CN103107141A - Parcel-gilt cover plate structure - Google Patents
Parcel-gilt cover plate structure Download PDFInfo
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- CN103107141A CN103107141A CN2013100512293A CN201310051229A CN103107141A CN 103107141 A CN103107141 A CN 103107141A CN 2013100512293 A CN2013100512293 A CN 2013100512293A CN 201310051229 A CN201310051229 A CN 201310051229A CN 103107141 A CN103107141 A CN 103107141A
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- cover plate
- gold
- gilt
- parcel
- nickel
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Abstract
The invention relates to a parcel-gilt cover plate structure which comprises a cover plate body. Nickel-plating layers are covered on the outer surface of the cover plate body. The parcel-gilt cover plate structure is characterized in that gold-plating layers are arranged on the nickel-plating layers on side faces of the cover plate body, and a gold-plating layer is arranged on part of the upper surface of the cover plate body. A gold-plating area arranged with the gold-plating layer and a bare area are formed on the upper surface of the cover plate body. The lower surface of the cover plate body is only provided with a nickel-plating layer. By means of the parcel-gilt cover plate structure, an electrogilding area is greatly reduced, welding of Au 80, stannum (Sn 20) and the like is not influenced, and cost of the plate cover is greatly reduced. According to the parcel-gilt cover plate structure, the surface of the cover plate exposed in the environment is a nickel layer, and no gold layer is coated on the nickel layer, so that electrochemical corrosion caused by potential difference between nickel and gold is eliminated, and corrosion resistance of the cover plate is improved.
Description
Technical field
The present invention relates to a kind of covering plate structure, especially a kind of parcel-gilt covering plate structure belongs to technical field of electronic encapsulation.
Background technology
At present, usually adopt in Electronic Packaging the metal cover board first electronickelling in surface gold-plated structure again, there is in actual use following problem: 1, for guaranteeing that electroplating cover plate does not stay the electrode contact point, need 2 plating just can complete the plating of cover plate, namely electroplate for the first time upper surface and the side of cover plate, electroplate for the second time lower surface and the side of cover plate; 2, the whole electrogildings of lid surface make cover plate consume gold and wait noble metal amount large, and the cover plate cost is high; 3, the whole electrogildings in surface are not to be environment-protection electroplating technique.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, a kind of parcel-gilt covering plate structure is provided, when electroplating, can once complete this covering plate structure, can the gold-plated area of decrease, reduce gold and wait the noble metal consumption, reduce the step of electroplating technology, and improve cover plate welded encapsulation rate of finished products and quality, meet the green manufacturing environmental requirement.
According to technical scheme provided by the invention, a kind of parcel-gilt covering plate structure, comprise cover board body, outer surface at cover board body coats nickel coating, it is characterized in that: on the nickel coating that is positioned at described cover board body side, Gold plated Layer is set, divides on the nickel coating top that is positioned at the cover board body upper surface Gold plated Layer is set.
Upper surface at described cover board body forms gold-plated zone and the exposed region that is provided with Gold plated Layer.
The lower surface of described cover board body only is provided with nickel coating.
Compared with the prior art the present invention has the following advantages: (1) the present invention significantly reduces the electrogilding area, and does not affect the welding of the scolders such as Au80Sn20, and makes cover plate cost decrease; (2) to be exposed to the lid surface in environment be nickel dam in the present invention, without the gold layer, eliminated between nickel-Jin chemical potential poor and cause electrochemical corrosion on nickel coating, promotes the cover plate corrosion resistance; (3) scolder of the present invention welding is gold-plated with the cover plate side, and during the scolder welding, excess solder will form meniscus at this, and this had both absorbed excess solder, had improved again cover plate welding shear strength and shock resistance; (4) scolder of the present invention welding partially plating gold structure, the trickling and cause the problems such as ultra-thin ceramic Bonding short circuit outstanding under scolder and that may cause thus along cover plate to inner chamber in the time of can eliminating solder fusing.
Description of drawings
Fig. 1 is structural representation of the present invention.
Fig. 2 is the A-A cutaway view of Fig. 1.
Embodiment
The invention will be further described below in conjunction with concrete accompanying drawing.
As figure～shown in Figure 2: as described in the parcel-gilt covering plate structure of single face comprise cover board body 1, nickel coating 2, Gold plated Layer 3, exposed region 4, gold-plated regional 5 etc.
As shown in Figure 1 and Figure 2, the present invention includes cover board body 1, coat nickel coating 2 at the outer surface of cover board body 1, on the nickel coating 2 that is positioned at cover board body 1 side, Gold plated Layer 3 is set, divide on nickel coating 2 tops that are positioned at cover board body 1 upper surface Gold plated Layer 3 is set;
As shown in Figure 1, be provided with gold-plated regional 5 and exposed region 4 of Gold plated Layer 3 in the upper surface formation of described cover board body 1, this exposed region 4 is not exposed to environment when cover plate uses in.
