CN111052421A - 透明密封构件 - Google Patents
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- 238000007789 sealing Methods 0.000 title claims abstract description 78
- 230000003287 optical effect Effects 0.000 claims abstract description 30
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000002834 transmittance Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 16
- 239000000843 powder Substances 0.000 description 11
- 239000000377 silicon dioxide Substances 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 238000007654 immersion Methods 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- 239000010419 fine particle Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 238000000746 purification Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 102000004169 proteins and genes Human genes 0.000 description 4
- 108090000623 proteins and genes Proteins 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 230000001954 sterilising effect Effects 0.000 description 3
- 238000004659 sterilization and disinfection Methods 0.000 description 3
- 230000000844 anti-bacterial effect Effects 0.000 description 2
- 239000000356 contaminant Substances 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 239000002957 persistent organic pollutant Substances 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 1
- 241001071918 Heliotropium Species 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本发明涉及透明密封构件。该透明密封构件是用于光学部件(16)的石英玻璃制的透明密封构件(10),该光学部件(16)具有至少一个光学元件(12)和安装有所述光学元件(12)的安装基板(14),所述透明密封构件(10)与所述安装基板(14)一起构成容纳所述光学元件(12)的封装(18),表面部(22)的铝浓度比内部(24)的铝浓度高。
Description
技术领域
本发明涉及用于例如LED(发光二极管)、LD(半导体激光器)等光学部件的透明密封构件。
背景技术
近来,在杀菌、净化用途中使用射出紫外线的发光元件(紫外线LED)的方式正在普及。紫外线LED器件中,为了保护发光元件免受外部气体、水分的影响,需要透明密封构件。从对紫外线的透过性、耐久性的观点考虑,该透明密封构件使用玻璃或石英玻璃。
在日本专利第6068411号公报及日本特表2009-532200号公报中,公开了使用紫外线LED的水净化装置。日本专利第5243806号公报中公开了一种透光性板材和半球状透镜成为一体的透明密封构件。
发明内容
通常,在污水等的液体净化的用途中,例如有蛋白质系或有机系的污染物质附着于透明密封构件的表面的情况。在这样的情况下,存在从光学元件射出的例如紫外线的光量在透明密封构件的表面减少,紫外线的杀菌效果降低这样的问题。
本发明是考虑到这样的课题而完成的,其目的在于提供一种起到下述效果的透明密封构件。
(a)能够抑制由氧缺陷引起的透过率的降低。
(b)蛋白质系或有机系等的污染物质难以附着,能够抑制由污染物质引起的杀菌效果的降低。
[1]本发明涉及的透明密封构件的特征在于,是用于光学部件的石英玻璃制的透明密封构件,所述光学部件具有至少一个光学元件和安装有所述光学元件的安装基板,所述透明密封构件与所述安装基板一起构成容纳所述光学元件的封装,所述透明密封构件的表面部的铝浓度比内部的铝浓度高。
通过使表面部的铝浓度高于内部的铝浓度,从而能够抑制由氧缺陷引起的透过率降低,同时还能够抑制有机物、微粒附着于透明密封构件的表面上。
[2]本发明中,将所述表面部的铝浓度设为A(ppm)、内部的铝浓度设为B(ppm)时,优选为10≤A/B≤200。
[3]本发明中,将所述表面部的铝浓度设为A(ppm)、内部的铝浓度设为B(ppm)时,优选为15≤A/B≤60。
[4]本发明中,优选所述表面部的铝浓度为500~2000ppm,所述内部的铝浓度为10~100ppm。
[5]本发明中,所述表面部是从表面起的深度为0.05~0.20μm的区域,所述内部是从表面起的深度为1~5μm的区域。
