CN110977361B - Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof - Google Patents
Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof Download PDFInfo
- Publication number
- CN110977361B CN110977361B CN201911369191.8A CN201911369191A CN110977361B CN 110977361 B CN110977361 B CN 110977361B CN 201911369191 A CN201911369191 A CN 201911369191A CN 110977361 B CN110977361 B CN 110977361B
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- Prior art keywords
- cover plate
- nickel
- alloy cover
- protective layer
- seam welding
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- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 77
- 239000000956 alloy Substances 0.000 title claims abstract description 77
- 238000003466 welding Methods 0.000 title claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 21
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 170
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 85
- 239000011241 protective layer Substances 0.000 claims abstract description 42
- 238000007747 plating Methods 0.000 claims abstract description 19
- 238000005260 corrosion Methods 0.000 claims abstract description 13
- 230000007797 corrosion Effects 0.000 claims abstract description 13
- 239000000126 substance Substances 0.000 claims abstract description 9
- 238000003754 machining Methods 0.000 claims abstract description 7
- 238000005507 spraying Methods 0.000 claims abstract description 7
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 38
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 9
- 239000010931 gold Substances 0.000 claims description 9
- 229910052737 gold Inorganic materials 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 229910001096 P alloy Inorganic materials 0.000 claims description 6
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical group [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 abstract description 18
- 239000007921 spray Substances 0.000 abstract description 12
- 150000003839 salts Chemical class 0.000 abstract description 11
- 238000007750 plasma spraying Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 15
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 10
- 239000003292 glue Substances 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 241000251468 Actinopterygii Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, belonging to the technical field of integrated circuit manufacturing. The preparation method of the parallel seam welding alloy cover plate for the integrated circuit packaging comprises the following steps: forming a first nickel protective layer by spraying on four sides of the alloy cover plate column by using a plasma spraying process; cutting the alloy cover plate column into single alloy cover plates along the transverse direction; and performing deburring treatment on the joint Jin Gaiban; forming a T-shaped alloy cover plate body by machining or chemical corrosion; and plating nickel on the outer surface of the alloy cover plate body to form a second nickel protective layer. According to the parallel seam welding alloy cover plate for integrated circuit packaging and the preparation method thereof disclosed by the invention, the first nickel protective layers are formed by spraying on the four sides of the alloy cover plate column, a single alloy cover plate is formed after cutting, the first nickel protective layers are formed by spraying on the sides of the alloy cover plate column more easily, the thickness of the obtained first nickel protective layers is relatively thicker, and the salt spray corrosion resistance is stronger.
Description
Technical Field
The invention relates to the technical field of integrated circuit manufacturing, in particular to a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof.
Background
Parallel seam welding is an important cover plate sealing technology of the airtight package of the high-reliability integrated circuit, and the technology utilizes the principle of resistance welding to melt a coating on the back surface of the cover plate through heat generated by roller electrodes; with the electrode wheel rolling on the cover plate, the welding spots are formed one by one, so that a fish scale-shaped lap joint welding seam is formed, and the welding between the cover plate and the sealing ring of the ceramic or metal shell is realized. The welding belongs to local welding, and when welding current passes through the contact part of the electrode and the cover plate and the contact part of the cover plate and the sealing ring, enough heat is generated, so that the plating layers at the two contact parts are melted. The heat of the seam welding process is concentrated in the part of the sealing area, and the chip in the device is not subjected to high temperature. The parallel seam welding is characterized in that high temperature is locally generated, the temperature of the chip inside the shell is low, and thermal shock is not generated on the chip. The common parallel seam welding alloy cover plate adopts nickel as a surface coating, and in order to avoid the influence of overhigh temperature on circuit chips and devices in a packaging shell in the welding process, a chemical nickel plating process with a lower melting point is generally adopted. In the process, the weight ratio of the doped phosphorus in the chemical nickel plating solution is generally 8% -12%, and the melting point of the plating layer is 880 ℃. In parallel seam welding, when the temperature of the contact part of the cover plate and the sealing ring is higher than the melting point of chemical nickel plating by controlling the welding current, the sealing welding between the cover plate and the sealing ring can be realized.
The conventional parallel seam welding alloy cover plate adopts an integral chemical nickel plating process to form a surface nickel plating layer with the thickness of only a few micrometers, so that the exposure of iron element in a substrate at the bottom of a plating layer is difficult to avoid in the parallel seam welding process, and therefore, the corrosion failure problem in a salt spray test occurs, and hidden danger is brought to the reliability in circuit application.
As the base material of the parallel seam welding alloy cover plate is iron-containing alloy, once the iron element is exposed, the corrosion resistance of the cover plate is degraded, which is also the root cause of the frequent occurrence of corrosion of the packaged product adopting the parallel seam welding sealing process in the salt spray test.
