd | Laminated flexible circuit board, a manufacturing method |
CN202213261U (zh) * | 2011-06-13 | 2012-05-09 | 莱芜金鼎电子材料有限公司 | 一种具有双胶粘层的fccl预制结构 |
WO2014058131A1 (ko) * | 2012-10-09 | 2014-04-17 | 주식회사 이티엘 | 필름형 인쇄회로 부착방식의 엘이디 모듈 제조 방법 |
JP2015155199A (ja) * | 2014-01-17 | 2015-08-27 | 太陽インキ製造株式会社 | 積層構造体 |
WO2017159773A1 (ja) * | 2016-03-17 | 2017-09-21 | 東レエンジニアリング株式会社 | フレキシブル回路基板およびその製造方法 |
CN107872927A (zh) * | 2017-12-07 | 2018-04-03 | 江门黑氪光电科技有限公司 | 一种用于led灯带的电路板制造方法 |
CN108495456A (zh) * | 2018-05-18 | 2018-09-04 | 中山市富大照明科技有限公司 | 一种单层线路板柔性led灯带及其生产方法 |
CN109251694A (zh) * | 2018-08-07 | 2019-01-22 | 江门新时代胶粘科技有限公司 | 一种用于led灯带的fpc膜及其制备方法 |
CN109661101A (zh) * | 2019-01-29 | 2019-04-19 | 深圳市鑫世佳电子科技有限公司 | 一种透明线路板及其制备方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008105480A1 (ja) * | 2007-03-01 | 2008-09-04 | Ajinomoto Co., Inc. | 金属膜転写用フィルム、金属膜の転写方法及び回路基板の製造方法 |
JP5727076B2 (ja) * | 2013-06-27 | 2015-06-03 | キヤノン・コンポーネンツ株式会社 | フレキシブルプリント配線板、フレキシブル回路板およびそれを用いた電子装置 |
JP6200042B2 (ja) * | 2015-08-06 | 2017-09-20 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
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2020
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Patent Citations (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61110489A (ja) * | 1984-11-02 | 1986-05-28 | 株式会社日立製作所 | 導体打抜配線板の製造方法 |
JPH04372193A (ja) * | 1991-06-20 | 1992-12-25 | Ibiden Co Ltd | プリント配線板 |
JPH1067978A (ja) * | 1996-06-14 | 1998-03-10 | Shin Etsu Chem Co Ltd | ポリカルボジイミド樹脂含有接着剤及びフレキシブルプリント配線用基板 |
JPH11112126A (ja) * | 1997-10-06 | 1999-04-23 | Matsushita Electric Ind Co Ltd | 微細パターンの製造方法 |
JP2000188451A (ja) * | 1998-12-22 | 2000-07-04 | Toagosei Co Ltd | フレキシブル印刷配線板、カバーレイフィルム及び接着剤組成物 |
JP2001127117A (ja) * | 1999-10-26 | 2001-05-11 | Hitachi Cable Ltd | Tabテープの製造方法 |
CN1383706A (zh) * | 2000-07-07 | 2002-12-04 | 三井金属鉱业株式会社 | 附载箔的复合铜箔、带电阻电路的印刷电路板的制造方法、和带电阻电路的印刷电路板 |
JP2005044925A (ja) * | 2003-07-25 | 2005-02-17 | Kyocera Corp | 複合シートの製造方法、並びに積層部品の製造方法 |
JP2005064280A (ja) * | 2003-08-14 | 2005-03-10 | Shin Etsu Polymer Co Ltd | 電磁波シールド体及びその製造方法 |
JP2008218576A (ja) * | 2007-03-01 | 2008-09-18 | Fujikura Ltd | フレキシブルプリント基板 |
JP2009029933A (ja) * | 2007-07-27 | 2009-02-12 | Toyo Ink Mfg Co Ltd | エステル型エポキシ樹脂及びそれを含む樹脂組成物及び接着剤組成物 |
TW201128949A (en) * | 2010-02-11 | 2011-08-16 | Jess Link Products Co Ltd | Laminated flexible circuit board, a manufacturing method |
CN202213261U (zh) * | 2011-06-13 | 2012-05-09 | 莱芜金鼎电子材料有限公司 | 一种具有双胶粘层的fccl预制结构 |
WO2014058131A1 (ko) * | 2012-10-09 | 2014-04-17 | 주식회사 이티엘 | 필름형 인쇄회로 부착방식의 엘이디 모듈 제조 방법 |
JP2015155199A (ja) * | 2014-01-17 | 2015-08-27 | 太陽インキ製造株式会社 | 積層構造体 |
WO2017159773A1 (ja) * | 2016-03-17 | 2017-09-21 | 東レエンジニアリング株式会社 | フレキシブル回路基板およびその製造方法 |
CN107872927A (zh) * | 2017-12-07 | 2018-04-03 | 江门黑氪光电科技有限公司 | 一种用于led灯带的电路板制造方法 |
CN108495456A (zh) * | 2018-05-18 | 2018-09-04 | 中山市富大照明科技有限公司 | 一种单层线路板柔性led灯带及其生产方法 |
CN109251694A (zh) * | 2018-08-07 | 2019-01-22 | 江门新时代胶粘科技有限公司 | 一种用于led灯带的fpc膜及其制备方法 |
CN109661101A (zh) * | 2019-01-29 | 2019-04-19 | 深圳市鑫世佳电子科技有限公司 | 一种透明线路板及其制备方法 |
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Effective date of registration: 20240508 Address after: 425000 Dongmen Street, Dao County, Yongzhou City, Hunan Province High tech Zone 135 Upgraded Factory Area, Block 2, Building 10 Patentee after: Yongzhou Tianhui Electronic Technology Co.,Ltd. Country or region after: China Address before: Building 2, No. 198, Jiangbei Road, Huangjiang Town, Dongguan City, Guangdong Province 523000 Patentee before: DONGGUAN TIANFLEX ELECTRONS CO.,LTD. Country or region before: China |
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Effective date of registration: 20240604 Address after: Building 2, No. 198, Jiangbei Road, Huangjiang Town, Dongguan City, Guangdong Province 523000 Patentee after: DONGGUAN TIANFLEX ELECTRONS CO.,LTD. Country or region after: China Address before: 425000 Dongmen Street, Dao County, Yongzhou City, Hunan Province High tech Zone 135 Upgraded Factory Area, Block 2, Building 10 Patentee before: Yongzhou Tianhui Electronic Technology Co.,Ltd. Country or region before: China |
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