CN111163623A - 一种多层金属结构的屏蔽膜 - Google Patents
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Abstract
本发明提供了一种多层金属结构的屏蔽膜,包括绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;多层金属之间设有导电粘结层。本发明通过设置多层金属,控制每层金属的厚度,金属层之间通过导电粘结层粘接,使得屏蔽膜具有较好的柔性,且屏蔽效果优异。另外,采用导电粘结层使得金属层与层之间的结合力较好,而且在保证大于80db@10ghz的高频信号屏蔽性能的同时,使得该屏蔽膜具有很好的柔性,满足柔性线路板的柔性需求,同时耐高温性好,在高温冲击时仍能保持金属层结合力不下降且稳定可靠。
Description
技术领域
本发明属于屏蔽膜技术领域,尤其涉及一种多层金属结构的屏蔽膜。
背景技术
现有的屏蔽膜材料为铜铝箔胶带及在1ghz以内具有50db以上的屏蔽膜材料,因其价格低廉,取材容易,屏蔽效果佳,一直上各家电子厂的首选材料。但是在柔性线路板上具体应用时铜箔铝箔无法满足厚度及耐弯曲的性能要求,普通屏蔽膜又不能满足1ghz以上高频率65db以上屏蔽性能要求,市面上有出现用铜箔直接当屏蔽层的高频应用屏蔽膜,但耐弯曲性能和耐高温性能均不能满足柔性版的生产需求,而且无形中也提高了生产的成本,没有使用价值。
发明内容
有鉴于此,本发明的目的在于提供一种多层金属结构的屏蔽膜,该屏蔽膜具有较好的柔性,且屏蔽性能好。
本发明提供了一种多层金属结构的屏蔽膜,包括绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;
多层金属之间设有导电粘结层。
优选地,所述绝缘层的厚度为2~20μm。
优选地,所述导电粘结层的厚度为1~10μm。
优选地,所述屏蔽膜复合柔性版之后整体在GB/T2679.5,135degree,Radius0.38mm下耐弯曲性能大于20次。
优选地,每层金属独立地选自镍、金、银、铜、铝或锡。
优选地,所述绝缘层包括质量比70~80:5~10:0~20:0~15的树脂、助剂、填料和颜料;
所述树脂选自聚氨酯、环氧、聚酰亚胺、改性硅胶和聚对苯二甲酸乙二酯中的一种或多种;
所述助剂选自对应树脂的固化剂、分散剂和改性剂中的一种或多种;
所述填料选自钛白粉、导热粉、二氧化硅和碳粉中的一种或多种。
优选地,所述导电粘结层中包括质量比为50~80:5~70:5~10:5~10的胶、金属粉、固化剂和助剂。
优选地,所述屏蔽膜的厚度为10~50微米。
优选地,所述多层金属依次为0.25~0.35μm的银-0.25~0.35μm的镍;
或0.45~0.55μm的铜-0.2~0.25μm的银-0.95~1.05μm铜-0.2~0.25μm的Ni-0.2~0.25μm的银;
或0.95~1.05μm的铜-0.55~0.55μm的铜-0.2~0.3μm银-0.25~0.35μm的镍。
优选地,所述胶选自市场上通用的环氧热固导电胶、丙烯酸热固导电胶或聚氨酯热固导电胶。
本发明提供了一种多层金属结构的屏蔽膜,包括绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;多层金属之间设有导电粘结层。本发明通过设置多层金属,控制每层金属的厚度,金属层之间通过导电粘结层粘接,使得屏蔽膜具有较好的柔性,且屏蔽效果优异。另外,采用导电粘结层使得金属层与层之间的结合力较好,耐高温性好,在高温冲击时仍能保持金属层结合力不下降且稳定可靠。实验结果表明:屏蔽膜的厚度在20~35μm,2~7层金属时,10hgz下屏蔽测试达到80db以上;100ghz下屏蔽测试达到70db以上;该屏蔽膜压合柔性版后取得的整体能通过288℃下浸泡30s的耐高温性能测试和在GB/T2679.5,135degree,Radius 0.38mm下耐弯曲测试大于50次,均能满足柔性版基本需求。
附图说明
图1为本发明提供的多层金属结构的屏蔽膜的结构示意图。
具体实施方式
本发明提供了一种多层金属结构的屏蔽膜,包括绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;
多层金属之间设有导电粘结层。