Disclosure of Invention
The invention aims to provide a parallel seam welding alloy cover plate for integrated circuit packaging and a preparation method thereof, which are used for solving the problems that the conventional parallel seam welding alloy cover plate adopts an integral chemical nickel plating process, the thickness of a formed surface nickel plating layer is only a few microns, the exposure of iron element in a substrate at the bottom of a plating layer is difficult to avoid in the parallel seam welding process, corrosion failure in a salt spray test occurs, and hidden danger is brought to the reliability in circuit application.
In order to solve the technical problems, the invention provides a preparation method of a parallel seam welding alloy cover plate for integrated circuit packaging, which comprises the following steps:
Machining to obtain an alloy cover plate column;
Forming a first nickel protective layer by spraying on four sides of the alloy cover plate column;
cutting the alloy cover plate column with the first nickel protective layer into single alloy cover plates along the transverse direction;
Deburring the cut alloy cover plate;
Forming a T-shaped alloy cover plate body by machining or chemical corrosion;
plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protective layer;
and (5) after cleaning and drying, manufacturing the parallel seam welding alloy cover plate.
The invention also provides a parallel seam welding alloy cover plate for integrated circuit packaging, which comprises a T-shaped alloy cover plate body, wherein the alloy cover plate body comprises a connecting part and a pressure bearing part, the side walls around the connecting part are respectively provided with a first nickel protection layer, and the first nickel protection layer and the alloy cover plate body are externally wrapped with a second nickel protection layer.
Optionally, the thickness of the first nickel protective layer is 200 μm to 400 μm.
Optionally, the first nickel protective layer is high-purity nickel, and the melting point is 1455 ℃.
Optionally, the second nickel protection layer is a nickel layer or a nickel layer plus a gold layer.
Optionally, the thickness of the nickel layer in the second nickel protective layer is 2-8.89 μm; when the second nickel protective layer is a nickel layer and a gold layer, the thickness of the gold layer is 0.01-6 mu m.
Optionally, the nickel in the second nickel protective layer is nickel-phosphorus alloy, and the melting point is 880 ℃.
Optionally, the weight ratio of phosphorus in the nickel-phosphorus alloy of the second nickel protective layer is 8% -12%.
The parallel seam welding alloy cover plate for integrated circuit packaging and the preparation method thereof have the following beneficial effects:
(1) The four sides of the alloy cover plate column are sprayed with first nickel protection layers, a single alloy cover plate is formed after cutting, a plurality of single alloy cover plates with the first nickel protection layers on the sides can be obtained quickly, the thickness of the obtained first nickel protection layers can effectively prevent the exposure of iron elements in the matrix kovar alloy in the flat sealing process, and the salt spray corrosion resistance of the cover plate is enhanced;
(2) Compared with the existing parallel seam welding nickel plating cover plate, the parallel seam welding alloy cover plate provided by the invention has better salt spray corrosion resistance, and can meet the more severe salt spray environment application requirements of integrated circuit products and the high reliability requirements of packaging devices by adopting a parallel seam welding sealing process.
Drawings
FIG. 1 is a schematic structural view of a machined alloy deck column;
FIG. 2 is a schematic view of the structure of an alloy cover post with four sides sprayed to form a first nickel protective layer;
FIG. 3 is a schematic structural view of a single alloy cover plate;
FIG. 4 is a cross-sectional view of a T-shaped alloy cover plate body;
FIG. 5 is a cross-sectional view of the outer surface of the alloy cover plate body after forming a second nickel protective layer;
FIG. 6 is an elevation view of a parallel seam welded alloy cover plate;
Fig. 7 is a top view of a parallel seam welded alloy cover plate.
Detailed Description
The invention provides a parallel seam welding alloy cover plate for integrated circuit packaging, which is further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the invention will become more apparent from the following description and from the claims. It should be noted that the drawings are in a very simplified form and are all to a non-precise scale, merely for convenience and clarity in aiding in the description of embodiments of the invention.
Example 1
The invention provides a preparation method of a parallel seam welding alloy cover plate for integrated circuit packaging, which comprises the following steps: firstly, machining to obtain an alloy cover plate column, as shown in fig. 1; secondly, forming a first nickel protective layer by spraying on four sides of the alloy cover plate column, as shown in fig. 2; next, the alloy cover plate column with the first nickel protective layer is transversely cut into single alloy cover plates, as shown in fig. 3; and deburring the cut alloy cover plate; then, forming a T-shaped alloy cover plate body by machining or chemical corrosion, as shown in FIG. 4; finally, plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protective layer, as shown in FIG. 5; and (5) after cleaning and drying, manufacturing the parallel seam welding alloy cover plate. The means used in forming the first nickel protective layer is a plasma spray process, and the means used in forming the second nickel protective layer is an electroplating or electroless plating technique. The first nickel protective layers are formed on the four side surfaces of the alloy cover plate column in a spraying mode, a single alloy cover plate is formed after cutting, a plurality of single alloy cover plates with the first nickel protective layers on the side surfaces can be obtained quickly, the thickness of the obtained first nickel protective layers can effectively prevent exposure of iron elements in the matrix kovar alloy in the flat sealing process, and salt spray corrosion resistance of the cover plates is enhanced; (this method is just like glue application on the side of a piece of paper, and glue application on the side of a book, it is obvious that glue application on the side of a book is easier and can be obtained with a certain thickness more easily). Compared with the existing parallel seam welding nickel plating cover plate, the invention can obtain the same sealing effect without increasing welding current.