如以上说明的那样,根据本发明涉及的透明密封构件,会起到下述效果。
(a)能够抑制由氧缺陷引起的透过率的降低。
(b)蛋白质系或有机系等的污染物质难以附着,能够抑制由污染物质引起的杀菌效果的降低。
附图说明
[图1]图1A是表示本实施方式涉及的透明密封构件的纵截面图,图1B是表示将透明密封构件密封而构成的光学部件的一例的纵截面图。
[图2]是表示透明密封构件的表面部及内部的说明图。
[图3]是表示将具有透镜形状的透明密封构件密封而构成的光学部件的一例的纵截面图。
[图4]是表示实施例1、2及3以及比较例1、2及3中的制法、Al浓度(表面部及内部)、初始全光线透过率以及浸渍后的全光线透过率的表1。
具体实施方式
以下,参照图1A~图4对本发明涉及的透明密封构件的实施方式例进行说明。
如图1A所示,本实施方式涉及的透明密封构件10例如形成为平板状。透明密封构件10的外形形状例如为圆筒状、四边形状、多棱柱状等。透明密封构件10例如由石英玻璃构成。
如图1B所示,该透明密封构件10用于具有例如射出紫外光的至少一个光学元件12和安装有光学元件12的安装基板14的光学部件16,与安装基板14一起构成容纳光学元件12的封装18。
安装基板14具有上表面开口的凹部20,在凹部20的底部安装光学元件12。透明密封构件10以封闭安装基板14的凹部20的上表面开口的方式被安装基板14密封。安装基板14例如由AlN(氮化铝)构成。
虽未图示,但光学元件12是例如在蓝宝石基板上层叠具备量子阱结构的GaN系结晶层而构成。作为光学元件12的安装方法,例如能够采用使光出射面12a与透明密封构件10相对来进行安装的、所谓面朝上(face up)安装。即,利用例如接合线(未图示)将从光学元件12导出的端子(未图示)与形成于安装基板14上的电路配线(未图示)电连接。当然,也可以优选采用使光出射面12a与安装基板14相对来进行安装的、所谓倒装芯片(flip chip)安装。
作为透明密封构件10的制法,可以优选采用粉末烧结法。例如在成型模具中浇铸包含二氧化硅粉末和有机化合物的成型浆料,通过有机化合物相互的化学反应,例如分散介质与固化剂、或固化剂相互的化学反应使其固化后,从成型模具脱模。然后,通过烧成,能够制作透明密封构件10。
作为透明密封构件10的尺寸,高度为0.1~10mm,外径为3.0~10mm。需要说明的是,作为光学元件12的尺寸,厚度为0.005~0.5mm,虽未图示,但从上表面观察时的纵向尺寸为0.5~2.0mm,横向尺寸为0.5~2.0mm。
而且,如图2所示,透明密封构件10的表面部22的铝浓度(以下,记为Al浓度)比内部24的Al浓度高。在此,透明密封构件10的表面部22表示从表面26起的深度为0.05~0.20μm的区域Za,内部24表示从表面26起的深度为1~5μm的区域Zb。
表面部22的Al浓度为500~2000ppm,内部24的Al浓度为10~100ppm。另外,将表面部22的Al浓度设为A(ppm)、内部24的Al浓度设为B(ppm)时,优选为10≤A/B≤200,进一步优选为15≤A/B≤60。
这样,由于使透明密封构件10的表面部22的Al浓度比内部24的Al浓度高,因此起到以下所示的效果。
即,透明密封构件10的内部24的Al浓度高的情况下,氧缺陷会增加。由于氧缺陷吸收紫外线,因此为了抑制由氧缺陷引起的透过率的降低,透明密封构件10的内部24优选Al浓度低。
通常,在污水等的液体净化的用途中,例如有蛋白质系或有机系的污染物质或微粒附着于透明密封构件10的表面26的情况。在这样的情况下,从光学元件12射出的例如紫外线的光量在透明密封构件10的表面26减少,存在紫外线的杀菌效果降低这样的问题。特别是,在透明密封构件10具有透镜形状等复杂形状的情况下,存在液体容易滞留的部分,因此上述问题变得显著。
在透明密封构件10的表面部22的Al浓度高的情况下,构成二氧化硅(SiO2)的Si的一部分被置换为Al。若Si(+4价)被Al(+3价)置换,则Al的周围成为-1价。即,Al置换位点带负电。即,透明密封构件10的表面26带负电。上述有机物、微粒通常在水中带负电,因此有机物、微粒难以附着在带负电的透明密封构件10的表面26上。
因此,例如,如图3所示,即使透明密封构件10具有透镜形状等复杂形状,局部存在液体容易滞留的部分,也能够抑制有机物、微粒附着于透明密封构件10的表面26。需要说明的是,图3所示的透明密封构件10具有以从周围包围安装在安装基板14上的光学元件12的方式配置的环状底座30、和一体地形成在底座30上的透镜体32。透明密封构件10的底座30上形成有下表面开口的凹部34(容纳空间)。该凹部34中至少容纳光学元件12。
这样,通过使表面部22的Al浓度比内部24的Al浓度高,能够抑制由氧缺陷引起的透过率降低,能够抑制有机物、微粒附着于透明密封构件10的表面26。
[实施例]
接下来,在实施例1~3、比较例1~3中,确认了透明密封构件10的表面部22及内部24的Al浓度所带来的影响。
[实施例1]
实施例1涉及的透明密封构件10具有与图1A所示的透明密封构件10相同的结构。
(透明密封构件的制作)
实施例1涉及的透明密封构件10的制造方法如下。即,将作为原料粉末的平均粒径0.5μm的二氧化硅粉末100质量份、作为分散剂的羧酸共聚物2质量份、作为分散介质的丙二酸二甲酯49质量份、甘醇4质量份、作为固化剂的4’4-二苯基甲烷二异氰酸酯4质量份、以及作为催化剂的三乙胺0.4质量份混合,调制成浆料。二氧化硅粉末的Al浓度为70ppm。
将该浆料在室温下注入金属制的模具内,在室温下放置一定时间。接着,将成型体从模具中脱模。进而,在室温放置一定时间,接着在90℃的温度下放置一定时间,得到二氧化硅粉末干燥体。需要说明的是,原料粉末的平均粒径使用堀场制作所制造的激光衍射散射式粒度分布测定装置LA-750进行测定。