本发明通过设置多层金属,控制每层金属的厚度,金属层之间通过导电粘结层粘接,使得屏蔽膜具有较好的柔性,且屏蔽效果优异。另外,采用导电粘结层使得金属层与层之间的结合力较好,而且在保证大于80db@10ghz的高频信号屏蔽性能的同时,使得该屏蔽膜具有很好的柔性,满足柔性线路板的柔性需求;耐高温性好,在高温冲击时仍能保持金属层结合力不下降且稳定可靠。本发明在保证柔性板材料基本要求的情况下(柔性,耐高温)所用的金属不需要很厚,但是也能达到80db(10ghz)以上的屏蔽性能,相当于纯金属层>2μm厚度的屏蔽性能,还能降低成本。
参见图1,图1为本发明提供的多层金属结构的屏蔽膜的结构示意图;其中,1为绝缘层,2为第一层金属,3为导电粘结层,4为第二层金属,5为最后一层金属,6为接地导电胶层,7为保护膜。
本发明提供的多层金属结构的屏蔽膜包括绝缘层1;所述绝缘层的厚度优选为2~20μm。所述绝缘层优选包括质量比70~80:5~10:0~12:0~15的树脂、助剂、填料和颜料;所述填料和颜料根据实际情况酌情添加,所述绝缘层优选包括质量比70~80:5~10:8~12:5~15的树脂、助剂、填料和颜料;所述树脂优选选自聚氨酯、环氧、聚酰亚胺、改性硅胶和聚对苯二甲酸乙二酯中的一种或多种;在具体实施例中,所述绝缘层中的树脂为韧驰891、ZY-3600R或Petpur胶黏剂。所述绝缘层中的助剂选自对应树脂的固化剂、分散剂和改性剂中的一种或多种;
所述填料选自钛白粉、导热粉、二氧化硅和碳粉中的一种或多种。具体实施例中,所述填料选自钛白粉。
在本发明中,所述绝缘层中的颜料使得绝缘层可以是透明、白色或黑色,根据客户需要进行选择。
或绝缘层具体包括质量比为70:10:10:10的ZY-3600R、泰升通用油性黑浆、钛白粉和ZY-3600R固化剂;
或绝缘层具体包括质量比为70:10:10:10的Petpur胶黏剂、钛白粉、Petpur固化剂和泰升通用油性黑浆。
所述绝缘层的厚度具体为3μm、5μm或7μm。
本发明提供的多层金属结构的屏蔽膜包括复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层。每层金属的厚度优选为0.05~2μm;多层金属的层数具体为2层、3层、4层、5层、6层、7层、8层、9层或10层。在具体实施例中,每层金属独立地选自镍、金、银、铜、铝或锡。所述多层金属包括第一层金属2、第二层金属4,直至最后一层金属5。
在本发明中,多层金属之间设有导电粘结层3;所述导电粘结层起导通的作用。所述导电粘结层作为非金属层,能够有效改善柔性。所述导电粘结层中包括质量比为50~80:5~70:5~10:5~10的胶、金属粉、固化剂和助剂;所述导电粘结层中的胶优选选自环氧胶、丙烯酸胶、聚酯和硅胶中的一种或多种;所述金属粉优选选自镍粉、银铜粉、铜粉、金粉、银粉和铝粉中的一种或多种;所述导电粘结层中的固化剂优选选自对应树脂体系的固化剂中一种或多种;所述导电粘结层中的助剂选自对应树脂的固化剂、填料分散剂和表面活性剂中的一种或多种;所述导电粘结层中的助剂视实际情况酌情添加。在本发明中,所述导电粘结层中的胶选自市场上通用的环氧热固导电胶、丙烯酸热固导电胶和聚氨酯热固导电胶等导电胶。所述导电粘结层的厚度优选为1~10μm,更优选为3~8μm;在具体实施例中,导电粘结层的厚度为8μm、5μm或3μm。
在本发明中,所述多层金属优选为0.25~0.35μm的银-0.25~0.35μm的镍;或0.45~0.55μm的铜-0.2~0.25μm的银-0.95~1.05μm铜-0.2~0.3μm的Ni-0.2~0.3μm的银;或0.95~1.05μm的铜-0.45~0.55μm的铜-0.2~0.3μm银-0.25~0.35μm的镍。具体实施例中,所述多层金属为0.3μm的银-0.3μm的镍;或0.5μm的铜-0.2μm的银-1μm铜-0.2μm的Ni-0.2μm的银;或1μm的铜-0.5μm的铜-0.2μm银-0.3μm的镍。
在本发明中,所述多层金属的最顶层上优选复合接地导电胶层6,再覆盖上保护膜7;所述保护膜优选选自PP保护膜或PET离型膜。
本发明提供的屏蔽膜的各项性能符合IPC标准,屏蔽测试效果达到65db以上。
本发明提供的多层金属结构的屏蔽膜优选按照以下方法制得:
在离型膜上涂覆绝缘层,烘干后再设置第一层金属,然后在第一层金属上涂覆导电粘结层,再重复设置金属层和涂覆导电粘结层,再在最后一层金属层上设置一层接地导电胶层6,最后覆盖保护膜7,得到多层金属结构的屏蔽膜。
