CN111149213B - 碳化硅半导体装置及其制造方法 - Google Patents

碳化硅半导体装置及其制造方法 Download PDF

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CN111149213B
CN111149213B CN201880056697.0A CN201880056697A CN111149213B CN 111149213 B CN111149213 B CN 111149213B CN 201880056697 A CN201880056697 A CN 201880056697A CN 111149213 B CN111149213 B CN 111149213B
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CN111149213A (zh
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梶爱子
竹内有一
箕谷周平
铃木龙太
山下侑佑
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/64—Double-diffused metal-oxide semiconductor [DMOS] FETs
    • H10D30/66—Vertical DMOS [VDMOS] FETs
    • H10D30/668—Vertical DMOS [VDMOS] FETs having trench gate electrodes, e.g. UMOS transistors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/01—Manufacture or treatment
    • H10D12/031—Manufacture or treatment of IGBTs
    • H10D12/032—Manufacture or treatment of IGBTs of vertical IGBTs
    • H10D12/038—Manufacture or treatment of IGBTs of vertical IGBTs having a recessed gate, e.g. trench-gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D12/00—Bipolar devices controlled by the field effect, e.g. insulated-gate bipolar transistors [IGBT]
    • H10D12/411—Insulated-gate bipolar transistors [IGBT]
    • H10D12/441—Vertical IGBTs
    • H10D12/461—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions
    • H10D12/481—Vertical IGBTs having non-planar surfaces, e.g. having trenches, recesses or pillars in the surfaces of the emitter, base or collector regions having gate structures on slanted surfaces, on vertical surfaces, or in grooves, e.g. trench gate IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/01—Manufacture or treatment
    • H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
    • H10D30/028—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs
    • H10D30/0291—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs
    • H10D30/0297—Manufacture or treatment of FETs having insulated gates [IGFET] of double-diffused metal oxide semiconductor [DMOS] FETs of vertical DMOS [VDMOS] FETs using recessing of the gate electrodes, e.g. to form trench gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/113—Isolations within a component, i.e. internal isolations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/124—Shapes, relative sizes or dispositions of the regions of semiconductor bodies or of junctions between the regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/141—Anode or cathode regions of thyristors; Collector or emitter regions of gated bipolar-mode devices, e.g. of IGBTs
    • H10D62/145—Emitter regions of IGBTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H10D62/149—Source or drain regions of field-effect devices
    • H10D62/151—Source or drain regions of field-effect devices of IGFETs 
    • H10D62/152—Source regions of DMOS transistors
    • H10D62/153—Impurity concentrations or distributions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/17—Semiconductor regions connected to electrodes not carrying current to be rectified, amplified or switched, e.g. channel regions
    • H10D62/393—Body regions of DMOS transistors or IGBTs 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/83—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge
    • H10D62/832—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group IV materials, e.g. B-doped Si or undoped Ge being Group IV materials comprising two or more elements, e.g. SiGe
    • H10D62/8325—Silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/202—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials
    • H10P30/204—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors
    • H10P30/2042—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the semiconductor materials into Group IV semiconductors into crystalline silicon carbide
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/21—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping of electrically active species
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P30/00—Ion implantation into wafers, substrates or parts of devices
    • H10P30/20—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping
    • H10P30/218—Ion implantation into wafers, substrates or parts of devices into semiconductor materials, e.g. for doping characterised by the implantation in a compound semiconductor of both electrically active and inactive species in the same semiconductor region to be doped n-type or p-type

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CN201880056697.0A 2017-08-31 2018-08-29 碳化硅半导体装置及其制造方法 Active CN111149213B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017166883A JP6740986B2 (ja) 2017-08-31 2017-08-31 炭化珪素半導体装置およびその製造方法
JP2017-166883 2017-08-31
PCT/JP2018/032005 WO2019044922A1 (ja) 2017-08-31 2018-08-29 炭化珪素半導体装置およびその製造方法

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CN111149213A CN111149213A (zh) 2020-05-12
CN111149213B true CN111149213B (zh) 2023-08-11

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JP7139596B2 (ja) * 2017-12-06 2022-09-21 富士電機株式会社 半導体装置及びその製造方法
WO2020004067A1 (ja) * 2018-06-25 2020-01-02 住友電気工業株式会社 炭化珪素半導体装置
JP7140148B2 (ja) 2019-02-27 2022-09-21 株式会社デンソー 炭化珪素半導体装置およびその製造方法
JP7302286B2 (ja) * 2019-05-23 2023-07-04 富士電機株式会社 半導体装置
JP7272235B2 (ja) * 2019-10-30 2023-05-12 株式会社デンソー 炭化珪素半導体装置およびその製造方法
JP7451981B2 (ja) 2019-12-10 2024-03-19 富士電機株式会社 半導体装置
CN113497124B (zh) * 2020-04-07 2023-08-11 长鑫存储技术有限公司 半导体器件及其制造方法
CN116438660A (zh) * 2020-10-14 2023-07-14 日立能源瑞士股份公司 沟槽式SiC功率半导体装置
JP7517206B2 (ja) * 2021-03-11 2024-07-17 株式会社デンソー 電界効果トランジスタ
JP7613670B2 (ja) 2021-03-19 2025-01-15 富士電機株式会社 炭化珪素半導体装置および炭化珪素半導体装置の製造方法
CN117083719A (zh) * 2021-03-24 2023-11-17 株式会社电装 碳化硅半导体装置及使用它的逆变器电路、碳化硅半导体装置的制造方法
JP7543960B2 (ja) 2021-03-25 2024-09-03 株式会社デンソー 半導体装置とその製造方法
CN113964196B (zh) * 2021-10-20 2023-01-20 重庆平创半导体研究院有限责任公司 一种耗尽型功率半导体结构、串联结构和加工工艺
JP7746206B2 (ja) * 2022-03-23 2025-09-30 株式会社東芝 半導体装置
CN115117053A (zh) * 2022-07-06 2022-09-27 杭州电子科技大学 平面栅功率mosfet抗单粒子烧毁器件及制备方法
US12660300B2 (en) * 2022-08-15 2026-06-16 Monolithic Power Systems, Inc. Semiconductor device with integrated junction field effect transistor and associated manufacturing method
US12666696B2 (en) * 2022-08-15 2026-06-23 Monolithic Power Systems, Inc. Semiconductor device with integrated junction field effect transistor and associated manufacturing method
CN115799334B (zh) * 2022-11-01 2026-02-24 西安电子科技大学 一种抗单粒子栅损伤的SiC基VDMOSFET器件
CN117810265B (zh) * 2024-02-28 2024-05-14 湖北九峰山实验室 一种宽禁带半导体沟槽mosfet器件及其制造方法
CN120640744B (zh) * 2025-08-13 2025-11-18 杭州谱析光晶半导体科技有限公司 一种自对准双栅极mosfet及其制造工艺

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JP2010021175A (ja) * 2008-07-08 2010-01-28 Denso Corp 炭化珪素半導体装置およびその製造方法
CN105593997A (zh) * 2013-10-04 2016-05-18 三菱电机株式会社 碳化硅半导体装置及其制造方法

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US20220045172A1 (en) 2022-02-10
US11201216B2 (en) 2021-12-14
US20200203482A1 (en) 2020-06-25
WO2019044922A1 (ja) 2019-03-07
US11735654B2 (en) 2023-08-22
JP2019046909A (ja) 2019-03-22
CN111149213A (zh) 2020-05-12
JP6740986B2 (ja) 2020-08-19

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