Manufacture craft of the present invention mainly adopts the modes such as local gluing-exposure-development or pad pasting; in electronickelling on cover board body 1 or after changing nickel plating and obtaining nickel coating 2; do not need the back side of gold-plated exposed region 4 and cover plate 1 to adopt protective layer to protect in cover plate 1 front; remove protective layer after Gold plated Layer 3 is completed, can obtain the cover plate of single face partially plating gold structure.The present invention significantly reduces the electrogilding area, and cover plate cost decrease meets the environmental protection concept of green manufacturing.
As: be of a size of the cover plate of 10.0mm * 10.0mm * 0.4mm, cover plate 1 surface area is 216mm
2The weld width of cover board body 1 upper surface Gold plated Layer is 1.0mm; there are the exposed region 4 of 8.0mm * 8.0mm and the back side of cover plate 1 to adopt the modes such as gluing-exposure-development or pad pasting to protect on nickel coating 2; electrode is electrically connected at exposed region 4; peel off protective layer and electrode on exposed region 4 after the plating Gold plated Layer, the cover plate of partially plating gold structure is namely completed again.Adopt partially plating gold covering plate structure of the present invention, gold-plated area Gongwei 52 mm
2, accounting for 24% of total surface area, gold-plated area has reduced 76%.
As: be of a size of the cover plate of 20.0mm * 16.0mm * 0.4mm, cover plate 1 surface area is 668.8mm
2The weld width of cover board body 1 upper surface Gold plated Layer is 1.5mm; there are the exposed region 4 of 17.0mm * 13.0mm and the back side of cover plate 1 to adopt the modes such as gluing or pad pasting to protect on nickel coating 2; electrode is electrically connected at exposed region 4; peel off protective layer and electrode on exposed region 4 after plating Gold plated Layer 3, the cover plate of partially plating gold structure is namely completed again.Adopt the bright partially plating gold covering plate structure of invention, gold-plated area is only 99 mm
2, accounting for 14.8% of total surface area, gold-plated area has reduced 85.2%.
Claims (3)
1. parcel-gilt covering plate structure, comprise cover board body (1), outer surface at cover board body (1) coats nickel coating (2), it is characterized in that: on the nickel coating (2) that is positioned at described cover board body (1) side, Gold plated Layer (3) is set, divides on nickel coating (2) top that is positioned at cover board body (1) upper surface Gold plated Layer (3) is set.
2. parcel-gilt covering plate structure as claimed in claim 1, is characterized in that: the gold-plated zone (5) and the exposed region (4) that are provided with Gold plated Layer (3) in the upper surface formation of described cover board body (1).
3. parcel-gilt covering plate structure as claimed in claim 1, it is characterized in that: the lower surface of described cover board body (1) only is provided with nickel coating (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100512293A CN103107141A (en) | 2013-02-16 | 2013-02-16 | Parcel-gilt cover plate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013100512293A CN103107141A (en) | 2013-02-16 | 2013-02-16 | Parcel-gilt cover plate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103107141A true CN103107141A (en) | 2013-05-15 |
Family
ID=48314893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013100512293A Pending CN103107141A (en) | 2013-02-16 | 2013-02-16 | Parcel-gilt cover plate structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN103107141A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977362A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Salt-fog-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02235362A (en) * | 1989-03-09 | 1990-09-18 | Sumitomo Metal Mining Co Ltd | Hermetic seal cover |
| JP2001110922A (en) * | 1999-10-12 | 2001-04-20 | Toyo Commun Equip Co Ltd | Package for electronic component |
| JP2004186428A (en) * | 2002-12-03 | 2004-07-02 | Citizen Watch Co Ltd | Method for manufacturing cover body of package for electronic device |
| CN101322242A (en) * | 2006-02-15 | 2008-12-10 | 株式会社新王材料 | Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap |
-
2013
- 2013-02-16 CN CN2013100512293A patent/CN103107141A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02235362A (en) * | 1989-03-09 | 1990-09-18 | Sumitomo Metal Mining Co Ltd | Hermetic seal cover |
| JP2001110922A (en) * | 1999-10-12 | 2001-04-20 | Toyo Commun Equip Co Ltd | Package for electronic component |
| JP2004186428A (en) * | 2002-12-03 | 2004-07-02 | Citizen Watch Co Ltd | Method for manufacturing cover body of package for electronic device |
| CN101322242A (en) * | 2006-02-15 | 2008-12-10 | 株式会社新王材料 | Cap for airtight sealing, package for housing electronic part, and process for producing airtightly sealing cap |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110977361A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977362A (en) * | 2019-12-26 | 2020-04-10 | 中国电子科技集团公司第五十八研究所 | Salt-fog-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN110977361B (en) * | 2019-12-26 | 2024-05-03 | 中国电子科技集团公司第五十八研究所 | Parallel seam welding alloy cover plate for integrated circuit packaging and preparation method thereof |
| CN110977362B (en) * | 2019-12-26 | 2024-05-07 | 中国电子科技集团公司第五十八研究所 | Salt spray corrosion resistant parallel seam welding alloy cover plate and preparation method thereof |
| CN113707618A (en) * | 2021-08-26 | 2021-11-26 | 中国电子科技集团公司第五十八研究所 | Salt-spray-corrosion-resistant parallel seam welding alloy cover plate and preparation method thereof |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130515 |