在本发明中,烘干的温度优选为100~200℃。设置金属层的方式为热贴或真空镀或水镀。保护膜选自PP膜或PET离型膜。
本发明采用GB/T30142-2013测试屏蔽膜的屏蔽性能;
采用GB/T2679.5,(135degree,Radius 0.38mm)测试屏蔽膜复合柔性线路板之后的的耐弯曲性能;
采用288℃下30s浸泡的条件测试屏蔽膜复合柔性版之后的耐高温性。
测试结果表明:本发明提供的屏蔽膜贴合柔性版之后具有较好耐SMT高温焊锡、耐弯曲性;金属层与层之间的结合力良好。
为了进一步说明本发明,下面结合实施例对本发明提供的一种多层金属结构的屏蔽膜进行详细地描述,但不能将它们理解为对本发明保护范围的限定。
实施例1
1)聚氨酯绝缘层配方(按照100重量份计):
钛白粉:20
色浆:黑色:5
2)原料膜涂黑胶:将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层3μm厚的黑色胶水,在100℃~200℃的烤箱中将丁酮溶剂表干,收卷好。
3)真空镀0.3μm银层;
4)涂3μm厚的导电粘结层;导电粘结层中包括质量比为70:10:10:10的环氧胶、镍粉、聚氨酯固化剂和助剂,烘干固化;
5)再在胶面镀一层0.3μm的第二金属镍;
6)在第二层金属上涂布一层10μm厚的接地导电胶层,再覆盖上一层pp保护膜;
8)然后进行检验,裁切,得到多层金属结构的屏蔽膜。
实施例2
1)环氧绝缘层配方(按照100重量份计):
ZY-3600R(中山市竹邑电子材料有限公司):70;
泰升通用油性黑浆(东莞市泰升颜料有限公司):10;
钛白粉:10;
ZY-3600R固化剂:10;
将ZY-3600R、泰升通用油性黑浆、钛白粉和固化剂混合,得到黑色胶水;
将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层5μm厚的黑色胶水,在100℃~200℃的烤箱中将溶剂表干,收卷;
3)真空镀膜镀0.5μm铜;
4)涂5μm厚的导电粘结层;导电粘结层中包括质量比为70:10:10:10的环氧胶、镍粉、聚氨酯固化剂和助剂,烘干固化;
5)再在胶面镀一层0.2μm的第二金属银;
6)重复4)和5),依次镀1μm的第三金属铜,0.2μm的第四金属Ni,和0.2μm的第5金属层银;
7)在第5层金属上涂布一层接地导电胶层,覆盖上一层pet离型膜;
8)对产品进行检验,裁切,得到多层金属结构的屏蔽膜。
实施例3
1)丙烯酸油墨绝缘层配方调整(按照100重量份计):
Petpur胶黏剂(重庆绿川):70
钛白粉:10
Petpur固化剂:10;
泰升通用油性黑浆(东莞市泰升颜料有限公司):10;
将petpur胶黏剂、钛白粉和petpur胶水固化剂及黑色色浆混合,得到黑色胶水;
2)原料膜涂黑胶:将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层7μm厚的黑色胶水,在100℃~200℃的烤箱中将溶剂表干,收卷;
3)真空镀1μm铜层;
4)涂8μm厚的导电粘结层;导电粘结层中包括质量比为70:10:10:10的环氧胶、镍粉、聚氨酯固化剂和助剂,烘干固化;
5)再在胶面镀一层0.5μm的第二金属铜;
6)重复4)和5),镀一层0.2μm后的第3金属层银;再镀一层0.3μm后的第4金属层镍;
7)在第4层金属上涂布一层接地导电胶层,覆盖上一层pp保护膜;
8)对产品进行检验,裁切,得到多层金属结构的屏蔽膜。
对比例1
1)聚氨酯绝缘层配方(按照100重量份计):
钛白粉:20
色浆:黑色5
2)原料膜涂黑胶:将准备好的离型膜在涂布线上放卷经过涂布头,均匀涂上一层3μm厚的黑色胶水,在100℃~200℃的烤箱中将溶剂表干,收卷好。
3)在120℃条件下用热贴机贴2μm厚的铜箔,再在铜箔表面涂布一层10μm厚的接地导电胶层,再覆盖上一层pp保护膜;
4)然后进行检验,裁切,得到单层金属结构的屏蔽膜。
本发明对实施例1~3和对比例1制备的屏蔽膜进行性能测试,结果见表1,表1为本发明实施例1~3和对比例1制备的屏蔽膜的性能测试结果:
表1本发明实施例1~3和对比例1制备的屏蔽膜的性能测试结果