The invention also provides a parallel seam welding alloy cover plate for packaging the integrated circuit, and the structure of the parallel seam welding alloy cover plate is shown in fig. 5-7. The metal packaging cover comprises a T-shaped alloy cover body 3, wherein the alloy cover body 3 comprises a connecting part 30 and a pressure bearing part 31 and is used for being matched with a step hole in a metal packaging shell, a first nickel protection layer 1 is formed on the peripheral side wall of the connecting part 30, and a second nickel protection layer 2 is wrapped outside the first nickel protection layer 1 and the alloy cover body 3.
Specifically, the thickness of the first nickel protective layer 1 is 200 μm to 400 μm. The first nickel protective layer 1 is high-purity nickel, and the melting point is 1455 ℃.
The second nickel protective layer 2 is a nickel layer or a nickel layer and a gold layer. The thickness of the nickel layer in the second nickel protective layer 2 is 2-8.89 mu m; when the second nickel protective layer 2 is a nickel layer and a gold layer, the thickness of the gold layer is 0.01-6 mu m.
The nickel in the second nickel protective layer 2 is nickel-phosphorus alloy, and the melting point is 880 ℃. The weight ratio of phosphorus in the nickel-phosphorus alloy of the second nickel protective layer 2 is 8% -12%.
Because the parallel seam welding process is unavoidable to the damage of the welding edge, the damage size can only be controlled by the process improvement, and the problem of the damage of the welding edge can not be fundamentally solved. According to the parallel seam welding alloy cover plate for integrated circuit packaging and the preparation method thereof, a reliable plating layer structure can be obtained on the side surface of the alloy cover plate body, the thickness of the obtained first nickel protective layer can effectively prevent the exposure of iron element in the matrix kovar alloy in the flat sealing process, the salt spray corrosion resistance is improved, the requirement of high-reliability ceramic packaging on a salt spray test can be met, and the requirements of harsher salt spray environment application of integrated circuit products and the high-reliability requirement of packaging devices by adopting a parallel seam welding sealing process can be met; compared with the existing parallel seam welding nickel plating cover plate, the invention can obtain the same sealing effect without increasing welding current.
The above description is only illustrative of the preferred embodiments of the present invention and is not intended to limit the scope of the present invention, and any alterations and modifications made by those skilled in the art based on the above disclosure shall fall within the scope of the appended claims.
Claims (1)
1. The preparation method of the parallel seam welding alloy cover plate for the integrated circuit packaging is characterized by comprising the following steps of:
Machining to obtain an alloy cover plate column;
Forming a first nickel protective layer by spraying on four sides of the alloy cover plate column;
cutting the alloy cover plate column with the first nickel protective layer into single alloy cover plates along the transverse direction;
Deburring the cut alloy cover plate;
Forming a T-shaped alloy cover plate body by machining or chemical corrosion;
plating nickel on the outer surface of the T-shaped alloy cover plate body to form a second nickel protective layer;
After cleaning and drying, manufacturing the parallel seam welding alloy cover plate is completed; the thickness of the first nickel protective layer is 200-400 mu m; the first nickel protective layer is high-purity nickel, and the melting point is 1455 ℃; the second nickel protective layer is a nickel layer or a nickel layer and a gold layer; the thickness of the nickel layer in the second nickel protective layer is 2-8.89 mu m; when the second nickel protective layer is a nickel layer and a gold layer, the thickness of the gold layer is 0.01-6 mu m; the nickel in the second nickel protective layer is nickel-phosphorus alloy, and the melting point is 880 ℃; and the weight ratio of phosphorus in the nickel-phosphorus alloy of the second nickel protective layer is 8% -12%.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911369191.8A CN110977361B (en) | 2019-12-26 | 2019-12-26 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911369191.8A CN110977361B (en) | 2019-12-26 | 2019-12-26 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
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| Publication Number | Publication Date |
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| CN110977361A CN110977361A (en) | 2020-04-10 |
| CN110977361B true CN110977361B (en) | 2024-05-03 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| SG11202007968WA (en) | 2020-04-20 | 2021-11-29 | Ningbo Radi Cool Advanced Energy Technologies Co Ltd | Radiative cooling metal plate, preparation method and application thereof |
| CN111497378A (en) * | 2020-04-20 | 2020-08-07 | 宁波瑞凌新能源科技有限公司 | Radiation refrigeration metal plate, preparation method and application thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
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