JP7028879B2 - 透明封止部材 - Google Patents
透明封止部材 Download PDFInfo
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- JP7028879B2 JP7028879B2 JP2019538830A JP2019538830A JP7028879B2 JP 7028879 B2 JP7028879 B2 JP 7028879B2 JP 2019538830 A JP2019538830 A JP 2019538830A JP 2019538830 A JP2019538830 A JP 2019538830A JP 7028879 B2 JP7028879 B2 JP 7028879B2
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- 238000007789 sealing Methods 0.000 title claims description 72
- 230000003287 optical effect Effects 0.000 claims description 24
- 229910052782 aluminium Inorganic materials 0.000 claims description 21
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 21
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 14
- 238000002834 transmittance Methods 0.000 description 25
- 230000000052 comparative effect Effects 0.000 description 15
- 239000000843 powder Substances 0.000 description 10
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 9
- 230000007547 defect Effects 0.000 description 9
- 238000007654 immersion Methods 0.000 description 9
- 239000001301 oxygen Substances 0.000 description 9
- 229910052760 oxygen Inorganic materials 0.000 description 9
- 239000010419 fine particle Substances 0.000 description 8
- 239000000377 silicon dioxide Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 238000000746 purification Methods 0.000 description 5
- 230000000844 anti-bacterial effect Effects 0.000 description 4
- 239000000356 contaminant Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 102000004169 proteins and genes Human genes 0.000 description 4
- 108090000623 proteins and genes Proteins 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 239000003344 environmental pollutant Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 150000002894 organic compounds Chemical class 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 231100000719 pollutant Toxicity 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 239000010865 sewage Substances 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- JPUHCPXFQIXLMW-UHFFFAOYSA-N aluminium triethoxide Chemical compound CCO[Al](OCC)OCC JPUHCPXFQIXLMW-UHFFFAOYSA-N 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- BEPAFCGSDWSTEL-UHFFFAOYSA-N dimethyl malonate Chemical compound COC(=O)CC(=O)OC BEPAFCGSDWSTEL-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
- C04B37/042—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass in a direct manner
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/06—Glass compositions containing silica with more than 90% silica by weight, e.g. quartz
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/04—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with articles made from glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2201/00—Glass compositions
- C03C2201/06—Doped silica-based glasses
- C03C2201/30—Doped silica-based glasses containing metals
- C03C2201/32—Doped silica-based glasses containing metals containing aluminium
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/0071—Compositions for glass with special properties for laserable glass
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C4/00—Compositions for glass with special properties
- C03C4/0085—Compositions for glass with special properties for UV-transmitting glass
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
- C04B2237/32—Ceramic
- C04B2237/36—Non-oxidic
- C04B2237/366—Aluminium nitride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Structural Engineering (AREA)
- Glass Compositions (AREA)
- Led Device Packages (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Description
(a) 酸素欠陥による透過率の低下を抑えることができる。
(b) タンパク質系や有機系等の汚染物質が付着し難く、汚染物質による殺菌効果の低下を抑制することができる。
(a) 酸素欠陥による透過率の低下を抑えることができる。
(b) タンパク質系や有機系等の汚染物質が付着し難く、汚染物質による殺菌効果の低下を抑制することができる。
次に、実施例1~3、比較例1~3について、透明封止部材10の表面部22及び内部24のAl濃度による影響を確認した。
実施例1に係る透明封止部材10は、図1Aに示す透明封止部材10と同様の構成を有する。