由以上实施例可知,本发明提供了一种绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;多层金属之间设有导电粘结层。本发明通过设置多层金属,控制每层金属的厚度,金属层之间通过导电粘结层粘接,使得屏蔽膜具有较好的柔性,且屏蔽效果优异。另外,采用导电粘结层使得金属层与层之间的结合力较好,耐高温性好,在高温冲击时仍能保持金属层结合力不下降且稳定可靠。实验结果表明:屏蔽膜的厚度在20~35μm,2~7层金属时,10hgz下屏蔽测试达到78~85db;100ghz下屏蔽测试达到71~79db;该屏蔽膜压合柔性版后取得的整体能通过288℃下浸泡30s的耐高温性能测试和在GB/T2679.5,135degree,Radius 0.38mm下耐弯曲测试大于50次,均能满足柔性版基本需求。
以上所述仅是本发明的优选实施方式,应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以做出若干改进和润饰,这些改进和润饰也应视为本发明的保护范围。
Claims (10)
1.一种多层金属结构的屏蔽膜,其特征在于,包括绝缘层和复合在所述绝缘层上的多层金属;每层金属的厚度为0.05~5μm;多层金属的层数为2~10层;
多层金属之间设有导电粘结层。
2.根据权利要求1所述的屏蔽膜,其特征在于,所述绝缘层的厚度为2~20μm。
3.根据权利要求1所述的屏蔽膜,其特征在于,所述导电粘结层的厚度为1~10μm。
4.根据权利要求1所述的屏蔽膜,其特征在于,所述屏蔽膜压合柔性版后取得的整体在GB/T2679.5,135degree,Radius0.38mm下耐弯曲性能大于20次。
5.根据权利要求1所述的屏蔽膜,其特征在于,每层金属独立地选自镍、金、银、铜、铝或锡。
6.根据权利要求1所述的屏蔽膜,其特征在于,所述绝缘层包括质量比50~80:5~10:0~20:0~15的树脂、助剂、填料和颜料;
所述树脂选自聚氨酯、环氧、聚酰亚胺、改性硅胶和聚对苯二甲酸乙二酯中的一种或多种;
所述助剂选自对应树脂的固化剂、分散剂和改性剂中的一种或多种;
所述填料选自钛白粉、导热粉、二氧化硅和碳粉中的一种或多种。
7.根据权利要求1所述的屏蔽膜,其特征在于,所述导电粘结层中包括质量比为50~80:5~70:5~10:5~10的胶、金属粉、固化剂和助剂。
8.根据权利要求1所述的屏蔽膜,其特征在于,所述屏蔽膜的厚度为10~50微米。
9.根据权利要求1所述的屏蔽膜,其特征在于,所述多层金属依次为0.25~0.35μm的银-0.25~0.35μm的镍;
或0.45~0.55μm的铜-0.2~0.25μm的银-0.95~1.05μm铜-0.2~0.3μm的Ni-0.2~0.3μm的银;
或0.95~1.05μm的铜-0.45~0.55μm的铜-0.2~0.3μm银-0.25~0.35μm的镍。
10.根据权利要求7所述的屏蔽膜,其特征在于,所述胶选自市场上通用的环氧热固导电胶、丙烯酸热固导电胶或聚氨酯热固导电胶。
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US11765875B2 (en) | 2019-07-05 | 2023-09-19 | Haining Zhuotai Electronic Materials Co., Ltd | Shielding film having multi-layered metal structure |
CN111806013A (zh) * | 2020-07-03 | 2020-10-23 | 河南国安电子材料有限公司 | 一种高频电磁屏蔽膜及其制备方法 |
CN114716934A (zh) * | 2022-02-21 | 2022-07-08 | 常州威斯双联科技有限公司 | 一种导热屏蔽复合材料及其制备方法 |
CN115093802A (zh) * | 2022-03-30 | 2022-09-23 | 安徽屹珹新材料科技有限公司 | 一种电磁屏蔽复合材料及其制备方法 |
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US20220361384A1 (en) | 2022-11-10 |
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US11765875B2 (en) | 2023-09-19 |
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