将所制作的二氧化硅粉末干燥体在大气中以500℃预烧后,一边导入5~10L/min的氢气,一边在1600~1700℃下进行烧成,使其致密化和透明化,制作透明密封构件10。透明密封构件10的外径为3.5mm见方,高度为0.5mm。
[实施例2]
除了使氢气量比实施例1少70%以外,与实施例1同样地制作实施例2涉及的透明密封构件10。
[实施例3]
除了二氧化硅粉末的Al浓度为50ppm以及使氢气量比实施例1少50%这一点以外,与实施例1同样地制作了实施例3涉及的透明密封构件10。
[比较例1]
与实施例1同样地制作透明密封构件10后,通过研磨加工除去表面部22,制作比较例1涉及的透明密封构件10。
[比较例2]
对熔融石英玻璃进行研磨加工,制作比较例2涉及的透明密封构件10。
[比较例3]
以二氧化硅粉末的Al浓度成为1300ppm的方式添加三乙醇铝,与实施例3同样地制作透明密封构件10后,通过研磨加工除去从表面起深度为1μm的区域,制作比较例3涉及的透明密封构件10。
<评价方法>
(表面部及内部的Al浓度)
对于实施例1~3、比较例1~3,测定了表面部22和内部24的Al浓度。Al浓度的测定通过SIMS(二次离子质量分析法)从透明密封构件10的表面26进行。
(全光线透过率和浸渍试验)
对于实施例1~3、比较例1~3,将实施浸渍试验前的全光线透过率设为初始全光线透过率。照射波长280nm的紫外光,测定实施例1~3、比较例1~3的初始全光线透过率。全光线透过率的测定使用日本分光制的分光光度计。
然后,将实施例1~3、比较例1~3浸渍保持于从净水厂取得的原水流通的体系内,1个月后从上述体系中取出,与上述同样地操作,测定实施例1~3、比较例1~3的全光线透过率。将其作为浸渍后的全光线透过率。
(评价结果)
将实施例1~3、比较例1~3中的表面部22及内部24的Al浓度、初始全光线透过率以及浸渍后的全光线透过率示于图4的表1。
(考察)
首先,实施例1~3的初始全光线透过率均高达91%。认为由于内部24的Al浓度低,因此抑制了由氧缺陷引起的透过率的降低。
另外,实施例1~3中,浸渍后的全光线透过率均高达72%以上。认为由于表面部22的Al浓度高,因此抑制了有机物或微粒附着于透明密封构件10的表面26。
另一方面,比较例1和2虽然初始全光线透过率高,但浸渍后的全光线透过率低。认为这是由于表面部22的Al浓度低,因此有机物或微粒附着于透明密封构件10的表面26而使浸渍后的全光线透过率降低。
比较例3中,浸渍后的全光线透过率高,但初始全光线透过率低。认为这是由于内部24的Al浓度高,因此由透明密封构件10的氧缺陷引起了透过率的降低。
需要说明的是,本发明涉及的透明密封构件不限于上述的实施方式,当然能够在不脱离本发明的主旨的情况下采用各种构成。
Claims (5)
1.一种透明密封构件(10),其特征在于,是用于光学部件(16)的石英玻璃制的透明密封构件(10),所述光学部件(16)具有至少一个光学元件(12)和安装有所述光学元件(12)的安装基板(14),所述透明密封构件(10)与所述安装基板(14)一起构成容纳所述光学元件(12)的封装(18),
所述透明密封构件(10)的表面部(22)的铝浓度比内部(24)的铝浓度高。
2.根据权利要求1所述的透明密封构件,其特征在于,
将所述表面部(22)的铝浓度设为A,将内部(24)的铝浓度设为B时,
10≤A/B≤200
其中,A和B的单位为ppm。
3.根据权利要求1所述的透明密封构件,其特征在于,
将所述表面部(22)的铝浓度设为A,将内部(24)的铝浓度设为B时,
15≤A/B≤60
其中,A和B的单位为ppm。
4.根据权利要求1所述的透明密封构件,其特征在于,
所述表面部(22)的铝浓度为500~2000ppm,
所述内部(24)的铝浓度为10~100ppm。
5.根据权利要求1~4中任一项所述的透明密封构件,其特征在于,
所述表面部(22)表示从表面(26)起的深度为0.05~0.20μm的区域(Za),
所述内部(24)表示从表面(26)起的深度为1~5μm的区域(Zb)。
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JPH05139778A (ja) * | 1991-11-15 | 1993-06-08 | Asahi Glass Co Ltd | フオトマスク用高耐熱性石英ガラス基板 |
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JP2005145792A (ja) * | 2003-11-19 | 2005-06-09 | Shin Etsu Chem Co Ltd | アルミニウムドープ合成石英ガラス及びその製造方法 |
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US8294156B2 (en) * | 2007-11-19 | 2012-10-23 | Samsung Electronics Co., Ltd. | Nanocrystal light-emitting diode |
JP5243806B2 (ja) | 2008-01-28 | 2013-07-24 | パナソニック株式会社 | 紫外光発光装置 |
US20090321758A1 (en) * | 2008-06-25 | 2009-12-31 | Wen-Huang Liu | Led with improved external light extraction efficiency |
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