実施例1に係る透明封止部材10の製造方法は以下の通りである。すなわち、原料粉末として平均粒径0.5μmのシリカ粉末100質量部、分散剤としてカルボン酸共重合体2質量部、分散媒としてマロン酸ジメチル49質量部、エチレングリコール4質量部、硬化剤として4’4-ジフェニルメタンジイソシアネート4質量部、及び触媒としてトリエチルアミン0.4質量部を混合したスラリーを調製した。シリカ粉末のAl濃度は70ppmであった。
水素ガス量を実施例1よりも70%減らした点以外は、実施例1と同様にして実施例2に係る透明封止部材10を作製した。
シリカ粉末のAl濃度が50ppmであったことと、水素ガス量を実施例1よりも50%減らした点以外は、実施例1と同様にして実施例3に係る透明封止部材10を作製した。
実施例1と同様にして透明封止部材10を作製した後、研磨加工によって表面部22を除去して比較例1に係る透明封止部材10を作製した。
溶融石英ガラスを研磨加工して、比較例2に係る透明封止部材10を作製した。
シリカ粉末のAl濃度が1300ppmになるようにアルミニウムエチレートを添加し、実施例3と同様にして透明封止部材10を作製した後、研磨加工によって表面から深さ1μmの領域を除去して比較例3に係る透明封止部材10を作製した。
(表面部及び内部のAl濃度)
実施例1~3、比較例1~3について、表面部22及び内部24のAl濃度を測定した。Al濃度の測定は、透明封止部材10の表面26からSIMS(二次イオン質量分析法)にて行った。
実施例1~3、比較例1~3について、浸漬試験を実施する前の全光線透過率を初期全光線透過率とした。波長280nmの紫外光を照射して、実施例1~3、比較例1~3の初期全光線透過率を測定した。全光線透過率の測定は、日本分光製の分光光度計を用いた。
実施例1~3、比較例1~3における表面部22及び内部24のAl濃度、初期全光線透過率並びに浸漬後の全光線透過率を図4の表1に示す。
先ず、実施例1~3は、初期全光線透過率がいずれも91%と高かった。内部24のAl濃度が低かったことから、酸素欠陥による透過率の低下が抑えられたものと考えられる。
Claims (4)
- 少なくとも1つの光学素子(12)と、前記光学素子(12)が実装された実装基板(14)とを有する光学部品(16)に用いられ、前記実装基板(14)と共に前記光学素子(12)を収容するパッケージ(18)を構成する石英ガラス製の透明封止部材(10)であって、
表面部(22)および内部(24)は共に石英ガラス中にアルミニウムを含有し、
前記表面部(22)のアルミニウムの濃度が、前記内部(24)のアルミニウムの濃度よりも高く、
前記表面部(22)は、表面(26)から深さ0.05~0.20μmの領域(Za)を示し、
前記内部(24)は、表面(26)から深さ1~5μmの領域(Zb)を示すことを特徴とする透明封止部材。 - 請求項1記載の透明封止部材において、
前記表面部(22)のアルミニウムの濃度をA(ppm)、内部(24)のアルミニウムの濃度をB(ppm)としたとき、
10≦A/B≦200
であることを特徴とする透明封止部材。 - 請求項1記載の透明封止部材において、
前記表面部(22)のアルミニウムの濃度をA(ppm)、内部(24)のアルミニウムの濃度をB(ppm)としたとき、
15≦A/B≦60
であることを特徴とする透明封止部材。 - 請求項1記載の透明封止部材において、
前記表面部(22)のアルミニウムの濃度が500~2000ppmであり、
前記内部(24)のアルミニウムの濃度が10~100ppmであることを特徴とする透明封止部材。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2017/031212 WO2019043845A1 (ja) | 2017-08-30 | 2017-08-30 | 透明封止部材 |
Publications (2)
Publication Number | Publication Date |
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JPWO2019043845A1 JPWO2019043845A1 (ja) | 2020-08-06 |
JP7028879B2 true JP7028879B2 (ja) | 2022-03-02 |
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JP2019538830A Active JP7028879B2 (ja) | 2017-08-30 | 2017-08-30 | 透明封止部材 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10988400B2 (ja) |
JP (1) | JP7028879B2 (ja) |
KR (1) | KR20200041891A (ja) |
CN (1) | CN111052421A (ja) |
DE (1) | DE112017007952T5 (ja) |
WO (1) | WO2019043845A1 (ja) |
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JP2015143324A (ja) | 2013-12-26 | 2015-08-06 | 信越石英株式会社 | 波長変換用石英ガラス部材及びその製造方法 |
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2017
- 2017-08-30 WO PCT/JP2017/031212 patent/WO2019043845A1/ja active Application Filing
- 2017-08-30 KR KR1020207005764A patent/KR20200041891A/ko unknown
- 2017-08-30 CN CN201780094507.XA patent/CN111052421A/zh active Pending
- 2017-08-30 JP JP2019538830A patent/JP7028879B2/ja active Active
- 2017-08-30 DE DE112017007952.7T patent/DE112017007952T5/de active Pending
-
2020
- 2020-02-26 US US16/801,740 patent/US10988400B2/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2003026440A (ja) | 2001-07-11 | 2003-01-29 | Sumitomo Metal Ind Ltd | 合成石英ガラスおよびその製造方法 |
JP2005145792A (ja) | 2003-11-19 | 2005-06-09 | Shin Etsu Chem Co Ltd | アルミニウムドープ合成石英ガラス及びその製造方法 |
US20090127576A1 (en) | 2007-11-19 | 2009-05-21 | Samsung Electronics Co., Ltd. | Nanocrystal light-emitting diode |
JP2015124098A (ja) | 2013-12-25 | 2015-07-06 | 旭硝子株式会社 | 抗菌性ガラスの製造方法及び抗菌性ガラス |
JP2015143324A (ja) | 2013-12-26 | 2015-08-06 | 信越石英株式会社 | 波長変換用石英ガラス部材及びその製造方法 |
JP2016213213A (ja) | 2015-04-28 | 2016-12-15 | 日機装株式会社 | 発光モジュール |
JP2017108129A (ja) | 2015-11-30 | 2017-06-15 | 隆達電子股▲ふん▼有限公司 | 波長変換材料およびその用途 |
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KR20200041891A (ko) | 2020-04-22 |
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US10988400B2 (en) | 2021-04-27 |
CN111052421A (zh) | 2020-04-21 |
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US20200189961A1 (en) | 2020-06-18 |
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